CN212519543U - Pad structure, circuit board and air conditioner - Google Patents

Abstract

The utility model discloses a pad structure, circuit board and air conditioner, wherein the pad structure includes: the first pad area is used for welding a first pin of an electronic element, the first pad area is provided with a first connecting pad and a first sampling pad which are arranged along a first direction, and a first gap is arranged between the first sampling pad and the first connecting pad; the second pad area is used for welding a second pin of the electronic element, the second pad area is provided with a second connecting pad and a second sampling pad which are arranged along the first direction, and a second gap is arranged between the second sampling pad and the second connecting pad; the first pad area and the second pad area are arranged along a second direction, and the first direction is perpendicular to the second direction; the length of the first sampling pad along the second direction is consistent with the length of the first connecting pad along the second direction; the length of the second sampling pad along the second direction is consistent with the length of the second connection pad along the second direction, and the pad structure can improve the accuracy of sampling signals.

Description

Pad structure, circuit board and air conditioner

Technical Field

The utility model relates to the field of electronic technology, especially, relate to pad structure, circuit board and air conditioner.

Background

In the related art, an electric control board is often used to detect or control the air conditioner. When the air conditioner is detected, an electronic element is usually used in the electronic control board to sample various currents or voltages on a circuit, for example, a sampling resistor welded in the electronic control board is used to sample various currents or voltages on the circuit, and since a sampling signal of the resistor and a current signal pass through the same pad together, when the sampling resistor is used to measure the current or voltage, the sampling signal may include a signal on a welding spot between the sampling resistor and the pad on the circuit board, which may cause a problem of low sampling precision of the sampling signal.

SUMMERY OF THE UTILITY MODEL

The present invention aims at solving at least one of the technical problems in the related art to a certain extent. Therefore, the utility model provides a pad structure, circuit board and air conditioner can improve sampling signal's accuracy.

In a first aspect, an embodiment of the present invention provides a pad structure, including:

the first pad area is used for welding a first pin of an electronic element, the first pad area is provided with a first connecting pad and a first sampling pad which are arranged along a first direction, and a first gap is arranged between the first sampling pad and the first connecting pad;

the second pad area is used for welding a second pin of an electronic element, the second pad area is provided with a second connecting pad and a second sampling pad which are arranged along the first direction, and a second gap is arranged between the second sampling pad and the second connecting pad;

the first pad area and the second pad area are arranged along a second direction, and the first direction is perpendicular to the second direction;

the length of the first sampling pad along the second direction is consistent with the length of the first connecting pad along the second direction; the length of the second sampling pad in the second direction is identical to the length of the second connection pad in the second direction.

The utility model discloses above-mentioned technical scheme of first aspect has one of following advantage or beneficial effect at least: for two pins of an electronic element, the pad structure can be provided with two pad areas, each pad area is provided with a connecting pad and a sampling pad which are arranged along a first direction, the two pad areas can be arranged along a second direction which is perpendicular to the first direction, and a gap is arranged between the connecting pad and the sampling pad. In addition, because the lengths of the connecting pad and the sampling pad along the second direction are consistent, when the electronic element such as the resistor has welding offset and is deviated to the first pad area or the second pad area, the electronic element such as the resistor can still be simultaneously connected with the connecting pad and the sampling pad, and the problem that the sampling pad cannot be connected with the electronic element such as the resistor to cause sampling failure can be prevented.

Optionally, in an embodiment of the present invention, the first connection pad and the second connection pad are arranged in mirror symmetry, and the first sampling pad and the second sampling pad are arranged in mirror symmetry.

First connection pad and second connection pad mirror symmetry set up, first sampling pad and second sampling pad mirror symmetry set up, and the size and the shape of first connection pad and second connection pad are the same and the symmetry sets up promptly, and the size and the shape of first sampling pad and second sampling pad are the same and the symmetry sets up, can avoid appearing some pad rosin joint or the scheduling problem that opens circuit.

Optionally, in an embodiment of the present invention, the first pad region is further provided with a third connection pad, the second pad region is further provided with a fourth connection pad, the first sampling pad and the third connection pad are sequentially arranged, the second connection pad, the second sampling pad and the fourth connection pad are sequentially arranged, the first sampling pad and the third connection pad are provided with a third gap therebetween, and the second sampling pad and the fourth connection pad are provided with a fourth gap therebetween.

