CN212534904U - Floor block - Google Patents

Abstract

The application relates to a floor panel, comprising: the honeycomb substrate is attached to and fixed on the panel on the upper surface of the honeycomb substrate; the honeycomb substrate includes: the honeycomb core layer is bonded and fixed on an upper plate body on the upper surface of the honeycomb core layer through a thermosetting adhesive, and bonded and fixed on a lower plate body on the lower surface of the honeycomb core layer through the thermosetting adhesive; the panel is adhesively secured to the upper surface of the upper panel body by a thermosetting or hot melt adhesive. Make the floor block really have the resistance to compression and the shock resistance of wear and aesthetic property and below honeycomb substrate of top panel concurrently in this application to promote the preparation efficiency of floor block, make this floor block can large-scale industrial production.

Description

Floor block

Technical Field

The application relates to the field of floors, in particular to a floor block.

Background

The chinese utility model patent No. cn200420108932.x discloses a floor block composed of a honeycomb substrate and a stone panel. The floor block with the composite structure has the wear resistance and the aesthetic property of stone and the compression resistance and the impact resistance of the honeycomb board. However, the patent document only describes that the stone panel on the upper layer of the composite floor board is adhered and fixed on the upper surface of the honeycomb board on the lower layer by means of a special adhesive, and does not describe the specific kind of the special adhesive, and does not describe the adhering process of the stone panel and the honeycomb substrate.

The following problems are encountered if the conventional adhesive and the conventional method are used to bond the stone panel and the honeycomb substrate in the above patent documents:

1. the glue layer formed after curing of conventional adhesives applied between stone panels and honeycomb substrates is usually provided with larger or smaller more or less grooves and holes, and the glue layer is neither continuous nor dense. The hollow structure is formed between the upper stone panel and the lower honeycomb substrate, and when the upper stone panel is subjected to downward impact force, the upper stone panel is easy to break, and the impact resistance stated in the patent specification can not be achieved.

2. The conventional adhesive needs a large area to be exposed to the environment for quick curing, and if the bonding strength of the stone panel and the honeycomb substrate is to be ensured, the adhesive needs to be applied between the stone panel and the honeycomb substrate before curing. However, the stone panels and honeycomb substrates have poor air permeability, which results in very long curing time of the adhesive, and thus the production efficiency of the composite floor boards is low, which is not suitable for large-scale industrial production.

In view of the above-mentioned drawbacks of the composite floorboards of the patent documents mentioned in the introduction, the applicant initially conceived the bonding of stone panels and honeycomb substrates thereof with thermosetting or hot-melt adhesives with a fast curing speed and strong controllability (this idea was not disclosed before the filing of the present application). However, the bonding process using thermosetting or hot melt adhesive requires high temperature, and the structural layers of the conventional honeycomb panel are bonded together by hot melt adhesive (hot melt adhesive film) which cannot withstand high temperature, and if the stone panels and the honeycomb substrate are bonded by thermosetting or hot melt adhesive, the honeycomb substrate is decomposed at high temperature.

Disclosure of Invention

The technical problem that this application will solve is: the floor block is provided, so that the floor block has the wear resistance and the aesthetic property of the upper panel and the compression resistance and the shock resistance of the lower honeycomb substrate, the manufacturing efficiency of the floor block is improved, and the floor block can be produced industrially on a large scale.

The technical scheme of the application is as follows:

a flooring block comprising:

a honeycomb substrate, and

the panel is attached to the upper surface of the honeycomb substrate;

the honeycomb substrate includes:

a honeycomb core layer,

an upper plate body adhesively fixed to an upper surface of the honeycomb core layer by a thermosetting adhesive, an

The lower plate body is bonded and fixed on the lower surface of the honeycomb core layer through a thermosetting adhesive;

the panel is adhesively secured to the upper surface of the upper panel body by a thermosetting or hot melt adhesive.

On the basis of the technical scheme, the application also comprises the following preferable scheme:

the floor board is characterized in that the adhesive for bonding the panel and the honeycomb substrate forms a continuous compact adhesive layer between the panel and the honeycomb substrate.

The honeycomb core layer is a metal honeycomb, and the upper plate body and the lower plate body are metal plates.

The honeycomb core layer is an aluminum honeycomb or a steel honeycomb, and the upper plate body and the lower plate body are aluminum plates or steel plates.

