CN212463900U - Temperature equalization plate component and radiator - Google Patents
Temperature equalization plate component and radiator Download PDFInfo
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- CN212463900U CN212463900U CN202021637672.0U CN202021637672U CN212463900U CN 212463900 U CN212463900 U CN 212463900U CN 202021637672 U CN202021637672 U CN 202021637672U CN 212463900 U CN212463900 U CN 212463900U
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Abstract
The application relates to the technical field of heat exchange equipment, in particular to a temperature-equalizing plate assembly and a radiator, which comprise a temperature-equalizing plate and a heat pipe; a heat source installation part and a condensing part installation part are formed on the temperature equalizing plate, and a hollow part is also formed on the temperature equalizing plate and is positioned between the heat source installation part and the condensing part installation part; one end of the heat pipe is connected with the heat source installation part, and the other end of the heat pipe is connected with the condensation part installation part, so that the projection of the heat pipe on the temperature equalizing plate covers at least part of the hollow part. The utility model provides a temperature-uniforming plate subassembly and radiator to opening on the temperature-uniforming plate has the fretwork for dodging components and parts in some radiators at present, makes the heat unable smooth transmission on the temperature-uniforming plate, makes the problem that the heat dispersion of radiator descends.
Description
Technical Field
The application relates to the technical field of heat exchange equipment, in particular to a temperature-equalizing plate assembly and a radiator.
Background
High-power components and parts on the PCB board in FRU (field replaceable unit) because calorific capacity is big, often need the radiator to dispel the heat for high-power components and parts, need utilize the space of FRU unit as far as in the heat dissipation design and arrange fin and base plate, and the PCB board arranges multiple components and parts, and the height of FRU unit has the restriction simultaneously, therefore the design of radiator is slim and special-shaped structure usually to adapt to the height and dodge components and parts. In some radiators, hollows are formed on the temperature-equalizing plate for avoiding components, so that heat cannot be smoothly transferred on the temperature-equalizing plate, and the heat radiation performance of the radiator is reduced.
SUMMERY OF THE UTILITY MODEL
The utility model provides a temperature-uniforming plate subassembly and radiator to opening on the temperature-uniforming plate has the fretwork for dodging components and parts in some radiators at present, makes the heat unable smooth transmission on the temperature-uniforming plate, makes the problem that the heat dispersion of radiator descends.
In order to achieve the purpose, the following technical scheme is adopted in the application:
one aspect of the present application provides a vapor chamber assembly comprising a vapor chamber and a heat pipe; a heat source installation part and a condensing part installation part are formed on the temperature equalizing plate, and a hollow part is also formed on the temperature equalizing plate and is positioned between the heat source installation part and the condensing part installation part;
one end of the heat pipe is connected with the heat source installation part, and the other end of the heat pipe is connected with the condensation part installation part, so that the projection of the heat pipe on the temperature equalizing plate covers at least part of the hollow part.
Optionally, the heat pipe is a flat pipe, and the thickness direction of the heat pipe is perpendicular to the temperature equalizing plate.
The technical scheme has the beneficial effects that: the heat pipe is the flat pipe, so that the contact area between the heat pipe and the temperature-equalizing plate can be increased, the heat transfer performance of the heat pipe is improved, the space occupied by the heat pipe in the direction perpendicular to the temperature-equalizing plate can be reduced, and a proper installation space is provided for other components installed on the temperature-equalizing plate.
Optionally, the both sides face of temperature-uniforming plate is first face and second face respectively, the heat source installation department with the condensation member installation department all forms in first face, the heat pipe with the second face is connected.
The technical scheme has the beneficial effects that: the heat pipe, the heat source installation part and the condensation part installation part are respectively positioned on different plate surfaces, so that the obstruction of the heat pipe to the installation of the heat source and the condensation part can be reduced as much as possible, and the installation and the production are convenient.
Optionally, the heat pipe has a bending portion, a projection of the bending portion on the second plate surface at least covers a part of the hollow portion, and an avoidance gap is left between the bending portion and the second plate surface.
The technical scheme has the beneficial effects that: original paper on the PCB board passes behind the fretwork portion, can stretch into in this dodges the clearance, reduces the possibility that the installation of heat pipe to the radiator caused the hindrance.
Optionally, the heat pipe includes a first heat transfer portion, the bending portion, and a second heat transfer portion sequentially connected in a length direction of the heat pipe; the first heat transfer portion is provided with a first binding face connected with the second plate face, the first binding face extends to the bending portion from one end of the heat pipe, and the second plate face covers the first binding face.