Can be provided with two connection pads and a sampling pad at least in same pad region, wherein the sampling pad can set up between two connection pads, all is provided with the clearance moreover between sampling pad and two connection pads, can improve the variety of pad structure to can be convenient for nimble wiring.

Optionally, in an embodiment of the present invention, the first gap, the second gap, the third gap and the fourth gap are all equal in distance.

The distances of the first gap, the second gap, the third gap and the fourth gap are all set to be equal, the design of the pad area can be normalized, and therefore the design efficiency of the circuit board can be improved.

Optionally, in an embodiment of the present invention, an area of the first sampling pad is smaller than an area of the first connection pad, and an area of the second sampling pad is smaller than an area of the second connection pad.

The area of the connecting bonding pad is larger than that of the sampling bonding pad, so that the conduction capability of the connecting bonding pad can be ensured; the area of the sampling pad is smaller than that of the connection pad, so that the sampling signal can be more concentrated, and the accuracy of the sampling signal can be improved.

In a second aspect, an embodiment of the present invention provides a circuit board, including a substrate and a pad structure as in any one of the embodiments of the first aspect, the pad structure being disposed on the substrate.

The utility model discloses the technical scheme of above-mentioned second aspect has one of following advantage or beneficial effect at least: the pad structure is arranged on the substrate, the pad structure can be provided with two pad areas, each pad area is provided with a connecting pad and a sampling pad which are arranged along a first direction, the two pad areas can be arranged along a second direction perpendicular to the first direction, and a gap is arranged between the connecting pad and the sampling pad. In addition, because the lengths of the connecting pad and the sampling pad along the second direction are consistent, when the electronic element such as the resistor has welding offset and is deviated to the first pad area or the second pad area, the electronic element such as the resistor can still be simultaneously connected with the connecting pad and the sampling pad, and the problem that the sampling pad cannot be connected with the electronic element such as the resistor to cause sampling failure can be prevented.

Optionally, in an embodiment of the present invention, the electronic device further includes an electronic component, the electronic component includes a first pin and a second pin, the first pin is soldered to the first pad region in the pad structure, and the second pin is soldered to the second pad region in the pad structure.

Two pins of the electronic element can be respectively welded with a first pad area and a second pad area in a pad structure, and each pin of the electronic element is welded with a connecting pad and a sampling pad, so that when the electronic element is deviated from the first pad area or the second pad area due to welding deviation, the electronic element can still be simultaneously connected with the connecting pad and the sampling pad, and the problem that sampling fails due to the fact that the sampling pad cannot be connected with the electronic element can be prevented.

Optionally, the utility model discloses an embodiment, still include the data detection module, the data detection module is provided with first detection pin and second detection pin, first detection pin connect in the first pad region first sampling pad, the second detection pin connect in the second pad region second sampling pad.

The first and second inspection pins in the data inspection module may be correspondingly connected to the first and second sampling pads in the first and second pad regions, so that the accuracy of the sampled signal may be improved by the first and second sampling pads.

Optionally, the utility model discloses an in the embodiment, still include that first sampling is walked line and second sampling and is walked the line, first detection pin passes through first sampling walk the line with first sampling pad is connected, the second detects the pin and passes through second sampling walk the line with second sampling pad is connected.

A first detection pin in the data detection module can be connected with a first sampling bonding pad in the first bonding pad area through a first sampling wire, and a second detection pin can be connected with a second sampling bonding pad in the second bonding pad area through a second sampling wire, so that the accuracy of a sampling signal can be improved through the first sampling wire, the second sampling wire, the first sampling bonding pad and the second sampling bonding pad.

In a third aspect, the present invention further provides an air conditioner, including the pad structure as in any one of the embodiments of the first aspect, or including the circuit board as in any one of the embodiments of the second aspect.

