CN212484254U

CN212484254U - MXM module mounting structure

Info

Publication number: CN212484254U
Application number: CN202021431153.9U
Authority: CN
Inventors: 龚苹频
Original assignee: Shenzhen Industrial Computer System Co ltd
Current assignee: Shenzhen Industrial Computer System Co ltd
Priority date: 2020-07-20
Filing date: 2020-07-20
Publication date: 2021-02-05
Anticipated expiration: 2030-07-20

Abstract

The utility model provides an MXM module mounting structure, which comprises a core mainboard and a bottom plate connected with the core mainboard; the core mainboard is integrated with a central processing unit, and a DDR4 memory bank and a video conversion module which are connected with the central processing unit; the bottom plate is an input/output interface board, a golden finger (4) connected with the bottom plate is formed on one side of the core mainboard, and an MXM seat in butt joint with the golden finger is arranged on the bottom plate. The utility model discloses not only the processing speed is fast, moreover small, low power dissipation, advantage such as easy installation.

Description

MXM module mounting structure

Technical Field

The utility model relates to a computer platform, especially a MXM module mounting structure.

Background

At present, the platform (51 series single chip microcomputer, ARM series single chip microcomputer) of the existing embedded system can not meet the requirements of data acquisition and processing (video, audio and the like) in the industrial control industry due to the limitation of processing speed, and can not meet the requirements of easy use, good use and universality of the market due to the limitation of using an operating system in operation, and is only limited to a specific operating system.

However, although the processing speed and the operation interface of the computer platform with the X86 architecture are recognized by people, the computer platform with the X86 architecture has a huge body shape, high power consumption and standardized architecture (ATX, etc.), which cannot meet the urgent requirements of the current market for customization, miniaturization, energy saving, consumption reduction, environmental protection, etc.

MXM, Mobile PCI Express Module, is a set of device interfaces designed for graphics processors based on the PCI-Express interface.

SUMMERY OF THE UTILITY MODEL

The utility model discloses to the not enough of present computer platform, provide an MXM module mounting structure.

The utility model discloses realize that its technical purpose technical scheme is: an MXM module mounting structure comprises a core mainboard and a bottom plate connected with the core mainboard; the core mainboard is integrated with a central processing unit, and a DDR4 memory bank and a video conversion module which are connected with the central processing unit; the base plate is an input/output interface board, a golden finger connected with the base plate is formed on one side of the core mainboard, and an MXM seat in butt joint with the golden finger is arranged on the base plate.

Further, in the MXM module mounting structure described above: the bottom plate is integrated with an Ethernet port, a universal serial bus interface, an asynchronous transmission standard interface RS232, an asynchronous transmission standard interface RS485, a keyboard and mouse interface PS/2, a serial communication port, a universal input and output interface, a high-definition multimedia interface and a hard disk interface.

Further, in the MXM module mounting structure described above: the golden finger comprises two groups of power interfaces and five groups of bus interfaces, the power interface row bus is a row bus with 10 pins in two rows, and the bus interface row bus is a row bus with 20 pins in two rows.

Further, in the MXM module mounting structure described above: the five groups of bus interface row buses are respectively as follows: high fidelity audio/secure digital input output bus (HAUDIO/SDIO), hard drive/low pin parallel bus (IDE/LPC), hard drive/universal serial bus (IDE/USB), universal serial bus/low voltage differential signal bus (USB/LVDS), serial digital video output/new generation PCI bus (SDVO/PCI _ EXPRESS).

Further, in the MXM module mounting structure described above: the row mother is a gold-plated row mother, and the row mother is distributed on the edge of a printed circuit board of the core mainboard in a straight line shape.

The utility model discloses, synthesize the bridgeware with CPU and SCH and integrate among the core mainboard, through MXM bus mode, provide the interface of the outside extension of bus, a firm communication channel that the interface was established, can be nimble on this communication channel go to connect the various functional modules that accord with the bus agreement requirement, just like having built a highway as long as obey the traffic rules, can run various vehicles on it, guarantee each vehicle safety rapid stabilization operation.

The utility model discloses in, the core mainboard synthesizes bridge piece and memory chip integration with CPU and SCH, through design and verification, has confirmed the stability of MXM core mainboard module, and the part of the most difficult CPU + bridge piece + memory has verified firmly in X86 architectural design, and then the supporting design that next requires to customer's peripheral hardware just realizes fairly easily to promote the rapid stabilization shaping of a new design scheme, satisfy customer's demand.

