CN212519758U - Adapter - Google Patents

Abstract

The embodiment of the application provides an adapter relates to electronic equipment technical field, can even each partial difference in temperature of shell, reduces the local hot spot temperature of shell, improves the radiating effect. The adapter includes: a housing, in which an electrical element is arranged; the heat dissipation layer comprises a plurality of heat dissipation layer units, each heat dissipation layer unit is correspondingly arranged on the inner side wall of one shell, at least two heat dissipation layer units are arranged on the adjacent inner side walls of the shells, and the two heat dissipation layer units arranged on the adjacent inner side walls of the shells are connected. The adapter provided by the embodiment of the application can be used for interface conversion.

Description

Adapter

Technical Field

The application relates to the technical field of electronic equipment, in particular to an adapter.

Background

The adapter is an accessory which is frequently used in daily use of a mobile phone or a notebook computer, and the adapter is an interface converter, such as a power adapter or an information interface switching device. After heat generated by components inside the adapter during operation is transferred inside the adapter, the heat is finally dissipated outwards through the shell.

Taking the power adapters of mobile phones and notebook computers as an example, as the charging power of the mobile phones and the notebook computers is continuously increased, the power of the power adapters for charging the mobile phones and the notebook computers is also increased, and further, the heat generated in the power adapters is increased more and more. In addition, the shell of the current adapter is generally made of plastic, and the thermal conductivity coefficient of the plastic is very low, so that the transverse heat equalizing performance and the outward heat dissipation performance of the plastic shell are very poor.

Because the heat of the heating component inside the adapter finally needs to be dissipated through the plastic shell, but the heat conductivity coefficient of the plastic shell is low, the heat is poor in the capability of dissipating the heat to the whole surface, a local hot spot can be formed at the position of the shell corresponding to the heating component, and the shell temperature of the hot spot is increased.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides an adapter, can be even each partial difference in temperature of shell, reduces the local hot spot temperature of shell, improves the radiating effect.

In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions:

an embodiment of the present application provides an adapter, including:

a housing, in which an electrical element is arranged;

the heat dissipation layer comprises a plurality of heat dissipation layer units, each heat dissipation layer unit is correspondingly arranged on the inner side wall of one shell, at least two heat dissipation layer units are arranged on the adjacent inner side walls of the shells, and the two heat dissipation layer units arranged on the adjacent inner side walls of the shells are connected.

The embodiment of the application provides an adapter, because the inside wall in the casing is equipped with the heat dissipation layer, and the heat dissipation layer includes a plurality of heat dissipation layer units, correspond the heat dissipation layer that sets up at a inside wall of casing and can be called a heat dissipation layer unit, can disperse the inside heat of power adapter earlier by heat dissipation layer soaking through the heat dissipation layer, give off to the casing again on, and then improve the radiating effect. In addition, in order to improve the radiating effect, make to have two heat dissipation layer units to set up on the adjacent inside wall of casing at least, and should set up two heat dissipation layer units on the adjacent inside wall of casing and be connected, like this, when the heat dissipation layer unit on the arbitrary one of two adjacent inside walls of casing has the heat, can be with this heat transfer to the heat dissipation layer unit of its another adjacent inside wall on, and then make the area that the heat evenly distributed bigger, two adjacent heat dissipation layer units can the combined action, can even each part difference in temperature of shell, reduce the local hot temperature of shell, and the radiating effect obtains improving by a wide margin. In addition, the heat dissipation layer units on every two adjacent inner side walls of the shell are connected, so that a continuous annular heat conduction wall surrounding the inner wall of the adapter shell is formed, and the heat dissipation capacity of the shell is enhanced.

In a first realizable manner, the heat dissipation layer units on each two adjacent inner side walls of the shell are connected. The heat dissipation layer arranged on any inner side wall of the shell can be called as a heat dissipation layer unit, the number of the heat dissipation layer units can be multiple, namely, the heat dissipation layer units can be correspondingly arranged on any inner side walls of the shell. In a plurality of heat dissipation layer units that set up, heat dissipation layer unit on the adjacent inside wall can link to each other, also can not link to each other, in order to make the effect of heat dissipation samming better, can make the heat dissipation layer unit on every two adjacent inside walls of casing all be connected, like this, all heat dissipation layer units that can conveniently connect on the adjacent inside wall have all been connected, the heat of an arbitrary heat dissipation layer unit wherein can all conduct to other all heat dissipation layer units, and then further improved the effect of heat dissipation samming.

