CN212436167U

CN212436167U - Liquid cooling radiating assembly and electronic equipment carrying same

Info

Publication number: CN212436167U
Application number: CN202021138909.0U
Authority: CN
Inventors: 方运; 方海; 刘伟
Original assignee: Shine Optoelectronics Kunshan Co Ltd
Current assignee: Shine Optoelectronics Kunshan Co Ltd
Priority date: 2020-06-18
Filing date: 2020-06-18
Publication date: 2021-01-29
Anticipated expiration: 2030-06-18

Abstract

The application provides a liquid cooling radiator unit and carry on its electronic equipment, this liquid cooling radiator unit has: the first cover plate is provided with a first cavity, a plurality of bulges are arranged in the first cavity, the second cover plate is provided with a second cavity, the bottom of the second cavity is provided with a fin array, the fin array comprises a plurality of fins, two adjacent fins or fin arrays form a flow channel for storing working media, the adjacent flow channels are communicated, and the surface of a groove between every two adjacent fin arrays or between the fin array and the side wall of the adjacent second cover plate is provided with a microstructure. This radiator unit simple structure like this utilizes the arch to play to support and form the steam chamber after first apron and the second combination, utilizes the phase transition of working medium in the runner to realize thermal transfer to the steam chamber at the steam intracavity with the heat transfer that heat sources such as the electronic component that the second apron side received to realize high-efficient heat transfer, have good samming performance simultaneously.

Description

Liquid cooling radiating assembly and electronic equipment carrying same

Technical Field

The application relates to the technical field of heat dissipation, in particular to a liquid cooling heat dissipation assembly for heat dissipation of a microelectronic element and an electronic device carrying the same.

Background

With the rapid development and application popularization of electronic information technology, the development of electronic components presents the trend of high speed, high frequency and high integration level, so that the power density of a chip is continuously improved to a new height at a high calculation rate, and the temperature is rapidly increased in a short time. The stability and the use precision of electronic components are reduced due to the overhigh temperature, the aging of products is accelerated, and the cycle service life is shortened. Therefore, the heat dissipation technology of electronic products is gradually becoming the bottleneck of the update of electronic products, and the research and development of safe and efficient heat dissipation technology is becoming the central focus of the electronic product field at present. The vapor cavity heat pipe utilizes liquid phase change, has good temperature uniformity and heat dissipation capability, and becomes the mainstream technology of passive heat dissipation at present, however, the efficiency of the vapor cavity heat pipe is not high, and how to improve the phase change efficiency of the phase change medium and improve the heat dissipation efficiency in increasingly thinner electronic products shows more urgent.

Therefore, there is a need for a heat dissipation assembly with a compact, light and thin steam chamber.

SUMMERY OF THE UTILITY MODEL

The purpose of this application lies in: a novel liquid-cooled heat sink assembly is provided for providing efficient heat dissipation/cooling of electronic components such as processors, chips, etc., the heat sink assembly having a simple internal structure.

In order to achieve the purpose, the technical scheme adopted by the application is as follows,

a liquid-cooled heat dissipation assembly, comprising:

a first cover plate having a first cavity, a plurality of protrusions are disposed in the first cavity, an air channel is formed between adjacent protrusions,

a second cover plate having a second cavity, a plurality of fin arrays disposed in the second cavity,

the fin array comprises a plurality of fins, a first flow channel is formed between every two adjacent fins,

a groove is formed between the adjacent fin arrays, a plurality of microstructures are configured on the bottom wall of the groove, a second flow channel is formed at the microstructure position by the groove, and the first flow channel is communicated with the second flow channel.

In one embodiment, the microstructures are provided as protrusions and/or depressions.

In one embodiment, a porous material layer is disposed on the bottom wall, and the porous material layer includes a plurality of the microstructures.

In one embodiment, the plurality of microstructures are randomly sized and distributed on the bottom wall.

In one embodiment, the air passage is disposed corresponding to the groove, and the air passage extends into the groove.

In an embodiment, the grooves are disposed between the fin array and the side wall of the second cover plate, the bottom wall of the grooves is disposed with a plurality of microstructures, and the protrusions and the side wall of the first cover plate are disposed at intervals to form the air passages.

In one embodiment, a portion or all of the surface of at least some of the fins is provided with microstructures.