The utility model discloses compare with traditional X86 framework desktop, traditional X86 framework desktop consumption 200 supplyes bricks 300 tiles, the utility model discloses a framework notebook computer consumption 60-120 tiles, and bulky be unfavorable for customer's application, and the synthetic system platform whole consumption of core mainboard only between 5-9 tiles, and the core mainboard can accomplish long only 95mm in addition, wide only 82mm, high only 12 mm.

Therefore, the utility model discloses not only the processing speed is fast, moreover small, low power dissipation, advantages such as easy installation.

The present invention will be described in more detail with reference to the accompanying drawings and examples.

Drawings

Fig. 1 is a schematic diagram of an MXM module assembling process according to the present invention.

Fig. 2 is a schematic diagram of the MXM module assembly of the present invention.

Detailed Description

The utility model discloses an MXM module mounting structure in an MXM design platform, which comprises a core mainboard 2 and a bottom plate 1 connected with the core mainboard 2, as shown in figures 1 and 2; a Central Processing Unit (CPU), a DDR4 memory bank connected with the CPU and a video conversion module are integrated on the core mainboard 2; the bottom plate 1 is an input/output interface board, a golden finger 4 connected with the bottom plate 1 is formed on one side of the core mainboard 2, and the bottom plate 1 is provided with an MXM seat 3 butted with the golden finger 4. As shown in fig. 1, the core main board 2 is fitted to the base board, and the two are assembled as shown in fig. 2.

The core mainboard 2 is integrated with a Central Processing Unit (CPU), a memory bank connected with the CPU, a north-south bridge integrated chip (SCH integrated bridge chip) and a video conversion module. Therefore, for an MXM Module, namely Mobile PCI Express Module, this is a set of device interfaces designed for a graphics processor based on the PCI-Express interface.

The backplane 1 is an input/output interface board, on which an ethernet port, a Universal Serial Bus (USB) interface, an asynchronous transmission standard interface RS232, an asynchronous transmission standard interface RS485, a keyboard and mouse interface PS/2, a serial communication port (COM port), a general input/output interface (GPIO interface), a high-definition multimedia interface (HDMI interface), and a hard disk interface (SATA interface) are integrated.

The core mainboard 2 comprises a printed circuit board and gold plating row buses welded on the edge of the printed circuit board, the row buses comprise two groups of power interface row buses and five groups of bus interface row buses, and the seven groups of row buses are distributed on three edges of the printed circuit board in an N shape. The power interface row mother is two rows, and each row is a 10-pin row mother; the bus interface row bus is two rows, each row of 20-pin row bus is respectively as follows: a high fidelity audio/secure digital input output bus (HAUDIO/SDIO bus) 22, a hard disk drive/low pin parallel bus (IDE/LPC bus) 23, a hard disk drive/universal serial bus (IDE/USB1.1/2.0 bus) 24, a universal serial bus/low voltage differential signal bus (USB1.1/2.0/LVDS bus) 25, a serial digital video output/new generation PCI bus (SDVO/PCI _ EXPRESS bus).

The utility model discloses combine following part: the MXM module, the multifunctional expansion bottom plate and the multifunctional video conversion module form a brand-new product.

The core mainboard 2, namely the MXM module, is designed by adopting an 8-layer PCB, and strictly follows INTEL Layout Guide to carry out wiring design, so that the signal integrity is ensured, and the function is stable.

The core mainboard 2 is the MXM module standard size 95X82mm, and the thick 1.6mm of PCB board, and the thick 12mm of PCBA board, and the mechanism miniaturization is more firm.

The MXM module integrates CPU (FSB 400/533), SCH (INTEL), DDR4, PM (Power management Module) and other modules, the bus connection is tight, and the signal transmission is stable and fast

The MXM module is connected with the multifunctional expansion board through an MXM280 bus, the MXM280 bus is divided into seven groups of signals, 7 rows of gold-plated interfaces with high reliability and ultralow signal loss are expanded outwards, the combined connection is completed in a gold finger connection and screw fixation mode, and the combination with the expansion bottom board is firmer and more reliable.