In a second realisable way, all inner side walls of the housing are provided with heat sink layer units. For each inner side wall in the shell, a heat dissipation layer unit can be arranged, or the heat dissipation layer unit is not arranged, and certainly, in order to enable all the inner side walls in the shell to have the temperature-equalizing heat dissipation function, all the inner side walls in the shell can be provided with the heat dissipation layer unit.

In a third implementation, the adapter is a switching connector, which has an output end and an input end, where the output end and the input end are generally plugs or wires, and the plugs or wires are used for transmitting current or signals, and are not suitable for electrically communicating with the housing of the adapter, otherwise, there is a great safety hazard. The heat sink layer may be made of a material that conducts heat, such as metal, but since the material may also be a conductor, the output and input terminals of the adapter are prevented from contacting the heat sink layer. Therefore, the inner side wall of the shell, which is provided with the output end and the input end, is not provided with a heat dissipation layer, so that potential safety hazards are avoided, the cost is reduced, and the manufacturing is convenient.

In a fourth realizable manner, the shell comprises a tubular main body and end covers covering two ends of the tubular main body, and the inner side wall of the tubular main body is provided with the heat dissipation layer unit. The shell shape and the process of the adapter have various forms; the shell can be arranged in a split way or can be integrally formed; the housing may be box-shaped or tubular, etc. For example, the casing includes a tubular main body and end covers covering both ends of the tubular main body, and with this structure, the heat dissipation layer unit may be disposed on the inner side wall of the tubular main body, or on the inner side wall of the end cover, or of course, both the inner side wall of the tubular main body and the inner side wall of the end cover may be disposed with the heat dissipation layer unit. In the structure of the shell, generally, the tubular main body is a main supporting and accommodating structure, and no matter the end cover is provided with the heat dissipation layer unit, the heat dissipation layer unit is preferentially arranged on the inner side wall of the tubular main body, so that on one hand, the tubular main body basically covers the whole area in the shell, the heat source is ensured to be contacted, and the uniform temperature heat dissipation effect is improved; on the other hand, the tubular main body is generally high in structural strength, and a heat dissipation layer unit is convenient to arrange.

In a fifth realizable mode, all inner side walls of the tubular main body are provided with the heat dissipation layer units, and the plurality of heat dissipation layer units are connected, so that the heat dissipation layer is in a tubular structure. Under the prerequisite that the casing includes the tubular main part, all inside walls of tubular main part can be that the part sets up the heat dissipation layer unit, also can be all set up the heat dissipation layer unit, and if set up the heat dissipation layer unit on the adjacent inside wall of tubular main part, can be connected these two adjacent heat dissipation layer units, and is further, all inside walls of tubular main part all are provided with the condition of heat dissipation layer unit, can connect into a tubular structure with all heat dissipation layer units, have added the one deck heat dissipation layer again in the inboard of tubular main part equivalently, can improve the effect of dispelling the temperature of the heat.

In a sixth realizable manner, the shell comprises an upper shell and a lower shell which are buckled with each other, and the heat dissipation layer unit is arranged on the inner side wall of the upper shell and/or the lower shell of the shell. The other structure of the shell of the adapter can be that the shell comprises an upper shell and a lower shell, wherein the upper shell and the lower shell can be buckled together, and under the structure, the heat dissipation layer unit can be arranged on the inner side wall of the upper shell of the shell, can also be arranged on the inner side wall of the lower shell, and can also be arranged on the inner side walls of the upper shell and the lower shell. Compared with the scheme that the inner side walls of the upper shell and the lower shell are arranged, the area of heat dissipation and temperature equalization can be increased, the area which can be covered by the heat dissipation layer unit is the largest, and the heat dissipation and temperature equalization effect is good.

In a seventh implementation manner, the inner side walls of the upper shell and the lower shell are both provided with heat dissipation layer units, and the heat dissipation layer units on the inner side walls of the upper shell are connected with the heat dissipation layer units on the inner side walls of the lower shell. In the scheme that the inner side walls of the upper shell and the lower shell are provided with the heat dissipation layer units, the heat dissipation layer units on the inner side walls of the upper shell and the heat dissipation layer units on the inner side walls of the lower shell can be connected together or separated, the temperature equalization area can be increased through the scheme of connection, and the heat dissipation effect is improved.