The honeycomb core layer is made of high-temperature-resistant plastic.

The panel is a marble plate, a tile plate, a wood plate or a plastic plate.

And a buckle mounting gap positioned around the honeycomb core layer is formed between the upper plate body and the lower plate body, and floor buckles welded or bonded and fixed with the upper plate body or/and the lower plate body are embedded in the buckle mounting gap.

The floor buckle is provided with a panel positioning bulge which is higher than the upper surface of the upper plate body and is mutually abutted with the side edge of the panel in the horizontal direction.

The application can realize the following beneficial effects:

1. this application will supply the people to trample the panel of walking and the honeycomb panel complex of high structural strength bending resistance to compression makes the floor block together, has remain wear-resisting and the aesthetic property of wooden, marble or ceramic tile panel commonly used promptly, has compensatied the defect at the bottom of wooden, marble or ceramic tile panel structural strength commonly used moreover.

2. The present application adhesively secures the various structural layers of the honeycomb substrate using a thermosetting adhesive, rather than a conventional hot melt adhesive, and provides a practical method of bonding. And then the upper panel can be bonded on the upper surface of the honeycomb substrate by means of other thermosetting or hot melt adhesive with high curing speed and strong controllability, so that the manufacturing efficiency of the floor block is improved.

3. When the honeycomb substrate is made of the metal material with rapid heat conduction, the heating plate providing heat is attached to the side of the honeycomb substrate, which is far away from the panel, and the heat is quickly guided to the thermosetting or hot-melt adhesive between the panel and the honeycomb substrate by the honeycomb substrate made of the metal material, so that the panel and the honeycomb substrate are bonded and fixed. In the manufacturing process, the panel does not bear high temperature, so that the upper panel can be made of various temperature-resistant or non-temperature-resistant materials, and is very ingenious. Moreover, the metal honeycomb plate has excellent compression resistance and bending resistance, which are just suitable for the use environment of the floor blocks paved on the ground, and just meet the use requirements of the floor blocks. Based on this, can make the panel of upper strata thin to several millimeters, save timber and stone material especially the use amount of famous and precious timber and stone material greatly. Further, when the floor block is used as a floor heating floor, the metal honeycomb substrate can guide heat of a heat source below to the panel quickly and then is dissipated to the indoor space through the panel, and indoor temperature is increased rapidly. And the floor heating system provided with the floor block can be started and heated immediately, the temperature of a heat source below the floor block does not need to be higher, the floor heating system can be normally used only by keeping the temperature at about 30 ℃, and the energy consumption is extremely low.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings of the embodiments will be briefly introduced below, and it is apparent that the drawings in the following description only relate to some embodiments of the present application and are not limiting on the present application.

Fig. 1 is a schematic cross-sectional structure of a floor board in the width direction in the first embodiment of the present application.

Fig. 2 is a schematic cross-sectional structure of the floor board along the length direction in the first embodiment of the application.

Fig. 3 is a schematic view of a connection structure of two adjacent floor boards in one embodiment of the present application.

Fig. 4 is a schematic structural diagram of a honeycomb substrate according to an embodiment of the present application.

Fig. 5 is an illustration of a method of making a floor panel in a first embodiment of the present application.

Fig. 6 is an illustration of a method of manufacturing a floor panel according to a second embodiment of the present application.

Fig. 7 is a schematic structural diagram of a completed floor board in the second embodiment of the present application.

Fig. 8 is a schematic perspective view of a three-honeycomb substrate according to an embodiment of the present application.

Fig. 9 is a schematic structural diagram of an upper plate of a three-honeycomb substrate according to an embodiment of the present application in a separated state.

Fig. 10 is an enlarged view of the X1 portion of fig. 9.

Fig. 11 is a schematic structural view of the lower plate of the three honeycomb substrates of the embodiment of the present application in a separated state.

Fig. 12 is an enlarged view of the X2 portion of fig. 11.

Fig. 13 is a schematic structural diagram of an upper plate of a four-honeycomb substrate according to an embodiment of the present application in a separated state.

Fig. 14 is a schematic structural view of the lower plate of the four-honeycomb substrate according to the embodiment of the present application in a separated state.

