CN212436017U - Printed circuit board convenient to patch element wiring - Google Patents
Printed circuit board convenient to patch element wiring Download PDFInfo
- Publication number
- CN212436017U CN212436017U CN202021268716.7U CN202021268716U CN212436017U CN 212436017 U CN212436017 U CN 212436017U CN 202021268716 U CN202021268716 U CN 202021268716U CN 212436017 U CN212436017 U CN 212436017U
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- CN
- China
- Prior art keywords
- circuit board
- main body
- board main
- patch element
- pad
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a printed circuit board convenient for patch element wiring, which comprises a circuit board main body, wherein the lower surface of the circuit board main body is provided with a mounting seat, the mounting seat comprises a connecting seat welded with the circuit board main body, springs arranged at two sides of the lower surface of the connecting seat and a mounting plate fixed at the lower end of the spring, a threading hole is arranged at the position corresponding to the center of the mounting plate on the circuit board main body, the upper surface of the circuit board main body is provided with a bonding pad, the bonding pad comprises a welding part welded with the circuit board main body, an extension part arranged above the welding part and a bonding pad main body arranged above the extension part, the mounting seat of the utility model is provided with the springs, the springs have certain length, the situation that the heat is not easy to be dissipated when the patch element is directly mounted on the circuit board main body can be avoided, to accommodate different length pins or wires of the patch element.
Description
Technical Field
The utility model relates to a printed circuit board technical field specifically is a printed circuit board convenient to patch element wiring.
Background
Printed circuit boards are providers of electrical connections of electronic components and are widely used in electronic devices and equipment. When the patch element on the traditional printed circuit board is connected with an external lead, the external lead is respectively connected with the pin of the patch element and welded on the same side surface of the printed circuit board, which can cause the problems of short circuit of circuit elements and the like under certain conditions;
the patent with application number 201621486202.2 proposes a printed circuit board convenient for patch element wiring, which increases the distance between the patch element and the circuit board by adding an element placing board to dissipate heat, but the element placing board with fixed height is not convenient for adapting to different patch elements because the lengths of leads or pins of the patch elements are not fixed.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a printed circuit board convenient to patch element wiring to solve among the prior art because patch element's wire or the length of pin is indefinite, so the problem that the different patch elements of adaptation are not convenient for to the board is placed to the component of fixed height.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a printed circuit board convenient to patch element wiring, includes the circuit board main part, the lower surface of circuit board main part is provided with the mount pad, the mount pad include with circuit board main part welded connecting seat, set up the spring in connecting seat lower surface both sides and fix the mounting panel at the spring lower extreme, the through wires hole has been seted up with the mounting panel center department of corresponding in the circuit board main part, the upper surface of circuit board main part is provided with the pad, the pad includes with circuit board main part welded weld part, set up the extension portion in the weld part top and set up the pad main part in extension portion top.
Preferably, an outer sleeve is arranged outside the lengthened part, and heat-conducting silica gel is filled between the outer sleeve and the lengthened part.
Preferably, the pad body, the elongated portion and the welding portion are integrally formed, and a first central hole is formed in the center of the pad body, the elongated portion and the welding portion.
Preferably, the middle part of the connecting seat is provided with a second middle hole, and the middle part of the mounting plate is provided with a third middle hole.
Preferably, the middle part of the spring is sleeved with a guide rod, the lower end of the guide rod is welded with the mounting plate, and a guide hole matched with the guide rod is formed in the position, corresponding to the guide rod, on the connecting seat.
Preferably, a first copper foil conductor layer is mounted on one side of the circuit board main body, and a second copper foil conductor layer is mounted on the other side of the circuit board main body.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the spring is arranged on the mounting seat of the utility model, the spring has a certain length, the situation that the heat is not easy to be dissipated because the patch element is directly mounted on the main body of the circuit board can be avoided, and the distance between the patch element and the main body of the circuit board can be adjusted by the spring to adapt to pins or wires with different lengths of the patch element;
2. the utility model discloses a pad includes pad main part, extension portion and weld part, and extension portion is used for increasing the distance between pad main part and the circuit board main part to avoid the condition that the heat that the distance between pad main part and the circuit board main part leads to is difficult to the effluvium for the short-term.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural view of the present invention;
fig. 2 is a partial view of fig. 1.
