CN212463879U

CN212463879U - Electronic device

Info

Publication number: CN212463879U
Application number: CN202021450510.6U
Authority: CN
Inventors: 李嗣明
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2020-07-21
Filing date: 2020-07-21
Publication date: 2021-02-02
Anticipated expiration: 2030-07-21

Abstract

The application discloses electronic equipment belongs to the electronic equipment field. The electronic equipment comprises an equipment shell, a heating component, a heat conducting component and heat conducting plastic; the heating component is arranged in the equipment shell; the equipment shell is provided with a bearing groove, the heat conduction assembly is arranged in the bearing groove, heat conduction plastic cement is filled between the equipment shell and the heat conduction assembly, and the equipment shell, the heat conduction plastic cement and the heat conduction assembly are integrally formed in an injection molding mode. Like this, when electronic equipment assembles, can be with equipment casing, heat conduction plastic and heat-conducting component through the mode integrated into one piece of moulding plastics for gapless between equipment casing and the heat-conducting component, again because the heating element sets up in equipment casing, consequently, make the heat that the heating element produced can conduct the equipment casing fast in heat-conducting component, the heat can not concentrate near heat-conducting component, and then improved electronic equipment's radiating efficiency.

Description

Electronic device

Technical Field

The application belongs to the technical field of communication, and particularly relates to an electronic device.

Background

With the continuous development of electronic devices, the functions of the electronic devices are also continuously improved. As the functions of electronic devices are increasing, the heat dissipation requirements of electronic devices are also increasing. The heat conduction pipe is used as a device for efficiently transferring heat, and is widely applied to various electronic equipment so as to meet the increasing heat dissipation requirements of the electronic equipment.

Currently, heat pipes are typically bonded between the CPU and the housing of the electronic device. The heat conduction pipe comprises a copper pipe and a liquid absorption core. The liquid absorption core is fixed in the inner cavity of the copper pipe. One end of the heat conduction pipe is an evaporation end, and the other end of the heat conduction pipe is a condensation end. When the evaporation end is heated, the liquid in the liquid absorption core is quickly evaporated, vapor flows from the evaporation end to the condensation end under the action of pressure difference generated by temperature difference of the two ends of the heat conduction pipe, in the flowing process, heat is continuously released and condensed into liquid again, and the liquid flows back to the evaporation end again under the action of capillary force of the liquid absorption core, so that one cycle of heat dissipation is completed.

However, in the process of implementing the present application, the inventors found that at least the following problems exist in the prior art: in the process of assembling the heat conduction pipe and the shell of the electronic equipment, once the heat conduction pipe deforms, a gap exists between the heat conduction pipe and the shell of the electronic equipment, so that heat in the heat conduction pipe cannot be quickly conducted to the shell of the electronic equipment, the heat is still concentrated near the heat conduction pipe, and the heat dissipation efficiency of the electronic equipment is further reduced.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the application is to provide an electronic device, which can solve the problem that the heat dissipation efficiency of the electronic device is low due to a gap between a heat conduction pipe and a shell of the electronic device.

In order to solve the technical problem, the present application is implemented as follows:

the embodiment of the application provides electronic equipment, which comprises an equipment shell, a heating component, a heat conducting component and heat conducting plastic;

the heating component is arranged in the equipment shell;

the equipment shell is provided with a bearing groove, the heat conduction assembly is arranged in the bearing groove, the equipment shell and the heat conduction assembly are filled with the heat conduction plastic, and the equipment shell, the heat conduction plastic and the heat conduction assembly are integrally formed in an injection molding mode.

As can be seen from the above embodiments, in the embodiments of the present application, the electronic device includes a device housing, a heat generating component, a heat conducting component, and a heat conducting plastic; the heating component is arranged in the equipment shell; the equipment shell is provided with a bearing groove, the heat conduction assembly is arranged in the bearing groove, heat conduction plastic cement is filled between the equipment shell and the heat conduction assembly, and the equipment shell, the heat conduction plastic cement and the heat conduction assembly are integrally formed in an injection molding mode. The heat generated by the heat generating component is conducted out of the equipment shell through the heat conducting component. Like this, when electronic equipment assembles, can be with equipment casing, heat conduction plastic and heat-conducting component through the mode integrated into one piece of moulding plastics for gapless between equipment casing and the heat-conducting component, again because send out the heating element setting in equipment casing, consequently, make the heat that the heating element produced can conduct the equipment casing fast in heat-conducting component, the heat conduction plastic, the heat can not concentrate near heat-conducting component, and then improved electronic equipment's radiating efficiency.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments of the present application will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive exercise.

