CN221429187U - Electronic module, board card and electronic equipment - Google Patents

Abstract

The present disclosure relates to an electronic module, a board and an electronic device. The electronic module includes a main board, an auxiliary board, a chip component, a current control component and an electrical connector. The chip component is arranged on the main board, the current control component is arranged on the auxiliary board, the chip component and the current control component are electrically connected through the electrical connector, and the auxiliary board is configured to dissipate heat for the current control component. Through the above technical solution, on the one hand, compared with the current control component being arranged on the main board and dissipating heat through the main board, the auxiliary board will not be interfered or restricted by the chip component when dissipating heat for the current control component, and can provide a larger heat dissipation space for the current control component, so it has better heat dissipation efficiency and heat dissipation effect. On the other hand, it can also avoid the problem that the heat generated by the current control component affects the operation of the chip component or the heat generated by the chip component affects the operation of the current control component, thereby improving the efficiency of the electronic module.

Description

Electronic modules, boards and electronic devices

Technical Field

The present disclosure relates to the technical field of electronic modules, and in particular to an electronic module, a board and an electronic device.

Background technique

A current control component is a commonly used current control component in a circuit, which can convert changes in input voltage into changes in output current.

The current control component generates a certain amount of heat during operation. In the prior art, the heat generated by the current control component is generally dissipated through a PCB board. However, as the functions of electronic modules increase and their power increases, the PCB board can no longer meet the heat dissipation requirements of the current control component.

Utility Model Content

The purpose of the present disclosure is to provide an electronic module, a board and an electronic device to solve the technical problems existing in the related art.

In order to achieve the above-mentioned objectives, the first aspect of the present disclosure provides an electronic module, including a main board, an auxiliary board, a chip component, a current control component and an electrical connector, wherein the chip component is arranged on the main board, the current control component is arranged on the auxiliary board, the chip component and the current control component are electrically connected through the electrical connector, and the auxiliary board is configured to dissipate heat for the current control component.

Optionally, the auxiliary plate has a heat-conducting surface, and the heat-conducting surface is used to carry the current control component and contact the current control component.

Optionally, the auxiliary plate is made of a heat-conducting metal material, and an outer surface of the auxiliary plate is the heat-conducting surface.

Optionally, the auxiliary plate is made of aluminum.

Optionally, the auxiliary plate includes an auxiliary plate body and an auxiliary plate heat-conducting structure laid on the auxiliary plate body, the auxiliary plate heat-conducting structure includes at least one heat-conducting layer, and a surface of the heat-conducting layer facing away from the auxiliary plate body is the heat-conducting surface.

Optionally, there are multiple heat-conducting layers, and the multiple heat-conducting layers are stacked along the thickness direction of the auxiliary plate.

Optionally, the mainboard includes a mainboard body and a mainboard heat-conducting structure laid on the mainboard body, and the chip assembly is arranged on the mainboard heat-conducting structure;

Among them, the thermal conductivity of the auxiliary plate thermal conductive structure is the same as the thermal conductivity of the main board thermal conductive structure, and the thickness of the auxiliary plate thermal conductive structure is different from the thickness of the main board thermal conductive structure; or, the thermal conductivity of the auxiliary plate thermal conductive structure is different from the thermal conductivity of the main board thermal conductive structure.

Optionally, the heat conducting layer is a copper layer.

Optionally, the electrical connector is a flexible electrical connector.

Optionally, the flexible electrical connector is a flexible circuit board, one end of the flexible circuit board is electrically connected to the main board, and the other end of the flexible circuit board is electrically connected to the auxiliary board; or,

The flexible electrical connector is a wire, one end of which is electrically connected to the chip component, and the other end of which is electrically connected to the current control component.

Optionally, the electronic module further comprises a heat sink, and a side of the chip component facing away from the main board and a side of the current control component away from the auxiliary board are both in thermal contact with the heat sink.

Optionally, a side of the chip component facing away from the main board and a side of the current control component facing away from the auxiliary board are located in the same plane.

