CN212510566U

CN212510566U - LED device, LED lamp strip with same and display device

Info

Publication number: CN212510566U
Application number: CN202021443593.6U
Authority: CN
Inventors: 李金泽
Original assignee: Beijing Xiaomi Mobile Software Co Ltd
Current assignee: Beijing Xiaomi Mobile Software Co Ltd
Priority date: 2020-07-21
Filing date: 2020-07-21
Publication date: 2021-02-09
Anticipated expiration: 2030-07-21

Abstract

The application discloses LED device and have its LED lamp strip and display device, include the base plate and set up in the LED chip and the casing of base plate, the casing has the installation cavity, and the LED chip is located the installation cavity, and the surface of casing has the first bonding region that is used for contacting with glue, and first bonding region is equipped with a coarse structure. The application provides an LED device and have its LED lamp strip and display device is equipped with first coarse structure through the first bonding district at the casing, and first coarse structure can increase the bonding area between casing and the glue, improves the joint strength between glue and the casing, and then improves the joint strength between LED device and the circuit board, has reduced the risk that the LED device drops from the circuit board.

Description

LED device, LED lamp strip with same and display device

Technical Field

The utility model relates to a lighting apparatus technical field, concretely relates to display panel technical field especially relates to LED device and have its LED lamp strip and display device.

Background

The mobile phone comprises a liquid crystal display panel, the liquid crystal display panel comprises a side-emitting LED lamp bar, a circuit board and a plurality of LED devices attached to the circuit board are arranged on the LED lamp bar, and the LED devices are welded with the circuit board through bonding pads. The packaging sleeve of the LED device is bonded with the circuit board through glue formed by dispensing, so that the connection strength between the packaging sleeve of the LED device and the circuit board is improved.

Based on the demand of the mobile phone for the development of ultra-narrow frames, the size of the LED device is getting smaller and smaller. However, when the size of the LED device is reduced, the size of the glue between the package cover of the LED device and the circuit board is also reduced, so that the connection strength between the LED device and the glue is poor, and the problem that the LED device falls off is easily caused.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned drawbacks and deficiencies in the prior art, it is desirable to provide an LED device, and an LED light bar and a display device having the same.

In a first aspect, the application provides an LED device, including the base plate and set up in the LED chip and the casing of base plate, the casing has the installation cavity, and the LED chip is located the installation cavity, and the surface of casing has the first bonding region that is used for contacting with glue, and first bonding region is equipped with first coarse structure.

Furthermore, the first rough structure comprises more than one first convex part structure, and the first convex part structure is in a point shape or a stripe shape; and/or the first rough structure comprises more than one first concave structure, and the first concave structure is in a dot shape or a stripe shape.

Furthermore, a first bonding pad and a second bonding pad are arranged on the substrate, the first bonding pad is connected with the anode of the LED chip, the second bonding pad is connected with the cathode of the LED chip, and a second rough structure is arranged on the welding surface of the first bonding pad and/or the second bonding pad.

Furthermore, the second rough structure comprises more than one second convex part structure, and the second convex part structure is in a point shape or a stripe shape; and/or the second rough structure comprises more than one second concave structure, and the second concave structure is in a dot shape or a stripe shape.

Further, the outer surface of the substrate is provided with a second bonding area used for being in contact with glue, the second bonding area is close to the first bonding area, and the second bonding area is provided with a third rough structure.

Furthermore, the third rough structure comprises more than one third convex part structure, and the third convex part structure is in a point shape or a stripe shape; and/or the third rough structure comprises more than one third concave structure, and the third concave structure is in a dot shape or a stripe shape.

Further, the first rough structure and the shell are integrally formed.

Further, the roughness Ra of the first roughness structure is in the range of 1.12-2.24 μm, or the roughness Ra of the second roughness structure is in the range of 1.12-2.24 μm, or the roughness Ra of the third roughness structure is in the range of 1.12-2.24 μm.

In a second aspect, the application provides an LED light bar, which comprises a circuit board and an LED device, wherein a first bonding area is bonded with the circuit board through glue.

In a third aspect, the present application further provides a display device including an LED device or an LED light bar.