In an eighth implementable manner, the inner side walls of the upper shell and the lower shell are both provided with heat dissipation layer units, and the heat dissipation layer units on the inner side wall of the upper shell and the heat dissipation layer units on the inner side wall of the lower shell are avoided from being arranged. The inside wall of epitheca and inferior valve all is equipped with heat dissipation layer unit, though the heat dissipation layer unit of the inside wall of epitheca and the heat dissipation layer unit of the inside wall of inferior valve link together and can increase the samming area, the heat dissipation effect is improved, however, in the production assembly of reality, probably because the thickness of epitheca and inferior valve is less, the position that is connected at epitheca and inferior valve will generally set up the structure that is used for connecting, probably spill and just in time connect the mode of laminating more difficulty when epitheca and inferior valve assemble at the design heat dissipation layer, consequently, for the convenience of the design manufacturing and assembly, the heat dissipation layer unit of the inside wall of the epitheca and the heat dissipation layer unit of the inside wall of inferior valve can.

In a ninth implementation, the lower shell is a box-like structure with an opening, the upper shell is a plate-like structure, and the upper shell cover is arranged at the opening of the lower shell. In the scheme that the shell of the adapter comprises an upper shell and a lower shell which can be buckled with each other, the upper shell and the lower shell can be of a box-shaped structure, and the other plate-shaped structure, and the part cover of the plate-shaped structure is arranged at the opening of the layout of the box-shaped structure; or two box-shaped structures can be adopted, and the openings of the parts of the two box-shaped structures are opposite and buckled together.

In a tenth implementable manner, the lower case is a box-shaped structure, and the inner side wall of the lower case is provided with a heat dissipation layer unit in a U-shaped structure. When epitheca or inferior valve are box-like structure, the heat dissipation layer unit can set up on partial inside wall, also can set up on all inside walls, wherein, the more radiating effect that the heat dissipation layer unit set up is better. In addition, the output end and the input end of the adapter are generally arranged at two opposite ends, in order to avoid the interference of the heat dissipation layer unit with the output end and the input end, the heat dissipation layer unit is not arranged on two opposite inner side walls of the shell, which are provided with the output end and the input end, and then the cross section of the structure formed by the final heat dissipation layer unit is in a U-shaped structure.

In an eleventh implementable manner, the electrical component within the housing is connected in contact with the heat dissipation layer. The housing is provided with electrical components therein, which are the source of heat generation. The heat that the electric elements during operation produced can be indirect transfer to the heat dissipation layer, also can be direct transfer to the heat dissipation layer on, compares, and the heat transfer efficiency of direct transfer is higher, and then the heat dissipation is rapid, and the samming is effectual. Thus, the electrical component in the housing is connected in contact with the heat dissipation layer.

In a twelfth implementable manner, the heat dissipation layer is a thermally conductive sheet made of a thermally conductive material. The realization of heat dissipation layer can be the sheet structure of making alone, also can adopt the heat conduction material to pile up or mode such as cladding material in the casing and realize, wherein, makes the sheet structure alone earlier with the heat dissipation layer, again with the casing assembly, easily realizes, convenient production.

In a thirteenth realizable manner, the heat-conducting sheet is a metal sheet or a heat-conducting graphite sheet. The heat conducting sheet is made of heat conducting material, such as metal sheet or graphite sheet.

In a fourteenth implementation manner, the housing is provided with a groove corresponding to the heat conducting fin, the groove being adapted to the outer contour of the heat conducting fin, and the heat conducting fin is installed in the groove. In order to facilitate the assembly of the heat conducting fin and the shell, the shell is provided with a groove matched with the outline of the heat conducting fin corresponding to the heat conducting fin, so that the heat conducting fin can be conveniently assembled in the groove, and the groove can play a limiting and guiding role on the heat conducting fin, thereby facilitating the assembly and facilitating the fixation.

In a fifteenth achievable mode, the thermally conductive sheet is bonded to an inner side wall of the housing. In order to fix the heat-conducting sheet to the inner side wall of the housing, the heat-conducting sheet may be bonded to the inner side wall of the housing.

Drawings

Fig. 1 is a schematic structural diagram of an adapter provided in the present application as a mobile phone charging adapter;

FIG. 2 is a schematic structural diagram of an adapter as a power adapter of a notebook computer according to an embodiment of the present disclosure;

FIG. 3 is a schematic cross-sectional view of an adapter housing including a tubular body according to an embodiment of the present disclosure;

FIG. 4 is a schematic structural view of an adapter according to an embodiment of the present disclosure, wherein the shell includes an upper shell and a lower shell that are fastened to each other;

fig. 5 is a second schematic structural view of the adapter according to the embodiment of the present application when the housing includes an upper shell and a lower shell that are fastened to each other.

