CN212517119U

CN212517119U - Semiconductor chip packaging mechanism

Info

Publication number: CN212517119U
Application number: CN202021033071.9U
Authority: CN
Inventors: 常嘉伟; 王霞; 王志伟
Original assignee: Jiangsu Fulanke Information Technology Co ltd
Current assignee: Jiangsu Fulanke Information Technology Co ltd
Priority date: 2020-06-08
Filing date: 2020-06-08
Publication date: 2021-02-09
Anticipated expiration: 2030-06-08

Abstract

The utility model discloses a semiconductor chip packaging mechanism, including the high-pressure box, the front surface movable mounting of high-pressure box has sealing door, fixed surface installs the pneumatic cylinder on the inside of high-pressure box, fixed surface installs down the hot plate under the inside of high-pressure box, fixed surface installs the barometer on the high-pressure box, fixed surface installs control panel before the high-pressure box, one side fixed mounting that the front surface of high-pressure box is located control panel has the fixing base, fixed surface installs the installation box under the high-pressure box, the inside fixed mounting of installation box has the vacuum pump. A semiconductor chip packaging mechanism, can eliminate when the pressfitting that gaseous and dust sneak into the clearance between plastics upper substrate and the plastics infrabasal plate, and prevent that the steam in the air from sneaking into and leading to the short circuit to the quality of semiconductor chip encapsulation has been improved, and packaging mechanism's production efficiency can be improved.

Description

Semiconductor chip packaging mechanism

Technical Field

The utility model relates to a packaging mechanism field, in particular to semiconductor chip packaging mechanism.

Background

The shell for installing the semiconductor integrated circuit chip plays a role in placing, fixing, sealing, protecting the chip and enhancing the electric heating performance, and is also a bridge for communicating the internal world of the chip with an external circuit, namely, a joint on the chip is connected to pins of the package shell by leads, and the pins are connected with other devices by leads on a printed board, so that the package plays an important role in a CPU and other LSI integrated circuits; however, the existing semiconductor chip packaging mechanism and packaging process have certain disadvantages when in use, and when in chip packaging, especially when packaging some semiconductor chips with high packaging requirements, the influence of the outside on the packaging cannot be eliminated, for example, the existing chip packaging is packaged in exposed air, the air is inevitably pressed between two plastic substrates when in packaging, the mixed air is easy to oxidize or corrode internal chip circuits, so that the chips are damaged, and in processing, workers are required to put the chips and the pressing structure by a lower heating plate every time the chips are processed, so that the working efficiency is reduced.

SUMMERY OF THE UTILITY MODEL

A primary object of the present invention is to provide a semiconductor chip packaging mechanism, which can effectively solve the problems in the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a semiconductor chip packaging mechanism, includes the high-pressure box, the front surface movable mounting of high-pressure box has sealing door, fixed surface installs the pneumatic cylinder on the inside of high-pressure box, fixed surface installs down the hot plate under the inside of high-pressure box, the last fixed surface of high-pressure box installs the barometer, fixed surface installs control panel before the high-pressure box, the front surface of high-pressure box is located one side fixed mounting of control panel and has the fixing base, the fixed surface of high-pressure box installs the installation box, the inside fixed mounting of installation box has the vacuum pump.

Preferably, the front surface of the high-pressure box body is located on one side, far away from the control panel, of the fixing seat, the upper surface of the high-pressure box body is fixedly connected with one side, located on the barometer, of the upper surface of the high-pressure box body and provided with an exhaust pipeline, the electromagnetic valve is fixedly connected with the surface of the exhaust pipeline, and the lower port of the exhaust pipeline is communicated with the inside of the high-pressure box body.

Preferably, the inside surface of sealing door is close to marginal position fixed mounting and has the sealing washer, the fixed embedding in middle part of sealing door is established and is installed the observation transparent window, one side middle part fixed mounting of sealing door has the fixing clip.

Preferably, the other side of the sealing door is fixedly provided with a hinge, and the sealing door is movably connected with the edge port of the processing port through the hinge.

Preferably, the lower extreme movable mounting of pneumatic cylinder has the telescopic link, the spacing groove has been seted up to the lower extreme of telescopic link, the inside fixed connection in spacing groove installs return spring, the inside movable mounting in spacing groove has the connection slide bar, the lower extreme fixed mounting who connects the slide bar has the upper heating plate, the lower surface of upper heating plate has seted up the pressfitting recess.