The utility model discloses the technical scheme of above-mentioned third aspect has one of following advantage or beneficial effect at least: the circuit board is arranged on the air conditioner and comprises a substrate and a pad structure arranged on the substrate, the pad structure can be provided with two pad areas, each pad area is provided with a connecting pad and a sampling pad which are arranged along a first direction, the two pad areas can be arranged along a second direction perpendicular to the first direction, and a gap is arranged between the connecting pad and the sampling pad. In addition, because the lengths of the connecting pad and the sampling pad along the second direction are consistent, when the electronic element such as the resistor has welding offset and is deviated to the first pad area or the second pad area, the electronic element such as the resistor can still be simultaneously connected with the connecting pad and the sampling pad, and the problem that the sampling pad cannot be connected with the electronic element such as the resistor to cause sampling failure can be prevented.

Drawings

The accompanying drawings are included to provide a further understanding of the technical solutions of the present invention, and are incorporated in and constitute a part of this specification, together with the embodiments of the present invention for explaining the technical solutions of the present invention, and do not constitute a limitation on the technical solutions of the present invention.

Fig. 1 is a schematic diagram of a pad structure according to an embodiment of the present invention;

fig. 2 is a schematic diagram of a pad structure according to another embodiment of the present invention;

fig. 3 is a schematic diagram of a pad structure according to another embodiment of the present invention;

fig. 4 is a schematic diagram of a circuit board provided by an embodiment of the present invention;

fig. 5 is a schematic diagram of an air conditioner according to an embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

It should be noted that although functional block divisions are provided in the system drawings and logical orders are shown in the flowcharts, in some cases, the steps shown and described may be performed in different orders than the block divisions in the systems or in the flowcharts. The terms first, second and the like in the description and in the claims, and the drawings described above, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.

In the related art, an electric control board is often used to detect or control the air conditioner. When the air conditioner is detected, an electronic element is usually used in the electronic control board to sample various currents or voltages on a circuit, for example, a sampling resistor welded in the electronic control board is used to sample various currents or voltages on the circuit, and since a sampling signal of the resistor and a current signal pass through the same pad together, when the sampling resistor is used to measure the current or voltage, the sampling signal may include a signal on a welding spot between the sampling resistor and the pad on the circuit board, which may cause a problem of low sampling precision of the sampling signal.

The two ends of the sampling resistor are respectively welded with two different welding pads, when the current sampling resistor is used for measuring, a first impedance and a second impedance can be formed at the two ends of the resistor and a welding point between the two welding pads, when a resistor sampling signal and a current signal share the same welding pad, the actual detection value of the current sampling signal is the signal value generated by the first impedance, the second impedance and the sampling resistor, the theoretical value of the current sampling signal is the signal value generated by the sampling resistor, the actual detection value of the current sampling signal is different from the theoretical value of the current sampling signal, and the resistance values of the first resistor and the second resistor influence the accuracy of current sampling.

In order to solve the technical problems, the utility model provides a pad structure, a circuit board and an air conditioner, which are characterized in that two pad areas are arranged in the pad structure, a connection pad and a sampling pad are disposed in each pad region, which are disposed in a first direction, and two pad regions may be disposed in a second direction perpendicular to the first direction, and a gap is provided between the connection pad and the sampling pad, so that, when an electronic component such as a resistor is soldered to the two pad areas, since both pins of the electronic component such as the resistor are connected to the connection pad and the sampling pad at the same time, and the connection pad is separated from the sampling pad, so that the sampling signal obtained by sampling through the sampling pad can be prevented from containing signals flowing through welding spots between electronic elements such as resistors and the connection pad, and the accuracy of the sampling signal can be improved. In addition, because the lengths of the connecting pad and the sampling pad along the second direction are consistent, when the electronic element such as the resistor has welding offset and is deviated to the first pad area or the second pad area, the electronic element such as the resistor can still be simultaneously connected with the connecting pad and the sampling pad, and the problem that the sampling pad cannot be connected with the electronic element such as the resistor to cause sampling failure can be prevented.

The embodiments of the present invention will be further explained with reference to the drawings.

