CN212542371U

CN212542371U - Multi-chip particle testing device

Info

Publication number: CN212542371U
Application number: CN202021749847.7U
Authority: CN
Inventors: 李锦光
Original assignee: Guangdong Full Core Semiconductor Co ltd
Current assignee: Guangdong Full Core Semiconductor Co ltd
Priority date: 2020-08-20
Filing date: 2020-08-20
Publication date: 2021-02-12
Anticipated expiration: 2030-08-20

Abstract

The utility model relates to a multi-chip particle testing device, which comprises a base, a top seat, a driving mechanism, a concentrator, a testing work server, a bearing platform and a lifting platform, wherein the top end of the base is fixedly connected with the top seat through a connecting column; the base is also fixedly connected with a bearing table, a plurality of placing grooves are uniformly formed in the bearing table, and wafer chips are placed in the placing grooves; the lifting platform is connected to the connecting column in a sliding manner through a driving mechanism; the bottom end of the lifting platform is uniformly and fixedly connected with a plurality of test probe cards, the test probe cards correspond to the placing grooves, a plurality of test probes are uniformly arranged on the test probe cards, and the test probes on each test probe card correspond to the crystal grains on the wafer chip; the lifting platform is driven to move up and down through the cooperation of the ball screw and the ball nut, then a plurality of test needle clamps are dragged through the arrangement of the concentrator, a plurality of wafer chips can be tested through one device, and the test efficiency is improved.

Description

Multi-chip particle testing device

Technical Field

The utility model relates to a chip test technical field specifically is a multi-chip particle testing arrangement.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and the original material thereof is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed. At present, domestic wafer production lines mainly comprise 8 inches and 12 inches;

the wafer test is to carry on the probe test to every crystalline grain on the chip, utilize the probe on the needle card to contact with contact on the crystalline grain, test its electrical characteristic, the unqualified crystalline grain will be marked with the mark, then when the chip cuts into the independent crystalline grain according to crystalline grain as the unit, the unqualified crystalline grain marked with the mark will be rejected by wash one's face, no longer carry on the next process, in order to avoid increasing the manufacturing cost in vain;

however, the conventional wafer chip testing device can only detect single wafer chips one by one, so that the detection efficiency is low;

in summary, the present application provides a multi-chip particle testing apparatus to solve the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a multi-chip particle testing arrangement to solve the problem that proposes in the above-mentioned background art, the utility model discloses convenient to use, easy operation, systematic height, the practicality is strong.

In order to achieve the above object, the utility model provides a following technical scheme: a multi-chip particle testing device comprises a base, a top seat, a driving mechanism, a concentrator, a testing work server, a bearing table and a lifting table, wherein the top end of the base is fixedly connected with the top seat through a connecting column; the base is also fixedly connected with a bearing table, a plurality of placing grooves are uniformly formed in the bearing table, and wafer chips are placed in the placing grooves; the lifting platform is connected to the connecting column in a sliding manner through a driving mechanism; the bottom end of the lifting table is uniformly and fixedly connected with a plurality of test probe cards, the test probe cards correspond to the placing grooves, a plurality of test probes are uniformly arranged on the test probe cards, and the test probes on each test probe card correspond to crystal grains on the wafer chip; the test work server is electrically connected with the concentrator through a wire, the connecting ports of the concentrator are respectively and electrically connected with the corresponding test pin cards through wires, and the concentrator is fixedly connected to the top end of the top seat.

Preferably, the driving mechanism comprises a servo motor, a ball screw, a ball nut, a limiting slide rail and a limiting slide block, the servo motor is fixedly connected to both sides of the top end of the top seat, the ball nut is fixedly embedded in both ends of the lifting platform, the ball screw is rotatably connected to the ball nut, and one end of the ball screw penetrates through the top seat and is fixedly connected with an output shaft of the servo motor; the two sides of the lifting platform are also fixedly connected with limiting sliding blocks, limiting sliding rails are fixedly mounted at the positions of the limiting sliding blocks corresponding to the connecting columns, and the limiting sliding blocks are connected to the limiting sliding rails in a sliding mode.