The application provides an LED device and have its LED lamp strip and display device is equipped with first coarse structure through the first bonding district at the casing, and first coarse structure can increase the bonding area between casing and the glue, improves the joint strength between glue and the casing, and then improves the joint strength between LED device and the circuit board, has reduced the risk that the LED device drops from the circuit board.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:

fig. 1 is a schematic perspective view of an LED device provided in an embodiment of the present application;

fig. 2 is a schematic bottom view of an LED device provided in an embodiment of the present application;

fig. 3 is a schematic connection diagram between an LED device and a circuit board according to an embodiment of the present disclosure.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and are not limiting of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

Referring to fig. 1, an LED device 100 is used as a light emitting device, which can be used as a backlight source of a display device. Of course, the application field of the LED device 100 is not limited to display devices, but may also be used in other lighting apparatuses, for example. The LED device 100 is generally mounted on the circuit board 200, and the circuit board 200 controls the on/off of the LED device 100. The display device may be applied, for example, but not limited to, in a mobile terminal.

With continuing reference to fig. 1 and with reference to fig. 2-3, the present application provides an LED device 100, which includes a substrate 110, an LED chip disposed on the substrate 110, and a housing 120, where the housing 120 has a mounting cavity, the LED chip is located in the mounting cavity, an outer surface of the housing 120 has a first bonding area for contacting with a glue 300, and the first bonding area has a first roughness structure 121.

In the present embodiment, the LED device 100 and the circuit board 200 are bonded by the glue 300, wherein the region where the glue 300 is in bonding contact with the LED device 100 includes a first bonding region located on the outer surface of the housing 120. The first bonding area is provided with a first rough structure 121, the first rough structure 121 has certain roughness, the bonding area between the shell 120 and the glue 300 can be increased, the connection strength between the glue 300 and the shell 120 is improved, the connection strength between the LED device 100 and the circuit board 200 is further improved, and the risk that the LED device 100 falls off from the circuit board 200 is reduced.

Alternatively, the LED chip may be provided with a fluorescent film 130 thereon, and the illumination light is emitted through the fluorescent film 130. The fluorescent film 130 may be yellow, and the LED chip may emit blue light, so that the LED device 100 emits white illumination light with better uniformity through the fluorescent film 130.

Optionally, the housing 120 may be made of a highly reflective material, such as but not limited to silicon, to reflect light emitted from the LED chip, so as to improve the lighting effect of the LED. The housing 120 has an opening 122 to expose the phosphor film 130. The housing 120 can fix the LED chip and protect and seal the LED chip. The housing 120 is formed by, for example, but not limited to, injection molding the LED chip package mounted on the substrate 110, which is not only simple in operation but also has good overall performance.

Alternatively, the substrate 110 may be an insulating material and a corrosion-resistant material, such as PC plastic, etc. The substrate 110 in each LED device 100 may be cut from the whole substrate 110 or processed independently.

It should be understood that the circled area indicated by arrow a in fig. 2 is an enlarged area to facilitate the display of the first roughness 121. The first bonding region acquires the case 120 and does not extend to the substrate 110.

In some embodiments of the present application, the first roughness structure 121 includes more than one first protrusion structure, and the first protrusion structure is in a dot shape or a stripe shape; and/or the first rough structure comprises more than one first concave structure, and the first concave structure is in a dot shape or a stripe shape.

In this embodiment, the first roughness structure 121 may be one or more first protrusion structures and/or one or more first recess structures. The first convex part structure is in a point shape or a stripe shape, and the first concave part structure is in a point shape or a stripe shape. For example: the first roughness structure 121 may include a plurality of convex points, a plurality of concave points, and a plurality of wave-shaped stripes.

Due to the uneven surface of the first rough structure 121, the contact area between the glue 300 and the first bonding area can be increased, and the connection strength between the LED device 100 and the circuit board 200 can be improved. Alternatively, the roughness Ra of the first roughness structure 121 is in the range of 1.12-2.24 μm, so that the bonding strength between the housing 120 and the glue 300 can be improved by more than 20%. Meanwhile, when the contact area between the shell 120 and the glue 300 is increased, the processing difficulty and the processing cost of the first rough structure 121 can be considered.

Optionally, the first rough structure 121 and the housing 120 are integrally formed, so that the processing effect of the housing 120 is improved, and the overall performance is better. For example, when the housing 120 is injection molded, the first rough structure 121 may be integrally formed on the surface of the prepared housing 120 by performing an electric discharge process on the molding surface of the injection mold to form a rough structure matching the first rough structure 121.

Of course, in other embodiments, the first rough structure 121 may be rough-machined on the prepared shell 120 to form the first rough structure 121.