Reference numerals:

a housing 1; a tubular body 11; an end cap 12; an upper case 13; a lower case 14; an electric element 2; 21 a circuit board; 22 a power element; a heat dissipation layer 3; a heat dissipation layer unit 31.

Detailed Description

The adapter generates heat when components inside the adapter work, taking the power adapter as an example, as shown in fig. 1, the power adapter of the mobile phone charger, as shown in fig. 2, the power adapter of the notebook computer, both of which are transmitting and converting current when working, can generate more heat. Specifically, power adapter is at the during operation, and inside heating element's heat can directly conduct to the plastic casing heat dissipation through heat-conducting medium material, but the coefficient of heat conductivity of plastic casing is low, and the heat diffusion is relatively poor to the radiating ability in whole shell surface, consequently, can form local hotspot in the shell position that heating element corresponds, and the shell temperature of hotspot risees, is unfavorable for the heat dissipation very much.

Moreover, when the power adapter is used, a person often needs to touch the power adapter directly, and the temperature of the power adapter is not high. Therefore, the temperature of the shell of the adapter rises, and does not meet the safety requirements, or the temperature experience is not good when the user touches the shell.

In addition, with the demand of mobile phones and notebook computers, the working power of the power adapter is continuously increased, and if the heat dissipation capability of the adapter cannot be increased, the performance of the adapter is affected, for example, the charging power is reduced. The operating power of the power adapter is continuously improved, and if the structure of the original adapter is kept unchanged, the adapter needs to be large in size to meet the temperature rise requirement, so that the power adapter is not beneficial to small and light design.

An embodiment of the present application provides an adapter, referring to fig. 3, 4, and 5, including:

a housing 1, wherein an electric element 2 is arranged in the housing 1;

the heat dissipation layer 3, the heat dissipation layer 3 includes a plurality of heat dissipation layer units 31, and every heat dissipation layer unit 31 corresponds and sets up on the inside wall of a casing 1, has at least two heat dissipation layer units 31 to set up on the adjacent inside wall of casing 1, and should set up two heat dissipation layer units 31 on the adjacent inside wall of casing 1 and be connected.

The adapter that the embodiment of this application provided, refer to fig. 3, fig. 4 and fig. 5, because the inside wall in casing 1 is equipped with heat dissipation layer 3, and heat dissipation layer 3 includes a plurality of heat dissipation layer units 31, correspond the heat dissipation layer 3 that sets up at a inside wall of casing 1 and can be called a heat dissipation layer unit 31, can disperse the inside heat of power adapter earlier by 3 soaking of heat dissipation layer through heat dissipation layer 3, give off to the casing again on, and then improve the radiating effect. In addition, in order to improve the heat dissipation effect, make to have two heat dissipation layer units 31 to set up on the adjacent inside wall of casing 1 at least, and should set up two heat dissipation layer units 31 on the adjacent inside wall of casing 1 and be connected, like this, when heat dissipation layer unit 31 on any one of two adjacent inside walls of casing 1 has the heat, can be with this heat transfer to the heat dissipation layer unit 31 of another adjacent inside wall thereof on, and then make the area that the heat evenly distributed bigger, two adjacent heat dissipation layer units 31 can the combined action, can even each part difference in temperature of shell, reduce the local hot spot temperature of shell, and the heat dissipation effect obtains improving by a wide margin. In addition, the heat dissipation effect of the adapter can be greatly improved without increasing the size of the adapter, and the small and light design is facilitated.

In the multiple heat dissipation layer units 31, the heat dissipation layer units 31 on the adjacent inner side walls of the housing 1 may be connected or not connected, and in order to achieve better heat dissipation and temperature equalization effects, the heat dissipation layer units 31 on every two adjacent inner side walls of the housing 1 may be connected, as shown in fig. 3 and 4, the heat dissipation layer units 31 on every two adjacent inner side walls of the housing 1 are connected. The heat dissipation layer disposed on any inner sidewall of the housing 1 may be referred to as a heat dissipation layer unit 31, and the number of the heat dissipation layer units 31 may be multiple, that is, the heat dissipation layer units 31 may be disposed on any number of inner sidewalls of the housing 1. Therefore, all the heat dissipation layer units 31 which are arranged on the adjacent inner side walls and can be conveniently connected are connected, the heat of any one heat dissipation layer unit 31 can be conducted to all other heat dissipation layer units 31, and the heat dissipation and temperature equalization effect is further improved.

The heat dissipation layer unit 31 may be disposed on each inner sidewall of the housing 1, or the heat dissipation layer unit 31 may not be disposed on each inner sidewall of the housing 1, and naturally, the heat dissipation layer units 31 may be disposed on all inner sidewalls of the housing 1 in order to make all inner sidewalls of the housing 1 have a uniform temperature heat dissipation function.

It should be noted that all the inner side walls of the housing 1 are provided with the heat dissipation layer units 31, and all the heat dissipation layer units 31 are connected one by one to form a whole, and finally the heat dissipation layer 3 is formed in the housing 1. In terms of process, the heat dissipation layer 3 may be a one-piece structure, and the heat dissipation layer 3 may be attached to the inner side wall of the housing 1 by bending or the like, and a portion of the heat dissipation layer 3 attached to a single inner side wall of the housing 1 may be referred to as a heat dissipation layer unit 31.

The adapter is a conversion connector and is provided with an output end and an input end, the output end and the input end are generally plugs or wires and the like, the plugs or the wires are used for transmitting current or signals and are not suitable for being electrically communicated with the shell 1 of the adapter, and otherwise, a larger potential safety hazard exists. The heat sink layer 3 may be made of a material that conducts heat, such as metal, but since the material may also be a conductor, it is avoided that the input and output terminals of the adapter are in contact with the heat sink layer 3. Therefore, the inner side wall of the shell 1, which is provided with the output end and the input end, is not provided with the heat dissipation layer 3, so that potential safety hazards are avoided, the cost is reduced, and the manufacturing is convenient.

It should be noted that, the inner side wall of the casing 1, which is provided with the output end and the input end, may also be provided with the heat dissipation layer 3, as long as the heat dissipation layer correspondingly avoids the output end and the input end. In this way, the effect of heat dissipation and temperature equalization can be maximized, but the morphological structure of the heat dissipation layer 3 in such a scheme is relatively complex to produce and assemble, and the cost is also increased, so generally, the heat dissipation layer 3 is not disposed on the inner side wall of the housing 1 where the output end and the input end are disposed.

The shell 1 of the adapter has various shapes and technologies; the shell 1 can be arranged in a split way or can be integrally formed; the housing 1 may be box-shaped or tubular, etc.

Referring to fig. 1, which is a power adapter of a mobile phone, the power adapter is generally a tubular housing structure, and specifically, referring to fig. 1 and 3, the housing 1 includes a tubular main body 11 and end caps 12 covering both ends of the tubular main body 11, and a heat dissipation layer unit 31 is disposed on an inner side wall of the tubular main body 11. The casing 1 includes a tubular main body 11 and end covers 12 covering both ends of the tubular main body 11, and with this structure, the heat dissipation layer unit 31 may be disposed on the inner side wall of the tubular main body 11, or on the inner side wall of the end cover 12, or of course, the heat dissipation layer unit 31 may be disposed on both the inner side wall of the tubular main body 11 and the inner side wall of the end cover 12. In the structure of the housing 1, generally, the tubular main body 11 is a main supporting and accommodating structure, and no matter the heat dissipation layer unit 31 is arranged at the end cover 12, it should be preferentially ensured that the heat dissipation layer unit 31 is arranged on the inner side wall of the tubular main body 11, so that on one hand, the tubular main body 11 basically covers the whole area in the housing 1, and ensures to contact with a heat source and improve the uniform temperature heat dissipation effect; on the other hand, the tubular body 11 generally has high structural strength, and facilitates the installation of the heat dissipation layer unit 31.

On the premise that the shell 1 comprises the tubular main body 11, all inner side walls of the tubular main body 11 can be partially provided with the heat dissipation layer units 31, or can be completely provided with the heat dissipation layer units 31, and if the heat dissipation layer units 31 are arranged on the adjacent inner side walls of the tubular main body 11, the two adjacent heat dissipation layer units 31 can be connected, further, under the condition that all inner side walls of the tubular main body 11 are provided with the heat dissipation layer units 31, all the heat dissipation layer units 31 can be connected into a tubular structure, namely, one heat dissipation layer 3 is additionally arranged on the inner side of the tubular main body 11, and the heat dissipation and temperature equalization effects can be improved. That is, specifically, referring to fig. 3, all inner sidewalls of the tubular body 11 are provided with the heat dissipation layer units 31, and the plurality of heat dissipation layer units 31 are connected such that the heat dissipation layer 3 has a tubular structure.