FIG. 1 is a schematic structural diagram of an electronic device provided herein;

FIG. 2 is a schematic cross-sectional view of an electronic device provided herein in a Y-Y direction;

FIG. 3 is an enlarged partial schematic view of an electronic device provided herein at A;

FIG. 4 is an exploded schematic view of an electronic device provided herein;

FIG. 5 is a schematic view of a thermally conductive assembly provided herein in a first orientation;

FIG. 6 is a schematic cross-sectional view in the A-A direction of a thermally conductive assembly provided herein;

FIG. 7 is an enlarged, fragmentary schematic view at B of a thermally conductive assembly provided herein;

FIG. 8 is a schematic cross-sectional view of a thermally conductive assembly provided herein in the B-B direction;

FIG. 9 is an enlarged schematic partial view at C of the thermally conductive assembly provided herein;

FIG. 10 is a schematic view of a thermally conductive assembly provided herein in a second orientation;

FIG. 11 is a schematic view of the internal structure of a thermally conductive assembly provided herein;

FIG. 12 is a schematic cross-sectional view of a thermally conductive assembly provided herein in the C-C direction;

FIG. 13 is a schematic structural view of an apparatus housing provided herein;

FIG. 14 is a schematic cross-sectional view of the device housing provided herein in the direction D-D;

FIG. 15 is a schematic view of the installation of the device housing and thermally conductive assembly provided herein;

FIG. 16 is a schematic cross-sectional view of an electronic device provided herein in the direction E-E;

FIG. 17 is a schematic view of the apparatus housing provided in the present application after filling with a thermally conductive plastic;

fig. 18 is a schematic cross-sectional view of an electronic device provided herein in the F-F direction.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or described herein. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

The electronic device provided by the embodiment of the present application is described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof. Fig. 1 is a schematic structural diagram of an electronic device provided in the present application, and fig. 2 is a schematic cross-sectional diagram of fig. 1 in a Y-Y direction, as shown in fig. 2, the electronic device includes a device housing 1, a heat generating component 2, a heat conducting component 3, and a heat conducting plastic 4; the heating component 2 is arranged in the equipment shell 1; the equipment shell 1 is provided with a bearing groove 112, the heat conduction assembly 3 is arranged in the bearing groove 112, heat conduction plastic 4 is filled between the equipment shell 1 and the heat conduction assembly 3, and the equipment shell 1, the heat conduction plastic 4 and the heat conduction assembly 3 are integrally formed in an injection molding mode.

The device case 1 is a carrier for carrying the heat generating component 2, the heat conducting component 3, and other components of the electronic device. Specifically, the device case 1 is a frame-like structure having a cavity. Specifically, a receiving groove 112 may be formed in the device housing 1, so that the heat conducting assembly 3 may be fixed in the receiving groove 112, and thus, heat generated by the heat conducting assembly 3 may be quickly transferred to the device housing 1. The equipment shell 1 can also be provided with structures such as the clamping groove 312, so that devices such as the heating assembly 2 can be fixed inside the equipment shell 1 through the structures such as the clamping groove 312, the devices such as the heating assembly 2 can be installed in the equipment shell 1, the equipment shell 1 can protect the devices such as the easy-to-damage and the heating assembly 2, and the service life of the electronic equipment is prolonged.

The device case 1 may be made of one of materials having a heat dissipation function and a light weight, such as an aluminum alloy or a magnesium alloy. Taking an aluminum alloy as an example, the density of the aluminum alloy material is 2.66 multiplied by 10kg/m³～2.73×10kg/m³Therefore, the whole aluminum alloy material is light, the whole weight of the electronic equipment can be reduced, and the light-weight design of the electronic equipment is facilitated. The heat-conducting plastic 4 can be TCPA3025A with high heat conductivity, and has good heat conductivity because the heat-conducting plastic is a plastic composite material compounded by adding heat-conducting metal oxide, graphite fiber or carbon fiber and the like into common plastic. During assembly, the equipment housing 1, the heat-conducting plastic 4 and the heat-conducting component 3 are integrally formed in an injection molding mode, so that the heat-conducting plastic 4 is injected into the equipment housing 1, the heat-conducting plastic 4 is filled in the edge position of the heat-conducting component 3, the heat-conducting plastic 4 is located in a gap between the heat-conducting component 3 and the equipment housing 1, and then no gap is reserved between the equipment housing 1 and the heat-conducting component 3.