In some embodiments of the present application, a first bonding pad 111 and a second bonding pad 112 are disposed on the substrate 110, the first bonding pad 111 is connected to an anode of the LED chip, the second bonding pad 112 is connected to a cathode of the LED chip, and a bonding surface of the first bonding pad 111 and/or the second bonding pad 112 is provided with a second rough structure.

In this embodiment, the LED chip is mounted on the substrate 110, a first bonding pad 111 and a second bonding pad 112 are disposed on an outer side wall of the substrate 110, the first bonding pad 111 is connected to an anode of the LED chip through a wire, and the second bonding pad 112 is connected to a cathode of the LED chip through a wire. The circuit board 200 is provided with a third pad 201 and a third pad 201 corresponding to the first pad 111 and the second pad 112, respectively, the first pad 111 and the third pad 201 can be soldered by a solder 400, and the second pad 112 and the fourth pad 202 can be soldered by the solder 400, so as to electrically connect the LED device 100 and the circuit board 200. The welding surface of the first welding pad 111 and/or the second welding pad 112 is provided with a second rough structure, the second rough structure has certain roughness, the welding area between the welding pads on the LED device 100 and the circuit board 200 can be increased, the connection strength between the glue 300 and the shell 120 is improved, the connection strength between the LED device 100 and the circuit board 200 is further improved, and the risk that the LED device 100 falls off from the circuit board 200 is reduced.

One or more pairs of first and

second pads

111 and 112 may be disposed on the substrate 110, and any pair of first and

second pads

111 and 112 may be soldered to corresponding third and

fourth pads

201 and 202 on the circuit board 200. Any pair of the first and

second pads

111 and 112 may be located on the same side or different sides of the LED device 100 from the first roughness 121. Any one or more than two pads on the substrate 110 may be provided with the second roughness structure.

It should be understood that the LED device 100 and the circuit board 200 are not only bonded by the glue 300, but also fixedly connected to the circuit board 200 by the bonding pad.

The circuit board 200 may preferably be a flexible circuit board 200, which is thin and can be bent to facilitate installation in electronic devices such as mobile terminals.

In some embodiments of the present application, the second roughness structure includes more than one second protrusion structure, and the second protrusion structure is in a dot shape or a stripe shape; and/or the second rough structure comprises more than one second concave structure, and the second concave structure is in a dot shape or a stripe shape.

In this embodiment, the second roughness structure may be one or more second protrusion structures and/or one or more second recess structures. The second convex part structure is in a point shape or a stripe shape, and the second concave part structure is in a point shape or a stripe shape. For example: the second roughness structure may include a plurality of convex points, a plurality of concave points, and a plurality of wave-shaped stripes.

Due to the uneven surface of the second rough structure, the welding area between the soldering pad and the soldering tin 400 can be increased, and the connection strength between the LED device 100 and the circuit board 200 is further improved. Alternatively, the roughness Ra of the second roughness is in the range of 1.12-2.24 μm, so that the soldering strength between the pad and the solder 400 can be significantly improved. Meanwhile, when the welding area between the pad and the soldering tin 400 is increased, the processing difficulty and the processing cost of the second rough structure can be considered.

Alternatively, the second roughness structure may be formed on the first pad 111 and/or the second pad 112 by means of an electric discharge process, which not only simplifies the machining, but also allows the roughness of the second roughness structure to be precisely controlled. Of course, the manner of forming the second roughness on the first pad 111 and/or the second pad 112 is not limited to the above-described manner of the electric discharge processing.

In some embodiments of the present application, the outer surface of the substrate 110 has a second adhesive area for contact with the glue 300, the second adhesive area being adjacent to the first adhesive area, the second adhesive area being provided with a third roughness structure.

In the present embodiment, the LED device 100 and the circuit board 200 are bonded by the glue 300, wherein the region where the glue 300 is in bonding contact with the LED device 100 includes a second bonding region located on the outer surface of the substrate 110. The second bonding area is provided with a third rough structure, the third rough structure has certain roughness, the bonding area of the substrate 110 and the glue 300 can be increased, the connection strength between the glue 300 and the substrate 110 is improved, the connection strength between the LED device 100 and the circuit board 200 is further improved, and the risk that the LED device 100 falls off from the circuit board 200 is reduced.

The first and second adhesive regions are located on the same side of the LED device 100. The first and second bonding regions are close to the interface between the base body and the housing 120, so that the glue 300 can be prevented from exposing the LED device 100 under the press-fitting of the LED device 100.

