CN212436168U - Miniaturized controller - Google Patents
Miniaturized controller Download PDFInfo
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- CN212436168U CN212436168U CN202021141594.5U CN202021141594U CN212436168U CN 212436168 U CN212436168 U CN 212436168U CN 202021141594 U CN202021141594 U CN 202021141594U CN 212436168 U CN212436168 U CN 212436168U
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- circuit board
- controller
- bottom plate
- miniaturized
- cooling
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Abstract
The utility model discloses a miniaturized controller, including the heat abstractor who installs the circuit board to the controller, heat abstractor includes the bottom plate, radiator fan, cooling tube and liquid reserve tank, bottom plate mounting to the soldering tin face of circuit board, and be equipped with the interval space between the soldering tin face of circuit board, radiator fan installs in the bottom plate, and with circuit board electric connection, radiator fan is used for towards the circuit board, cooling tube installs in interval space, and be used for cooling circuit board's soldering tin face, be equipped with thermoelectric generation piece and miniature solenoid valve on the cooling tube, thermoelectric generation piece has cold junction and hot junction, the hot junction is connected with the circuit board, miniature solenoid valve is used for controlling cooling tube intercommunication or disconnection, and with cold junction electric connection, the liquid reserve tank is installed in the bottom plate, and be used for the storage coolant liquid, and be connected. The utility model discloses under the condition that does not increase fan volume, fan quantity, can improve the radiating effect by a wide margin, make the controller has further realized the miniaturization.
Description
Technical Field
The utility model relates to a controller technical field, in particular to miniaturized controller.
Background
The controller is the indispensable hardware device in electronic equipment or the electronic equipment, and along with the development of science and technology, the controller constantly promotes self performance, and its volume also develops towards miniaturization to satisfy requirements such as the portability of electronic equipment. In the long-time working process, the controller can generate high heat, and the key for ensuring the reliable operation of the controller is to timely dissipate the heat. However, the conventional heat dissipation method of simply adopting air cooling has not only high noise but also low efficiency, and if the number of the air cooling fans is too large, the sizes of the controller and the electronic equipment are greatly increased.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a miniaturized controller aims at solving the controller and need dispel the heat in the course of the work, and the conventional radiating mode that singly adopts the forced air cooling is not only the noise big, and is inefficient moreover, if forced air cooling fan quantity is too many, the problem of the volume that will greatly increased controller and electronic equipment.
In order to achieve the above object, the utility model provides a miniaturized controller, including install extremely the heat abstractor of the circuit board of controller, heat abstractor includes:
the bottom plate is mounted on the soldering tin surface of the circuit board, and a spacing space is arranged between the bottom plate and the soldering tin surface of the circuit board;
the heat dissipation fan is arranged on the bottom plate, electrically connected with the circuit board and used for facing the circuit board;
the cooling pipeline is arranged in the interval space and used for cooling the soldering tin surface of the circuit board, a thermoelectric generation piece and a miniature electromagnetic valve are arranged on the cooling pipeline, the thermoelectric generation piece is provided with a cold end and a hot end, the hot end of the thermoelectric generation piece is connected with the circuit board, and the miniature electromagnetic valve is used for controlling the connection or disconnection of the cooling pipeline and is electrically connected with the cold end of the thermoelectric generation piece; and the number of the first and second groups,
the liquid storage tank is arranged on the bottom plate and used for storing cooling liquid and is connected with the cooling pipeline.
Optionally, still be equipped with micro-pump and water pump switch on the cooling line, water pump switch respectively with micro-pump with the cold junction electric connection of thermoelectric generation piece, water pump switch is used for controlling micro-pump work.
Optionally, a contact area between the hot end of the thermoelectric generation piece and the circuit board is provided with a heat conduction silicone layer.
Optionally, a copper coating or an aluminum coating is provided on the wall surface of the bottom plate facing the circuit board.
Optionally, the cooling pipeline includes a circular pipeline and a rectangular pipeline connected with each other, the circular pipeline is connected with the liquid storage tank, and the rectangular pipeline is installed in the space.
Optionally, the number of the rectangular pipelines is multiple, and the plurality of the rectangular pipelines are distributed at intervals.
Optionally, the air inlet side of the heat dissipation fan is arranged towards the circuit board of the controller.
Optionally, the soldering surface of the circuit board is provided with a plurality of heat conducting pillars for connecting with the bottom plate, and the plurality of heat conducting pillars are distributed at intervals.
Optionally, the heat conducting column is made of aluminum or copper; and/or a heat conduction silicone grease layer is arranged on the contact area between the soldering tin surface of the heat conduction column and the circuit board and the bottom plate.
Optionally, a plurality of heat dissipation fins are convexly arranged on a wall surface of the bottom plate, which is opposite to the circuit board of the controller.