Referring to fig. 2, the power adapter of the notebook computer generally has a structure in which an upper case 13 and a lower case 14 are fastened, and specifically, referring to fig. 4 and 5, the power adapter may include the upper case 13 and the lower case 14, and the upper case 13 and the lower case 14 may be fastened together, and in this structure, the heat dissipation layer unit 31 may be disposed on an inner side wall of the upper case 13 of the housing 1, on an inner side wall of the lower case 14, or on both inner side walls of the upper case 13 and the lower case 14, the heat dissipation layer unit 31 may be disposed. Compared with the scheme that the inner side walls of the upper shell 13 and the lower shell 14 are arranged, the area of heat dissipation and temperature equalization can be increased, the area which can be covered by the heat dissipation layer unit 31 is the largest, and the heat dissipation and temperature equalization effect is good.

In the scheme that the inner side walls of the upper case 13 and the lower case 14 are both provided with the heat dissipation layer units 31, the heat dissipation layer units 31 of the inner side walls of the upper case 13 and the heat dissipation layer units 31 of the inner side walls of the lower case 14 may be connected together or separated, as shown in fig. 4, the inner side walls of the upper case 13 and the lower case 14 are both provided with the heat dissipation layer units 31, and the heat dissipation layer units 31 of the inner side walls of the upper case 13 are connected with the heat dissipation layer units 31 of the inner side walls of the lower case 14. The scheme of linking together can increase the samming area, improves the radiating effect.

The inside walls of the upper casing 13 and the lower casing 14 are both provided with the heat dissipation layer unit 31, although the heat dissipation layer unit 31 of the inside wall of the upper casing 13 and the heat dissipation layer unit 31 of the inside wall of the lower casing 14 are connected together to increase the temperature equalization area, thereby improving the heat dissipation effect, in the actual production assembly, the structure for connection is generally set at the position where the upper casing 13 and the lower casing 14 are connected, it is difficult to exactly connect the mode of fitting when the upper casing 13 and the lower casing 14 are assembled due to the leakage of the heat dissipation layer in the design, therefore, in order to facilitate the design, the manufacture and the assembly, the heat dissipation layer unit 31 of the inside wall of the upper casing 13 and the heat dissipation layer unit 31 of the inside wall of the lower casing 14 can avoid the setting. Specifically, as shown in fig. 5, the inner side walls of the upper case 13 and the lower case 14 are both provided with the heat dissipation layer unit 31, and the heat dissipation layer unit 31 on the inner side wall of the upper case 13 and the heat dissipation layer unit 31 on the inner side wall of the lower case 14 are arranged in a manner of avoiding each other.

In the case where the housing 1 of the adapter includes the upper case 13 and the lower case 14 that can be engaged with each other, referring to fig. 4 and 5, the upper case 13 and the lower case 14 may be of one box-like structure and the other plate-like structure, and the component cover of the plate-like structure is provided at the opening of the layout of the box-like structure; of course, it is also possible to have two box-like structures, the openings of the parts of which are opposite and snap together.

As shown in fig. 4 and 5, the lower case 14 has a box-like structure, and the inner side wall of the lower case 14 is provided with a heat dissipation layer unit 31 in a U-shaped structure. When the upper case 13 or the lower case 14 has a box-like structure, the heat dissipation layer unit 31 may be provided on a part of the inner side walls, or may be provided on all the inner side walls, wherein the more the heat dissipation layer unit 31 is provided, the better the heat dissipation effect is. In addition, the output end and the input end of the adapter are generally at the opposite ends, and in order to avoid the heat dissipation layer unit 31 interfering with the output end and the input end, the heat dissipation layer unit 31 is not arranged on the two opposite inner side walls of the housing 1 where the output end and the input end are arranged, and further, the cross section of the structure formed by the heat dissipation layer unit 31 is in a U-shaped structure finally.

It should be noted that, in the solutions shown in fig. 4 and 5, the lower casing 14 is a box-shaped structure, and the heat dissipation layer unit 31 disposed on the inner side wall of the lower casing 14 forms a U-shaped structure, while the upper casing 13 is a plate-shaped structure, and the corresponding heat dissipation layer unit 31 on the inner side wall of the upper casing 13 is also a plate-shaped structure; when the upper case 13 and the lower case 14 are fastened, all the heat dissipation layer units 31 are also finally formed into a tubular structure.

