CN212519832U - Heat radiator for electronic power device - Google Patents
Heat radiator for electronic power device Download PDFInfo
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- CN212519832U CN212519832U CN202021623510.1U CN202021623510U CN212519832U CN 212519832 U CN212519832 U CN 212519832U CN 202021623510 U CN202021623510 U CN 202021623510U CN 212519832 U CN212519832 U CN 212519832U
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- bottom plate
- rod
- fixed
- electronic power
- heat
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 49
- 230000007246 mechanism Effects 0.000 claims abstract description 27
- 238000009434 installation Methods 0.000 claims description 14
- 230000006978 adaptation Effects 0.000 claims description 6
- 241000883990 Flabellum Species 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
The utility model discloses a heat dissipation device of an electronic power device, which comprises a bottom plate, wherein a cover plate is arranged above the bottom plate; an annular radiating fin group is fixed at the top of the bottom plate and consists of a plurality of radiating fins which are uniformly distributed at the top of the bottom plate; a plurality of support rods are uniformly distributed on the circumference of the top of the bottom plate, and the top of each support rod is fixedly connected with a support disc; the top ends of two support rods which are symmetrical about the center of the bottom plate are fixed with a screw rod, the two screw rods respectively penetrate through the limiting holes on the cover plate, and the outer parts of the two screw rods are respectively connected with fastening nuts matched with the screw rods in a threaded fit manner; each supporting rod is fixedly connected with a circular rod, and a plurality of mounting rod groups are arranged on the circular rods; the outer side of the circular ring rod is provided with at least one heat dissipation mechanism matched with the mounting rod group; four heat-conducting plates of circumference equipartition are still gone to the top of bottom plate, the utility model discloses, have the characteristics that the radiating effect is good, use the flexibility good.
Description
Technical Field
The utility model relates to a heat dissipation technical field specifically is a heat abstractor of electron power device.
Background
The power electronic device is also called a power semiconductor device, is mainly used for high-power electronic devices in the aspects of electric energy conversion and control circuits of power equipment, and has wide application in life. It can produce heat in the course of working, usually need heat abstractor to carry out heat dissipation treatment to it.
The heat dissipation mechanism on the existing heat dissipation device adopts a fixed connection mode, so that the heat dissipation mechanism is inconvenient to rapidly disassemble and assemble, and different heat dissipation requirements are inconvenient to meet when the heat dissipation device is used; meanwhile, the position of the heat dissipation mechanism is inconvenient and flexible to adjust, and the heat dissipation mechanism is inconvenient to meet the requirement of dissipating heat of certain parts of the electronic device with high heat dissipation requirements, so that the flexibility of use is low.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat abstractor of electron power device to solve the problem that proposes among the above-mentioned background art.
In order to solve the technical problem, the utility model provides a following technical scheme: a heat dissipation device of an electronic power device comprises a bottom plate, wherein a cover plate is arranged above the bottom plate; an annular radiating fin group is fixed at the top of the bottom plate and consists of a plurality of radiating fins which are uniformly distributed at the top of the bottom plate; a plurality of support rods are uniformly distributed on the circumference of the top of the bottom plate, and the top of each support rod is fixedly connected with a support disc; the top ends of two support rods which are symmetrical about the center of the bottom plate are fixed with a screw rod, the two screw rods respectively penetrate through the limiting holes on the cover plate, and the outer parts of the two screw rods are respectively connected with fastening nuts matched with the screw rods in a threaded fit manner; each supporting rod is fixedly connected with a circular rod, and a plurality of mounting rod groups are arranged on the circular rods; the outer side of the circular ring rod is provided with at least one heat dissipation mechanism matched with the mounting rod group; four heat-conducting plates are uniformly distributed on the top of the bottom plate in the circumferential direction and are in contact with the heat-radiating fin group.
Furthermore, the mounting rod group comprises two mounting rods fixed on the circular rod.
Further, heat dissipation mechanism includes fan housing, fan housing's internally mounted has driving motor, the driving motor output has the flabellum through drive shaft connection, fan housing is last to be fixed with two fixed blocks, two the top of fixed block is fixed with respectively one with the spacing sleeve of installation pole looks adaptation.
Furthermore, the mounting rod is inserted in the limiting sleeve, and the mounting rod and the through hole of the limiting sleeve are in interference fit.
Further, the bottom equipartition of apron a plurality ofly with the spacing groove of supporting disk looks adaptation, the supporting disk top contacts with spacing groove roof.
Furthermore, the heat conducting plates jointly surround a square groove.