In addition, heat conduction subassembly 3 can be the heat pipe, also can be for having the lamellar structure of inner chamber, and is exemplary, when electronic equipment was the cell-phone, heat conduction subassembly 3 can be the lamellar structure, and it is convenient more to fix heat conduction subassembly 3 in equipment casing 1, also is favorable to reducing the whole thickness of cell-phone simultaneously. It should be noted that the heat conducting member 3 may include a copper shell and a wick. The liquid absorption core is fixed in the inner cavity of the copper shell. One end of the copper shell is an evaporation end, and the other end of the copper shell is a condensation end. The liquid core is filled with liquid, and the liquid is one of low boiling point materials. When the evaporation end is heated, the liquid in the liquid absorption core is quickly evaporated, vapor flows from the evaporation end to the condensation end under the action of pressure difference generated by temperature difference between the two ends of the copper shell, heat is continuously released in the flowing process, the vapor is condensed into liquid again, and the liquid flows back to the evaporation end again under the action of capillary force of the liquid absorption core, so that the heat dissipation of a cycle is completed.

The heat generating component 2 may be a circuit board assembly 21, a battery, or other devices capable of generating heat, which is not limited in this embodiment. The heating component 2 can be bonded on the outer wall of the heat conducting component 3 through heat conducting glue. Like this, when heating element 2 generates heat, can be with in heat transfer to heat-conducting component 3, on transmitting equipment casing 1 by heat conduction plastic 4 again, finally with heat transfer to equipment casing 1's outside, avoid heating element 2 because the unchangeable trouble that leads to of heat dissipation takes place, and then be favorable to heating element 2 to last high-efficient work. It should be noted that, after the heat generating component 2 is assembled inside the device housing 1, the device housing 1 is provided with a receiving groove 112 disposed around the heat generating component 2, so that the heat conducting component 3 can be contacted with the heat generating component after being disposed in the receiving groove 112, and further, the heat generated by the heat generating component 2 is conducted out of the device housing 1 through the heat conducting component 3.

It should be noted that, when the electronic device provided in the embodiment of the present application is assembled, as shown in fig. 13 and 14, structures such as a receiving groove 112 for fixing the heat conducting structure and a heat conducting hole 113 for dissipating heat of the heat generating component 2 may be first processed on the device housing 1, as shown in fig. 15 and 16, then the heat conducting component 3 is connected to the device housing 1 by a fixing method such as riveting, as shown in fig. 17 and 18, and finally the heat conducting plastic 4 is injected between the heat conducting pipe and the device housing 1, so that the heat conducting component 3 and the device housing 1 are an integral structure, and further, no gap is left between the device housing 1 and the heat conducting component 3.

As can be seen from the above embodiments, in the embodiment of the present application, the electronic device includes a device housing 1, a heat generating component 2, a heat conducting component 3, and a heat conducting plastic 4; the heating component 2 is arranged in the equipment shell 1; the equipment shell 1 is provided with a bearing groove 112, the heat conduction assembly 3 is arranged in the bearing groove 112, heat conduction plastic 4 is filled between the equipment shell 1 and the heat conduction assembly 3, and the equipment shell 1, the heat conduction plastic 4 and the heat conduction assembly 3 are integrally formed in an injection molding mode. Like this, when electronic equipment assembles, can be with equipment casing 1, heat conduction plastic 4 and heat-conducting component 3 through the mode integrated into one piece of moulding plastics, make zero clearance between equipment casing 1 and the heat-conducting component 3, again because send out heat subassembly 2 and set up in equipment casing 1, consequently, make the heat that heat subassembly 2 produced can be via heat-conducting component 3, conduct equipment casing 1 fast in the heat conduction plastic 4, the heat can not concentrate near heat-conducting component 3, and then electronic equipment's radiating efficiency has been improved.