In one embodiment, the protrusions are in the form of continuous stripes, or the protrusions are in the form of discrete cylinders, spheres, hemispheres, diamonds, arranged in an array or randomly.

In one embodiment, after the first cover plate is connected with the second cover plate in a matching mode, a gap is reserved between the end portion of the protrusion and the top of the fin array.

An embodiment of the present application provides an electronic device, which carries the above-mentioned liquid cooling heat dissipation assembly.

Advantageous effects

Compared with the scheme in the prior art, the heat dissipation assembly provided by the embodiment of the application has the advantages that the structure is simple, the heat conduction performance is extremely high, and efficient cooling is provided for small-area high-heat-flow-density electronic elements.

Drawings

In order to more clearly illustrate the embodiments of the present specification or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the specification, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive exercise:

fig. 1 is a schematic structural diagram of a heat dissipation assembly according to an embodiment of the present application;

FIG. 1a is a schematic view of a perspective view of FIG. 1;

FIG. 1B is a schematic cross-sectional view B-B of FIG. 1 a;

FIG. 1c is a schematic view of a variation of FIG. 1 b;

FIG. 1d is a schematic view of a variation of FIG. 1 b;

FIG. 1e is a schematic view of a variation of FIG. 1 b;

FIG. 1f is a schematic view of a variation of FIG. 1 e;

fig. 2 is a schematic structural diagram of a first cover plate according to a first embodiment of the present application;

FIG. 3 is a schematic structural diagram of a first cover plate according to a second embodiment of the present application;

fig. 4 is a schematic structural diagram of a first cover plate according to a third embodiment of the present application;

FIG. 5 is a schematic structural diagram of a second cover plate according to an embodiment of the present disclosure;

FIG. 6 is a schematic cross-sectional view A-A of FIG. 5;

FIG. 7 is an enlarged view of a portion B of FIG. 6;

FIG. 8 is a schematic cross-sectional view of a variation of A-A of FIG. 5;

FIG. 9 is an enlarged partial view of C in FIG. 8;

fig. 10-11 are schematic structural views of a second cover plate according to an embodiment of the present application.

Detailed Description

In order to make those skilled in the art better understand the technical solutions proposed in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments in the present application, and not all of the embodiments. All other embodiments that can be derived by a person skilled in the art from one or more embodiments described herein without making any inventive step shall fall within the scope of protection of the present application.

The application provides a liquid cooling radiator unit, it is used for providing the efficient cooling for the electronic component of the high thermal current density of small size to solve high thermal current density heat dissipation problem in the narrow and small space, improved radiator unit's radiating efficiency, temperature uniformity greatly, because its whole thickness is little, can be used to the heat dissipation of portable intelligent treater. At least part of the surface of the fin is provided with a capillary structure for improving capillary force. The heat dissipation assembly comprises: the first cover plate is provided with a first cavity, a plurality of bulges are arranged in the first cavity, an air channel is formed between every two adjacent bulges, the second cover plate is provided with a second cavity, a plurality of fin arrays are arranged in the second cavity, each fin array comprises a plurality of fins, a first flow channel is formed between every two adjacent fins, a groove is formed between every two adjacent fin arrays, a plurality of microstructures are configured on the bottom wall of the groove, the groove forms a second flow channel at the position of the microstructures, and the first flow channel is communicated with the second flow channel. The first cover plate and the second cover plate are combined and then support is achieved through the protrusions to form a steam cavity, and structural strength of the heat dissipation assembly is improved. The heat generated by the electronic element and other heat sources received by the second cover plate side is transferred to the steam cavity by utilizing the phase change of the working medium in the flow channel, so that the heat transfer is realized in the steam cavity, the high-efficiency heat transfer is realized, and the heat-insulating steam box has good temperature-equalizing performance. The heat dissipation assembly has good temperature equalization performance.

The heat dissipation assembly proposed in the present application is described in detail below with reference to the accompanying drawings.