Furthermore, a plurality of mounting blocks are fixed on the outer side of the bottom plate, and second mounting holes are formed in the mounting blocks.
Furthermore, a plurality of first mounting holes are formed in the bottom plate.
Compared with the prior art, the utility model discloses the beneficial effect who reaches is: the utility model discloses, through being provided with a plurality of installation pole groups and being used for demountable installation heat dissipation mechanism, can utilize one or more heat dissipation mechanisms to be used for dispelling the heat of annular fin group, be convenient for improve the radiating effect; the installation rod sets are arranged in a plurality of numbers, so that the heat dissipation mechanisms can be installed at different positions, and one or more parts of the electronic device with high heat dissipation requirements can be efficiently dissipated; the heat dissipation mechanism is disassembled and assembled, so that different heat dissipation requirements can be met conveniently.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is an overall exploded view of the present invention;
FIG. 3 is a schematic view of the cover plate structure of the present invention;
FIG. 4 is a schematic view of the heat-conducting plate of the present invention;
fig. 5 is a schematic structural view of the heat dissipation mechanism of the present invention;
in the figure: 1. a base plate; 11. a first mounting hole; 2. mounting blocks; 21. a second mounting hole; 3. a support bar; 31. a support disc; 4. a heat dissipation mechanism; 41. a fan housing; 42. a drive motor; 43. a fixed block; 44. a limiting sleeve; 45. a fan blade; 5. fastening a nut; 6. a cover plate; 61. a limiting hole; 62. a limiting groove; 7. an annular fin group; 71. a heat sink; 8. a ring rod; 81. installing a rod group; 811. mounting a rod; 9. a stud; 10. a heat conducting plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides a technical solution: a heat dissipating double-fuselage of the electronic power device, including the bottom plate 1, there is cover plate 6 above the bottom plate 1; the top of the bottom plate 1 is fixed with an annular radiating fin group 7, and the annular radiating fin group 7 consists of a plurality of radiating fins 71 which are uniformly distributed on the top of the bottom plate 1; a plurality of support rods 3 are uniformly distributed on the circumference of the top of the bottom plate 1, each support rod 3 is positioned outside the annular radiating fin group 7, and the top of each support rod 3 is fixedly connected with a support disc 31; wherein, the top ends of two support rods 3 which are symmetrical about the center of the bottom plate 1 are fixed with a screw rod, the two screw rods respectively pass through the limit holes 61 on the cover plate 6, and the outer parts of the two screw rods are respectively connected with fastening nuts 5 which are matched with the screw rods through screw thread matching; each support rod 3 is fixedly connected with a circular rod 8, and a plurality of mounting rod groups 81 are arranged on the circular rods 8; the outer side of the circular ring rod 8 is provided with at least one heat dissipation mechanism 4 matched with the mounting rod group 81; four heat-conducting plates 10 are uniformly distributed on the top of the bottom plate 1, and the four heat-conducting plates 10 are in contact with the radiating fins 71.
The mounting rod set 81 includes two mounting rods 811 fixed to the ring rod 8, and the mounting rods 811 are used for mounting the heat dissipation mechanism 4, so as to fix the heat dissipation mechanism 4 to the ring rod 8.
The bottom equipartition of apron 6 is a plurality of and the spacing groove 62 of supporting disk 31 looks adaptation, and supporting disk 31 top contacts with spacing groove 62 roof, and the installation of the apron 6 of being convenient for is spacing.
The heat conducting plates 10 are jointly surrounded into a square groove, and the square groove is beneficial to the installation and fixation of the electrical elements.
A plurality of mounting blocks 2 are fixed on the outer side of the bottom plate 1, second mounting holes 21 are formed in the mounting blocks 2, a plurality of first mounting holes 11 are formed in the bottom plate 1, and the device is convenient to mount through the first mounting holes 11 and the second mounting holes 21.