The technical scheme has the beneficial effects that: therefore, the contact area between the first heat transfer part and the soaking plate is larger, and the heat transfer capacity is stronger.
Optionally, two side edges of the first attachment surface in the first direction are two side edges of the heat pipe in the first direction, the first direction is perpendicular to the length direction of the heat pipe, and the first direction is parallel to the temperature equalization plate.
The technical scheme has the beneficial effects that: this makes the first binding face reach the maximum size that expands in the first direction under the restriction of heat pipe self size, makes the heat transfer performance of first heat transfer portion obtain great the promotion.
Optionally, the second heat transfer portion has a second adhesion surface connected to the second plate surface, the second adhesion surface extends from the other end of the heat pipe to the bending portion, and the second plate surface covers the second adhesion surface.
The technical scheme has the beneficial effects that: therefore, the contact area between the second heat transfer part and the soaking plate is larger, and the heat transfer capacity is stronger. Of course, the second bonding surfaces may be bonded to the second plate surface.
Optionally, two side edges of the second attachment surface in the first direction are two side edges of the heat pipe in the first direction, the first direction is perpendicular to the length direction of the heat pipe, and the first direction is parallel to the temperature equalization plate.
The technical scheme has the beneficial effects that: this makes the second abutting surface reach the maximum size that expands in the first direction under the restriction of the size of the heat pipe itself, so that the heat transfer performance of the second heat transfer portion is greatly improved.
Optionally, the number of the heat pipes is at least two, the heat pipes are parallel to each other and arranged in a first direction, the first direction is perpendicular to the length direction of the heat pipes, and the first direction is parallel to the temperature equalizing plate.
The technical scheme has the beneficial effects that: at least two heat pipes are arranged, so that the transferred heat is increased, and the heat transfer performance is further improved.
Another aspect of the present application provides a heat sink including the vapor chamber panel assembly provided herein a condensing member is mounted to the condensing member mounting portion.
The technical scheme provided by the application can achieve the following beneficial effects:
the utility model provides a samming board subassembly and radiator owing to bridge at fretwork department through the heat pipe, connects heat source installation department and condensation piece installation department, makes the heat that heat source piece produced can pass through the smooth diffusion of heat pipe to the condensation piece, and then promotes the performance of radiator.
Additional features of the present application and advantages thereof will be set forth in the description which follows, or may be learned by practice of the present application.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings used in the description of the embodiments will be briefly described below. It should be apparent that the drawings in the following description are embodiments of the present application and that other drawings may be derived from those drawings by a person of ordinary skill in the art without inventive step.
Fig. 1 is a schematic perspective view illustrating a heat sink according to an embodiment of the present disclosure;
fig. 2 is a schematic perspective view of another perspective structure of an embodiment of a heat sink according to an embodiment of the present disclosure;
FIG. 3 is a schematic structural diagram of a front view of an embodiment of a uniform temperature plate assembly according to an embodiment of the present application;
fig. 4 is a schematic perspective view of an embodiment of a heat pipe according to an embodiment of the present disclosure.
Reference numerals:
100-temperature-equalizing plate;
110-a hollowed-out;
120-step structure;
130-a heat source mounting;
140-a condensing element mount;
200-a heat pipe;
210-a first heat transfer portion;
211-a first mating surface;
220-bending part;
230-a second heat transfer portion;
231-a second faying surface;
300-a condensing member;
400-avoiding the gap.
Detailed Description
The technical solutions of the present application will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
As shown in fig. 1 to 4, one aspect of the present application provides a vapor chamber assembly including a vapor chamber 100 and a heat pipe 200; a heat source installation part 130 and a condensing part installation part 140 are formed on the temperature equalizing plate 100, a hollow-out part 110 is further formed on the temperature equalizing plate 100, and the hollow-out part 110 is located between the heat source installation part 130 and the condensing part installation part 140;
one end of the heat pipe 200 is connected to the heat source installation part 130, and the other end is connected to the condensation member installation part 140, so that the projection of the heat pipe 200 on the temperature equalization plate 100 covers at least a part of the hollow part 110.
Because there is the fretwork portion 110 on the temperature-uniforming plate 100, the heat that makes the heat source spare produce can't pass through the fretwork portion 110 when diffusing on the temperature-uniforming plate 100, transmit to the condensation piece 300 of installing on the condensation piece installation department 140, when the radiator adopts the temperature-uniforming plate 100 subassembly that this application embodiment provided, because bridge at fretwork portion 110 department through heat pipe 200, connect heat source installation department 130 and condensation piece installation department 140, the heat that makes the heat source spare produce can be through the smooth diffusion of heat pipe 200 to condensation piece 300, and then promote the performance of radiator.
