CN212498664U - Auxiliary mould flow injection molding structure - Google Patents
Auxiliary mould flow injection molding structure Download PDFInfo
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- CN212498664U CN212498664U CN202020571301.0U CN202020571301U CN212498664U CN 212498664 U CN212498664 U CN 212498664U CN 202020571301 U CN202020571301 U CN 202020571301U CN 212498664 U CN212498664 U CN 212498664U
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- auxiliary
- injection molding
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- semiconductor packaging
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The utility model relates to an auxiliary mould flows structure of moulding plastics, contain semiconductor package substrate and a plurality of auxiliary flow ways, have multiseriate chip plastic envelope portion on the semiconductor package substrate, be provided with a plurality of auxiliary injection moulding mouths on one side of semiconductor package substrate, each auxiliary flow way all has the mould inflow mouth, auxiliary flow way and auxiliary injection moulding mouth intercommunication; according to the scheme, an oval opening is designed above the longitudinal units at the upper end of the substrate, so that a new injection molding opening is formed between the encapsulation mold and the substrate, epoxy resin flows into a mold cavity through the injection molding opening, and after the temperature is reduced, an upper mold cavity and a lower mold cavity are formed to complete plastic package; the scheme has simple structure and good compatibility; the problem of slow or bubble of moulding plastics is solved, and can be better compatible multiple not equidimension encapsulation product.
Description
Technical Field
The utility model relates to a supplementary mould flow structure of moulding plastics belongs to semiconductor packaging technical field.
Background
In the substrate chip plastic package process, when the size of a chip is too large, or the longitudinal size of an open slot in the middle of the chip and a substrate is close to each other, after the chip is attached to the substrate, the gap of the open slot in the middle of the chip and the substrate is too small, an injection molding opening is too small, mold flow is difficult to flow into, and the mold flow speed is low, so that epoxy resin is molded slowly, or bubbles are easily generated during injection, and the injection molding effect is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the not enough of prior art and providing an auxiliary mould flows structure of moulding plastics.
In order to achieve the above purpose, the utility model adopts the technical scheme that: the utility model provides an auxiliary mould flows structure of moulding plastics, contains semiconductor package substrate and a plurality of auxiliary runner, has multiseriate chip plastic envelope portion on the semiconductor package substrate, is provided with a plurality of supplementary mouths of moulding plastics on one side of semiconductor package substrate, and every auxiliary runner all has the mould inflow mouth, auxiliary runner and the supplementary mouth intercommunication of moulding plastics.
Preferably, the plurality of auxiliary flow channels are arranged in a row, semiconductor package substrates are arranged on two sides of the row of auxiliary flow channels, and each auxiliary flow channel is communicated with the auxiliary injection molding ports of the semiconductor package substrates on the two sides.
Preferably, the auxiliary injection molding opening is an oval through hole.
Preferably, the oval through hole has a length of 1.8mm, a width of 1.2mm, and a depth equal to the thickness of the semiconductor package substrate.
Preferably, each auxiliary injection molding opening corresponds to one row of chip plastic package parts.
Preferably, the distance between the auxiliary injection molding port and the top end of the corresponding chip plastic package part is 2.95 mm.
Preferably, the auxiliary runner is used for injecting epoxy resin.
Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:
according to the scheme, an oval opening is designed above the longitudinal units at the upper end of the substrate, so that a new injection molding opening is formed between the encapsulation mold and the substrate, epoxy resin flows into a mold cavity through the injection molding opening, and after the temperature is reduced, an upper mold cavity and a lower mold cavity are formed to complete plastic package; the scheme has simple structure and good compatibility; the problem of slow or bubble of moulding plastics is solved, and can be better compatible multiple not equidimension encapsulation product.