In the technical scheme of the utility model, under the condition that the temperature of the circuit board of the controller is not high, only the heat radiation fan provides a heat radiation path for the circuit board, and at the moment, the heat radiation device can meet the heat radiation requirement of the controller under the condition of low power consumption; when the temperature of the circuit board of the controller gradually rises, the thermoelectric generation piece starts to work to provide power for the miniature electromagnetic valve, so that the miniature electromagnetic valve opens the cooling pipeline, and the circuit board is cooled intensively; the utility model discloses a miniaturized controller can improve the radiating effect by a wide margin under the condition that does not increase fan volume, fan quantity, makes the controller has further realized the miniaturization.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic side view of an embodiment of a miniaturized controller provided by the present invention;
fig. 2 is a schematic top view of the miniaturized controller of fig. 1.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | |
32 | |
| 101 | Circuit board | 4 | Thermoelectric power generation piece |
| 1 | |
5 | Miniature electromagnetic valve |
| 2 | |
6 | Liquid storage tank |
| 3 | |
7 | |
| 31 | Rectangular pipeline | 8 | Heat conducting column |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
In the long-time working process, the controller can generate high heat, and the key for ensuring the reliable operation of the controller is to timely dissipate the heat. However, the conventional heat dissipation method of simply adopting air cooling has not only high noise but also low efficiency, and if the number of the air cooling fans is too large, the sizes of the controller and the electronic equipment are greatly increased.
To solve the above problems, the present invention provides a miniaturized controller, please refer to fig. 1-2, which is a specific embodiment of the miniaturized controller, and the miniaturized controller comprises a heat dissipation device mounted on a circuit board 101 of the controller, wherein the heat dissipation device comprises a bottom plate 1, a heat dissipation fan 2, a cooling pipeline 3 and a liquid storage tank 6, the bottom plate 1 is mounted on a soldering tin surface of the circuit board 101, a spacing space is provided between the bottom plate 1 and the soldering tin surface of the circuit board 101, the heat dissipation fan 2 is mounted on the bottom plate 1, the heat dissipation fan 2 is electrically connected with the circuit board 101 and faces the circuit board 101, the cooling pipeline 3 is mounted in the spacing space, the cooling pipeline 3 is used for cooling the soldering tin surface of the circuit board 101, a thermoelectric generation piece 4 and a micro electromagnetic valve 5 are provided on the cooling pipeline 3, the thermoelectric generation piece 4 has a cold end and a hot end, the hot end of the, miniature solenoid valve 5 is used for controlling cooling pipeline 3 intercommunication or disconnection, and with thermoelectric generation piece 4's cold junction electric connection, and liquid reserve tank 6 installs in bottom plate 1, and liquid reserve tank 6 is used for saving the coolant liquid, and is connected with cooling pipeline 3.
In this embodiment, when the temperature of the circuit board 101 of the controller 100 is not high, only the heat dissipation fan 2 provides a heat dissipation path for the circuit board 101, and at this time, the heat dissipation device can meet the heat dissipation requirement of the controller 100 under the condition of low power consumption. When the temperature of the circuit board 101 of the controller gradually rises, the controller 100 needs a more efficient heat dissipation way, the rotating speed of the heat dissipation fan 2 is limited, and the heat dissipation requirement is difficult to meet, but the temperature difference is formed between the hot end and the cold end of the thermoelectric generation sheet 4 connected with the circuit board 101 at the moment, so that a potential difference is formed, the thermoelectric generation sheet 4 starts to work, a power supply is provided for the micro electromagnetic valve 5, the cooling pipeline 3 is opened, and the circuit board 101 is cooled intensively. The utility model discloses a miniaturized controller can improve the radiating effect by a wide margin under the condition that does not increase fan volume, fan quantity, makes controller 100 has further realized the miniaturization.
In the present embodiment, the cooling liquid of the cooling pipeline 3 is supplied from the cooling tank, and the cooling tank is mounted on the base plate 1 as a part of the overall structure of the controller 100, and if the cooling pipeline 3 is extended appropriately to further miniaturize the controller 100, the cooling tank may be provided at the distal end without affecting the layout of the controller 100 main body.
Since the controller is usually provided with a housing, the bottom plate 1 can be integrated into the housing as a part of the housing, and the overall volume of the controller can be reduced to a certain extent. Furthermore, a plurality of heat dissipation fins are convexly arranged on the wall surface of the bottom plate 1 opposite to the circuit board 101 of the controller 100, which helps to improve the heat dissipation effect of the controller 100.
Further, still be equipped with miniature pump 7 and water pump switch on the cooling pipeline 3, water pump switch respectively with miniature pump 7 and thermoelectric generation piece 4's cold junction electric connection, water pump switch is used for controlling miniature pump 7 work. The micro water pump 7 can increase the flow rate of cooling water in the cooling pipeline 3, and further improve the cooling effect.
In this embodiment, the contact area between the hot end of the thermoelectric generation piece 4 and the circuit board 101 is provided with a heat conduction silicone layer, so that heat on the circuit board 101 can be more quickly introduced into the thermoelectric generation piece 4.
Furthermore, a copper coating or an aluminum coating is arranged on the wall surface of the bottom plate 1 facing the circuit board 101, and the copper coating or the aluminum coating has good heat-conducting property and can improve the cooling effect.