Optionally, the current control component includes a metal-oxide semiconductor field effect transistor.

A second aspect of the present disclosure provides a board card, comprising a board card body and the electronic module as described above, wherein the electronic module is mounted on the board card body.

A third aspect of the present disclosure provides an electronic device, comprising the board as described above.

Through the above technical solution, the chip component is arranged on the main board, and the current control component is arranged on the auxiliary board. The chip component and the current control component are electrically connected through an electrical connector, and the auxiliary board is constructed to be able to dissipate heat for the current control component. In this way, during the operation of the above electronic module, since the current control component is arranged on the auxiliary board, on the one hand, compared with setting the current control component on the main board and dissipating heat through the main board, the auxiliary board will not be interfered with or restricted by other structures (such as the chip component) when dissipating heat for the current control component, and can provide a larger heat dissipation space for the current control component, so it has better heat dissipation efficiency and heat dissipation effect, thereby avoiding the problem of overheating or burning of the current control component; on the other hand, since the chip component and the current control component are respectively arranged on the main board and the auxiliary board, it is also possible to avoid the problem that the heat generated by the current control component affects the operation of the chip component or the heat generated by the chip component affects the operation of the current control component, thereby improving the efficiency and service life of the electronic module.

Furthermore, precisely because the current control component and the chip component are respectively arranged on the auxiliary board and the main board, during the actual assembly process, the operator can adaptively increase or decrease the thickness, size and other parameters of the auxiliary board according to the heat dissipation requirements of the current control component, or, the auxiliary board can be manufactured using a material different from that of the main board, that is, the arrangement of the auxiliary board is not restricted by the main board.

In addition, since the above-mentioned current control component is arranged on the auxiliary board, it also provides a larger space for arranging the chip components on the main board (ie, PCB board), which is more conducive to improving the integration of the electronic module.

Other features and advantages of the present disclosure will be described in detail in the following detailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:

FIG1 is a schematic cross-sectional view of a resistor module provided by an exemplary embodiment of the present disclosure, wherein there are two heat-conducting layers, and the thickness of the auxiliary plate heat-conducting structure is different from the thickness of the main plate heat-conducting structure;

FIG2 is a cross-sectional schematic diagram of a resistor module provided by another exemplary embodiment of the present disclosure, wherein there is one heat-conducting layer, and the thickness of the auxiliary plate heat-conducting structure is different from the thickness of the main plate heat-conducting structure;

FIG3 is a schematic cross-sectional view of a resistor module provided by a third exemplary embodiment of the present disclosure, wherein the auxiliary plate is made of a thermally conductive metal material.

Description of Reference Numerals

1-electronic module; 10-main board; 11-main board body; 12-main board thermal conductive structure; 20-auxiliary board; 21-auxiliary board body; 22-auxiliary board thermal conductive structure; 220-thermal conductive layer; 221-thermal conductive surface; 30-chip assembly; 40-current control assembly; 41-metal-oxide semiconductor field effect transistor; 50-electrical connector; 60-heat sink.

Detailed ways

The specific implementation of the present disclosure is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the present disclosure, and is not used to limit the present disclosure.

In the present disclosure, unless otherwise stated, the directional words used, such as "thickness direction", are defined in terms of the thickness direction of the main board or auxiliary board, as shown in the drawing directions of Figures 1 to 3, "inside" and "outside" refer to the inside and outside of the corresponding structural contour, and "far" and "near" refer to the distance from the corresponding structure. The above-mentioned directional words are only for the convenience of describing the present disclosure, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present disclosure. In addition, it should be noted that the terms used, such as "first" and "second", etc., are used to distinguish one element from another element, and do not have order and importance.