As shown in fig. 1, fig. 1 is a schematic diagram of a pad structure 100 according to an embodiment of the present invention. The pad structure 100 includes a first pad region 110 and a second pad region 120, wherein the first pad region 110 is used for soldering a first pin of an electronic component, the first pad region 110 is provided with a first connection pad 111 and a first sampling pad 112 sequentially arranged along a first direction, and a first gap is arranged between the first sampling pad 112 and the first connection pad 111; the second pad region 120 is used for welding a second pin of the electronic component, the second pad region 120 is provided with a second connection pad 121 and a second sampling pad 122 which are sequentially arranged along the first direction, and a second gap is arranged between the second sampling pad 122 and the second connection pad 121; the first pad region 110 and the second pad region 120 are disposed in a second direction perpendicular to the first direction; the length of the first sampling pad 112 in the second direction coincides with the length of the first connection pad 111 in the second direction; the length of the second sampling pad 122 in the second direction coincides with the length of the second connection pad 121 in the second direction.

In one embodiment, the pad structure 100 may be provided with two pad regions (e.g., a first pad region 110 and a second pad region 120 in fig. 1), each pad region being provided with a connection pad (e.g., a first connection pad 111 and a second connection pad 121 in fig. 1) and a sampling pad (e.g., a first sampling pad 112 and a second sampling pad 122 in fig. 1) arranged along a first direction, the two pad regions may be arranged sequentially along a second direction perpendicular to the first direction, and a gap is provided between the connection pad and the sampling pad, so that when an electronic component such as a resistor is soldered to the two pad regions, since both pins of the electronic component such as a resistor are connected to the connection pad and the sampling pad at the same time and the connection pad and the sampling pad are separated, a sampled signal sampled by the sampling pad may be prevented from including a signal flowing through a solder joint between the electronic component such as a resistor and the connection pad, thereby enabling to improve the accuracy of the sampled signal. In addition, because the lengths of the connection pad and the sampling pad in the second direction are consistent, when the electronic component such as the resistor is deviated to the first pad region 110 or the second pad region 120 due to welding deviation, the electronic component such as the resistor can still be simultaneously connected with the connection pad and the sampling pad, so that the problem that sampling failure is caused because the sampling pad cannot be connected with the electronic component such as the resistor can be prevented.

It should be noted that the shapes of the first connection pad 111, the second connection pad 121, the first sampling pad 112, and the second sampling pad 122 may be rectangular, and may be circular, and the present embodiment is not limited thereto.

It should be noted that the number of the connection pads may be one, and may be two, and this embodiment does not specifically limit this.

It should be noted that the size and shape of the first pad region 110 and the second pad region 120 may be set according to the electronic component, and the embodiment is not limited thereto.

It should be noted that the electronic component may be a resistor or other electronic components, and this embodiment does not limit the electronic component solely.

It should be noted that the first sampling pad 112 is disposed in the first pad region 110, and a gap is disposed between the first sampling pad 112 and the first connection pad 111, and the distance of the gap cannot be too large, so as to avoid occupying the area of the first connection pad 111 and affecting the conductive ability of the first connection pad 111, but the distance of the gap cannot be too small, so as to avoid welding the first sampling pad 112 and the first connection pad 111 together during welding. The present embodiment does not specifically limit the distance of the gap.

It should be noted that the second sampling pad 122 is disposed in the second pad region 120, and a gap is disposed between the second sampling pad 122 and the second connection pad 121, and for the description of the gap between the second sampling pad 122 and the second connection pad 121, reference may be made to the description of the gap between the first sampling pad 112 and the first connection pad 111, and details are not repeated here.

In one embodiment, the first connection pad 111 and the second connection pad 121 are arranged mirror symmetrically, and the first sampling pad 112 and the second sampling pad 122 are arranged mirror symmetrically. That is, the size and shape of the first connection pad 111 and the second connection pad 121 may be the same and axisymmetrically disposed, and the size and shape of the first sampling pad 112 and the second sampling pad 122 may be the same and axisymmetrically disposed, so that the problems of a certain pad cold joint or open circuit can be avoided.

In one embodiment, the area of the first sampling pad 112 is smaller than that of the first connection pad 111, and the area of the second sampling pad 122 is smaller than that of the second connection pad 121. The area of the connecting bonding pad is larger than that of the sampling bonding pad, so that the conduction capability of the connecting bonding pad can be ensured; the area of the sampling pad is smaller than that of the connection pad, so that the sampling signal can be more concentrated, and the accuracy of the sampling signal can be improved.