Optionally, the heat pipe 200 is a flat pipe, and a thickness direction of the heat pipe 200 is perpendicular to the temperature-uniforming plate 100. The flat pipe of the heat pipe 200 can increase the contact area between the heat pipe 200 and the vapor chamber plate 100, increase the heat transfer performance of the heat pipe 200, reduce the space occupied by the heat pipe 200 in the direction perpendicular to the vapor chamber plate 100, and provide a suitable installation space for other components installed on the vapor chamber plate 100.
Optionally, the two side panels of the temperature-uniforming plate 100 are respectively a first panel and a second panel, the heat source installation part 130 and the condensation member installation part 140 are both formed on the first panel, and the heat pipe 200 is connected to the second panel. That is, the heat pipe 200 is indirectly connected to the heat source mounting part 130 and the condenser mounting part 140. The heat pipe 200, the heat source mounting part 130 and the condensing part mounting part 140 are respectively positioned on different plate surfaces, so that the obstruction of the heat pipe 200 to the mounting of the heat source and the condensing part 300 can be reduced as much as possible, and the mounting and the production are convenient. Of course, it is also possible to mount the heat pipe 200 on the first plate surface, and to machine grooves for accommodating the heat pipe 200 on the condensation member 300 and the heat source.
Optionally, the heat pipe 200 has a bending portion 220, a projection of the bending portion 220 on the second board surface at least covers a part of the hollow portion 110, and an avoidance gap 400 is left between the bending portion 220 and the second board surface. After passing through the hollow portion 110, an original on the PCB may extend into the avoiding gap 400, so as to reduce the possibility that the heat pipe 200 obstructs the installation of the heat sink.
Optionally, the heat pipe 200 includes a first heat transfer portion 210, the bending portion 220, and a second heat transfer portion 230 sequentially connected in a length direction of the heat pipe 200; the first heat transfer portion 210 has a first bonding surface 211 connected to the second plate surface, the first bonding surface 211 extends from one end of the heat pipe 200 to the bending portion 220, and the second plate surface covers the first bonding surface 211. That is, the first bonding surface 211 is completely bonded to the second board surface, so that the contact area between the first heat transfer portion 210 and the soaking board is large, and the heat transfer capability is strong. Of course, the first bonding surface 211 may be partially bonded to the second plate surface.
Optionally, two side edges of the first attachment surface 211 in a first direction are two side edges of the heat pipe 200 in the first direction, the first direction is perpendicular to the length direction of the heat pipe 200, and the first direction is parallel to the temperature-uniforming plate 100. This allows the first abutting surface 211 to reach a maximum size expanded in the first direction under the limitation of the size of the heat pipe 200 itself, so that the heat transfer performance of the first heat transfer part 210 is greatly improved.
Optionally, the second heat transfer portion 230 has a second abutting surface 231 connected to the second plate surface, the second abutting surface 231 extends from the other end of the heat pipe 200 to the bending portion 220, and the second plate surface covers the second abutting surface 231. That is, the second contact surface 231 is completely contacted with the second plate surface, so that the contact area between the second heat transfer portion 230 and the soaking plate is large, and the heat transfer capability is strong. Of course, the second bonding surface 231 may be partially bonded to the second plate surface.
Optionally, two side edges of the second abutting surface 231 in the first direction are two side edges of the heat pipe 200 in the first direction, the first direction is perpendicular to the length direction of the heat pipe 200, and the first direction is parallel to the temperature equalization plate 100. This allows the second abutting surface 231 to reach the maximum size expanded in the first direction under the limitation of the size of the heat pipe 200 itself, so that the heat transfer performance of the second heat transfer portion 230 is greatly improved.
Optionally, the number of the heat pipes 200 is at least two, each of the heat pipes 200 is parallel to each other and arranged in a first direction, the first direction is perpendicular to the length direction of the heat pipe 200, and the first direction is parallel to the temperature equalization plate 100. If there are at least two heat pipes 200, the amount of heat transferred is increased, and the heat transfer performance is further improved. Of course, at least two heat pipes 200 may be overlapped with each other in a direction perpendicular to the vapor chamber 100. The number of heat pipes 200 is preferably two, and three, four, or five, etc. may be provided as appropriate.