Preferably, the upper surface of the lower heating plate is fixedly provided with a conduction fin, the upper surface of the lower heating plate is fixedly contacted and embedded with a placing disc, the lower surface of the placing disc is fixedly provided with a heated fin, the upper surface of the placing disc is provided with a placing groove, the upper surface of the placing disc is positioned at two sides of the placing groove and is provided with a pin placing groove, the periphery of the lower heating plate is provided with a limiting plate block, the placing disc is embedded into the surface of the lower heating plate through a gap between the conduction fins, and the heated fins are in close contact with the conduction fins.

Preferably, the screw rod is installed to the surface swing joint of fixing base, the fastening knob is installed to the surface spiral of screw rod, the fixed surface of fixing base installs the pivot, the surface of screw rod is close to one end position and has seted up the through-hole, the fixing base passes through-hole and screw rod swing joint through the pivot.

Preferably, a box door is movably mounted on the front surface of the mounting box body, an inner buckle handle is arranged on the surface of the box door, a power motor is connected and mounted on one side of the vacuum pump, a high-pressure pipeline is fixedly connected and mounted at one port of the vacuum pump, and the other end of the high-pressure pipeline is communicated with the inside of the high-pressure box body.

Compared with the prior art, the utility model discloses following beneficial effect has:

in the utility model, through the high-pressure box body and the vacuum pump, the high-pressure box body can be vacuumized by the vacuum pump, so that the moist gas inside and the dust mixed in the gas can be removed, the gap between the plastic upper substrate and the plastic lower substrate mixed with the gas and the dust is removed during pressing, and the short circuit caused by the mixing of the steam in the air is prevented, thereby improving the packaging quality of the semiconductor chip;

through the lower hot plate that sets up, when the encapsulation, be provided with a plurality ofly with the dish of placing of lower hot plate gomphosis, the staff can place the dish and add another of taking and place the dish and put chip plastics upper substrate, plastics infrabasal plate and chip and pin when placing the dish, alright improve the production efficiency of packaging mechanism like this.

Drawings

Fig. 1 is a schematic view of an overall structure of a semiconductor chip packaging mechanism according to the present invention;

fig. 2 is a top view of a placing tray of the semiconductor chip packaging mechanism of the present invention;

FIG. 3 is a front view of a tray for holding a semiconductor chip package mechanism according to the present invention;

fig. 4 is a partial cross-sectional view of a lower heating plate of a semiconductor chip packaging mechanism according to the present invention;

fig. 5 is a partial cross-sectional view of the telescopic rod of the semiconductor chip packaging mechanism of the present invention;

fig. 6 is an enlarged view of a portion a of the semiconductor chip packaging mechanism of the present invention shown in fig. 1;

fig. 7 is a partial sectional view of the mounting box of the semiconductor chip packaging mechanism of the present invention.

In the figure: 1. a high pressure tank body; 101. processing a port; 102. an exhaust duct; 103. an electromagnetic valve; 2. a sealing door; 201. a seal ring; 202. a transparent window for observation; 203. fixing the card; 3. a hydraulic cylinder; 301. a telescopic rod; 302. a limiting groove; 303. a return spring; 304. connecting a sliding rod; 305. an upper heating plate; 4. a lower heating plate; 401. a conductive fin; 402. placing a tray; 403. a heated fin; 404. arranging a groove; 405. a pin placing groove; 5. a barometer; 6. a control panel; 7. a fixed seat; 701. a screw rod; 702. fastening a knob; 8. installing a box body; 801. a box door; 802. an inner buckle handle; 9. a vacuum pump; 901. a power motor; 902. a high pressure pipeline.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The first embodiment is as follows:

as shown in fig. 1-7, a semiconductor chip packaging mechanism comprises a high-pressure box 1, a sealing door 2 is movably mounted on the front surface of the high-pressure box 1, a hydraulic cylinder 3 is fixedly mounted on the inner upper surface of the high-pressure box 1, a lower heating plate 4 is fixedly mounted on the inner lower surface of the high-pressure box 1, a barometer 5 is fixedly mounted on the upper surface of the high-pressure box 1, a control panel 6 is fixedly mounted on the front surface of the high-pressure box 1, a fixing seat 7 is fixedly mounted on one side, located on the control panel 6, of the front surface of the high-pressure box 1, a mounting box 8 is fixedly mounted on the lower surface of the high-pressure box 1;