In the figure: 1. a first copper foil conductor layer; 2. a circuit board main body; 3. a second copper foil conductor layer; 4. a pad; 41. a pad body; 42. a lengthening part; 43. welding the part; 44. a first mesopore; 5. a mounting seat; 51. a connecting seat; 52. mounting a plate; 53. a second mesopore; 54. a spring; 55. a third mesopore; 56. a guide hole; 57. a guide bar; 6. threading holes; 7. heat conducting silica gel; 8. an outer sleeve.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to the drawings, in an embodiment of the present invention, a printed circuit board convenient for wiring of a chip component includes a circuit board main body 2, a first copper foil conductor layer 1 is installed on one side of the circuit board main body 2, and a second copper foil conductor layer 3 is installed on the other side of the circuit board main body 2;
as shown in fig. 2, a mounting seat 5 is disposed on the lower surface of the circuit board main body 2, the mounting seat 5 includes a connecting seat 51 welded to the circuit board main body 2, springs 54 disposed on both sides of the lower surface of the connecting seat 51, and a mounting plate 52 fixed to the lower end of the springs 54, a second central hole 53 is disposed in the middle of the connecting seat 51, a third central hole 55 is disposed in the middle of the mounting plate 52, a patch element is disposed on the lower surface of the mounting plate 52, a pin or a lead of the patch element passes through the second central hole 53 and the third central hole 55, the spring 54 can adjust the distance between the patch element and the circuit board main body 2 to adapt to pins or leads of different lengths of the patch element, the spring 54 has a certain length, and the situation that heat is not easily dissipated due to;
as shown in fig. 2, a guide rod 57 is sleeved in the middle of the spring 54, the lower end of the guide rod 57 is welded to the mounting plate 52, a guide hole 56 matched with the guide rod 57 is formed in the connecting seat 51 at a position corresponding to the guide rod 57, the guide rod 57 can guide the spring 54 to prevent the spring 54 from deflecting, and the guide hole 56 can provide a path for the movement of the guide rod 57;
continuing to refer to fig. 2, a threading hole 6 is formed in a position, corresponding to the center of the mounting plate 52, of the circuit board main body 2, a pad 4 is arranged on the upper surface of the circuit board main body 2, the pad 4 includes a welding portion 43 welded to the circuit board main body 2, an elongated portion 42 arranged above the welding portion 43, and a pad main body 41 arranged above the elongated portion 42, the pad main body 41, the elongated portion 42 and the welding portion 43 are integrally formed, a first central hole 44 is formed in the center of the pad main body 41, the elongated portion 42 and the center of the 43, the welding portion 43 is used for positioning the pad 4 on the circuit board main body 2, and the elongated portion 42 is used for increasing the distance between the pad main body 41 and the circuit board main body 2, so as to avoid a situation that heat is not easily dissipated due to an excessively short distance between the;
with reference to fig. 2, an outer sleeve 8 is disposed outside the elongated portion 42, and a heat conductive silicone 7 is filled between the outer sleeve 8 and the elongated portion 42, where the heat conductive silicone 7 can conduct heat away from the bonding pad 4.
The utility model discloses a theory of operation and use flow: when the device is used, a patch element to be mounted is arranged on the lower surface of the mounting plate 52, the spring 54 can adjust the distance between the patch element and the circuit board main body 2 to adapt to pins or leads with different lengths of the patch element, the spring 54 has a certain length and can avoid the situation that heat is not easy to dissipate because the patch element is directly mounted on the circuit board main body 2, the guide rod 57 can guide the spring 54 to avoid the spring 54 from skewing, the guide hole 56 can provide a path for the movement of the guide rod 57, and the pins or leads of the patch element pass through the second central hole 53 and the third central hole 55, then pass through the threading hole 6 and the first central hole 44 and then are welded on the upper surface of the pad main body 41;
the soldering portion 43 is used for positioning the pad 4 on the circuit board main body 2, and the extension portion 42 is used for increasing the distance between the pad main body 41 and the circuit board main body 2, so as to avoid the situation that heat is not easy to dissipate due to the fact that the distance between the pad main body 41 and the circuit board main body 2 is too short, and the heat conducting silica gel 7 can further conduct the heat on the pad 4 out.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A printed wiring board for facilitating wiring of a chip component, comprising a board main body (2), characterized in that: the lower surface of circuit board main part (2) is provided with mount pad (5), mount pad (5) include with circuit board main part (2) welded connecting seat (51), set up spring (54) in connecting seat (51) lower surface both sides and fix mounting panel (52) at spring (54) lower extreme, through wires hole (6) have been seted up with mounting panel (52) center department of correspondence on circuit board main part (2), the upper surface of circuit board main part (2) is provided with pad (4), pad (4) include with circuit board main part (2) welded welding part (43), set up lengthening portion (42) and set up pad main part (41) in lengthening portion (42) top of welding part (43).
2. A printed wiring board for facilitating the wiring of a patch element as claimed in claim 1, wherein: an outer sleeve (8) is arranged outside the lengthened part (42), and heat-conducting silica gel (7) is filled between the outer sleeve (8) and the lengthened part (42).
3. A printed wiring board for facilitating the wiring of a patch element as claimed in claim 1, wherein: the welding pad is characterized in that the welding pad main body (41), the lengthened part (42) and the welding part (43) are integrally formed, and a first middle hole (44) is formed in the centers of the welding pad main body (41), the lengthened part (42) and the welding part (43).
4. A printed wiring board for facilitating the wiring of a patch element as claimed in claim 1, wherein: the middle part of the connecting seat (51) is provided with a second middle hole (53), and the middle part of the mounting plate (52) is provided with a third middle hole (55).
5. A printed wiring board for facilitating the wiring of a patch element as claimed in claim 1, wherein: the middle part of the spring (54) is sleeved with a guide rod (57), the lower end of the guide rod (57) is welded with the mounting plate (52), and a guide hole (56) matched with the guide rod (57) is formed in the position, corresponding to the guide rod (57), on the connecting seat (51).
6. A printed wiring board for facilitating the wiring of a patch element as claimed in claim 1, wherein: a first copper foil conducting wire layer (1) is installed on one side of the circuit board main body (2), and a second copper foil conducting wire layer (3) is installed on the other side of the circuit board main body (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021268716.7U CN212436017U (en) | 2020-07-02 | 2020-07-02 | Printed circuit board convenient to patch element wiring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021268716.7U CN212436017U (en) | 2020-07-02 | 2020-07-02 | Printed circuit board convenient to patch element wiring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212436017U true CN212436017U (en) | 2021-01-29 |
Family
ID=74278318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021268716.7U Expired - Fee Related CN212436017U (en) | 2020-07-02 | 2020-07-02 | Printed circuit board convenient to patch element wiring |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212436017U (en) |
-
2020
- 2020-07-02 CN CN202021268716.7U patent/CN212436017U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210129 Termination date: 20210702 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |