CN212417898U

CN212417898U - Cooling device is used in adhesive production

Info

Publication number: CN212417898U
Application number: CN202021005074.1U
Authority: CN
Inventors: 高鹏辉; 柳文君
Original assignee: Jiangxi Wandao New Material Co ltd
Current assignee: Jiangxi Wandao New Material Co ltd
Priority date: 2020-06-04
Filing date: 2020-06-04
Publication date: 2021-01-29
Anticipated expiration: 2030-06-04

Abstract

The utility model discloses a cooling device is used in adhesive production, locate the cooling jacket of jar external portion including the cover, the water cavity has been seted up to the inside of cooling jacket, one side switch-on respectively of water cavity is equipped with drain pipe and inlet tube, one side fixed mounting of cooling jacket has the water tank, the induction pipe of water tank passes through the hose and switches on with the drain pipe mutually, one side fixed mounting of water tank has the water pump, the output tube of water tank passes through the hose and switches on with the extraction mouth of water pump mutually, the delivery port of water pump passes through the hose and switches on with the inlet tube mutually, one side fixed mounting of water tank has the semiconductor refrigeration piece. The utility model discloses set up the backup pad on the jar body and establish the cooling jacket on the jar body for the cover and provide the holding power, be equipped with the water cavity in the cooling jacket, send water for the water cavity circulation through at cooling jacket side-mounting water tank and water pump, and utilize the semiconductor refrigeration piece to provide the cooling water and use to accelerate the discharge of jar internal semi-manufactured goods, improve work efficiency.

Description

Cooling device is used in adhesive production

Technical Field

The utility model relates to an adhesive production and processing technology field specifically is a cooling device is used in adhesive production.

Background

The adhesive can be used for connecting same or more than two same or different workpieces together, and after being cured, the organic or inorganic, natural or synthetic substances with enough strength are collectively called as adhesives or adhesives, and conventionally called as glue for short, and the adhesives are used for connecting objects by surface adhesion through adhesion and cohesion.

The adhesive need heat when stirring in reation kettle with man-hour, need take out after it cools off the cooling after accomplishing when the stirring, but current cooling device mostly sets up the condenser backward flow in reation kettle and cools off the cooling, under this kind of mode, is difficult to take out the maintenance when the condenser damages, probably still can cause the pollution to the semi-manufactured goods of processing in the reation kettle. Therefore, it is desirable to provide a cooling device for adhesive production to solve the above-mentioned technical problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a cooling device is used in adhesive production sets up the backup pad on the jar body, uses the backup pad to establish for the cover and establish the cooling jacket provides the holding power on the jar body, is equipped with the water cavity in the cooling jacket, and send water for the water cavity circulation through at cooling jacket side-mounting water tank and water pump, and utilize the semiconductor refrigeration piece to provide the cooling water use, make the internal semi-manufactured goods rapid cooling of jar, in order to accelerate the internal semi-manufactured goods of jar to discharge, improve work efficiency, in order to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a cooling device is used in adhesive production, locates the cooling jacket of jar external portion including the cover, the water cavity has been seted up to the inside of cooling jacket, one side switch-on respectively of water cavity is equipped with drain pipe and inlet tube, one side fixed mounting of cooling jacket has the water tank, the induction pipe of water tank passes through the hose and switches on with the drain pipe mutually, one side fixed mounting of water tank has the water pump, the output tube of water tank passes through the hose and switches on with the extraction mouth of water pump mutually, the delivery port of water pump passes through the hose and switches on with the inlet tube mutually, one side fixed mounting of water tank has the semiconductor refrigeration piece.

Preferably, the bottom of the tank body is fixedly connected with supporting legs, the bottoms of the supporting legs are connected with damping rubber pads in an adhesive mode, and spherical raised anti-skid rubber blocks are arranged on the bottom surfaces of the damping rubber pads.