Fig. 1 is a schematic structural diagram of a heat dissipation assembly according to an embodiment of the present application; the heat dissipation assembly 100 includes: when the first cover plate 101 and the second cover plate 102 connected with the first cover plate 101 in a matching mode are manufactured, after the first cover plate 101 and the second cover plate 102 are combined, working media are injected through the injection port, then the injection port is vacuumized, and the injection port is sealed. FIG. 1a is a schematic view of a perspective view of FIG. 1; FIG. 1B is a schematic cross-sectional view B-B of FIG. 1 a; in the first cavity a of the first cover plate 101, there is a protrusion 101c, which is connected to the first fin array 102 b. Two fins in the second fin array 102c form a flow channel for storing the working medium. The material of the first cover plate/the second cover plate can be copper or aluminum, stainless steel, copper alloy, titanium alloy and other metals or PI, PET and other polymers.

As a variant as in fig. 1b as in fig. 1 c; the first cover plate 701 has a protrusion 701c in a first cavity a, the protrusion 701c may also improve the structural strength of the heat dissipation assembly, and the second cover plate 702 has a first fin array 702b (also referred to as a first groove 702b array) in a second cavity, and grooves 702c are formed between two adjacent first fin arrays 702b and between the first fin array 702b and the sidewall. When the heat dissipation assembly is manufactured, the first cover plate 701 and the second cover plate 702 are fixed by welding with solder, and after the fixing, solder 703 is arranged between the end of the side wall of the first cover plate 701 and the end of the side wall of the second cover plate 702, because the protrusion 701c of the solder 703 is not completely contacted with (has a gap) the end/top of the first fin array 702 b. The grooves 702c form channels for storing working media, and adjacent channels are communicated. In the fabrication of the first fin array 702b, bumps may be disposed in the second cavities in advance, and then the bumps may be formed by etching or the like. A trench is formed between two adjacent bumps or between a bump and a sidewall by etching or the like. The material of the first cover plate/the second cover plate can be copper or aluminum, stainless steel, copper alloy, titanium alloy and other metals or PI, PET and other polymers.

As a variant as in fig. 1b as in fig. 1 d; the first cover plate 801 has a protrusion 801c in the first cavity a, the protrusion 801c is provided with a recess 801c1, and the protrusion 801c can also improve the structural strength of the heat dissipation assembly. The second cover plate 802 has first fin arrays 802b (also referred to as first groove 802b arrays) in the second cavity, and grooves 802c are formed between two adjacent first fin arrays 802b and between the first fin arrays 802b and the sidewall. The first cover plate 801 and the second cover plate 802 are fixed by welding with solder 803, after the fixing, because the solder 803 is arranged between the end of the side wall of the first cover plate 701 and the end of the side wall of the second cover plate 702, the protrusion 801c, the recess 801c1 and the end/top of the first fin array 802b form a small cavity, and the design of the cavity enables the liquefied working medium of the heat dissipation assembly during working (during heat dissipation) to rapidly flow back into the flow channel, so that the heat dissipation efficiency can be improved. The grooves 802c form channels for storing working media, and adjacent channels are communicated. The grooves in the array of first grooves 802b also constitute flow channels (first flow channels). The bottom wall 802c1 of the groove 802c is lower than the top (end) 802b1 of the first fin array 802 b. I.e., the bottom wall 802c1 of the groove 802c lies in a plane lower than the plane of the top (end) 802b1 of the first fin array 802 b.

As a variation of the embodiment shown in fig. 1d, as shown in fig. 1 e; the first cover 901 has a protrusion 901c in the first cavity a, the protrusion 901c is provided with a recess 901c1, and the protrusion 901c can also improve the structural strength of the heat dissipation assembly. First fin arrays 902b (also called as first groove 902b arrays) in the second cavity of the second cover plate 902, grooves 902c are formed between two adjacent first fin arrays 902b and between the first fin arrays 902b and the side walls, a bottom wall 902c1 of the groove 902c is provided with a microstructure, and the groove forms a second flow channel 902c2 at the microstructure. After the side wall 901b of the first cover plate 901 and the second cover plate 902 are fixed by welding with solder 903, after the fixing, the solder 903 is arranged between the end of the side wall 901b of the first cover plate 901 and the end of the side wall of the second cover plate 902, and the protrusion 901c and the concave part 901c1 and the end/top of the first fin array 902b form a fine cavity (the design of the cavity enables the heat dissipation assembly to work (liquefied working medium quickly flows back to the flow channel during heat dissipation), so that the heat dissipation efficiency can be improved.