The current control component is a commonly used current control component in the circuit, which can convert the change of input voltage into the change of input current, and will generate a lot of heat during its operation. At present, the heat generated by the current control component is generally first transferred to the PCB board, and then the heat is dissipated to the outside world through the PCB in the corresponding area with copper plating, thermal vias and other heat dissipation structures in the corresponding area. However, as the functions of electronic modules become more and more numerous and the power becomes higher and higher, the copper plating and thermal vias set on the PCB board can no longer meet the heat dissipation requirements of the current control component, which will cause the current control component to overheat or even burn the PCB board.

Based on this, referring to Figures 1 to 3, the first aspect of the present disclosure provides an electronic module 1, including a main board 10, an auxiliary board 20, a chip assembly 30, a current control assembly 40 and an electrical connector 50, the chip assembly 30 is arranged on the main board 10, the current control assembly 40 is arranged on the auxiliary board 20, the chip assembly 30 and the current control assembly 40 are electrically connected through the electrical connector 50, and the auxiliary board 20 is constructed to be able to dissipate heat for the current control assembly 40.

Through the above technical solution, the chip component 30 is arranged on the main board 10, and the current control component 40 is arranged on the auxiliary board 20, the chip component 30 is electrically connected to the current control component 40 through the electrical connector 50, and the auxiliary board 20 is configured to be able to dissipate heat for the current control component 40. In this way, during the operation of the above electronic module 1, since the current control component 40 is arranged on the auxiliary board 20, on the one hand, compared with the current control component 40 being arranged on the main board 10 and dissipating heat through the main board 10, the auxiliary board 20 will not be affected by other structures (such as The interference or limitation of the chip component 30) can provide a larger heat dissipation space for the current control component 40, so it has better heat dissipation efficiency and heat dissipation effect, thereby avoiding the problem of overheating or burning of the current control component 40; on the other hand, since the chip component 30 and the current control component 40 are respectively arranged on the main board 10 and the auxiliary board 20, it is also possible to avoid the heat generated by the current control component 40 affecting the operation of the chip component 30 or the heat generated by the chip component 30 affecting the operation of the current control component 40, thereby improving the efficiency and service life of the electronic module 1.

Furthermore, precisely because the current control component 40 and the chip component 30 are respectively arranged on the auxiliary board 20 and the main board 10, during the actual assembly process, the operator can adaptively increase or decrease the thickness, size and other parameters of the auxiliary board 20 according to the heat dissipation requirements of the current control component 40, or, the auxiliary board 20 can be manufactured using a material different from that of the main board 10, that is, the arrangement of the auxiliary board 20 is not restricted by the main board 10.

In addition, because the current control component 40 is disposed on the auxiliary board 20 , a larger space is provided for arranging the chip component 30 on the main board 10 (ie, the PCB board), which is more conducive to improving the integration of the electronic module 1 .

Here, it should be noted that the present disclosure does not impose any specific restrictions on the type and type of the above-mentioned electronic module 1, and it can be any electronic module 1 having a current control component 40 with the above-mentioned heat dissipation requirements. In an exemplary embodiment provided in the present disclosure, the above-mentioned electronic module 1 can be a graphics processing unit (GPU).

Optionally, as shown in FIGS. 1 to 3 , the auxiliary board 20 has a heat-conducting surface 221, and the heat-conducting surface 221 is used to carry and contact the current control component 40. Since the current control component 40 is in contact with the heat-conducting surface 221 of the auxiliary board 20, the heat generated by the current control component 40 disposed on the auxiliary board 20 during operation can be directly conducted to the heat-conducting surface 221, and then the heat is dissipated to the outside atmosphere through the heat-conducting surface 221, which has higher heat dissipation efficiency.

In order to further improve the heat dissipation effect of the current control component 40, in an exemplary embodiment provided by the present disclosure, the auxiliary plate 20 can be made of a heat-conducting metal material, and the outer surface of the auxiliary plate 20 is a heat-conducting surface 221. In this way, after the heat generated by the current control component 40 is transferred to the auxiliary plate 20 via the outer surface of the auxiliary plate 20, the heat can be dissipated outwards through each side of the auxiliary plate 20 made of metal material, with a larger heat dissipation area, thereby achieving the purpose of improving the heat dissipation efficiency and heat dissipation effect.