Preferably, the bearing platform and the lifting platform are both rectangular structures.

Preferably, the placing groove is also fixedly connected with a suction head for sucking the wafer chip.

Preferably, the servo motor is fixedly connected to the top base through a bolt.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a set up mutually supporting of servo motor, ball screw, ball nut, concentrator, test work server, plummer and elevating platform, the cooperation through ball screw and ball nut drives the elevating platform up-and-down motion, then adopts one to drag a plurality of test needle cards through setting up of concentrator, can test a plurality of wafer chips through an equipment simultaneously, has promoted efficiency of software testing.

Drawings

Fig. 1 is a schematic view of the structure of the present invention;

FIG. 2 is a schematic top view of the carrier table of the present invention;

fig. 3 is a schematic view of the elevating platform of the present invention;

fig. 4 is a schematic diagram of the electric wire connection structure of the middle component of the present invention.

Reference numerals: 100. a base; 110. connecting columns; 120. a top seat; 200. a limiting slide rail; 210. a limiting slide block; 300. a bearing table; 310. a placement groove; 320. a suction head; 400. a wafer chip; 410. a crystal grain; 500. a lifting platform; 510. testing the pin card; 520. testing the probe; 600. a servo motor; 610. a ball screw; 620. a ball nut; 700. a hub; 800. and testing the working server.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: a multi-chip particle testing device comprises a base 100, a top seat 120, a driving mechanism, a concentrator 700, a testing work server 800, a bearing table 300 and a lifting table 500, wherein the top end of the base 100 is fixedly connected with the top seat 120 through a connecting column 110; the pedestal 100 is further fixedly connected with a carrying table 300, a plurality of placing grooves 310 are uniformly formed in the carrying table 300, and the wafer chips 400 are placed in the placing grooves 310; the lifting platform 500 is slidably connected to the connecting column 110 through a driving mechanism; a plurality of test probe cards 510 are uniformly and fixedly connected to the bottom end of the lifting table 500, the test probe cards 510 correspond to the placing groove 310, a plurality of test probes 520 are uniformly arranged on the test probe cards 510, and the test probes 520 on each test probe card 510 correspond to the dies 410 on the wafer chip 400; the test work server 800 is electrically connected to the hub 700 through a wire, and the connection ports of the hub 700 are electrically connected to the corresponding test pin cards 510 through wires, respectively, and the hub 700 is fixedly connected to the top end of the top base 120;

the test work server 800 is used for processing the test probe card 510 to analyze and process data returned after the wafer chip 400 is tested, and the test work server 800 is the prior art and therefore is not described herein;

wherein, the outer end of the placing slot 310 may further be provided with labels, such as 1, 2, 3, etc., for distinguishing different wafer chips 400;

the hub 700 can control a plurality of test pin cards 510, and then the data detected by the test pin cards 510 is transmitted to the test work server 800;

the driving mechanism comprises a servo motor 600, a ball screw 610, ball nuts 620, a limiting slide rail 200 and a limiting slide block 210, wherein the servo motor 600 is fixedly connected to both sides of the top end of the top seat 120, the ball nuts 620 are fixedly embedded in both ends of the lifting platform 500, the ball screw 610 is rotatably connected to the ball nuts 620, and one end of the ball screw 610 penetrates through the top seat 120 and is fixedly connected with an output shaft of the servo motor 600; the two sides of the lifting platform 500 are also fixedly connected with limiting sliding blocks 210, the limiting sliding rails 200 are fixedly installed at the positions of the limiting sliding blocks 210 corresponding to the connecting columns 110, and the limiting sliding blocks 210 are slidably connected to the limiting sliding rails 200;

the servo motor 600 is electrically connected with the test work server 800;

the ball screw 610 and the ball nut 620 are high-precision ball screws 610 and ball nuts 620, so that the lifting platform 500 can stably descend or ascend;