As a variation on the embodiment of fig. 1e, as shown in fig. 1 f; the first cover plate 1001 has a protrusion 1001c in the first cavity a, and the protrusion 1001c can improve the structural strength of the heat dissipation assembly. First fin arrays 1002b (also referred to as first groove arrays 1002 b) in the second cavity of second cover plate 1002 have grooves 1002c between two adjacent first fin arrays 1002b and between first fin arrays 1002b and the side wall, and a bottom wall 1002c1 of groove 1002c is provided with a microstructure 1002c 2. The side wall 1001b of the first cover plate 1001 and the second cover plate 1002 are fixed by welding with solder 1003, and after the fixing, the solder 100 is arranged between the end of the side wall 1001b of the first cover plate 1001 and the end of the side wall of the second cover plate 1002, so that the heat dissipation efficiency can be improved. By arranging the microstructure on the bottom wall 1002c1 of the groove 1002c, the microstructure forms the second flow channel 1002c2 to improve the capillary force of the working medium in the groove 1002c, namely, the working medium flows in the groove 1002c, so that the heat dissipation efficiency is improved.

The heat dissipating assembly of the embodiments of the application will be described in detail with reference to fig. 2 to 11.

Fig. 2 is a schematic structural diagram of a first cover plate according to a first embodiment; a side wall 101b is disposed at one side of the first cover plate 101, an injection port 101a is disposed at the side wall 101b, a liquid working medium for cooling is injected into the heat dissipation assembly through the injection port 101a, a predetermined amount of the working medium is injected, and then the injection port 101a is vacuumized and sealed. The first cover plate 101 is hermetically connected to a second cover plate 102 (not shown) through an end portion of the sidewall 101 b. The phase change working medium at least comprises one or the combination of water, deionized water, alcohol, methanol, acetone, glycol and the like. In the present embodiment, the projection 101c is continuously formed in a long shape. The end of the projection 101c is in the same plane as the end of the side wall 101b, or the plane of the projection 101c does not extend beyond the end of the side wall 101b (see fig. 1 b). The protrusion 101c may enhance the structural strength of the heat dissipation assembly.

In one embodiment, the protrusions are disposed in discontinuous segments as shown in fig. 3, the first cover plate 201 has a first cavity therein, a sidewall 201b is disposed on one side of the first cover plate, an injection port 201a is disposed on the sidewall 201b on one side of the first cover plate, a plurality of protrusions 201c disposed in segments are disposed on the bottom of the first cavity, a groove 201d is disposed between adjacent protrusions, and the length of each segment or each protrusion is the same or different. The width of the projections (L1-L2 direction) is 10 μm-3 mm, and the width of the interval between adjacent projections is 100 μm-10 mm. In one embodiment, the protrusion has a square cross-section, at least one side of which comprises a pointed shape; or round in cross-section or circular in cross-section (semi-circular), in which case the protrusions are arranged in a random or array, the diameters may be the same or different, and the width of the protrusions is the diameter or the largest diameter.

In one embodiment, the protrusions are arranged in an array as shown in fig. 4, the first cover plate 301 has a first cavity therein, a sidewall 301b is arranged on one side of the first cover plate, an injection port 301a is arranged on the sidewall 301b on one side of the first cover plate, and a plurality of protrusions 301c are arranged on the bottom of the first cavity. The protrusion 301c has a diamond shape. In other embodiments, the protrusions 301c may be cylindrical, spherical, hemispherical, etc., and may be arranged in an array or randomly.

Next, the structure of the second cover plate according to an embodiment of the present application will be described with reference to fig. 5 to 9, wherein the second cover plate 102 includes a side wall 102a for connecting with a side wall (not shown) of the first cover plate, and a second cavity is formed therein, and a bottom of the second cavity is configured with a protruding fin.

Please refer to fig. 6 and 7, which are schematic cross-sectional views a-a in fig. 5 according to an embodiment; the bottom of the second cavity is provided with a first fin array 102b and a second fin array 102c which protrude,

the first fin array 102b includes a plurality of first fins 102b1, the top portions 102b2 of which are adapted to be connected to the ends of a protrusion (not shown). Preferably, at least part of the surface of the first fin is provided with a micro structure 102d (micro-nano structure), two adjacent first fins form a flow channel for storing the working medium (or the first fin and the adjacent side wall thereof form a flow channel for storing the working medium), and the two adjacent flow channels are communicated with each other. The surface of the fin is provided with a microstructure to improve the capillary force, so that the liquid working medium is stored in the flow channel. Preferably, the tops 102b2 of the first fins 102b1 are in the same plane. In one embodiment, the first fin 102b1 has its top 102b2 in the same plane as the end of the side wall 102 a.