It should be noted that the areas of the first sampling pad 112, the first connection pad 111, the second sampling pad 122, and the second connection pad 121 are set according to the electronic component to be soldered, and the embodiment is not particularly limited thereto.

Referring to fig. 2, a pad structure 100 according to another embodiment of the present invention is shown. The difference from the pad structure 100 provided in the embodiment of fig. 1 is that a first sampling pad 112 and a first connection pad 111 are disposed in the first pad region 110 and sequentially arranged along the first direction, a second sampling pad 122 and a second connection pad 121 are disposed in the second pad region 120 and sequentially arranged along the first direction, and other pad structures 100 are the same as the pad structure 100 provided in the embodiment of fig. 1 and will not be described in detail here.

A sampling pad (e.g., a first sampling pad 112 and a second sampling pad 122 in fig. 2) and a connection pad (e.g., a first connection pad 111 and a second connection pad 121 in fig. 2) are sequentially disposed in a first direction in each pad region (e.g., a first pad region 110 and a second pad region 120 in fig. 2), the two pad regions may be disposed in a second direction perpendicular to the first direction, and a gap is disposed between the connection pad and the sampling pad, so when an electronic component such as a resistor is soldered in the two pad regions, since both pins of the electronic component such as a resistor are simultaneously connected to the connection pad and the sampling pad and the connection pad and the sampling pad are separated, a sampled signal sampled by the sampling pad may be prevented from including a signal flowing through a solder joint between the electronic component such as a resistor and the connection pad, thereby enabling to improve the accuracy of the sampled signal. In addition, because the lengths of the connection pad and the sampling pad in the second direction are consistent, when the electronic component such as the resistor is deviated to the first pad region 110 or the second pad region 120 due to welding deviation, the electronic component such as the resistor can still be simultaneously connected with the connection pad and the sampling pad, so that the problem that sampling failure is caused because the sampling pad cannot be connected with the electronic component such as the resistor can be prevented.

Referring to fig. 3, a pad structure 100 according to another embodiment of the present invention is shown. Fig. 3 is a pad structure 100 based on fig. 1, in which a third connection pad 310 is additionally disposed in the first pad region 110, and a fourth connection pad 320 is additionally disposed in the second pad region 120, in the first pad region 110, the first connection pad 111, the first sampling pad 112, and the third connection pad 310 may be sequentially arranged along the first direction, in the second pad region 120, the second connection pad 121, the second sampling pad 122, and the fourth connection pad 320 may be sequentially arranged along the first direction, a third gap may be disposed between the first sampling pad 112 and the third connection pad 310, and a fourth gap may be disposed between the second sampling pad 122 and the fourth connection pad 320.

In an embodiment, at least two connection pads (e.g., the first connection pad 111 and the third connection pad 310 in fig. 3) and one sampling pad (e.g., the first sampling pad 112 in fig. 3) may be disposed in the same pad region (e.g., the first pad region 110 in fig. 3), wherein the sampling pad may be disposed between the two connection pads, and a gap is disposed between the sampling pad and the two connection pads, so that the diversity of the pad structure 100 can be improved, and flexible wiring can be facilitated.

It should be noted that the present embodiment does not only limit the arrangement order of the first connection pad 111, the first sampling pad 112, and the third connection pad 310 or the arrangement order of the second connection pad 121, the second sampling pad 122, and the fourth connection pad 320.

It should be noted that the areas of the third connection pad 310 and the fourth connection pad 320 are set according to the electronic component to be soldered, and the embodiment is not particularly limited thereto.

In an embodiment, the distances of the first gap, the second gap, the third gap and the fourth gap may be set to be equal, so that the design of the pad region can be normalized, and the design efficiency of the circuit board can be improved. It should be noted that, in this embodiment, the distances of the first gap, the second gap, the third gap, and the fourth gap are not specifically limited, and on the premise that the technical effect of this embodiment is not affected, the distances of the first gap, the second gap, the third gap, and the fourth gap may be set to be different.