a processing port 101 is formed in one side, away from the control panel 6, of the front surface of the high-pressure box body 1, which is located on the fixed seat 7, an exhaust pipeline 102 is fixedly connected and mounted on one side, located on the barometer 5, of the upper surface of the high-pressure box body 1, an electromagnetic valve 103 is fixedly connected and mounted on the surface of the exhaust pipeline 102, and the lower port of the exhaust pipeline 102 is communicated with the interior of the high-pressure box body 1; a sealing ring 201 is fixedly arranged on the inner side surface of the sealing door 2 close to the edge, an observation transparent window 202 is fixedly embedded in the middle of the sealing door 2, and a fixing clip 203 is fixedly arranged in the middle of one side of the sealing door 2; the other side of the sealing door 2 is fixedly provided with a hinge, and the sealing door 2 is movably connected with the edge port of the processing port 101 through the hinge; the lower end of the hydraulic cylinder 3 is movably provided with a telescopic rod 301, the lower end of the telescopic rod 301 is provided with a limiting groove 302, the inside of the limiting groove 302 is fixedly connected with a return spring 303, the inside of the limiting groove 302 is movably provided with a connecting slide rod 304, the lower end of the connecting slide rod 304 is fixedly provided with an upper heating plate 305, and the lower surface of the upper heating plate 305 is provided with a pressing groove; the upper surface of the lower heating plate 4 is fixedly provided with a conduction fin 401, the upper surface of the lower heating plate 4 is fixedly provided with a placing disc 402 in a contact and embedding manner, the lower surface of the placing disc 402 is fixedly provided with a heated fin 403, the upper surface of the placing disc 402 is provided with a placing groove 404, the upper surface of the placing disc 402 is positioned at two sides of the placing groove 404 and is provided with a pin placing groove 405, the periphery of the lower heating plate 4 is provided with a limiting plate block, the placing disc 402 is arranged on the surface of the lower heating plate 4 in a contact manner through a gap between the conduction fins 401 embedded by the heated fin 403, and the heated fin 403 is in close contact; a screw rod 701 is movably connected and mounted on the surface of the fixed seat 7, a fastening knob 702 is spirally mounted on the surface of the screw rod 701, a rotating shaft is fixedly mounted on the surface of the fixed seat 7, a through hole is formed in the position, close to one end, of the surface of the screw rod 701, and the fixed seat 7 penetrates through the through hole through the rotating shaft and is movably connected with the screw rod 701; a box door 801 is movably mounted on the front surface of the mounting box body 8, an inner buckle handle 802 is arranged on the surface of the box door 801, a power motor 901 is connected and mounted on one side of the vacuum pump 9, a high-pressure pipeline 902 is fixedly connected and mounted at one port of the vacuum pump 9, and the other end of the high-pressure pipeline 902 is communicated with the inside of the high-pressure box body 1.

Example two:

it should be noted that, the utility model relates to a semiconductor chip packaging mechanism, when using, at first place the plastic lower base plate of encapsulation in settling groove 404, then put the chip in the middle of the plastic lower base plate, and place the pin in pin arrangement groove 405, cover the plastic upper base plate after settling, then settle other same chips in proper order, after settling, imbed the heated fin 403 of placing the dish 402 between the conduction fin 401 and link up with lower hot plate 4, cover sealing door 2 after linking up, and block into fixing card 203 with hob 701, rotatory fastening knob 702 compresses tightly sealing door 2, then start power motor 901 and drive vacuum pump 9 and draw into vacuum state high-pressure box 1 through high-pressure pipeline 902, and read corresponding data through barometer 5, stop the operation of vacuum pump 9 after the data reaches standard, this moment heat upper hot plate 305 and lower hot plate 4 simultaneously, and starting the hydraulic cylinder 3 to extend out of the telescopic rod 301 to move the upper heating plate 305 downwards to press with the placing plate 402, so that plastic deformation occurs in a dry area during pressing and an oxide layer on a pressure welding interface is damaged, thereby generating attraction among atoms to achieve the purpose of bonding, after packaging is finished, opening the electromagnetic valve 103 to enable external air to enter the inside of the high-pressure box 1, then taking out the placing plate 402, placing the next placed placing plate 402 into the inside of the high-pressure box 1 for processing, wherein the high-pressure box 1 is arranged, the inside of the high-pressure box 1 can be pumped into a vacuum state through the vacuum pump 9, thereby removing the moist air and dust mixed in the air, eliminating the gap between the plastic upper substrate and the plastic lower substrate during pressing, preventing the steam mixed in the air from causing short circuit, and improving the packaging quality of semiconductor chips, in addition, during packaging, a plurality of placing discs 402 embedded with the lower heating plate 4 are arranged, and a worker can take another placing disc 402 to place the chip plastic upper substrate, the plastic lower substrate, the chip and the pins when one placing disc 402 is processed, so that the production efficiency of the packaging mechanism can be improved.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A semiconductor chip packaging mechanism is characterized in that: including high-pressure box (1), the preceding surface movable mounting of high-pressure box (1) has sealing door (2), fixed surface installs pneumatic cylinder (3) on the inside of high-pressure box (1), the inside fixed surface of high-pressure box (1) installs down hot plate (4), the last fixed surface of high-pressure box (1) installs barometer (5), the preceding fixed surface of high-pressure box (1) installs control panel (6), one side fixed mounting that the front surface of high-pressure box (1) is located control panel (6) has fixing base (7), the fixed surface of high-pressure box (1) installs installation box (8), the inside fixed mounting of installation box (8) has vacuum pump (9).