The second fin array 102c comprises a plurality of second fins 102c1, the surface of each second fin is at least partially provided with a micro-structure 102d (micro-nano structure), two adjacent second fins form a flow channel for storing working media (or the second fins and the adjacent side walls thereof form a flow channel for storing the working media), and the two adjacent flow channels are communicated with each other. The surface of the fin is provided with a microstructure to improve the capillary force, so that the liquid working medium is stored in the flow channel

In this embodiment, the height h1 of the first fin 102b1 is higher than the height h2 of the second fin 102c1, so that when the second cover plate is combined with the first cover plate, the top 102b2 of the first fin 102b1 contacts with the end of the protrusion of the first cover plate, so that two adjacent protrusions and the first fin array matched with the adjacent protrusions on the inner side of the side wall of the first/second cover plate form an air channel for steam to flow. The ratio of the height h2 of the second fins to the height h1 of the first fins is greater than or equal to 0.1. Preferably, the ratio of the height h2 of the second fin to the height h1 of the first fin is 0.1-0.95. The width w1 of the first fin array is equivalent to the width w2 of the second fin array between two first fin arrays or w1< w 2. The width w3 of the second fin array between the first fin array and the adjacent sidewall.

The first fin array and the second fin array are alternately arranged, after the first cover plate and the second cover plate are combined, the first cover plate and the second cover plate are contacted with the top of the first fin by utilizing the bulge to form a supporting part, and an air channel for steam flow is formed between every two adjacent supporting parts or between the supporting part and the inner side of the side wall of the first cover plate and the inner side of the adjacent first cover plate. And two adjacent second fins contained in the second fin array form a flow channel for storing the working medium. Preferably, the flow channel for storing the working medium is also formed between two adjacent first fins included in the first fin array. The adjacent channels are communicated with each other, so that the whole surface is used for cooling. The microstructure is arranged on at least part of the surface of the second fin or the microstructures are arranged on at least part of the surfaces of the first fin and the second fin, so that the capillary force of the flow channel is improved, and the heat dissipation efficiency of the heat dissipation assembly is further improved.

As a modification of the embodiment of fig. 6, a schematic cross-sectional view of a second cover plate according to another embodiment is shown in fig. 8 and 9. The second cover plate comprises a side wall 202a for connecting with the side wall (not shown) of the first cover plate, and a second cavity is formed in the second cover plate, a fin array is arranged at the bottom of the second cavity, the fin array comprises a plurality of protruding fins 202b, and at least part of the surface of the fins 202b is provided with a microstructure comprising a plurality of protrusions 202 c. In other embodiments, the microstructure comprises a plurality of recesses. In one embodiment, the microstructure is a porous material layer or a secondary microstructure of a porous material. The fins 202b have substantially the same height, and the recesses between the fins 202b have the same depth. Or the height of the fins 202b is substantially uniform, and the depth of the recess between the two fins 202b is different. The end 202b1 of part of the fins 202b contacts with the protrusion (not shown) of the first cover plate, so that after the first/second cover plates are combined, the protrusion of the first cover plate forms a supporting member, two adjacent fins 202b form a flow channel for storing working medium, and at least part of the surface of the fin 202b is provided with a microstructure, thereby improving capillary force, improving the capacity of containing liquid working medium, and further improving the heat dissipation efficiency of the heat dissipation assembly. The protrusions thus in contact with the end 202b1 of the fin 202b may be continuous, or may be discrete protrusions arranged in an array or randomly. The steam cavity is separated by the bulges after the first cover plate and the second cover plate are combined, and the liquid working medium is stored in the flow channel.