The housing 1 of the adapter contains electrical components 2, the electrical components 2 being the source of the heat generation. The heat that electric element 2 during operation produced can be indirect transfer to heat dissipation layer 3 on, also can be direct transfer to heat dissipation layer 3 on, and the comparison, the heat transfer efficiency of direct transfer is higher, and then the heat dissipation is rapid, and the samming is effectual. Therefore, as shown in fig. 3, 4, and 5, the electric element 2 in the case 1 is connected in contact with the heat dissipation layer 3.

It should be noted that, referring to fig. 3, 4 and 5, the electrical component 2 inside the housing 1 of the adapter may include a circuit board 21, and a plurality of power components 22 disposed on the circuit board 21, wherein the power components 22 include, but are not limited to, electronic components such as a transformer, a capacitor and an inductor.

In some embodiments, the heat dissipation layer 3 is a heat conductive sheet made of a heat conductive material. The realization of heat dissipation layer 3 can be the sheet structure of making alone, also can adopt the heat conduction material to pile up or mode such as cladding material in casing 1 and realize, wherein, makes sheet structure alone earlier with heat dissipation layer 3, assembles with casing 1 again, easily realizes convenient production.

The heat conducting sheet is made of heat conducting material, such as metal sheet or graphite sheet. Wherein, the metal sheet can be a copper sheet or an aluminum sheet but is not limited to these two high thermal conductive metal materials.

In order to facilitate the assembly of the heat conducting fin and the shell 1, and under the condition that the outer edge of the heat conducting fin does not exceed the inner side wall of the shell, the shell 1 is provided with a groove matched with the outer contour of the heat conducting fin corresponding to the heat conducting fin, and the heat conducting fin is arranged in the groove. The shell 1 is provided with a groove matched with the outline of the heat conducting fin, so that the heat conducting fin can be conveniently assembled in the groove, and the groove can play a limiting and guiding role on the heat conducting fin, thereby facilitating assembly and fixing.

In order to fix the heat-conducting sheet to the inner wall of the housing 1, the heat-conducting sheet may be bonded to the inner wall of the housing 1.

In addition, the conducting strip can be of a whole-piece structure, and when the conducting strip is made of a metal sheet, all parts of the conducting strip can be correspondingly attached to the inner side wall of the shell 1 through a bending process, so that the scheme that the conducting strip is arranged on the inner side wall of the shell 1 is realized. The fixing of the heat conducting sheet and the inner side wall of the housing 1 can be realized by injection molding or metal sheet gluing, but is not limited to these two realization modes.

In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims (33)

1. An adapter, comprising:

a housing having electrical components disposed therein;

the heat dissipation layer, the heat dissipation layer includes a plurality of heat dissipation layer units, every heat dissipation layer unit corresponds the setting and is in one on the inside wall of casing, have two at least heat dissipation layer unit sets up on the adjacent inside wall of casing, and should set up two on the adjacent inside wall of casing heat dissipation layer unit is connected.

2. The adapter of claim 1 wherein the heat sink units on each adjacent two inner side walls of the housing are connected.

3. An adapter according to claim 1 or 2, characterized in that all inner side walls of the housing are provided with the heat sink layer unit.

4. The adapter according to claim 1, wherein the housing comprises a tubular body and end caps covering both ends of the tubular body, and the inner side wall of the tubular body is provided with the heat dissipation layer unit.

5. The adapter according to claim 2, wherein the housing comprises a tubular body and end caps covering both ends of the tubular body, and the inner side wall of the tubular body is provided with the heat dissipation layer unit.

6. The adapter as claimed in claim 3 wherein the housing comprises a tubular body and end caps covering both ends of the tubular body, the inner side wall of the tubular body being provided with the heat dissipating layer unit.

7. The adapter according to claim 4, wherein all inner side walls of the tubular body are provided with the heat dissipation layer units, and a plurality of the heat dissipation layer units are connected to form the heat dissipation layer into a tubular structure.

8. The adapter according to claim 5, wherein all inner side walls of the tubular body are provided with the heat dissipation layer unit, and a plurality of the heat dissipation layer units are connected to form the heat dissipation layer into a tubular structure.

9. The adapter according to claim 6, wherein all inner side walls of the tubular body are provided with the heat dissipation layer units, and a plurality of the heat dissipation layer units are connected to form the heat dissipation layer into a tubular structure.

10. The adapter as claimed in claim 1, wherein the housing comprises an upper case and a lower case which are fastened to each other, and the heat dissipation layer unit is disposed at an inner sidewall of the upper case and/or the lower case of the housing.