The universal expansion bottom plate can be changed and combined according to different market requirements, the interfaces can be arranged randomly, various input and output interfaces can be provided, and one is recommended:

LAN 1 is with 10/100/1000Mbps rate self-detecting Ethernet port, adopts Realtek

RTL8111C/RTL8111D network chip

Displaying SDVO pin-arranging display output, connecting ICN-M200 VGA/ICN-M202 HDMI display module

DF 1318/24 Bit single-channel LVDS display option

USB 5 USB 2.0/1.1,2 USB2.0, support system guide

Super I/O W83627HW super I/O chip

The COM1/COM2 is supported to be a 9-wire RS232, wherein the COM1 can be used for selecting the RS232/RS485 by jumping

PS/2Mouse&Keyboard

The 10 paths of GPIOs can be customized to enter and exit according to the requirement

Store 1 FPC SATA interface (SATA interface with 1 corner in parallel)

Onboard 4GB PATA SSD (optional 8GB)

An expansion Bus MINI-PCIE Bus slot for supporting WIFI

Audio

HighDefinition Audio, Realtek ALC883/ALC888codec, support5.1 and SPDIF coaxial interface

A multi-function video conversion module that can provide a variety of different display output options, including: an LVDS display screen; an HDMI display; a DVI display; s _ VIDEO/SVBS/… … display;

the combination process of the embodiment is simple to operate, the core mainboard 2 and the bottom plate 1 are combined and connected in a golden finger connection and screw fixation mode, and the combination of the core mainboard 2 and the expansion bottom plate is firmer and more reliable; and the model of the new model is more flexible and convenient to replace after the MXM module is upgraded.

The embodiment shortens the development cycle: according to different requirements of customers, the customized product only needs to modify the MXM module, so that the time from concept forming to marketing of the product is reduced by 3-6 months.

This embodiment reduces enterprise's inventory cost: the MXM modules are integrated with various models of Central Processing Units (CPUs), the MXM modules of different models are prepared only during production and inventory, the inventory cost pressure is reduced, the matched carrier plate is not required to be changed, and the secondary development cost of the carrier plate is reduced.

The product of this example was produced and processed: the advanced SMT processing technology in the industry is adopted, the working hours are few, the yield is high, and the yield is high.

The implementation fully considers and understands the requirements of the industry market and the difficulties of the current application in the design process, fully investigates the current similar products at home and abroad in design, carefully considers various aspects such as safety, stability, usability, environmental protection, energy conservation, consumption reduction and the like, and strictly follows the current industry standard for design, for example: electromagnetic emission standard EN55022, bus standard: USB1.1/2.0, RS232/422/485, PCI _ EXPRESS … … Green environmental protection Standard: ROHSA, energy star, and the like, which well solves various problems faced by the practical application of the industry market in the current platform of embedded systems (51 series single chip microcomputer, ARM series single chip microcomputer) and X86 architecture.

In this embodiment, the following advantages are provided:

the installation is more convenient. After the MXM is inserted in one direction, the MXM is fixed by adopting a locking screw mode, and the MXM is relatively easy to disassemble and assemble.

The signal quality is better.

The impedance of the gold finger directly plated with gold is almost undistorted. The PCB of the CMS module is soldered to the connector, and the impedance is inevitably distorted, which will affect the transmission of high-speed signals.

Simplifying the backplane design.

MXM only needs the bottom plate to provide single power, and the module just can work, and CMS module needs the bottom plate cooperation to provide multiple power just can work, increases the degree of difficulty like this to the bottom plate design.

The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the above embodiments are only applicable to help understand the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the description should not be construed as a limitation to the present invention.

Claims

1. An MXM module mounting structure which characterized in that: comprises a core mainboard (2) and a bottom plate (1) connected with the core mainboard (2); a central processing unit, a DDR4 memory bank and a video conversion module which are connected with the central processing unit are integrated on the core mainboard (2); the base plate (1) is an input/output interface board, a golden finger (4) connected with the base plate (1) is formed on one side of the core mainboard (2), and the base plate (1) is provided with an MXM seat (3) butted with the golden finger (4).

2. The MXM module mounting structure of claim 1, wherein: the bottom plate (1) is integrated with an Ethernet port, a universal serial bus interface, an asynchronous transmission standard interface RS232, an asynchronous transmission standard interface RS485, a keyboard and mouse interface PS/2, a serial communication port, a universal input and output interface, a high-definition multimedia interface and a hard disk interface SATA.

3. The MXM module mounting structure of claim 1, wherein: the golden finger comprises two groups of power interfaces and five groups of bus interfaces, the power interface row bus is a row bus with 10 pins in two rows, and the bus interface row bus is a row bus with 20 pins in two rows.

4. The MXM module mounting structure according to claim 3, wherein: the five groups of bus interface row buses are respectively as follows: high fidelity audio/safety digital input/output bus, hard disk drive/low pin parallel bus, hard disk drive/universal serial bus, universal serial bus/low voltage differential signal bus, serial digital video output/new generation PCI bus.

5. The MXM module mounting structure according to claim 4, wherein: the row mother is a gold-plated row mother, and the row mother is distributed on the edge of the printed circuit board of the core mainboard (2) in a straight line shape.