Fig. 10 shows a schematic view of a second cover plate according to an embodiment as a modification of the embodiment of fig. 5. The second cover plate 302 includes a side wall 3021 and a cavity 3024, wherein a plurality of connected flow channels are disposed in the cavity 3024, and the flow channels include an interrupted flow channel 3022 and a rapid flow channel 3023 (the rapid flow channel can rapidly guide the working medium to or from the heat dissipation area to achieve rapid heat dissipation as compared with the interrupted flow channel). In the present embodiment, the surge channel 3023 extends from one side of the side wall 3021 of the second cover plate 302. Preferably, the fast flow channel 3023 extends from one side of the side wall 3021 of the second cover plate 302 to the first heat dissipation area or close to the first heat dissipation area, and a working medium is stored in the fast flow channel, and two adjacent flow channels are communicated with each other. Through the design of the rapid flow channel 3023, the working medium in the flow channel is rapidly guided to the position of the heat dissipation area with large heat productivity, so that the heat dissipation efficiency of the heat dissipation assembly is improved. The length L4 of the rush flow passage 3023 is longer than the length L3 of the flow passage 3022. Preferably, the ratio of L4 to L3 is 1.5-50. The surfaces of the flow channel 3022 and the rush flow channel 3023 are respectively provided with microstructures (not shown, please refer to fig. 7 or fig. 9). Further improving the heat dissipation efficiency of the heat dissipation assembly.

As a variation of the embodiment of fig. 10, a schematic view of a second cover plate of another embodiment is shown in fig. 11. The components (e.g., chip/chip assembly, processor, etc.) corresponding to the y-position of the heat dissipation assembly have large heat dissipation capacity, such that the second cover plate 502 comprises a sidewall 5021 and a cavity, and a flow channel is configured in the cavity, and the flow channel comprises an intermittent flow channel, a first rapid flow channel 5023, a second rapid flow channel 5025, a third flow channel 5024, and a fourth rapid flow channel 5026. In this embodiment, the first fast flow path 5023, the second fast flow path 5025, and the fourth fast flow path 5026 are disposed to extend from one side of the sidewall 5021 of the second cover plate 502 to the first heat dissipation region. Preferably, the first heat dissipation area extends to or close to the first heat dissipation area (y position) corresponding to the electronic component with large heat generation. The third runner 5024 has a certain radian configuration, and the working medium in the runner is quickly drained to the y position through the third runner 5024. In addition, the length of the flow channel of the first heat dissipation area is correspondingly extended through the design of the third flow channel 5024, and the cooling/heat dissipation effect of the first heat dissipation area is improved (i.e., the local heat dissipation efficiency of the heat dissipation assembly is improved). In one embodiment, microstructures (not shown, please refer to fig. 7 or fig. 9) are respectively disposed on the surfaces of the first fast flow channel 5023, the second fast flow channel 5025, the third flow channel 5024, and the fourth fast flow channel 5026. This further improves the heat dissipation efficiency of the heat dissipation assembly.

In one embodiment, the protruding portion of the first cover plate at least comprises a pointed shape, and the protruding cross section is a round-bag shape and a semicircular shape, so that a space is formed between the bottom of the first cavity and the fin after the first cover plate contacts with the top of the fin, and the space is used as a steam cavity for transferring heat.

In the design of the heat dissipation assembly, the heat dissipation assembly is simple in structure and provided with a first cover plate and a second cover plate in matched connection, a protruding fin array is arranged at the bottom in a second cavity of the second cover plate, the fin array comprises a plurality of fins, a microstructure is arranged on the surface of at least part of the fins, and two adjacent fins form a flow channel for storing working media (sometimes, a depression between the fins and the adjacent side walls of the fins form a flow channel for storing the working media). The adjacent flow passages are communicated. The first cover plate and the second cover plate are combined and then supported by the protrusions to form a steam cavity, heat generated by electronic elements and other heat sources received by the second cover plate side is transferred to the steam cavity by means of phase change of working media in the flow channel, heat transfer is achieved in the steam cavity, efficient heat transfer is achieved, the microstructures are configured on at least part of the surfaces of the fins, capillary force is improved, and heat dissipation efficiency of the heat dissipation assembly is further improved.

In the design of the heat dissipation assembly, the heat dissipation assembly comprises: the first cover plate is provided with a first cavity, a plurality of bulges are arranged in the first cavity, a steam cavity is formed between the bulges, the second cover plate is provided with a second cavity, a plurality of flow channels are arranged in the second cavity, the adjacent flow channels are communicated, cooling/radiating working media are stored in the flow channels, a radiating area is defined on the liquid cooling radiating assembly, and the flow channels further comprise at least one rapid flow channel which continuously extends to and/or is close to the radiating area. The heat dissipation area is matched with electronic components (such as chips/processors and the like) with large heat productivity, so that the local heat dissipation efficiency of the heat dissipation assembly is improved.