Optionally, in an embodiment provided by the present disclosure, as shown in Fig. 3, the auxiliary plate 20 may be made of aluminum. Aluminum has good thermal conductivity and heat dissipation effects, and has a low density and a smaller weight under the same volume.

It should be noted that in the embodiment where the auxiliary plate 20 is made of aluminum, the current control component 40 is connected to the upper surface of the auxiliary plate 20 (aluminum plate), and the upper surface of the auxiliary plate 20 (aluminum plate) is formed as the above-mentioned heat conduction surface 221.

In other embodiments provided in the present disclosure, the auxiliary plate 20 may also be made of metal materials such as copper and iron, or may also be made of alloy materials such as aluminum alloy, and the present disclosure does not limit this.

Alternatively, in another exemplary embodiment provided by the present disclosure, as shown in FIGS. 1 to 2 , optionally, the auxiliary board 20 may include an auxiliary board body 21 and an auxiliary board heat-conducting structure 22 laid on the auxiliary board body 21, the auxiliary board heat-conducting structure 22 includes at least one heat-conducting layer 220, and the surface of the heat-conducting layer 220 facing away from the auxiliary board body 21 is a heat-conducting surface 221. In this way, after generating heat, the current control component 40 contacts the heat-conducting surface 221 of the auxiliary board heat-conducting structure 22, transfers the heat to the heat-conducting layer 220, and dissipates the heat to the outside atmosphere through the side walls of the heat-conducting layer 220.

In order to improve the heat dissipation effect of the auxiliary plate heat conduction structure 22, optionally, as shown in FIG1 , there may be multiple heat conduction layers 220, and the multiple heat conduction layers 220 are stacked along the thickness direction of the auxiliary plate 20. In this way, after the current control component 40 generates heat, the heat can be transferred to the heat conduction layer 220 closest to it. Since the multiple heat conduction layers 220 are stacked along the thickness direction of the auxiliary plate 20, after the heat is transferred to the heat conduction layer 220 located at the top layer, it can diffuse to the heat conduction layer 220 adjacent to it, thereby transferring the heat to the multiple heat conduction layers 220 to jointly conduct, absorb and release the heat generated by the current control component 40.

Optionally, in an exemplary embodiment provided by the present disclosure, the heat conductive layer 220 may be a copper layer. Copper has a high thermal conductivity and is more convenient for heat conduction, absorption and diffusion.

Optionally, the main board 10 may include a main board body 11 and a main board heat-conducting structure 12 laid on the main board body 11, and the chip assembly 30 is arranged on the main board heat-conducting structure 12; wherein the thermal conductivity of the auxiliary board heat-conducting structure 22 is the same as that of the main board heat-conducting structure 12, and the thickness of the auxiliary board heat-conducting structure 22 is different from that of the main board heat-conducting structure 12; or, the thermal conductivity of the auxiliary board heat-conducting structure 22 is different from that of the main board heat-conducting structure 12. That is, in the embodiment in which the thermal conductivity of the auxiliary board heat-conducting structure 22 is the same as that of the main board heat-conducting structure 12, the thickness of the auxiliary board heat-conducting structure 22 can be set to be different from that of the main board heat-conducting structure 12 according to the heat dissipation requirement of the current control assembly 40 arranged on the auxiliary board 20. As shown in FIGS. 1 to 2, the thickness of the auxiliary board heat-conducting structure 22 is greater than that of the main board heat-conducting structure 12.

Alternatively, for an implementation embodiment in which the thermal conductivity of the auxiliary plate thermal conductive structure 22 is different from the thermal conductivity of the main board thermal conductive structure 12, for example, in an implementation embodiment in which the auxiliary plate 20 is made of aluminum and the thermal conductive layer 220 on the main board 10 is a copper layer, since the thermal conductivity of the auxiliary plate 20 is different from the thermal conductivity of the thermal conductive layer 220 of the main board 10, in order to achieve different heat dissipation requirements, the thickness of the auxiliary plate 20 can be the same as or different from the thickness of the thermal conductive layer 220 of the main board 10.

