CN212461664U

CN212461664U - Power electronic module bottom plate structure

Info

Publication number: CN212461664U
Application number: CN202021339510.9U
Authority: CN
Inventors: 陶锦根
Original assignee: Taizhou Yazhou Electronic Technology Co ltd
Current assignee: Taizhou Yazhou Electronic Technology Co ltd
Priority date: 2020-07-09
Filing date: 2020-07-09
Publication date: 2021-02-02
Anticipated expiration: 2030-07-09

Abstract

The utility model discloses a power electronic module bottom plate structure, comprising a base plate, the last lateral wall of bottom plate runs through there is first through-hole, the last inner wall fixedly connected with spliced pole of bottom plate, the internal surface of spliced pole is provided with the silica gel inner circle, the inside of bottom plate and the fixed surface that is located the spliced pole are connected with the baffle, it has the second through-hole to run through on the baffle, the last fixed surface of baffle is connected with the supporting shoe, the thin copper sheet of last fixed surface of supporting shoe, the last fixed surface of thin copper sheet is connected with the copper wire, the upper surface of thin copper sheet is provided with the silicone grease layer. The utility model discloses in, through the effect of copper wire, graphite alkene fin, silicone grease layer, thin copper sheet, keep away from power electronic module's heat conduction, can also lead a little current simultaneously, the cotton layer of absorbing water in it can absorb the moisture in the power electronic module place environment, makes power electronic module work better.

Description

Power electronic module bottom plate structure

Technical Field

The utility model relates to a semiconductor power device technical field especially relates to a power electronic module bottom plate structure.

Background

The power electronic module bottom plate is the carrier that is used for installing power electronic module, power electronic module passes through the upper surface that crimping or welded mode is fixed to the power electronic module bottom plate, power electronic module can produce the heat at the during operation, these heats can not cause the harm to power electronic module if giving off, power electronic module also dreads moisture comparatively, if power electronic module bottom plate can assist the heat dissipation of power electronic module and detach moisture, will make power electronic module work better.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing a power electronic module bottom plate structure.

In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a power electronic module bottom plate structure, includes the bottom plate, the last lateral wall of bottom plate runs through there is first through-hole, the last inner wall fixedly connected with spliced pole of bottom plate, the internal surface of spliced pole is provided with the silica gel inner circle, the inside of bottom plate and the surface fixedly connected with baffle that is located the spliced pole, it has the second through-hole to run through on the baffle, the last fixed surface of baffle is connected with the supporting shoe, the last fixed surface of supporting shoe is connected with thin copper sheet, the last fixed surface of thin copper sheet is connected with the copper wire, the upper surface of thin copper sheet is provided with the silicone grease layer, the upper surface on silicone grease layer is provided with graphite alkene fin, the lower part of bottom plate is provided with the apron, the upper surface of apron is provided with the cotton layer that absorbs water, it has.

As a further description of the above technical solution:

the silica gel inner circle passes the last lateral wall of bottom plate, the inside cavity of silica gel inner circle, the up end of silica gel inner circle is level with the upper surface of bottom plate mutually, the lower terminal surface of silica gel inner circle is level with the lower terminal surface of spliced pole mutually.

As a further description of the above technical solution:

the copper wire sequentially penetrates through the silicone grease layer and the graphene radiating fins to reach the first through hole, and the copper wire is not in contact with the first through hole.

As a further description of the above technical solution:

the number of the connecting columns is four, and the four connecting columns are divided into two groups and are respectively contacted with the left inner wall and the right inner part of the bottom plate.

As a further description of the above technical solution:

the upper surface of apron just is located edge fixedly connected with inserted bar, the surface and the bottom plate sliding connection of inserted bar.

As a further description of the above technical solution:

the cover plate is connected to the outer surface of the connecting column in a sliding mode, and one end, far away from the bottom plate, of the connecting column is flush with the lower surface of the cover plate.

The utility model discloses following beneficial effect has:

compared with the prior art, this power electronic module bottom plate structure through the effect of copper wire, graphite alkene fin, silicone grease layer, thin copper sheet, keeps away from power electronic module's heat conduction, can also lead a little current simultaneously, and the cotton layer that absorbs water in it can absorb the moisture in the environment of power electronic module place, makes power electronic module work better.

Drawings

Fig. 1 is a front sectional view of a bottom plate structure of a power electronic module according to the present invention;

fig. 2 is a bottom view of a bottom plate structure of a power electronic module according to the present invention;

fig. 3 is a top view of a power electronic module bottom plate structure provided by the present invention.