Referring to fig. 4, a schematic diagram of a circuit board 400 according to an embodiment of the present invention is shown. The circuit board 400 includes a substrate 410, a pad structure 100 of any one of the above embodiments disposed on the substrate 410, an electronic component (not labeled in the figure) connected to the pad structure 100, a data detection module 411 for collecting a current condition of the electronic component, a first sampling trace 412 and a second sampling trace 413 for connecting the data detection module 411 to the pad structure 100, where the pad structure 100 includes a first pad area 110 and a second pad area 120, the first pad area 110 is used for soldering a first pin of the electronic component, the first pad area 110 is provided with a first connection pad 111 and a first sampling pad 112 sequentially disposed along a first direction, and a first gap is disposed between the first sampling pad 112 and the first connection pad 111; the second pad region 120 is used for welding a second pin of the electronic component, the second pad region 120 is provided with a second connection pad 121 and a second sampling pad 122 which are sequentially arranged along the first direction, and a second gap is arranged between the second sampling pad 122 and the second connection pad 121; the first pad region 110 and the second pad region 120 are disposed in a second direction perpendicular to the first direction; the length of the first sampling pad 112 in the second direction coincides with the length of the first connection pad 111 in the second direction; the length of the second sampling pad 122 in the second direction coincides with the length of the second connection pad 121 in the second direction; the electronic component includes a first lead soldered to the first pad area 110 in the pad structure 100 and a second lead soldered to the second pad area 120 in the pad structure 100; the data detection module 411 is provided with a first detection pin and a second detection pin, the first detection pin is connected to the first sampling pad 112 in the first pad area 110 through a first sampling trace 412, and the second detection pin is connected to the second sampling pad 122 in the second pad area 120 through a second sampling trace 413.

It should be noted that the pad structure 100 is provided with two pad regions (e.g., the first pad region 110 and the second pad region 120 in fig. 4), a connection pad (e.g., the first connection pad 111 and the second connection pad 121 in fig. 4) and a sampling pad (e.g., the first sampling pad 112 and the second sampling pad 122 in fig. 4) are provided in the pad regions, and a gap is provided between the connection pad and the sampling pad, it is possible to prevent the occurrence of a problem that the sampled signal includes a signal on a pad between the electronic component and the pad on the circuit board 400, to improve the accuracy of the sampled signal, and since the connection pad and the sampling pad have the same length in the second direction, when the resistance welding is more biased toward the first pad region 110 or the second pad region 120, the resistance all can weld with connection pad and sampling pad simultaneously, can prevent the sampling pad can't appear with resistance weld's problem.

It should be noted that two pins of the electronic component may be respectively soldered to the first pad region 110 and the second pad region 120 in the pad structure 100, and each pin of the electronic component is soldered to the connection pad and the sampling pad, so that when the electronic component is deviated from the first pad region 110 or the second pad region 120 due to soldering deviation, the electronic component can still be simultaneously connected to the connection pad and the sampling pad, and the problem of sampling failure due to the sampling pad being unable to be connected to the electronic component can be prevented.

It should be noted that the electronic component may be a resistor, and may be another electronic component, and this embodiment does not limit this to only one.

It should be noted that the resistor may be a chip resistor, and this embodiment does not limit this to the only one.

It should be noted that the first and second detection pins in the data detection module 411 may be connected to the first sampling pad 112 in the first pad area 110 and the second sampling pad 122 in the second pad area 120 through the first and second sampling traces 412 and 413, respectively, which may prevent the sampling signal from including the signal on the pad between the electronic component and the pad on the circuit board 400, and may improve the accuracy of the sampling signal.

It should be noted that the routing manner of the first sampling routing 412 and the second sampling routing 413 may be a differential routing manner, and the interference rejection can be improved by using the differential routing manner, so that the problem of electromagnetic interference can be effectively suppressed, and the accuracy of the sampling signal is improved.

It should be noted that, the connection end of the first sampling trace 412 and the first sampling pad 112 is smaller than the length of the first sampling pad 112 in the first direction, so that the problem of the error welding between the first sampling trace 412 and the first connection pad 111 during welding can be reduced; the connecting end of the second sampling trace 413 and the second sampling pad 122 is smaller than the length of the second sampling pad 122 in the first direction, so that the problem that the second sampling trace 413 and the second connection pad 121 are welded by mistake during welding can be reduced.

Fig. 5 is a schematic view of an air conditioner according to an embodiment of the present invention. The air conditioner includes the circuit board 400 in the above embodiment, wherein the specific structure of the circuit board 400 is described in detail in the embodiment disclosed in fig. 4, and is not described in detail herein. The pad structure 100 arranged in the circuit board 400 is provided with two pad regions, a connection pad and a sampling pad are arranged in the pad region, and a gap is arranged between the connection pad and the sampling pad, so that the problem that a sampling signal comprises a signal on a welding spot between an electronic element and a pad on the circuit board 400 can be prevented, the accuracy of the sampling signal can be improved, and because the lengths of the connection pad and the sampling pad in the second direction are consistent, when resistance welding is more deviated to the first pad region or the second pad region, resistors can be simultaneously welded with the connection pad and the sampling pad, and the problem that the sampling pad cannot be welded with the resistors can be prevented.

It should be noted that the air conditioner 500 may include the pad structure 100 in the embodiment provided in fig. 1 to 3, the pad structure 100 provided in the air conditioner 500 is provided with two pad regions, a connection pad and a sampling pad are provided in the pad region, and a gap is provided between the connection pad and the sampling pad, which may prevent a problem that a sampling signal includes a signal on a solder joint between an electronic component and a pad on the circuit board 400, and may improve accuracy of the sampling signal, and since the connection pad and the sampling pad have the same length in the second direction, when resistance welding is more biased to the first pad region or the second pad region, a resistor may be simultaneously welded to the connection pad and the sampling pad, and may prevent a problem that the sampling pad may not be welded to the resistance welding.

While the preferred embodiments of the present invention have been described, the present invention is not limited to the above embodiments, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and such equivalent modifications or substitutions are intended to be included within the scope of the present invention defined by the appended claims.

Claims (10)

1. A bond pad structure, comprising:

the first pad area is used for welding a first pin of an electronic element, the first pad area is provided with a first connecting pad and a first sampling pad which are arranged along a first direction, and a first gap is arranged between the first sampling pad and the first connecting pad;

the second pad area is used for welding a second pin of an electronic element, the second pad area is provided with a second connecting pad and a second sampling pad which are arranged along the first direction, and a second gap is arranged between the second sampling pad and the second connecting pad;

the first pad area and the second pad area are arranged along a second direction, and the first direction is perpendicular to the second direction;

the length of the first sampling pad along the second direction is consistent with the length of the first connecting pad along the second direction; the length of the second sampling pad in the second direction is identical to the length of the second connection pad in the second direction.

2. The pad structure of claim 1, wherein: the first connecting pad and the second connecting pad are arranged in a mirror symmetry mode, and the first sampling pad and the second sampling pad are arranged in a mirror symmetry mode.

3. Pad structure according to claim 1 or 2, characterized in that: the first pad area still is provided with the third connection pad, the second pad area still is provided with the fourth connection pad, first connection pad first sampling pad with the third connection pad is arranged in proper order and is set up, the second connection pad second sampling pad with the fourth connection pad is arranged in proper order and is set up, first sampling pad with be provided with the third clearance between the third connection pad, the second sampling pad with be provided with the fourth clearance between the fourth connection pad.

4. The pad structure of claim 3, wherein: the first gap, the second gap, the third gap and the fourth gap are all equal in distance.

5. The pad structure of claim 1, wherein the area of the first sampling pad is smaller than the area of the first connection pad, and the area of the second sampling pad is smaller than the area of the second connection pad.

6. A circuit board comprising a substrate and a pad structure according to any one of claims 1 to 5, the pad structure being provided on the substrate.

7. The circuit board of claim 6, further comprising an electronic component including a first pin and a second pin, the first pin being soldered to the first land area in the land structure, the second pin being soldered to the second land area in the land structure.

8. The circuit board according to claim 6 or 7, further comprising a data inspection module provided with a first inspection pin connected to the first sampling pad in the first pad region and a second inspection pin connected to the second sampling pad in the second pad region.

9. The circuit board of claim 8, further comprising a first sampling trace and a second sampling trace, wherein the first detection pin is connected to the first sampling pad through the first sampling trace, and wherein the second detection pin is connected to the second sampling pad through the second sampling trace.

10. An air conditioner characterized by comprising a pad structure according to any one of claims 1 to 5 or a circuit board according to any one of claims 6 to 9.

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