In the embodiment where the thermal conductive layer 220 of the auxiliary plate thermal conductive structure 22 is a copper layer and the main plate thermal conductive structure 12 is also a copper layer, the thermal conductivity coefficients of the two are the same. In order to achieve different heat dissipation requirements, as shown in Figures 1 and 2, the auxiliary plate thermal conductive structure 22 and the main plate thermal conductive structure 12 can be set to different thicknesses to meet different heat dissipation requirements of the current control component 40 and the battery cell component.

Optionally, in the present disclosure, the electrical connector 50 may be a flexible electrical connector 50. In this way, when the main board 10 and the auxiliary board 20 are assembled, the flexible electrical connector 50 connected between the main board 10 and the auxiliary board 20 may be adaptively deformed and bent according to the specific assembly state of the main board 10 and the auxiliary board 20 to avoid other electronic components in the electronic module 1, thereby facilitating the assembly of the main board 10 and the auxiliary board 20.

Alternatively, in an exemplary embodiment provided by the present disclosure, the flexible electrical connector 50 may be a flexible circuit board, one end of which is electrically connected to the main board 10, and the other end of which is electrically connected to the auxiliary board 20; or, in another exemplary embodiment provided by the present disclosure, the flexible electrical connector 50 may also be a wire, one end of which is electrically connected to the chip assembly 30, and the other end of which is electrically connected to the current control assembly 40. In short, the present disclosure does not limit the specific connection method and type of the above-mentioned flexible electrical connector 50, as long as the electrical connection between the chip assembly 30 disposed on the main board 10 and the current control assembly 40 disposed on the auxiliary board 20 can be achieved.

In the embodiment where the auxiliary plate 20 is made of a metal thermally conductive material, the above-mentioned flexible electrical connector 50 can be directly connected to the auxiliary plate 20, so as to achieve electrical connection with the current control component 40 connected to the auxiliary plate 20. Of course, the above-mentioned flexible electrical connector 50 can also be directly electrically connected to the current control component 40, and the present disclosure does not impose any restrictions on this.

Optionally, as shown in FIGS. 1 to 3 , the electronic module 1 may further include a heat sink 60, and the side of the chip component 30 facing away from the main board 10 and the side of the current control component 40 away from the auxiliary board 20 are both in thermal contact with the heat sink 60. In this way, a portion of the heat generated by the current control component 40 can be diffused through the auxiliary board 20 through the side close to the auxiliary board 20, and another portion of the heat generated by the current control component 40 can be dissipated through the side of the current control component 40 away from the auxiliary board 20 through the heat sink 60, further improving the heat dissipation effect of the current control component 40.

Optionally, the side of the chip assembly 30 away from the main board 10 and the side of the current control assembly 40 away from the auxiliary board 20 are located in the same plane. Because the chip assembly 30 and the current control assembly 40 are connected via the flexible electrical connector 50, when the chip assembly 30 and the current control assembly 40 are connected via the flexible electrical connector 50, the flexible electrical connector 50 can be bent, deformed, etc. to allow the overall height of the auxiliary board 20 to be adjusted (i.e., adjusted in the thickness direction), so that the side of the chip assembly 30 away from the main board 10 and the side of the current control assembly 40 away from the auxiliary board 20 are located in the same plane (i.e., the side of the current control assembly 40 close to the heat sink 60 and the side of the heat sink 60 are close to the heat sink 60). 1 to 3, so that during actual assembly, the side of the chip assembly 30 away from the main board 10 and the side of the current control assembly 40 away from the auxiliary board 20 can be in thermal contact with the heat sink 60 at the same time, without the need to set a pad or other raising structure to compensate for the height difference between the current control assembly 40 and the chip assembly 30. Therefore, the structure of the electronic module 1 can be further simplified, the overall weight of the electronic module 1 can be reduced, and the space utilization rate of the electronic module 1 can be improved.