the lifting platform 500 can stably ascend or descend by the limiting action of the limiting slide block 210 and the limiting slide rail 200;

the bearing table 300 and the lifting table 500 are both rectangular structures;

the placing groove 310 is also fixedly connected with a suction head 320 for sucking the wafer chip 400;

the suction head 320 is connected to a vacuum suction device for sucking the wafer 400 and ensuring the stability of the wafer 400;

the servo motor 600 is fixedly connected to the top base 120 through bolts;

the working principle is as follows: when the test platform is used, firstly, a plurality of wafer chips 400 are placed in the placing groove 310 by mechanical claws or manually, then the wafer chips are adsorbed and fixed by the absorption head 320, then the servo motor 600 is controlled to rotate to drive the ball screw 610 to rotate, the ball screw 610 rotates on the ball screw, so under the action of the limiting slide block 210 and the limiting slide rail 200, the lifting platform 500 stably descends until the test probes 520 on the test probe card 510 are abutted against the crystal grains 410 on the wafer chips 400, then the test work server 800 is used for starting the test probe card 510 to work, the test probe card 510 sends test data to the hub 700 through the test probes 520, then the hub 700 sends the data back to the test work server 800, and the test work server 800 analyzes and processes the data, so that unqualified wafer chips 400 can be tested; therefore, the device adopts one-to-many test pin cards 510 through the arrangement of the concentrator 700, and can test a plurality of wafer chips 400 through one device, thereby improving the test efficiency.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A kind of multichip granule testing device, characterized by that: the test platform comprises a base (100), a top seat (120), a driving mechanism, a concentrator (700), a test work server (800), a bearing platform (300) and a lifting platform (500), wherein the top end of the base (100) is fixedly connected with the top seat (120) through a connecting column (110); the base (100) is also fixedly connected with a bearing table (300), a plurality of placing grooves (310) are uniformly formed in the bearing table (300), and wafer chips (400) are placed in the placing grooves (310);

the lifting table (500) is connected to the connecting column (110) in a sliding manner through a driving mechanism;

the bottom end of the lifting table (500) is uniformly and fixedly connected with a plurality of test probe cards (510), the test probe cards (510) correspond to the placing grooves (310), a plurality of test probes (520) are uniformly arranged on the test probe cards (510), and the test probes (520) on each test probe card (510) correspond to the crystal grains (410) on the wafer chip (400);

the test work server (800) is electrically connected with the hub (700) through a lead, the connection ports of the hub (700) are respectively and electrically connected with the corresponding test pin cards (510) through leads, and the hub (700) is fixedly connected to the top end of the top seat (120).

2. The multi-chip pellet test apparatus of claim 1 wherein: the driving mechanism comprises a servo motor (600), a ball screw (610), a ball nut (620), a limiting slide rail (200) and a limiting slide block (210), wherein both sides of the top end of the top seat (120) are fixedly connected with the servo motor (600), both ends of the lifting platform (500) are fixedly embedded with the ball nut (620), the ball screw (610) is rotatably connected with the ball nut (620), and one end of the ball screw (610) penetrates through the top seat (120) and is fixedly connected with an output shaft of the servo motor (600);

the two sides of the lifting platform (500) are fixedly connected with limiting sliding blocks (210), limiting sliding rails (200) are fixedly mounted at the positions, corresponding to the connecting columns (110), of the limiting sliding blocks (210), and the limiting sliding blocks (210) are connected to the limiting sliding rails (200) in a sliding mode.

3. The multi-chip pellet test apparatus of claim 1 wherein: the bearing table (300) and the lifting table (500) are both rectangular structures.

4. The multi-chip pellet test apparatus of claim 1 wherein: the placing groove (310) is also fixedly connected with a suction head (320) for sucking the wafer chip (400).

5. The multi-chip pellet test apparatus of claim 2 wherein: the servo motor (600) is fixedly connected to the top seat (120) through a bolt.