In the design of the fins, at least part of the surface of the fins is provided with microstructures, which comprise a convex and/or concave design, or which comprise a porous material. The design improves the capillary force of the working medium in the heat sink and improves the heat dissipation effect.

In the design of the fin array, the fin array comprises a plurality of fins which are partially and continuously arranged, so that the flow channel is optimized to quickly guide the working medium in the flow channel to a position with large heat productivity, the local heat dissipation capacity of the heat dissipation assembly is improved, and the overall heat dissipation effect of the heat dissipation assembly is improved.

In the design of the first cover plate, a first cavity is arranged in the first cover plate, and a plurality of bulges are arranged at the bottom of the cavity. Preferably, the top (also called end) of the protrusion is coplanar with the end of the sidewall. Or the projection does not project out of the plane of the end of the side wall. The projections are in the form of continuous elongated squares or discontinuous elongated squares, and the length of each segment or each may be the same or different. The interval between the adjacent projections is 100 μm to 10 mm. Preferably, the cross section of the protrusion is square or at least one side of the protrusion comprises a pointed shape or a round bag shape or the cross section is round (semicircular). Preferably, the protrusions are in a random or array configuration when they are discrete. The structural strength of the heat dissipation assembly can be increased through the bulges.

In the design of the second cover plate, a second cavity is arranged in the second cover plate, a protruding fin array is arranged at the bottom of the second cavity, the fin array comprises a plurality of fins protruding out of the bottom of the second cavity, the heights of the fins are the same or different, and at least part of the surfaces of the fins are provided with microstructures; or the heights of the fins are the same, and the depths of the depressions between the two fins are the same or different.

The heat dissipation assembly in the above embodiments may be used to dissipate heat generated by an electronic component (e.g., a processor) of an electronic device. Preferably, the thickness of the heat dissipation assembly is smaller than 3 millimeters, and the heat dissipation problem in a narrow space can be well solved. In the above embodiments, a plurality of the embodiments may be understood.

The above embodiments are merely illustrative of the technical concepts and features of the present application, and the purpose of the embodiments is to enable those skilled in the art to understand the content of the present application and implement the present application, and not to limit the protection scope of the present application. All equivalent changes and modifications made according to the spirit of the present application are intended to be covered by the scope of the present application.

Claims

1. A liquid-cooled heat dissipation assembly, comprising:

a groove is formed between the adjacent fin arrays, a plurality of microstructures are arranged on the bottom wall of the groove, a second flow channel is formed at the microstructure position by the groove,

the first flow passage and the second flow passage are communicated.

2. The liquid cooled heat sink assembly of claim 1, wherein: the microstructures are arranged in a convex and/or concave manner.

3. The liquid cooled heat sink assembly of claim 1, wherein: a porous material layer is arranged on the bottom wall and comprises a plurality of microstructures.

4. The liquid cooled heat sink assembly of claim 1, wherein: the microstructures are randomly arranged and distributed on the bottom wall.

5. The liquid cooled heat sink assembly of claim 1, wherein: the air passage and the groove are arranged correspondingly, and the air passage extends into the groove.

6. The liquid cooled heat sink assembly of claim 1, wherein: the groove is arranged between the fin array and the side wall of the second cover plate, a plurality of microstructures are arranged on the bottom wall of the groove, and the protrusion and the side wall of the first cover plate are arranged at intervals to form the air passage.

7. The liquid cooled heat sink assembly of claim 1, wherein: at least part of the surface or the whole surface of the fin is provided with a microstructure.

8. The liquid cooled heat sink assembly of claim 1, wherein: the bulges are in the shape of a continuous strip,

or the bulges are in a discrete cylinder shape, a sphere shape, a semi-sphere shape or a diamond shape and are arranged in an array or a random arrangement.

9. The liquid cooled heat sink assembly of claim 1, wherein: after the first cover plate is connected with the second cover plate in a matched mode, a gap is reserved between the end portion of the protrusion and the top of the fin array.

10. An electronic device carrying a liquid-cooled heat dissipating module as claimed in any one of claims 1 to 9.