In some embodiments of the present application, the third roughness structure includes more than one third protrusion structure, and the third protrusion structure is in a dot shape or a stripe shape; and/or the third rough structure comprises more than one third concave structure, and the third concave structure is in a dot shape or a stripe shape.

In this embodiment, the third roughness structure may be one or more third protrusion structures and/or one or more third recess structures. The third convex part structure is in a point shape or a stripe shape, and the third concave part structure is in a point shape or a stripe shape. For example: the third roughness structure may include a plurality of convex points, a plurality of concave points, and a plurality of wave-shaped stripes.

Due to the uneven surface of the third rough structure, the contact area between the glue 300 and the second bonding area can be increased, and the connection strength between the LED device 100 and the circuit board 200 can be improved.

Optionally, the roughness Ra of the third roughness structure is in the range of 1.12-2.24 μm, so as to improve the bonding strength between the substrate 110 and the glue 300 by more than 20%. Meanwhile, when the contact area between the substrate 110 and the glue 300 is increased, the processing difficulty and the processing cost of the third rough structure can be considered.

Alternatively, the third roughness structure may be formed on the substrate 110 by, for example, but not limited to: the entire substrate 110 is cut by using a cutting blade having a corresponding rough surface to form a third roughness on the cut substrate 110.

The embodiment of the application provides an LED lamp strip, which comprises a circuit board 200 and an LED device 100, wherein a first bonding area is bonded with the circuit board 200 through glue 300.

Optionally, the glue 300 may extend to the first and second bonding areas, and the glue 300 bonds with both the first and second bonding areas.

The embodiment of the present application further provides a display device, which includes the LED device 100, or includes an LED light bar. The display device may be a liquid crystal display device or the like.

It will be understood that any reference to the above orientation or positional relationship as indicated by the terms "central," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc., is intended to be based on the orientation or positional relationship shown in the drawings and is for convenience in describing and simplifying the invention, and does not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and is therefore not to be considered as limiting. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be understood by those skilled in the art that the scope of the present invention is not limited to the specific combination of the above-mentioned features, but also covers other embodiments formed by any combination of the above-mentioned features or their equivalents without departing from the spirit of the present invention. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.

Claims

1. The LED device is characterized by comprising a substrate, an LED chip and a shell, wherein the LED chip and the shell are arranged on the substrate, the shell is provided with a mounting cavity, the LED chip is located in the mounting cavity, the outer surface of the shell is provided with a first bonding area used for being in contact with glue, and the first bonding area is provided with a first rough structure.

2. The LED device of claim 1, wherein the first roughness structure comprises one or more first bump structures, the first bump structures being dot-shaped or stripe-shaped; and/or the first rough structure comprises more than one first concave structure, and the first concave structure is in a dot shape or a stripe shape.

3. The LED device according to claim 1, wherein a first bonding pad and a second bonding pad are arranged on the substrate, the first bonding pad is connected with the anode of the LED chip, the second bonding pad is connected with the cathode of the LED chip, and a second rough structure is arranged on the bonding surface of the first bonding pad and/or the second bonding pad.

4. The LED device of claim 3, wherein the second roughness structure comprises one or more second bump structures, the second bump structures being dot-shaped or stripe-shaped; and/or the second rough structure comprises more than one second concave structure, and the second concave structure is in a dot shape or a stripe shape.

5. LED device according to any of claims 1-4, characterized in that the outer surface of the substrate has a second adhesive area for contact with glue, which second adhesive area is adjacent to the first adhesive area, which second adhesive area is provided with a third roughness structure.

6. The LED device of claim 5, wherein the third roughness structure comprises more than one third bump structure, the third bump structure being dot-shaped or stripe-shaped; and/or the third rough structure comprises more than one third concave structure, and the third concave structure is in a dot shape or a stripe shape.

7. The LED device according to claim 5, wherein the roughness Ra of the first roughness structure is in the range of 1.12-2.24 μm, or the roughness Ra of the third roughness structure is in the range of 1.12-2.24 μm.

8. The LED device according to claim 3, wherein the roughness Ra of the second roughness structure is in the range of 1.12-2.24 μm.

9. The LED device of claim 1, wherein the first roughness structure is integrally formed with the housing.

10. An LED light bar, comprising a circuit board and the LED device of any one of claims 1-9, wherein the first bonding region is bonded to the circuit board by glue.

11. A display apparatus comprising the LED device of any one of claims 1 to 9, or comprising the LED light bar of claim 10.