Drawings
The technical scheme of the utility model is further explained by combining the attached drawings as follows:
fig. 1 is a front schematic view of an auxiliary mold flow injection molding structure of the present invention;
figure 2 is a side schematic view of the auxiliary mold flow injection molding structure of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1-2, an auxiliary mold flow injection molding structure, contain semiconductor package substrate 4 and a plurality of auxiliary flow way 3, a plurality of auxiliary flow way 3 are arranged in a row, all set up semiconductor package substrate 4 on one row of auxiliary flow way 3's the both sides, multiseriate chip plastic envelope portion 5 has on the semiconductor package substrate 4, be provided with a plurality of auxiliary injection molding mouths 1 on one side of semiconductor package substrate 4, every auxiliary injection molding mouth 1 all corresponds a chip plastic envelope portion 5, every auxiliary flow way 3 all communicates with the auxiliary injection molding mouth 1 of the semiconductor package substrate 4 of both sides, every auxiliary flow way 3 all has mold flow inlet 2.
The auxiliary injection molding port 1 is an oval through hole, the length of the oval through hole is 1.8mm, the width of the oval through hole is 1.2mm, and the depth of the oval through hole is the same as the thickness of the semiconductor packaging substrate 4; the distance between the auxiliary injection molding opening 1 and the top end of the corresponding chip plastic package part 5 is 2.95 mm.
When the chip is plastically packaged, epoxy resin mold flow enters the auxiliary flow passage 3 through the mold flow inlet 2 and enters the mold cavity through the auxiliary injection molding opening 1 to form an upper mold cavity and a lower mold cavity.
The above is only a specific application example of the present invention, and does not constitute any limitation to the protection scope of the present invention. All the technical solutions formed by equivalent transformation or equivalent replacement fall within the protection scope of the present invention.
Claims (7)
1. The utility model provides a supplementary mould flows structure of moulding plastics which characterized in that: the semiconductor packaging structure comprises a semiconductor packaging substrate (4) and a plurality of auxiliary flow channels (3), wherein a plurality of rows of chip plastic packaging parts (5) are arranged on the semiconductor packaging substrate (4), a plurality of auxiliary injection molding openings (1) are formed in one side of the semiconductor packaging substrate (4), each auxiliary flow channel (3) is provided with a mold inflow opening (2), and the auxiliary flow channels (3) are communicated with the auxiliary injection molding openings (1).
2. The secondary mold flow injection molding structure of claim 1, wherein: a plurality of auxiliary flow channels (3) are arranged in a row, semiconductor packaging substrates (4) are arranged on two sides of one row of auxiliary flow channels (3), and each auxiliary flow channel (3) is communicated with the auxiliary injection molding ports (1) of the semiconductor packaging substrates (4) on two sides.
3. The secondary mold flow injection molding structure of claim 1, wherein: the auxiliary injection molding port (1) is an oval through hole.
4. The secondary mold flow injection structure of claim 3, wherein: the length of the oval through hole is 1.8mm, the width of the oval through hole is 1.2mm, and the depth of the oval through hole is the same as the thickness of the semiconductor packaging substrate (4).
5. The secondary mold flow injection molding structure of claim 1, wherein: each auxiliary injection molding opening (1) corresponds to one row of chip plastic package parts (5).
6. The secondary mold flow injection molding structure of claim 5, wherein: the distance between the auxiliary injection molding port (1) and the top end of the corresponding chip plastic package part (5) is 2.95 mm.
7. The secondary mold flow injection molding structure of claim 1, wherein: the auxiliary runner (3) is used for injecting epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020571301.0U CN212498664U (en) | 2020-04-17 | 2020-04-17 | Auxiliary mould flow injection molding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020571301.0U CN212498664U (en) | 2020-04-17 | 2020-04-17 | Auxiliary mould flow injection molding structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212498664U true CN212498664U (en) | 2021-02-09 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020571301.0U Active CN212498664U (en) | 2020-04-17 | 2020-04-17 | Auxiliary mould flow injection molding structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212498664U (en) |
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2020
- 2020-04-17 CN CN202020571301.0U patent/CN212498664U/en active Active
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