Alternatively, fig. 3 is an enlarged view of a portion of fig. 2 at a, as shown in fig. 3. The heat conducting assembly 3 comprises a first heat conducting part 31, a second heat conducting part 32 and a heat conducting copper wire 33; the first heat conduction part 31 and the second heat conduction part 32 are fixedly connected, and the first heat conduction part 31 and the second heat conduction part 32 are connected to form a heat conduction cavity; the heat conducting copper wire 33 is fixed in the heat conducting cavity, the second heat conducting part 32 is riveted with the equipment shell 1, and the surface of the second heat conducting part 32 is adhered to the heating component 2; the heat conductive plastic 4 is filled in the gap between the apparatus case 1 and the first heat conductive portion 31.

Specifically, in a possible implementation manner, the first heat conduction portion 31 and the second heat conduction portion 32 may be semicircular tubes, so that the first heat conduction portion 31 and the second heat conduction portion 32 may form a heat conduction tube having a heat conduction cavity after being welded. In another possible implementation manner, the first heat conduction portion 31 and the second heat conduction portion 32 may be sheet-shaped heat conduction structures, so that the first heat conduction portion 31 and the second heat conduction portion 32 can form a heat conduction sheet with a heat conduction cavity after being welded. When the first heat conduction portion 31 and the second heat conduction portion 32 may have a sheet-like heat conduction structure, the thickness of the entire electronic device may be reduced, which is advantageous for the light weight design of the electronic device. When the first heat conducting portion 31 and the second heat conducting portion 32 are welded to form a heat conducting pipe having a heat conducting cavity, the volume of the heat conducting cavity can be larger, and the shapes of the first heat conducting portion 31 and the second heat conducting portion 32 are determined according to the type of the electronic device, which is not limited in the embodiment of the present application.

It should be further noted that the heat conducting copper wire 33 may be a copper wire or other device having a heat conducting function, and after the heat conducting copper wire 33 is fixed in the heat conducting cavity, the liquid inside the heat conducting cavity can rapidly transfer heat to the outside of the heat conducting cavity through the heat conducting copper wire 33. When fixing heat-conducting component 3 on equipment housing 1, can rivet second heat conduction portion 32 and equipment housing 1, again because first heat conduction portion 31 and second heat conduction portion 32 fixed connection, like this, after heat conduction plastic 4 is filled between equipment housing 1 and first heat conduction portion 31, make the fixed between heat-conducting component 3 and the equipment housing 1 more firm, make the laminating between heat conduction plastic 4 and the heat-conducting component 3 more inseparable, further guarantee zero clearance between equipment housing 1 and the heat-conducting component 3. Furthermore, since the thermal conductivity of copper is 397W/m.k, heat can be quickly transferred into the device case 1 through the thermally conductive copper wire. In addition, the heat conduction copper wire has certain ductility, therefore, can adapt to the shape of heat conduction cavity and change the shape of heat conduction copper wire to adapt to different application scenarios.

Optionally, as shown in fig. 13 and 14, a plurality of riveting columns 111 are disposed on a wall of the socket 112, and each riveting column 111 is provided with at least one first positioning hole 1111; as shown in fig. 5 to 10, a plurality of hanging lugs 321 are disposed on an outer wall of the second heat conducting portion 32, and each hanging lug 321 is provided with at least one second positioning hole 3211; the second heat conduction portion 32 and the device case 1 are riveted through the first positioning hole 1111 and the second positioning hole 3211.