2. The semiconductor chip packaging mechanism according to claim 1, wherein: processing port (101) have been seted up to one side that the front surface of high pressure box (1) is located fixing base (7) and keeps away from control panel (6), exhaust duct (102) are installed to one side fixed connection that the upper surface of high pressure box (1) is located barometer (5), solenoid valve (103) are installed to the fixed surface connection of exhaust duct (102), the inside intercommunication of port and high pressure box (1) under exhaust duct (102).

3. The semiconductor chip packaging mechanism according to claim 1, wherein: the inboard surface of sealing door (2) is close to edge position fixed mounting and has sealing washer (201), the fixed embedding in middle part of sealing door (2) is established and is installed observation transparent window (202), one side middle part fixed mounting of sealing door (2) has fixing clip (203).

4. A semiconductor chip packaging mechanism according to claim 3, wherein: the other side of sealing door (2) is fixedly provided with a hinge, and sealing door (2) is movably connected with the edge port of processing port (101) through the hinge.

5. The semiconductor chip packaging mechanism according to claim 1, wherein: the lower extreme movable mounting of pneumatic cylinder (3) has telescopic link (301), spacing groove (302) have been seted up to the lower extreme of telescopic link (301), return spring (303) are installed to the inside fixed connection of spacing groove (302), the inside movable mounting of spacing groove (302) has connecting slide bar (304), the lower extreme fixed mounting of connecting slide bar (304) has last hot plate (305), the pressfitting recess has been seted up to the lower surface of going up hot plate (305).

6. The semiconductor chip packaging mechanism according to claim 1, wherein: the upper surface fixed mounting of lower hot plate (4) has conduction fin (401), the upper surface fixed contact of lower hot plate (4) is inlayed and is installed and place dish (402), the lower fixed mounting who places dish (402) has heated fin (403), the upper surface of placing dish (402) has seted up arrangement groove (404), the upper surface of placing dish (402) is located the both sides of arrangement groove (404) and has seted up pin arrangement groove (405), the periphery of lower hot plate (4) is equipped with spacing plate, place dish (402) through the clearance contact of being heated fin (403) embedding between conduction fin (401) settle on the surface of hot plate (4) down, and be heated fin (403) and conduction fin (401) in close contact.

7. The semiconductor chip packaging mechanism according to claim 1, wherein: the utility model discloses a fastening knob, including fixing base (7), screw rod (701) is installed to the surface swing joint of fixing base (7), the fastening knob (702) is installed to the surface spiral of screw rod (701), the fixed surface of fixing base (7) installs the pivot, the surface of screw rod (701) is close to one end position and has seted up the through-hole, through-hole and screw rod (701) swing joint are passed through the pivot in fixing base (7).

8. The semiconductor chip packaging mechanism according to claim 1, wherein: the front surface movable mounting of installation box (8) has chamber door (801), interior buckle handle (802) have been seted up on the surface of chamber door (801), power motor (901) are installed in the connection of one side of vacuum pump (9), a port fixed connection of vacuum pump (9) installs high-pressure pipeline (902), the other end of high-pressure pipeline (902) and the inside intercommunication of high-pressure box (1).