11. The adapter as claimed in claim 2, wherein the housing comprises an upper case and a lower case which are fastened to each other, and the heat dissipation layer unit is disposed at an inner sidewall of the upper case and/or the lower case of the housing.

12. The adapter as claimed in claim 3, wherein the housing comprises an upper shell and a lower shell which are fastened to each other, and the heat dissipation layer unit is disposed on an inner sidewall of the upper shell and/or the lower shell of the housing.

13. The adapter as claimed in claim 10, wherein the inner side walls of the upper case and the lower case are provided with the heat dissipation layer unit, and the heat dissipation layer unit of the inner side wall of the upper case is connected with the heat dissipation layer unit of the inner side wall of the lower case.

14. The adapter as claimed in claim 11, wherein the inner side walls of the upper and lower cases are provided with the heat dissipation layer unit, and the heat dissipation layer unit of the inner side wall of the upper case is connected with the heat dissipation layer unit of the inner side wall of the lower case.

15. The adapter as claimed in claim 12, wherein the inner side walls of the upper case and the lower case are provided with the heat dissipation layer unit, and the heat dissipation layer unit of the inner side wall of the upper case is connected with the heat dissipation layer unit of the inner side wall of the lower case.

16. The adapter as claimed in claim 13, wherein the inner side walls of the upper case and the lower case are provided with the heat dissipation layer unit, and the heat dissipation layer unit of the inner side wall of the upper case and the heat dissipation layer unit of the inner side wall of the lower case are disposed to be avoided.

17. The adapter as claimed in claim 14, wherein the inner side walls of the upper case and the lower case are provided with the heat dissipation layer unit, and the heat dissipation layer unit of the inner side wall of the upper case and the heat dissipation layer unit of the inner side wall of the lower case are disposed to be avoided.

18. The adapter as claimed in claim 15, wherein the inner side walls of the upper case and the lower case are provided with the heat dissipation layer unit, and the heat dissipation layer unit of the inner side wall of the upper case and the heat dissipation layer unit of the inner side wall of the lower case are disposed to be avoided.

19. The adapter of claim 10 wherein the lower housing is a box-like structure having an opening and the upper housing is a plate-like structure, the upper housing cover being disposed at the opening of the lower housing.

20. The adapter of claim 11 wherein the lower housing is a box-like structure having an opening and the upper housing is a plate-like structure, the upper housing cover being disposed at the opening of the lower housing.

21. The adapter of claim 12 wherein the lower housing is a box-like structure having an opening and the upper housing is a plate-like structure, the upper housing cover being disposed at the opening of the lower housing.

22. The adapter of claim 13 wherein the lower housing is a box-like structure having an opening and the upper housing is a plate-like structure, the upper housing cover being disposed at the opening of the lower housing.

23. The adapter of claim 14 wherein the lower housing is a box-like structure having an opening and the upper housing is a plate-like structure, the upper housing cover being disposed at the opening of the lower housing.

24. The adapter of claim 15 wherein the lower housing is a box-like structure having an opening and the upper housing is a plate-like structure, the upper housing cover being disposed at the opening of the lower housing.

25. The adapter of claim 16 wherein the lower housing is a box-like structure having an opening and the upper housing is a plate-like structure, the upper housing cover being disposed at the opening of the lower housing.

26. The adapter of claim 17 wherein the lower housing is a box-like structure having an opening and the upper housing is a plate-like structure, the upper housing cover being disposed at the opening of the lower housing.

27. The adapter of claim 18 wherein the lower housing is a box-like structure having an opening and the upper housing is a plate-like structure, the upper housing cover being disposed at the opening of the lower housing.

28. The adapter of claim 1 wherein electrical components within the housing are in contact connection with the heat sink layer.

29. The adapter of claim 1 wherein said heat sink layer is a thermally conductive sheet of thermally conductive material.

30. The adapter of claim 29 wherein said thermally conductive sheet is a metal sheet or a thermally conductive graphite sheet.

31. The adapter as claimed in claim 30 wherein the housing is provided with a groove corresponding to the heat-conducting plate, the groove being adapted to the outer contour of the heat-conducting plate, the heat-conducting plate being fitted in the groove.

32. The adapter of claim 1 wherein said heat sink layer elements on each adjacent two of said inner sidewalls of said housing are joined to form a continuous annular heat conducting wall surrounding said inner wall of said adapter housing to enhance the heat dissipating capacity of said housing.

33. The adapter of claim 29 wherein said thermally conductive sheet is bonded to an interior sidewall of said housing.

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