Specifically, as shown in fig. 13, when the heat conducting assembly 3 is fixed on the device housing 1, a receiving groove 112 may be formed in the device housing 1, the receiving groove 112 faces a direction close to the heat generating assembly 2, the shape of the receiving groove 112 is determined according to the shape of the heat conducting assembly 3, and for example, in the case that a heat conducting sheet having a heat conducting cavity is formed after the first heat conducting portion 31 and the second heat conducting portion 32 are welded, the receiving groove 112 is a square groove. Before fixing the heat conducting component 3, a plurality of riveting columns 111 can be machined on the groove wall of the bearing groove 112 through CNC machining, and an equal number of riveting columns 111 can be machined on the groove wall of the bearing groove 112 in each direction. For example, in the case that the socket 112 is a square groove, two riveting columns 111 may be disposed on four groove walls of the socket 112. Each of the rivet posts 111 may have a plurality of first positioning holes 1111 formed therein. The outer wall of the second heat conducting part 32 may be provided with a hanging lug 321, the hanging lug 321 is a sheet-shaped fixing structure protruding from the outer wall of the second heat conducting part 32, each hanging lug 321 is provided with a second positioning hole 3211, the number of the second positioning holes 3211 formed in each hanging lug 321 is equal to the number of the first positioning holes 1111 formed in each riveting column 111, so that when the second heat conducting part 32 is riveted with the device housing 1, as shown in fig. 15, a rivet may pass through the first positioning holes 1111 and the second positioning holes 3211 by a riveting device, so that the hanging lug 321 is fixed on the riveting column 111, and the device housing 1 is riveted with the heat conducting assembly 2, because the riveting columns 111 and the hanging lugs 321 may be pressed against each other during riveting, and further the fixing between the heat conducting assembly 3 and the device housing 1 is more fastened, and further, after the heat conducting plastic 4 is filled between the device housing 1 and the first heat conducting part 31, so that the adhesion between the heat-conducting plastic 4 and the heat-conducting component 3 is tighter, and further no gap is formed between the equipment shell 1 and the heat-conducting component 3. It should be noted that fig. 5 is a schematic structural diagram of the heat conducting assembly 3 in a first direction, the first direction is a direction perpendicular to the first heat conducting portion 11, and fig. 10 is a schematic structural diagram of the heat conducting assembly 3 in a second direction, the second direction is a direction perpendicular to the second heat conducting portion 12.

Alternatively, as shown in fig. 11 and 12, the thermally conductive copper wire 33 includes a plurality of thermally conductive ports 331; each of the heat conduction ports 331 is opposed to one of the lugs 321 in the case where the second heat conduction portion 32 and the device case 1 are rivet-connected.

Specifically, the heat conducting copper wire 33 may include a heat conducting body, and the plurality of heat conducting ports 331 are disposed to protrude from the heat conducting body. When the receiving groove 112 is a square groove, the first heat conducting portion 31 and the second heat conducting portion 32 can be welded to form a square heat conducting sheet, and a heat conducting cavity of the heat conducting sheet is also a square heat conducting cavity. The heat conducting sheet may have two hanging lugs 321 on each side wall, and two heat conducting ports 331 on each side wall of the heat conducting body. Under the condition that second heat conduction portion 32 and equipment casing 1 riveted, every heat conduction port 331 all is relative with an hangers 321, and under the condition that heat conduction subassembly 3 was fixed on equipment casing 1, heat conduction port 331 and hangers 321 contacted, like this, heat conduction copper wire 33 can be through heat conduction port 331 fast with the heat transfer to the heat conduction of heat conduction cavity, further improvement heat conduction subassembly 3's heat conduction efficiency.

Optionally, as shown in fig. 7, a clamping groove 312 is formed on an outer surface of the first heat conducting portion 31; the heat conductive plastic 4 includes a fixing portion, and the fixing portion is clamped in the clamping groove 312.

Specifically, the fastening groove 312 may be dovetail-shaped, and the fastening groove 312 is disposed on a surface of the first heat conduction portion 31 away from the second heat conduction portion 32. The heat conductive plastic 4 may be provided with a fixing portion, which may be a protrusion structure. Like this, under the condition of heat conduction plastic 4 packing between the surface of equipment casing 1 and first heat conduction portion 31, the fixed part joint is in joint groove 312 for heat conduction plastic 4 can hug closely first heat conduction portion 31 and set up, further guarantees gapless between equipment casing 1 and the heat-conducting component 3.

Optionally, as shown in fig. 1 and 4, the electronic device further includes a display screen 5; the display panel 5 is fixed to the apparatus casing 1, and a heat dissipation film 41 is provided between the first heat conduction portion 31 and the display panel 5.