Illustration of the drawings:

1. a base plate; 2. a first through hole; 3. a copper wire; 4. a graphene heat sink; 5. a silicone layer; 6. a thin copper sheet; 7. a support block; 8. a partition plate; 9. a second through hole; 10. a water absorbent cotton layer; 11. a cover plate; 12. inserting a rod; 13. connecting columns; 14. a silica gel inner ring; 15. and (4) anti-skid bulges.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-3, the utility model provides a pair of power electronic module bottom plate structure: the power electronic module bottom plate structure comprises a bottom plate 1, a first through hole 2 penetrates through the upper side wall of the bottom plate 1, a connecting column 13 is fixedly connected to the upper inner wall of the bottom plate 1 and plays a role in supporting and connecting, a silica gel inner ring 14 is arranged on the inner surface of the connecting column 13, so that the power electronic module bottom plate structure is conveniently connected with a using device, vibration of a connecting position can be relieved when the power electronic module bottom plate structure is used, a partition plate 8 is fixedly connected to the inner portion of the bottom plate 1 and the outer surface of the connecting column 13, a second through hole 9 penetrates through the partition plate 8 and is used for moisture passing, a supporting block 7 is fixedly connected to the upper surface of the partition plate 8, a thin copper sheet 6 is fixedly connected to the upper surface of the supporting block 7 and is used for heat dissipation and micro-current consumption, a copper wire 3 is fixedly connected to the upper surface of the thin copper sheet 6 and, the lower part of the micro-current bottom plate 1 with heat dissipation and conduction consumption is provided with a cover plate 11, a water absorption cotton layer 10 is convenient to take out, the upper surface of the cover plate 11 is provided with the water absorption cotton layer 10 for absorbing water, and an anti-skid bulge 15 penetrates through the cover plate 11 to play a role in skid resistance.

Silica gel inner circle 14 passes the last lateral wall of bottom plate 1, the inside cavity of silica gel inner circle 14, the up end of silica gel inner circle 14 is level with the upper surface of bottom plate 1, the lower terminal surface of silica gel inner circle 14 is level with the lower terminal surface of spliced pole 13, copper wire 3 passes silicone grease layer 5 in proper order, graphite alkene fin 4 reachs in first through-hole 2, contactless between copper wire 3 and the first through-hole 2, spliced pole 13's quantity has four, four spliced poles 13 divide two sets of left inner wall and the right inside contact with bottom plate 1 respectively, the upper surface of apron 11 just is located edge fixedly connected with inserted bar 12, the surface and the bottom plate 1 sliding connection of inserted bar 12, apron 11 sliding connection is in the surface of spliced pole 13, the one end that bottom plate 1 was kept away from to spliced pole 13 is level with apron 11 lower.

The working principle is as follows: after power electronic module is connected to bottom plate 1, copper wire 3 and power electronic module contact, make the heat that power electronic module produced and the microcurrent that self leaks outward guide to graphite alkene fin 4 through first through-hole 2 and carry out the consumption of losing and dissipating for the first time, it consumes to lose to carry out the second time to thin copper sheet 6, silicone grease layer 5 can be with heat mutual transmission between graphite alkene fin 4 and thin copper sheet 6, accelerate the speed of loosing, moisture near following power electronic module passes through first through-hole 2, it is absorbed by absorbent cotton layer 10 to pass through second through-hole 9 again, the realization keeps the drying of power electronic module department, it can change absorbent cotton layer 10 to take out apron 11.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.

Claims

1. A power electronic module backplane structure, comprising a backplane (1), characterized in that: the upper side wall of the bottom plate (1) penetrates through a first through hole (2), the upper inner wall of the bottom plate (1) is fixedly connected with a connecting column (13), a silica gel inner ring (14) is arranged on the inner surface of the connecting column (13), a partition plate (8) is fixedly connected to the outer surface of the inner part of the bottom plate (1) and located on the connecting column (13), a second through hole (9) penetrates through the partition plate (8), a supporting block (7) is fixedly connected to the upper surface of the partition plate (8), a thin copper sheet (6) is fixedly connected to the upper surface of the supporting block (7), a copper wire (3) is fixedly connected to the upper surface of the thin copper sheet (6), a silica gel layer (5) is arranged on the upper surface of the thin copper sheet (6), a graphene radiating fin (4) is arranged on the upper surface of the silica gel layer (5), and a cover plate (11, the upper surface of apron (11) is provided with cotton layer (10) that absorb water, it has raised on the apron (11) to run through antiskid (15).

2. A power electronic module backplane structure according to claim 1, wherein: silica gel inner circle (14) pass the last lateral wall of bottom plate (1), the inside cavity of silica gel inner circle (14), the up end of silica gel inner circle (14) is level with the upper surface of bottom plate (1), the lower terminal surface of silica gel inner circle (14) is level with the lower terminal surface of spliced pole (13).

3. A power electronic module backplane structure according to claim 1, wherein: the copper wire (3) sequentially penetrates through the silicone grease layer (5) and the graphene radiating fins (4) to reach the first through hole (2), and the copper wire (3) is not in contact with the first through hole (2).

4. A power electronic module backplane structure according to claim 1, wherein: the number of the connecting columns (13) is four, and the four connecting columns (13) are divided into two groups and are respectively contacted with the left inner wall and the right inner part of the bottom plate (1).

5. A power electronic module backplane structure according to claim 1, wherein: the upper surface of apron (11) just is located edge fixedly connected with inserted bar (12), the surface and bottom plate (1) sliding connection of inserted bar (12).

6. A power electronic module backplane structure according to claim 1, wherein: the cover plate (11) is connected to the outer surface of the connecting column (13) in a sliding mode, and one end, far away from the bottom plate (1), of the connecting column (13) is flush with the lower surface of the cover plate (11).