The working principle is that when the heat dissipation device works, two fastening nuts 5 are screwed out, the cover plate 6 is detached, the electronic power device is fixed in a square groove surrounded by the heat conduction plates 10, then the cover plate 6 is installed, each limiting groove 62 is matched with each supporting plate 31, two studs 9 penetrate through two limiting holes 61, the two fastening nuts 5 are screwed in to complete the fixation of the cover plate 6, heat generated when the electronic power device works is transferred to the annular heat dissipation plate group 7 through the heat conduction plates 10 to dissipate heat, meanwhile, the heat dissipation mechanism 4 on the annular rod 8 works, the fan blades 45 are driven to rotate through the driving motor 42, and the heat on the annular heat dissipation plate group 7 is quickly absorbed and dissipated; meanwhile, the heat dissipation mechanism 4 is arranged on the installation rod group 81, and an interference fit mode is adopted between the installation rod 811 and the through hole of the limiting sleeve 44, so that the heat dissipation mechanism 4 can be detachably arranged on the installation rod group 81, when the heat dissipation requirement of the electronic power device is high, a plurality of heat dissipation mechanisms 4 can be arranged to improve the heat dissipation effect, and the annular rod 8 is provided with a plurality of installation rod groups 81, so that the heat dissipation mechanisms 4 can be arranged at different positions, and the heat dissipation of a certain part or parts of the electronic power device with high heat dissipation requirements can be better realized; the heat dissipation mechanism 4 is detachably mounted, so that heat dissipation work can be performed only by the annular heat dissipation sheet group 7 under the condition that the heat dissipation requirement of the electronic power device is low, the use flexibility is high, different heat dissipation requirements can be met conveniently, and the use cost can be reduced.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. A heat dissipation device of an electronic power device is characterized in that: comprises a bottom plate (1), and a cover plate (6) is arranged above the bottom plate (1); an annular radiating fin group (7) is fixed at the top of the bottom plate (1), and the annular radiating fin group (7) consists of a plurality of radiating fins (71) which are uniformly distributed at the top of the bottom plate (1) in the circumferential direction; a plurality of support rods (3) are uniformly distributed on the circumference of the top of the bottom plate (1), and the top of each support rod (3) is fixedly connected with a support disc (31) respectively; wherein, the top ends of two support rods (3) which are symmetrical about the center of the bottom plate (1) are fixed with a screw rod, the two screw rods respectively pass through the limit holes (61) on the cover plate (6), and the outer parts of the two screw rods are respectively connected with fastening nuts (5) matched with the screw rods in a matching way through threads; each supporting rod (3) is fixedly connected with a circular ring rod (8), and a plurality of mounting rod groups (81) are arranged on the circular ring rods (8); at least one heat dissipation mechanism (4) matched with the mounting rod group (81) is arranged on the outer side of the circular ring rod (8); four heat-conducting plates (10) are uniformly distributed on the top of the bottom plate (1) in the circumferential direction, and the four heat-conducting plates (10) are in contact with the radiating fins (71).
2. A heat dissipating device for an electronic power device as claimed in claim 1, wherein: the mounting rod group (81) comprises two mounting rods (811) fixed on the circular rod (8).
3. A heat dissipating apparatus for an electronic power device as claimed in claim 2, wherein: heat dissipation mechanism (4) include fan housing (41), the internally mounted of fan housing (41) has driving motor (42), driving motor (42) output has flabellum (45) through the drive shaft connection, be fixed with two fixed blocks (43) on fan housing (41), two the top of fixed block (43) is fixed with one respectively with spacing sleeve (44) of installation pole (811) looks adaptation.
4. A heat dissipating device for an electronic power device as claimed in claim 3, wherein: the mounting rod (811) is inserted in the limiting sleeve (44) and is in interference fit with the through hole of the limiting sleeve (44).
5. A heat dissipating device for an electronic power device as claimed in claim 1, wherein: the bottom equipartition of apron (6) a plurality ofly with spacing groove (62) of supporting disk (31) looks adaptation, supporting disk (31) top and spacing groove (62) roof contact.
6. A heat dissipating device for an electronic power device as claimed in claim 1, wherein: the heat-conducting plates (10) jointly enclose a square groove.
7. A heat dissipating device for an electronic power device as claimed in claim 1, wherein: the outer side of the bottom plate (1) is fixed with a plurality of mounting blocks (2), and second mounting holes (21) are formed in the mounting blocks (2).
8. A heat dissipating device for an electronic power device as claimed in claim 1, wherein: a plurality of first mounting holes (11) are formed in the bottom plate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021623510.1U CN212519832U (en) | 2020-08-07 | 2020-08-07 | Heat radiator for electronic power device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021623510.1U CN212519832U (en) | 2020-08-07 | 2020-08-07 | Heat radiator for electronic power device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212519832U true CN212519832U (en) | 2021-02-09 |
Family
ID=74383749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021623510.1U Expired - Fee Related CN212519832U (en) | 2020-08-07 | 2020-08-07 | Heat radiator for electronic power device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212519832U (en) |
-
2020
- 2020-08-07 CN CN202021623510.1U patent/CN212519832U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210209 |