Specifically, the display screen 5 may be glued to a frame of the device housing 1, so that the display screen 5 may cover the heat conducting assembly 3. The heat dissipation film 41 can be arranged between the first heat conduction part 31 and the display screen 5, and the heat dissipation film 41 has the function of rapid heat transfer, so that heat generated in the display screen 5 can be directly transferred to the heat conduction cavity through the heat dissipation film 41, and the heat dissipation speed of the heat dissipation assembly is further accelerated. It should be noted that the heat dissipation film 41 may be any one of a graphite heat dissipation film, an artificial graphite heat dissipation film, or a nano-carbon heat dissipation film, in the embodiments of the present application, if the overall thickness of the electronic device needs to be considered, any one of the artificial graphite heat dissipation film 41 or the nano-carbon heat dissipation film 41 may be selected, and since the thickness of the heat dissipation film 41 is relatively thin, the light and thin design of the electronic device may be satisfied.

Alternatively, as shown in fig. 7, a first convex hull 311 is disposed on the outer surface of the first heat conduction part 31; the first convex hull 31 is on the outer surface of the first heat conduction part 31, and the first convex hull 311 is in contact with the heat dissipation film 41.

Specifically, first convex hull 311 is the protruding structure of protrusion in first heat-conducting portion 31 surface, like this, fixes the condition on equipment casing 1 at display screen 5, and first convex hull 311 can provide the platform of laminating for heat dissipation membrane 41 for first heat-conducting portion 31 more makes things convenient for and contacts with heat dissipation membrane 41, and then can derive the heat that display screen 5 produced soon.

Alternatively, as shown in fig. 10, the heat generating component includes a battery, and a second convex hull 322 is disposed on the outer surface of the second heat conducting portion 32; the second convex hull 322 is arranged on the outer surface of the second heat conducting part 32, the battery is fixed on the device shell 1, and the second convex hull 322 is in contact with the battery.

Specifically, the battery is the energy supply part of electronic equipment, and when electronic equipment operated for a long time, can produce certain heat, based on this, can be provided with second convex hull 322 on the surface of two heat conduction parts, and second convex hull 322 is the protruding structure of protrusion in second heat conduction part 32 surface, and the protruding structure of second convex hull 322 is close to the battery. The battery can be fixed on equipment casing 1 through modes such as gluing or joint, fixes back on equipment casing 1 at the battery for second convex closure 322 and battery contact, and then make the heat that the battery produced directly transmit to the heat conduction cavity through second convex closure 322 in, like this, make the heat that the battery produced also can obtain the transmission fast. As shown in fig. 4, the electronic device further includes a rear case 6, and the rear case 6 is fixed to the device housing 1 by clamping, welding, and the like, so that components such as a battery are fixed in an inner cavity formed by the device housing 1 and the rear case 6, and an effect of protecting internal devices of the electronic device can be achieved.

Optionally, as shown in fig. 3 and 4, the heat generating assembly 2 includes a circuit board assembly 21, the heat conducting assembly 3 further includes a connecting copper pipe 34, and the circuit board assembly 21 is provided with a heat conducting fin 21; in the case where the outer surface of the heat conductive member 3 is in contact with the circuit board assembly 21, the connecting copper pipe 34 is in contact with the heat conductive sheet 21.

It should be noted that the circuit board assembly 21 is a flexible circuit board, so that the circuit board assembly 21 has the advantages of high wiring density, light weight, thin thickness and good bending property, and can further adapt to the complex installation environment inside the device housing 1. In addition, the heat conducting sheet 21 may be made of a heat conducting glass fiber material, and the heat conducting glass fiber material is bonded to the circuit board assembly 21, so that heat generated by the circuit board assembly 21 can be led out. Because heat conduction component 3 is the slice or tubular structure, consequently leads to heat conduction component 3 to be difficult for directly contacting with circuit board assembly 21, on this basis, can be directly through connecting copper pipe 34 and heat conduction piece 21 contact, with the heat transfer of production in the heat conduction cavity on the circuit board assembly 21 for the heat transfer that circuit board assembly 21 produced is more simple and convenient.

Alternatively, as shown in fig. 13, the device case 1 is provided with a heat conduction hole 113, and an opening of the heat conduction hole 113 is aligned with the heat generating component 2.

It should be noted that, as shown in fig. 13, a heat conduction hole 113 may be further formed in the device housing 1, and one end of the heat conduction hole 113 is aligned with the heating component 2, so that heat generated by the heating component 2 can be transferred through the heat conduction hole 113, and a heat conduction path of the heating component 2 is further increased, which is beneficial to heat dissipation of the heating component 2.

