CN211578705U - Suction nozzle transmission structure suitable for chip heating test - Google Patents
Suction nozzle transmission structure suitable for chip heating test Download PDFInfo
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- CN211578705U CN211578705U CN202020549087.9U CN202020549087U CN211578705U CN 211578705 U CN211578705 U CN 211578705U CN 202020549087 U CN202020549087 U CN 202020549087U CN 211578705 U CN211578705 U CN 211578705U
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- suction nozzle
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- heating test
- transmission structure
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Abstract
The utility model discloses a suction nozzle transmission structure suitable for chip heating test, including connection substrate, suction nozzle fixed block, briquetting, suction nozzle, hasp, be equipped with the recess on the connection substrate, it is connected with the cooperation of suction nozzle fixed block, the suction nozzle runs through in the center of suction nozzle fixed block, the lower extreme air inlet and the connection substrate of suction nozzle are connected, the upper end gas outlet of suction nozzle is deepened in the briquetting and is connected, the hasp is fixed in connection substrate's both sides edge. The utility model has the advantages that: the transmission structure is applied to the chip heating test fixture, the pressing block is connected with the air outlet at the upper end of the suction nozzle, the chip heating test can be directly adsorbed, the working procedures and the working hours are saved, the pressing block on the pressing block is protruded to tightly cover the chip, the heat can be concentrated and not diffused, the energy is saved, and the chip detection efficiency is greatly improved.
Description
Technical Field
The utility model relates to a chip testing technology field specifically is a suction nozzle transmission structure suitable for chip heating test.
Background
With the development of science and technology, the development of the chip industry is faster and faster, and the miniaturization and multifunction of the chip are the development trend of the modern chip industry. Because the chip production needs hundreds of steps of processes, and the device failure can be caused by the error of any step, the chip detection link is very important. Some chips need to be heated and tested, the heating test commonly used is put into the heating jig with the chip earlier, but traditional chip adsorbs drive structure and all adopts the plastic suction nozzle, and single plastic suction nozzle takes place deformation easily under the high temperature condition, so can only remove adsorbing drive structure, heats the test again, and the operation is got up the trouble like this, and the heat on the chip runs off easily during the test, reduces the efficiency of chip heating test.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a suction nozzle transmission structure suitable for chip heating test to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a suction nozzle transmission structure suitable for chip heating test, includes connection substrate, suction nozzle fixed block, briquetting, suction nozzle, hasp, be equipped with the recess on the connection substrate, it is connected with the cooperation of suction nozzle fixed block, the suction nozzle runs through in the center of suction nozzle fixed block, the lower extreme air inlet of suction nozzle is connected with the connection substrate, the upper end gas outlet of suction nozzle is gone deep into in the briquetting and is connected, the hasp is fixed in the both sides edge of connecting the substrate.
Further preferably, a manipulator and an air source are connected below the connecting substrate, and a first sealing ring is arranged at the joint of the manipulator and the air source.
Further preferably, a second sealing ring is arranged at the joint of the groove and the air inlet at the lower end of the suction nozzle.
Further preferably, the suction nozzle fixing block and the connection substrate are connected through a positioning pin.
Further preferably, the pressing block is provided with a pressing block protrusion, and the upper edge of the pressing block protrusion is provided with a guide protrusion which can be clamped on the chip.
Further preferably, the pressing block and the pressing block are convexly provided with communicated through holes which are communicated with an air outlet at the upper end of the suction nozzle.
Advantageous effects
The utility model discloses a suction nozzle transmission structure suitable for chip heating test is a transmission structure who is applied to in the chip heating test fixture, through connecting the briquetting in the upper end gas outlet of suction nozzle, realizes directly adsorbing chip heating test, saves process, man-hour, and the briquetting arch on the briquetting tightly covers on the chip, can make the heat concentrate not spread, and the energy saving, and promotes the efficiency that the chip detected greatly.
Drawings
Fig. 1 is a schematic structural view of a nozzle transmission structure suitable for chip heating test according to an embodiment of the present invention.
Reference numerals
1-connecting a base plate, 11-a groove, 12-a first sealing ring, 13-a second sealing ring, 14-a positioning pin, 2-a suction nozzle fixing block, 3-a pressing block, 31-a pressing block bulge, 4-a suction nozzle and 5-a hasp.
Detailed Description
The following are specific embodiments of the present invention and the accompanying drawings are used to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.
Examples
As shown in fig. 1, a suction nozzle transmission structure suitable for chip heating test comprises a connection substrate 1, a suction nozzle fixing block 2, a pressing block 3, a suction nozzle 4 and a hasp 5, wherein a groove 11 is formed in the connection substrate 1 and is connected with the suction nozzle fixing block 2 in a matching manner, the suction nozzle 4 penetrates through the center of the suction nozzle fixing block 2, a lower air inlet of the suction nozzle 4 is connected with the connection substrate 1, an upper air outlet of the suction nozzle 4 extends into the pressing block 3 to be connected with the pressing block 3, and the hasp 5 is fixed on two side edges of the connection substrate 1.