In an exemplary embodiment provided in the present disclosure, optionally, the current control component 40 may include a metal-oxide semiconductor field effect transistor 41 (metal oxide semiconductor).

A second aspect of the present disclosure provides a board, comprising a board body and the above electronic module 1, wherein the electronic module 1 is mounted on the board body.

The third aspect of the present disclosure provides an electronic device, comprising the above board. The electronic device has all the beneficial effects of the above electronic module 1 and board, which will not be described in detail in the present disclosure.

The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings; however, the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, a variety of simple modifications can be made to the technical solution of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.

It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

In addition, various embodiments of the present disclosure may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the contents disclosed by the present disclosure.

Claims (15)

1. An electronic module, characterized in that it includes a main board, an auxiliary board, a chip component, a current control component and an electrical connector, wherein the chip component is arranged on the main board, the current control component is arranged on the auxiliary board, the chip component and the current control component are electrically connected through the electrical connector, and the auxiliary board is configured to dissipate heat for the current control component. 2 . The electronic module according to claim 1 , wherein the auxiliary board has a heat-conducting surface, and the heat-conducting surface is used to carry the current control component and contact the current control component. 3 . The electronic module according to claim 2 , wherein the auxiliary plate is made of a heat-conducting metal material, and an outer surface of the auxiliary plate is the heat-conducting surface. The electronic module according to claim 3 , wherein the auxiliary plate is made of aluminum. 5. The electronic module according to claim 2 is characterized in that the auxiliary board includes an auxiliary board body and an auxiliary board heat-conducting structure laid on the auxiliary board body, the auxiliary board heat-conducting structure includes at least one heat-conducting layer, and the surface of the heat-conducting layer facing away from the auxiliary board body is the heat-conducting surface. 6 . The electronic module according to claim 5 , wherein there are a plurality of heat-conducting layers, and the plurality of heat-conducting layers are stacked along a thickness direction of the auxiliary plate. 7. The electronic module according to claim 5, characterized in that the mainboard comprises a mainboard body and a mainboard heat-conducting structure laid on the mainboard body, and the chip assembly is arranged on the mainboard heat-conducting structure; Among them, the thermal conductivity of the auxiliary plate thermal conductive structure is the same as the thermal conductivity of the main board thermal conductive structure, and the thickness of the auxiliary plate thermal conductive structure is different from the thickness of the main board thermal conductive structure; or, the thermal conductivity of the auxiliary plate thermal conductive structure is different from the thermal conductivity of the main board thermal conductive structure. 8 . The electronic module according to claim 5 , wherein the heat conducting layer is a copper layer. 9 . The electronic module according to claim 1 , wherein the electrical connector is a flexible electrical connector. 10. The electronic module according to claim 9, characterized in that the flexible electrical connector is a flexible circuit board, one end of the flexible circuit board is electrically connected to the main board, and the other end of the flexible circuit board is electrically connected to the auxiliary board; or The flexible electrical connector is a wire, one end of which is electrically connected to the chip component, and the other end of which is electrically connected to the current control component. 11. The electronic module according to any one of claims 1 to 8, characterized in that the electronic module further comprises a heat sink, and a side of the chip component facing away from the main board and a side of the current control component away from the auxiliary board are both in thermal contact with the heat sink. 12 . The electronic module according to claim 11 , wherein a side of the chip component facing away from the main board and a side of the current control component facing away from the auxiliary board are located in the same plane. 13. The electronic module according to any one of claims 1 to 8, characterized in that the current control component comprises a metal-oxide semiconductor field effect transistor. 14. A board, characterized in that it comprises a board body and the electronic module according to any one of claims 1 to 13, wherein the electronic module is mounted on the board body. 15. An electronic device, comprising the board according to claim 14.