Preferably, the bottom cover of the jar body is established the welding and is had the backup pad, just the backup pad is the cyclic annular setting of rectangle, just the opening has been seted up to the inside of backup pad, the jar body is located in the opening.

Preferably, the cooling jacket is matched with the tank body and is set to be a rectangular annular aluminum alloy sleeve, a sleeve opening is formed in the cooling jacket, the tank body is arranged in the sleeve opening, and one end of the cooling jacket is attached to the surface of the supporting plate.

Preferably, a water replenishing pipe and a sewage draining pipe are communicated on the box body of the water tank, and a transparent glass observation window is installed on one side of the water tank.

Preferably, one side of the semiconductor refrigeration piece is fixedly connected with a heat dissipation fin plate, and the heat dissipation fin plate is a copper heat dissipation plate.

Compared with the prior art, the beneficial effects of the utility model are that: set up the backup pad on jar body, use the backup pad to establish for the cover and establish the cooling jacket on jar body and provide the holding power, be equipped with the water cavity in the cooling jacket, send water for the water cavity circulation through at cooling jacket side-mounting water tank and water pump, and utilize the semiconductor refrigeration piece to provide the cooling water use, make the internal semi-manufactured goods rapid cooling of jar, discharge with the internal semi-manufactured goods of acceleration jar, and the work efficiency is improved, whole cooling device cover is established and is installed at jar external portion, the risk of pollution has been avoided causing to the internal semi-manufactured goods of jar, and easy dismounting, the flexibility when using has been improved greatly.

Drawings

Fig. 1 is a schematic view of the structure of the present invention;

FIG. 2 is a schematic view of the internal structure of the cooling jacket of the present invention;

fig. 3 is a schematic top view of the supporting plate of the present invention.

In the figure: 1. a tank body; 2. supporting legs; 3. a shock-absorbing rubber pad; 4. an anti-slip rubber block; 5. a support plate; 501. a port; 6. a cooling jacket; 601. looping; 602. a water chamber; 7. a drain pipe; 8. a water inlet pipe; 9. a water tank; 10. a transparent glass viewing window; 11. an introducing pipe; 12. an output pipe; 13. a water pump; 14. a semiconductor refrigeration sheet; 15. a heat dissipation fin.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a cooling device for adhesive production comprises a cooling jacket 6 sleeved outside a tank body 1, a water cavity 602 is arranged inside the cooling jacket 6, a drain pipe 7 and a water inlet pipe 8 are respectively communicated with one side of the water cavity 602, a water tank 9 is fixedly arranged on one side of the cooling jacket 6, a lead-in pipe 11 of the water tank 9 is communicated with the drain pipe 7 through a hose, a water pump 13 is fixedly arranged on one side of the water tank 9, an output pipe 12 of the water tank 9 is communicated with a drawing port of the water pump 13 through a hose, a conveying port of the water pump 13 is communicated with the water inlet pipe 8 through a hose, a semiconductor refrigerating sheet 14 is fixedly arranged on one side of the water tank 9, the water in the water tank 9 is cooled and refrigerated by utilizing the semiconductor refrigerating sheet 14, the cooling jacket 6 is circularly supplemented with cooling water by the water pump 13, so as to cool the tank body 1, and the semi-finished product in the tank body 1 is rapidly cooled and cooled, the working efficiency is improved.

In actual implementation:

in order to stably place and use the tank body 1, the bottom of the tank body 1 is fixedly connected with supporting legs 2, the bottom of each supporting leg 2 is connected with a shock-absorbing rubber pad 3 in an adhesive mode, and the bottom surface of each shock-absorbing rubber pad 3 is provided with a spherical raised anti-skidding rubber block 4.

In order to stably place the cooling jacket 6, the bottom of the tank body 1 is welded with a support plate 5 in a sleeved mode, the support plate 5 is arranged in a rectangular ring mode, the through hole 501 is formed in the support plate 5, and the tank body 1 is arranged in the through hole 501.