Preferably, the lower part of the connection substrate 1 is connected with a manipulator and an air source, and a first sealing ring 12 is arranged at the joint of the manipulator and the air source, so that the sealing effect is good, and the influence on the adsorption effect of the suction nozzle 4 due to the leakage of air is prevented.
Preferably, a second sealing ring 13 is arranged at the joint of the groove 11 and the air inlet at the lower end of the suction nozzle 4, so that the sealing effect is good, and the influence on the adsorption effect of the suction nozzle 4 caused by the leakage of air is prevented.
Preferably, the nozzle fixing block 2 and the connection substrate 1 are connected by a positioning pin 14.
Preferably, be equipped with the protruding 31 of briquetting on the briquetting 3, the edge is equipped with the direction arch above the protruding 31 of briquetting, but its joint on the chip, the direction arch can be located the position accuracy, guarantees that the chip can accurately put into the chip inslot of next station, and the protruding chip of fixing of direction simultaneously makes the protruding 31 combination of chip and briquetting inseparable, and the heat is concentrated when guaranteeing the heating test, and the protruding 31 of briquetting is made for the metal material, all can not take place deformation and damage under the effect of high temperature, pressure.
Preferably, the pressing block 3 and the pressing block protrusion 31 are provided with communicated through holes which are communicated with an air outlet at the upper end of the suction nozzle 4, so that the air can conveniently circulate.
Preferably, the connection substrate 1 is connected with a manipulator through a hasp 5, so that the connection substrate is convenient to detach and replace.
The utility model discloses a suction nozzle transmission structure can be used to the heating test of chip in, through the absorption chip of suction nozzle 4, the protruding 31 location of briquetting covers on the chip with the pressure, then is fixed in the chip on the heating tool, heats the test, and the protruding 31 of briquetting of metal material can not produce deformation in the heating process, protection chip that can be fine makes it heat the test smoothly.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the content of the present invention within the protection scope of the present invention.
Claims (6)
1. The utility model provides a suction nozzle transmission structure suitable for chip heating test which characterized in that: including connection base plate (1), suction nozzle fixed block (2), briquetting (3), suction nozzle (4), hasp (5), be equipped with recess (11) on connection base plate (1), it is connected with suction nozzle fixed block (2) cooperation, suction nozzle (4) run through in the center of suction nozzle fixed block (2), the lower extreme air inlet of suction nozzle (4) is connected with connection base plate (1), the upper end gas outlet of suction nozzle (4) is connected with briquetting (3) in going deep into briquetting (3), hasp (5) are fixed in on the both sides limit of connecting base plate (1).
2. The suction nozzle transmission structure suitable for chip heating test according to claim 1, wherein: the lower part of the connecting base plate (1) is connected with a manipulator and an air source, and a first sealing ring (12) is arranged at the joint of the manipulator and the air source.
3. The suction nozzle transmission structure suitable for chip heating test according to claim 1, wherein: and a second sealing ring (13) is arranged at the joint of the groove (11) and the air inlet at the lower end of the suction nozzle (4).
4. The suction nozzle transmission structure suitable for chip heating test according to claim 1, wherein: the suction nozzle fixing block (2) is connected with the connecting substrate (1) through a positioning pin (14).
5. The suction nozzle transmission structure suitable for chip heating test according to claim 1, wherein: the upper surface of the pressing block (3) is provided with a pressing block bulge (31), and the upper edge of the pressing block bulge (31) is provided with a guide bulge which can be clamped on the chip.
6. The suction nozzle transmission structure suitable for chip heating test according to claim 5, wherein: the pressing block (3) and the pressing block protrusion (31) are provided with communicated through holes which are communicated with an air outlet at the upper end of the suction nozzle (4).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202020549087.9U CN211578705U (en) | 2020-04-14 | 2020-04-14 | Suction nozzle transmission structure suitable for chip heating test |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202020549087.9U CN211578705U (en) | 2020-04-14 | 2020-04-14 | Suction nozzle transmission structure suitable for chip heating test |
Publications (1)
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CN211578705U true CN211578705U (en) | 2020-09-25 |
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Family Applications (1)
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CN202020549087.9U Active CN211578705U (en) | 2020-04-14 | 2020-04-14 | Suction nozzle transmission structure suitable for chip heating test |
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CN (1) | CN211578705U (en) |
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2020
- 2020-04-14 CN CN202020549087.9U patent/CN211578705U/en active Active
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