Wherein: 1-substrate, 2-panel, 3-floor buckle, 4-adhesive layer, 5-heating plate, 6-hot melt adhesive film;

101-upper plate body, 102-lower plate body, 103-honeycomb core layer, 1 a-floor buckle embedding gap, 1031-metal sheet, 1032-stamping protrusion, 1031 a-upper surface of the metal sheet, 1032 a-lower surface of the stamping protrusion, 10321-cylindrical groove, 10322-circular column groove, 10323-inner hole of the cylindrical stamping protrusion, 10321 a-top groove wall of the cylindrical groove, 10322 a-bottom groove wall of the circular column groove, and 301-panel positioning protrusion.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings of the embodiments of the present application. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the application without any inventive step, are within the scope of protection of the application.

Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs. The use of the terms "a" or "an" and the like in the description and in the claims of the present application do not denote a limitation of quantity, but rather denote the presence of at least one.

In the description of the present specification and claims, the terms "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present application and simplifying the description, but do not indicate or imply that the referred device or unit must have a specific direction, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.

Embodiments of the present application will now be described with reference to the accompanying drawings.

The first embodiment is as follows:

fig. 1 to 5 show a preferred embodiment of the floor panel of the present application, which, in the same way as the floor panel constructions mentioned in the introduction, also comprises a honeycomb substrate 1 and a panel 2 abutting and fixed to the upper surface of the honeycomb substrate.

Unlike conventional honeycomb panels:

the honeycomb substrate 1 in the present embodiment includes: the honeycomb core layer 103 is bonded to the upper plate 101 fixed to the upper surface of the honeycomb core layer by a thermosetting adhesive (not a hot melt adhesive) and bonded to the lower plate 102 fixed to the lower surface of the honeycomb core layer by a thermosetting adhesive (not a hot melt adhesive). The face plate 2 is adhesively fixed to the upper surface of the upper plate body 101 by a thermosetting adhesive.

When manufacturing the floor board:

firstly, liquid thermosetting adhesive is coated on the upper surface of the lower plate body 102 and the lower surface of the upper plate body 101, the honeycomb core layer 103 is arranged between the lower plate body 102 and the upper plate body 101, clamping force which is close to each other to press the middle honeycomb core layer 103 is applied to the lower plate body 102 and the upper plate body 101, high temperature is applied to cure the thermosetting adhesive, and therefore the lower plate body 102, the upper plate body 101 and the honeycomb core layer 103 are fixedly connected, and the honeycomb substrate 1 is manufactured. The thickness of the liquid thermosetting adhesive, especially the liquid thermosetting adhesive on the lower surface of the upper plate body, is controlled. The coating is too little, and the bonding strength between the upper plate body and the lower plate body and the honeycomb core layer is low. If the coating is too much, the adhesive on the lower surface of the upper plate body is easy to drip down.

Thereafter, another thermosetting adhesive is applied to the lower surface of the panel 2 or/and the upper surface of the upper plate body 101, the panel 2 is placed against the upper surface of the upper plate body 101, and downward pressure is applied to the panel 2, so that the thermosetting adhesive between the panel 2 and the upper plate body 101 is uniformly spread by the aforementioned pressure. The heating plate 5 is disposed to abut against the lower surface of the lower plate 102, and heat generated from the heating plate 5 is transferred to the thermosetting adhesive between the panel 2 and the upper plate 101 through the lower plate 102, the honeycomb core layer 103, and the upper plate 101 in sequence, and the thermosetting adhesive is cured at a high temperature to fixedly connect the panel 2 and the upper plate 101.

Because the thermosetting adhesive between the panel 2 and the upper plate body 101 is uniformly dispersed under the action of pressure in the manufacturing process, after the manufacturing is completed, the cured thermosetting adhesive can form a continuous and compact adhesive layer 4 between the panel 2 and the upper plate body 101 of the honeycomb substrate, and no hole or groove exists between the panel 2 and the substrate 1, so that the floor block can bear great vertical load and vertical impact force.

In order to accelerate the heat transfer rate of the thermosetting adhesive between the panel 2 and the upper plate 101 on the heating plate 5 and further improve the manufacturing efficiency of the floor block, the honeycomb substrate in the embodiment adopts a metal honeycomb plate which is heat-conducting and has strong temperature resistance. Specifically, the upper plate 101 and the lower plate 102 of the honeycomb substrate 1 are both aluminum plates, and the middle honeycomb core layer 103 is an aluminum honeycomb. Of course, if the upper plate body 101 and the lower plate body 102 are made of steel plates and the middle honeycomb core layer 103 is made of steel honeycombs, the heat transfer rate is also high.