Further, cooling pipeline 3 is connected with liquid reserve tank 6 including the circular pipeline 32 and the rectangle pipeline 31 that are connected, circular pipeline 32, and rectangle pipeline 31 is installed to the interval space, compares circular pipeline 32, and the area of contact of rectangle pipeline 31 and circuit board 101 has increased, has promoted the cooling effect.
In this embodiment, a plurality of rectangular pipes 31 are provided, and the plurality of rectangular pipes 31 are distributed and spaced to uniformly cool each region on the circuit board 101, wherein the plurality of rectangular pipes 31 are connected to each other to form a loop.
In this embodiment, the air inlet side of the cooling fan 2 is arranged toward the circuit board 101 of the controller, and the cooling fan 2 sucks heat from the side of the circuit board 101 of the controller and blows away the heat, so that the heat can be prevented from being blown to the liquid storage tank 6. Of course, in other embodiments, if the liquid storage tank 6 and the heat dissipation fan 2 are not oppositely arranged, the installation position of the heat dissipation fan 2 can be changed according to actual conditions.
In this embodiment, the soldering tin surface of the circuit board 101 is provided with a plurality of heat conduction columns 8 for being connected with the bottom plate 1, and the plurality of heat conduction columns 8 are distributed and arranged at intervals, and based on the characteristic that the housing has a heat dissipation function in this embodiment, the heat conduction columns 8 are arranged at positions not covered by the rectangular pipeline 31, so that the cooling effect can be further enhanced.
Further, the heat conducting column 8 is made of aluminum or copper, or a heat conducting silicone layer is arranged on a contact area between the solder surface of the heat conducting column 8 and the circuit board 101 and the contact area between the solder surface of the circuit board 1 and the contact area of the circuit board 1.
The above only be the preferred embodiment of the utility model discloses a not consequently restriction the utility model discloses a patent range, all are in the utility model discloses a conceive, utilize the equivalent structure transform of what the content was done in the description and the attached drawing, or direct/indirect application all is included in other relevant technical field the utility model discloses a patent protection within range.
Claims (10)
1. A miniaturized controller including a heat sink mounted to a circuit board of the controller, the heat sink comprising:
the bottom plate is mounted on the soldering tin surface of the circuit board, and a spacing space is arranged between the bottom plate and the soldering tin surface of the circuit board;
the heat dissipation fan is arranged on the bottom plate, electrically connected with the circuit board and used for facing the circuit board;
the cooling pipeline is arranged in the interval space and used for cooling the soldering tin surface of the circuit board, a thermoelectric generation piece and a miniature electromagnetic valve are arranged on the cooling pipeline, the thermoelectric generation piece is provided with a cold end and a hot end, the hot end of the thermoelectric generation piece is connected with the circuit board, and the miniature electromagnetic valve is used for controlling the connection or disconnection of the cooling pipeline and is electrically connected with the cold end of the thermoelectric generation piece; and the number of the first and second groups,
the liquid storage tank is arranged on the bottom plate and used for storing cooling liquid and is connected with the cooling pipeline.
2. The miniaturized controller of claim 1, wherein a micro water pump and a water pump switch are further disposed on the cooling pipeline, the water pump switch is electrically connected to the micro water pump and the cold end of the thermoelectric generation chip, and the water pump switch is used for controlling the micro water pump to operate.
3. The miniaturized controller of claim 1 wherein a contact area of the hot side of the thermoelectric generation chip with the circuit board is provided with a thermally conductive silicone layer.
4. The miniaturized controller of claim 1 wherein a wall of the base plate facing the circuit board is coated with a copper or aluminum coating.
5. The miniaturized controller of claim 1 wherein the cooling circuit comprises a circular circuit connected to the reservoir and a rectangular circuit mounted to the spaced space in connection therewith.
6. The miniaturized controller of claim 5 wherein the plurality of rectangular pipes are arranged in a distributed and spaced manner.
7. The miniaturized controller of claim 1 wherein an air inlet side of the heat dissipation fan is disposed toward a circuit board of the controller.
8. The miniaturized controller of claim 1 wherein a solder surface of the circuit board has a plurality of heat conductive posts for connection to the base plate, the plurality of heat conductive posts being arranged in a distributed and spaced apart arrangement.
9. The miniaturized controller of claim 8 wherein the heat-conducting posts are made of aluminum or copper; and/or a heat conduction silicone grease layer is arranged on the contact area between the soldering tin surface of the heat conduction column and the circuit board and the bottom plate.
10. The miniaturized controller of claim 1 wherein a plurality of heat dissipating fins are formed on a wall of the base plate opposite to the circuit board of the controller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021141594.5U CN212436168U (en) | 2020-06-18 | 2020-06-18 | Miniaturized controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021141594.5U CN212436168U (en) | 2020-06-18 | 2020-06-18 | Miniaturized controller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212436168U true CN212436168U (en) | 2021-01-29 |
Family
ID=74280969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021141594.5U Active CN212436168U (en) | 2020-06-18 | 2020-06-18 | Miniaturized controller |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212436168U (en) |
-
2020
- 2020-06-18 CN CN202021141594.5U patent/CN212436168U/en active Active
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