In order to facilitate the sheathing of the cooling jacket 6 to be used and to carry out efficient heat exchange with the tank body 1, the cooling jacket 6 is matched with the tank body 1 to be a rectangular annular aluminum alloy jacket, a sleeve opening 601 is formed in the cooling jacket 6, the tank body 1 is arranged in the sleeve opening 601, and one end of the cooling jacket 6 is attached to the surface of the supporting plate 5.

In order to use the water tank 9 conveniently, a water replenishing pipe and a sewage draining pipe are communicated on the tank body of the water tank 9, and a transparent glass observation window 10 is installed on one side of the water tank 9.

In order to improve the refrigeration effect of the semiconductor refrigeration piece 14, a heat dissipation fin 15 is fixedly connected to one side of the semiconductor refrigeration piece 14, and the heat dissipation fin 15 is a copper heat dissipation plate.

The specific use description is as follows: when in actual use, aim at jar body 1 with the cuff 601 of cooling jacket 6 and overlap and establish the installation, the inner wall of cuff 601 sets up with the outer wall laminating of jar body 1, utilize backup pad 5 on the jar body 1 to make cooling jacket 6 steadily place, when carrying out cooling process, switch on semiconductor refrigeration piece 14's power earlier makes semiconductor refrigeration piece 14 carry out the cooling process to the water in the water tank 9, use water pump 13 to carry out the circulation of cooling water in the water cavity 602 of cooling jacket 6 to supply after that, thereby cool down the cooling to jar body 1, make the interior semi-manufactured goods of jar body 1 cool down the cooling fast, discharge with accelerating jar internal semi-manufactured goods, and the work efficiency is improved.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a cooling device is used in adhesive production, locates jar body (1) outside cooling jacket (6) including the cover, its characterized in that: water cavity (602) have been seted up to the inside of cooling jacket (6), one side of water cavity (602) is put through respectively and is equipped with drain pipe (7) and inlet tube (8), one side fixed mounting of cooling jacket (6) has water tank (9), leading-in pipe (11) of water tank (9) are put through with drain pipe (7) through the hose mutually, one side fixed mounting of water tank (9) has water pump (13), output tube (12) of water tank (9) are put through the extraction mouth of hose with water pump (13) mutually, the delivery port of water pump (13) is put through with inlet tube (8) through the hose mutually, one side fixed mounting of water tank (9) has semiconductor refrigeration piece (14).

2. The cooling device for adhesive production according to claim 1, wherein: the anti-skid tank is characterized in that the bottom of the tank body (1) is fixedly connected with supporting legs (2), the bottom of each supporting leg (2) is connected with a shock-absorbing rubber pad (3) in an adhesive mode, and spherical convex anti-skid rubber blocks (4) are arranged on the bottom surface of each shock-absorbing rubber pad (3).

3. The cooling device for adhesive production according to claim 1, wherein: the welding has backup pad (5) in the bottom cover of the jar body (1), just backup pad (5) are the cyclic annular setting of rectangle, just opening (501) have been seted up to the inside of backup pad (5), the jar body (1) is located in opening (501).

4. The cooling device for adhesive production according to claim 3, wherein: the cooling jacket (6) cooperation jar body (1) sets up to the cyclic annular aluminum alloy cover of rectangle, just the inside of cooling jacket (6) is equipped with linking (601), the jar body (1) is located in linking (601), just the one end of cooling jacket (6) sets up with the face laminating of backup pad (5).

5. The cooling device for adhesive production according to claim 1, wherein: a water replenishing pipe and a sewage draining pipe are communicated on the box body of the water tank (9), and a transparent glass observation window (10) is installed on one side of the water tank (9).

6. The cooling device for adhesive production according to claim 1, wherein: one side of the semiconductor refrigeration piece (14) is fixedly connected with a heat dissipation fin plate (15), and the heat dissipation fin plate (15) is a copper heat dissipation plate.