In some other embodiments of the present application, other temperature-resistant materials, such as temperature-resistant plastics, may also be used for the honeycomb core layer 103.

The face sheet 2 in this embodiment is a wood sheet, but it may be a marble sheet, a ceramic tile sheet, or a plastic sheet, or may be an abrasion resistant coating applied to the upper surface of the honeycomb substrate.

In the present embodiment, floor buckles 3 are fixedly connected to four sides of the honeycomb substrate 1, so that the floor boards can be butted against each other by means of the floor buckles 3 at the sides to form a floor system of large area laid on the ground.

The floor buckle 3 is connected at the side position of the honeycomb substrate 1 in such a way that: the area of the honeycomb core layer 103 in the honeycomb substrate is smaller than the areas of the upper plate body 101 and the lower plate body 102, and each side edge of the honeycomb core layer 103 is located inside the corresponding side edge of the upper plate body 101 and the lower plate body 102, so that a floor buckle embedding gap 1a located around the honeycomb core layer 103 is formed between the upper plate body 101 and the lower plate body 102. The floor buckle 3 is fitted into the buckle fitting gap 1 a. The floor buckle portion fitted into the floor buckle fitting gap 1a is bonded and fixed to the upper plate 101 and the lower plate 102.

The floor buckle 3 may be welded to only one of the upper plate 101 and the lower plate 102. The advantage of so designing lies in: the assembling efficiency of the floor buckle 3 and the honeycomb substrate 1 is improved. But has the defects that: the floor buckle 3 is slightly weak in connection strength with the honeycomb substrate 1.

The adhesive used for bonding the floor button 3 and the honeycomb substrate 1 may be a high-temperature-resistant thermosetting adhesive, so that the upper panel 2 can be bonded by the above-described process after the floor button 3 is assembled with the honeycomb substrate 1.

When the floor block is manufactured, the floor buckle 3 is assembled with the honeycomb substrate 1, and then the panel 2 is covered on the upper surface of the honeycomb substrate 1. If the structure of the installation position of the positioning panel 2 is not arranged on the honeycomb substrate 1 or the floor buckle 3, the relative positions of the upper panel 2 and the honeycomb substrate 1 of each floor block are not uniform, and then after the floor blocks are connected together, gaps between the adjacent floor blocks are different in size, so that the appearance is influenced. Even the severe situation may result in the panels being unable to be assembled together.

For the above reason, the present embodiment provides the panel positioning projections 301 projecting upward and higher than the upper surface of the honeycomb substrate 1 on each floor buckle 3, and after the assembly is completed, the side edges of the panel 2 and the panel positioning projections 301 abut against each other in the horizontal direction.

During assembly, after the floor buckle 3 is connected with the honeycomb substrate 1, the panel positioning bulges 301 on the floor buckle 3 protrude out of the upper surface of the honeycomb substrate 1, so that prepositioning is provided for mounting the panel 2, and then the panel 2 is bonded and assembled under the positioning action of the panel positioning bulges 301.

Of course, the floor buckles 3 may be installed after the assembly of the honeycomb substrate 1 and the panel 2 is completed, even without disposing the floor buckles 3.

The floor block mainly bears the vertical load who comes from the top in the use, in order to promote this floor block's the ability of bearing vertical load and vertical impact, this embodiment is with the whole vertical setting of lining up of each honeycomb hole of the honeycomb sandwich layer of its honeycomb base plate.

The term "thermosetting adhesive" as used herein includes both adhesives that cure by heating and adhesives that cure by heating at an increased rate.

Example two:

figures 6 and 7 show another preferred embodiment of a floor panel of the kind of the present application, which is essentially identical in construction to the first embodiment, with the main differences being only that:

the face plate 2 is adhesively fixed to the upper surface of the upper plate body 101 by means of a hot melt adhesive (instead of the thermosetting adhesive in the first embodiment).

Further, the face plate 2 and the upper plate 101 of the honeycomb substrate 1 are fixed by adhesion with a hot melt adhesive film 6 interposed therebetween.