Another aspect of the present application provides a heat sink, which includes the temperature-uniforming plate 100 assembly provided in the embodiment of the present application, wherein the condensing element 300 is mounted on the condensing element mounting part 140. In order to facilitate the installation of the heat source element, the heat source installation portion 130 may be a boss formed on the first plate surface, and the heat source element may be installed on an end surface of the boss. In order to make the vapor chamber 100 avoid the components on the PCB, the vapor chamber 100 may also form a step structure 120 in a direction perpendicular to the vapor chamber 100. The condensation member 300 is preferably a heat dissipating fin, or an assembly of a plurality of heat dissipating fins, but may be other heat dissipating members. When the heat pipe 200 is installed on the second board surface and the condensation member 300 and the heat source member are installed on the first board surface, a heat dissipation fin or a fin assembly may also be installed on the second board surface, and a groove may be formed in the fin or the fin assembly to accommodate the heat pipe 200.
When the heat sink adopts the temperature equalization plate 100 assembly provided by the embodiment of the present application, the heat source installation part 130 and the condensation part installation part 140 are connected by bridging the hollow part 110 through the heat pipe 200, so that heat generated by the heat source part can be smoothly diffused to the condensation part 300 through the heat pipe 200, and further the performance of the heat sink is improved.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.
Claims (10)
1. The temperature equalizing plate component is characterized by comprising a temperature equalizing plate and a heat pipe; a heat source installation part and a condensing part installation part are formed on the temperature equalizing plate, and a hollow part is also formed on the temperature equalizing plate and is positioned between the heat source installation part and the condensing part installation part;
one end of the heat pipe is connected with the heat source installation part, and the other end of the heat pipe is connected with the condensation part installation part, so that the projection of the heat pipe on the temperature equalizing plate covers at least part of the hollow part.
2. The vapor plate assembly of claim 1, wherein the heat pipe is a flat pipe, and the thickness direction of the heat pipe is perpendicular to the vapor plate.
3. The temperature-uniforming plate assembly according to claim 1, wherein two side plate surfaces of the temperature-uniforming plate are respectively a first plate surface and a second plate surface, the heat source mounting part and the condensing part mounting part are both formed on the first plate surface, and the heat pipe is connected with the second plate surface.
4. The temperature equalization plate assembly of claim 3, wherein the heat pipe has a bent portion, a projection of the bent portion on the second plate surface at least covers a portion of the hollow portion, and an avoidance gap is left between the bent portion and the second plate surface.
5. The temperature equalization plate assembly of claim 4, wherein the heat pipe comprises a first heat transfer portion, the bent portion and a second heat transfer portion connected in sequence in a length direction of the heat pipe; the first heat transfer portion is provided with a first binding face connected with the second plate face, the first binding face extends to the bending portion from one end of the heat pipe, and the second plate face covers the first binding face.
6. The temperature equalization plate assembly of claim 5, wherein two side edges of the first abutting surface in a first direction are two side edges of the heat pipe in the first direction, the first direction is perpendicular to a length direction of the heat pipe, and the first direction is parallel to the temperature equalization plate.
7. The temperature equalization plate assembly of claim 5, wherein the second heat transfer portion has a second abutting surface connected to the second plate surface, the second abutting surface extending from the other end of the heat pipe to the bent portion, the second plate surface covering the second abutting surface.
8. The temperature equalization plate assembly of claim 7, wherein two side edges of the second abutting surface in a first direction are two side edges of the heat pipe in the first direction, the first direction is perpendicular to a length direction of the heat pipe, and the first direction is parallel to the temperature equalization plate.
9. The temperature equalization plate assembly of any one of claims 1-8, wherein the number of heat pipes is at least two, each of the heat pipes is parallel to each other and aligned in a first direction, the first direction is perpendicular to a length direction of the heat pipes, and the first direction is parallel to the temperature equalization plate.
10. A heat sink comprising the vapor chamber plate assembly as recited in any one of claims 1 to 9, wherein a condensing member is mounted to the condensing member mounting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021637672.0U CN212463900U (en) | 2020-08-07 | 2020-08-07 | Temperature equalization plate component and radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021637672.0U CN212463900U (en) | 2020-08-07 | 2020-08-07 | Temperature equalization plate component and radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212463900U true CN212463900U (en) | 2021-02-02 |
Family
ID=74477005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021637672.0U Active CN212463900U (en) | 2020-08-07 | 2020-08-07 | Temperature equalization plate component and radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212463900U (en) |
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2020
- 2020-08-07 CN CN202021637672.0U patent/CN212463900U/en active Active
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