As can be seen from the above embodiments, in the embodiment of the present application, the electronic device includes a device housing 1, a heat generating component 2, a heat conducting component 3, and a heat conducting plastic 4; the heating component 2 is arranged in the equipment shell 1; the equipment shell 1 is provided with a bearing groove 112, the heat conduction assembly 3 is arranged in the bearing groove 112, heat conduction plastic 4 is filled between the equipment shell 1 and the heat conduction assembly 3, and the equipment shell 1, the heat conduction plastic 4 and the heat conduction assembly 3 are integrally formed in an injection molding mode. Like this, when electronic equipment assembles, can be with equipment casing 1, heat conduction plastic 4 and heat-conducting component 3 through the mode integrated into one piece of moulding plastics, make zero clearance between equipment casing 1 and the heat-conducting component 3, again because the setting of the subassembly 2 that generates heat is in equipment casing 1, consequently, make the heat that the subassembly 2 that generates heat can conduct equipment casing 1 fast in the heat conduction plastic 4 via heat-conducting component 3, the heat can not concentrate near heat-conducting component 3, and then electronic equipment's radiating efficiency has been improved.

In addition, the thermally conductive copper wire 33 includes a plurality of thermally conductive ports 331; in the case where the second heat conduction portion 32 and the device case 1 are riveted, each heat conduction port 331 corresponds to one of the lugs 321, and the heat conduction port 331 is in contact with the lug 321. Thus, the heat conducting copper wire 33 can rapidly transfer the heat of the heat conducting cavity to the heat conducting through the heat conducting port 331, and further improve the heat conducting efficiency of the heat conducting component 3.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. An electronic device is characterized by comprising a device shell, a heating component, a heat conducting component and heat conducting plastic;

the heating component is arranged in the equipment shell;

2. The electronic device of claim 1, wherein the heat conducting assembly comprises a first heat conducting portion, a second heat conducting portion and a heat conducting copper wire;

the first heat conduction part and the second heat conduction part are fixedly connected, and the first heat conduction part and the second heat conduction part are connected to form a heat conduction cavity;

the heat conducting copper wire is fixed in the heat conducting cavity, the second heat conducting portion is riveted with the equipment shell, and the surface of the second heat conducting portion is bonded with the heating assembly;

the heat-conducting plastic is filled between the shell and the first heat-conducting part.

3. The electronic device of claim 2, wherein a plurality of riveting columns are disposed on a wall of the receiving groove, and each of the riveting columns has at least one first positioning hole disposed therein;

a plurality of hanging lugs are arranged on the outer wall of the second heat conducting part, and at least one second positioning hole is formed in each hanging lug;

and the second heat conducting part and the equipment shell are in riveted connection through the first positioning hole and the second positioning hole.

4. The electronic device of claim 3, wherein the thermally conductive copper wire comprises a plurality of thermally conductive ports;

each of the heat-conducting ports is opposed to one of the lugs in a state where the second heat-conducting portion and the device case are riveted.

5. The electronic device of claim 3, wherein a snap groove is formed on an outer surface of the first heat conducting portion;

the heat-conducting plastic comprises a fixing part which is clamped in the clamping groove.

6. The electronic device of claim 2, further comprising a display screen;

the display screen is fixed on the equipment shell, and a heat dissipation film is arranged between the first heat conduction part and the display screen.

7. The electronic device according to claim 6, wherein a first convex hull is provided on an outer surface of the first heat conducting portion;

the first convex hull protrudes out of the outer surface of the first heat conduction part, and the first convex hull is in contact with the heat dissipation film.

8. The electronic device of claim 2, wherein the heat generating component comprises a battery, and a second convex hull is disposed on an outer surface of the second heat conducting portion;

the second convex hull protrudes out of the outer surface of the second heat conducting portion, the battery is fixed on the equipment shell, and the second convex hull is in contact with the battery.

9. The electronic device of claim 1, wherein the heat generating component comprises a circuit board assembly, the heat conducting component further comprises a connecting copper tube, and a heat conducting fin is disposed on the circuit board assembly, and the connecting copper tube is in contact with the heat conducting fin.

10. The electronic device of claim 1, wherein the device housing defines a heat-conducting aperture, and wherein an aperture of the heat-conducting aperture is aligned with the heat-generating component.