Referring to fig. 6, when manufacturing the floor panel:

firstly, liquid thermosetting adhesive is coated on the upper surface of the lower plate body 102 and the lower surface of the upper plate body 101, the honeycomb core layer 103 is arranged between the lower plate body 102 and the upper plate body 101, clamping force which is close to each other to press the middle honeycomb core layer 103 is applied to the lower plate body 102 and the upper plate body 101, high temperature is applied to cure the thermosetting adhesive, and therefore the lower plate body 102, the upper plate body 101 and the honeycomb core layer 103 are fixedly connected, and the honeycomb substrate 1 is manufactured.

After that, the assembly of the floor buckles 3 with the honeycomb substrate 1 is completed.

Then, the panel 2 is provided, the hot melt adhesive film 6 is clamped between the panel 2 and the upper plate body 101, the heating plate 5 is arranged on the lower surface of the lower plate body 102 in an attached mode, heat generated by the heating plate 5 is transmitted to the hot melt adhesive film 6 through the lower plate body 102, the honeycomb core layer 103 and the upper plate body 101 in sequence, the hot melt adhesive film 6 is melted at high temperature, heat of the heating plate 5 is removed, and the melted hot melt adhesive film is solidified at low temperature, so that the panel 2 is fixedly connected with the upper plate body 101.

The above-mentioned "removing the heat from the heating plate 5" includes two ways: firstly, the heating plate is withdrawn from the lower surface of the lower plate body 102; secondly, the heating current of the heating plate 5 is cut off or reduced, so that the temperature of the heating plate 5 is reduced. The above-mentioned "high temperature" and "low temperature" are relative and do not have fixed temperature values, and the meaning of "high temperature" and "low temperature" is generally understood by those skilled in the art.

After the manufacturing is completed, the melted and solidified hot melt adhesive film 6 also forms a continuous and compact adhesive layer between the panel 2 and the plate body 101 on the honeycomb substrate, and no hole or groove exists between the panel 2 and the plate body 101 on the honeycomb substrate.

Example three:

referring to fig. 8 to 12, the floor boards in this embodiment have substantially the same structure as the first embodiment, and the main difference is that the honeycomb core layer of the honeycomb substrate in this embodiment adopts another structure, so that the bonding area and bonding strength between the honeycomb core layer 103 and the upper board body 101 and the lower board body 102 are improved, and the possibility of the upper board body and the lower board body being separated from the honeycomb core layer is specifically as follows:

the honeycomb core layer 103 is made of a thin metal sheet 1031 and a plurality of downwardly protruding stamping protrusions 1032 stamped out of the metal sheet so as to be integrally formed on the metal sheet. The upper surface 1031a of the metal plate 1031 abuts against (the lower surface of) the upper plate body 101 and is adhesively fixed thereto, and the lower surface 1032a of the press projection 1032 abuts against (the upper surface of) the lower plate body 102 and is adhesively fixed thereto.

Considering that the upper surface of the lower plate body 102 is a planar structure, in order to increase the contact and bonding area of each stamping protrusion 1032 with the lower plate body 102, the present embodiment provides the lower surface 1032a of each stamping protrusion 1032 as a planar structure, and the lower surface 1032a of each stamping protrusion 1032 is arranged in the same plane.

Considering that the lower surface of the upper plate body 101 is also of a planar structure and the lower surface of the upper plate body 101 is parallel to the upper surface of the lower plate body 102, in order to increase the contact and adhesion area of the metal sheet 1031 to the upper plate body 101, the present embodiment further provides the upper surface 1031a of the metal sheet 1031 as a planar structure arranged in parallel to the lower surface 1032a of the stamping protrusion 1032.

Moreover, the sum of the areas of the lower surfaces 1032a of the stamping protrusions 1032 is equal to the area of the upper surface 1031a of the metal sheet 1031, so that the sum of the adhering areas of all the stamping protrusions 1032 and the lower plate body 102 is equal to the adhering area of the metal sheet 1031 and the upper plate body 101, the total adhering area of the honeycomb core layer is uniformly distributed, the connecting force between the honeycomb core layer 103 and the upper plate body 101 is equal to the connecting force between the honeycomb core layer 103 and the lower plate body 102, and the bonding force between the plate body on one side and the honeycomb core layer 103 is prevented from being obviously smaller than the bonding force between the plate body on the other side and the honeycomb core layer 103.

In this embodiment, the stamping protrusions 1032 are uniformly distributed in a matrix. And each punching boss 1032 is a circular cylindrical shape, and the circular cylindrical punching boss 1032 has formed therein: a cylindrical groove 10321 with an open bottom and a closed top, and a circular cylindrical groove 10322 with an open top and a closed bottom and surrounding the cylindrical groove. The upper surface of the top groove wall 10321a of the cylindrical groove 10321 abuts against and is adhesively fixed to the upper plate body 101, and the lower surface 1032a of the punched projection 1032 is formed on the bottom groove wall 10322a of the annular cylindrical groove 10322.

In order to improve the bonding area and bonding strength of the top end groove wall 10321a of the cylindrical groove and the upper plate body 101, the present embodiment sets the top end groove wall 10321a of the cylindrical groove 10321 to be a planar structure, and the upper surface of the top end groove wall 10321a of the cylindrical groove 10321 is arranged flush with the upper surface of the metal sheet 1031 — the upper surface of the top end groove wall 10321a of the cylindrical groove may be regarded as a part of the upper surface of the metal sheet 1031.

The method of manufacturing the honeycomb substrate will now be briefly described: a plurality of stamping protrusions 1032 projecting in the same direction in the thickness direction of the metal sheet 1031 are punched out of the metal sheet 1031 (by a circular cylindrical stamping head), and then the upper surface 1031a of the metal sheet 1031 is brought into contact with and adhesively fixed to the upper plate body 101, and the lower surface 1032a of each stamping protrusion 1032 is brought into contact with and adhesively fixed to the lower plate body 102.

In this embodiment, the annular cylindrical groove 10322 has a radial width gradually decreasing from the notch toward the groove bottom to facilitate the demolding of the press mold.

The metal sheet 1031 is preferably an aluminum sheet having good ductility, and the thickness thereof is generally selected to be 0.02 to 1 mm.

Example four:

referring to fig. 13 and 14, the floor board of the present embodiment has substantially the same structure as the third embodiment, and the main difference is that: the outer contour of each punch protrusion 302 in the honeycomb core layer is cylindrical.

Obviously, the stamping protrusion 302 may have other shapes, such as a polygonal prism shape.

However, the stamping protrusions 302 are preferably configured in the shape of circular columns in the third embodiment, so that the number of vertical supporting arms between the upper plate and the lower plate can be increased, and the bearing strength of the honeycomb substrate can be further improved.

The above are exemplary embodiments of the present application only, and are not intended to limit the scope of the present application, which is defined by the appended claims.

Claims (8)

1. A flooring block comprising:

a honeycomb substrate (1), and

a panel (2) attached to the upper surface of the honeycomb substrate;

characterized in that the honeycomb substrate (1) comprises:

a honeycomb core layer (103),

an upper plate body (101) adhesively fixed to an upper surface of the honeycomb core layer by a thermosetting adhesive, and

a lower plate body (102) adhesively fixed to a lower surface of the honeycomb core layer by a thermosetting adhesive;

the panel (2) is adhesively fixed to the upper surface of the upper plate body (101) by means of a thermosetting or hot-melt adhesive.

2. -floor panel according to claim 1, characterized in that the adhesive used for bonding the panel (2) to the honeycomb substrate (1) forms a continuous, dense adhesive layer (4) between the panel (2) and the honeycomb substrate (1).

3. -floor panel according to claim 1, characterized in that the honeycomb core (103) is a metal honeycomb and that the upper plate body (101) and the lower plate body (102) are metal plates.

4. -floor panel according to claim 3, characterized in that the honeycomb core (103) is an aluminium honeycomb or a steel honeycomb, and that the upper plate body (101) and the lower plate body (102) are aluminium or steel plates.

5. -floor panel according to claim 1, characterized in that said honeycomb core (103) is a high temperature resistant plastic.

6. -floor panel according to claim 1, characterized in that the panel (2) is a marble, tile, wood or plastic panel.

7. -floor panel according to claim 1, characterized in that between the upper panel body (101) and the lower panel body (102) a snap-fit mounting gap (1a) is formed around the honeycomb core (103), in which snap-fit mounting gap (1a) is embedded a floor covering (3) welded or adhesively fixed to the upper panel body (101) or/and the lower panel body (102).

8. -floor panel according to claim 7, characterized in that the floor covering (3) is provided with a panel positioning projection (301) which is higher than the upper surface of the upper panel body (101) and which is arranged against the side of the panel (2) in the horizontal direction.

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