CN212412027U - Silicon chip taking mechanism - Google Patents
Silicon chip taking mechanism Download PDFInfo
- Publication number
- CN212412027U CN212412027U CN202021291084.6U CN202021291084U CN212412027U CN 212412027 U CN212412027 U CN 212412027U CN 202021291084 U CN202021291084 U CN 202021291084U CN 212412027 U CN212412027 U CN 212412027U
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- suction piece
- piece part
- silicon wafer
- suction
- taking mechanism
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Abstract
The utility model provides a silicon chip gets piece mechanism. The silicon wafer taking mechanism comprises a first suction piece part, a second suction piece part and a third suction piece part, wherein the first suction piece part can suck a silicon wafer along a first direction; a first linear drive connected to the first suction piece portion, the first linear drive being capable of moving the first suction piece portion in a first direction; a second suction piece portion capable of sucking the silicon wafer in the first direction; the first suction piece part and the second suction piece part are arranged oppositely along a first direction; separating the plurality of silicon wafers adsorbed to each other by adopting a mode that the first adsorption piece part and the second adsorption piece part are adsorbed and separated from two sides of the silicon wafers; the silicon wafer taking mechanism is guaranteed to take only one silicon wafer, and therefore the influence of taking multiple silicon wafers simultaneously on subsequent processes is prevented.
Description
Technical Field
The utility model relates to a silicon chip gets piece mechanism.
Background
For stacked silicon wafers, a plurality of (generally two) silicon wafers are easily adsorbed together to take the wafers; creating obstacles for subsequent processes performed on the silicon wafer; therefore, the taken silicon wafers are required to be ensured to be single.
SUMMERY OF THE UTILITY MODEL
For the silicon chip that guarantees to take out be the sola, the utility model provides a silicon chip gets piece mechanism.
The technical scheme of the utility model is that: the silicon wafer taking mechanism comprises a first suction piece part, a second suction piece part and a third suction piece part, wherein the first suction piece part can suck a silicon wafer along a first direction; a first linear drive connected to the first suction piece portion, the first linear drive being capable of moving the first suction piece portion in a first direction; a second suction piece portion capable of sucking the silicon wafer in the first direction; the first suction piece portion and the second suction piece portion are arranged in a first direction in an opposite manner.
Further, the first direction is a vertical direction.
Further, the first suction piece part/the second suction piece part is connected with a second linear driving part, and the second linear driving part can drive the first suction piece part/the second suction piece part to move along a second direction; the second direction is at an angle theta to the first direction of 0 DEG < theta <180 deg.
Further, θ =90 °.
Further, the suction force of the first suction piece part and/or the second suction piece part is smaller than the silicon wafer fragment limiting force Fa, and the first suction piece part is larger than the second suction piece part.
Further, the first suction piece part/the second suction piece part is connected with a rotation driving part.
Further, the rotation driving part may be rotatable in a first direction.
The beneficial effects of the utility model reside in that: separating the plurality of silicon wafers adsorbed to each other by adopting a mode that the first adsorption piece part and the second adsorption piece part are adsorbed and separated from two sides of the silicon wafers; the silicon wafer taking mechanism is guaranteed to take only one silicon wafer, and therefore the influence of taking multiple silicon wafers simultaneously on subsequent processes is prevented.
Drawings
FIG. 1 is a schematic view of a silicon wafer picking mechanism according to an embodiment of the present invention;
fig. 2 is a schematic view of a second embodiment of the silicon wafer taking mechanism of the present invention.
Detailed Description
In order to facilitate the understanding of the technical solutions of the present invention for those skilled in the art, the technical solutions of the present invention will be described in further detail with reference to specific embodiments.
As shown in fig. 1 and 2, the wafer picking mechanism 100 comprises a first suction piece part 20, wherein the first suction piece part 20 can suck a silicon wafer w along a first direction a; a first linear driving part 30 connected to the first suction piece part 20, the first linear driving part 30 being capable of moving the first suction piece part 20 in a first direction a; a second suction piece part 40 capable of sucking the silicon wafer in the first direction a; the first suction piece portion 20 and the second suction piece portion 40 are arranged in a first direction a; that is, the first suction piece portion 20 and the second suction piece portion 40 can be sucked to both sides of the silicon wafer w; when the silicon wafer w is a plurality of silicon wafers, the first suction piece part 20 and the second suction piece part 40 respectively suck one silicon wafer w, and the first suction piece part 20 is driven by the first linear driving part 30 to move relative to the second suction piece part 40, thereby separating the silicon wafers w sucked to each other.
Adopt above-mentioned technical scheme: separating the plurality of silicon wafers w adsorbed to each other by adsorbing and separating the first suction piece part 20 and the second suction piece part 40 from both sides of the silicon wafers w; the silicon wafer taking mechanism 100 is ensured to take only one silicon wafer w, so that the influence of taking a plurality of silicon wafers w simultaneously on the subsequent process is prevented.
As shown in fig. 1 and 2, the first direction a is a vertical direction; thereby ensuring that the silicon wafer w is absorbed along the vertical direction, and facilitating the installation and debugging of the first absorbing piece part 20 and the second absorbing piece part 40.
As shown in fig. 1, a second linear driving part 50 is connected to the first suction piece part 20/the second suction piece part 40 (only the second linear driving part 50 is shown to be connected to the first suction piece part 20 in the drawing), and the second linear driving part 50 can drive the first suction piece part 20/the second suction piece part 40 to move along the second direction b; the second direction b and the first direction a form an included angle theta, and the included angle theta is 0 degrees and less than 180 degrees; the first linear driving unit 30 and the second linear driving unit 50 facilitate the removal of the silicon wafer w separated by the cooperation of the first suction portion 20 and the second suction portion 40.
As shown in fig. 1, θ =90 °, that is, the first direction a and the second direction b are perpendicular to each other, so that the first suction piece portion 20 is moved in two directions perpendicular to each other with respect to the second suction piece portion 40, thereby carrying away the separated silicon wafer w; the path is short and the first suction piece portion 20 can be sufficiently separated from the second suction piece portion 40.
As shown in fig. 1, the suction force of the first suction piece part 20 and/or the second suction piece part 40 is smaller than the silicon wafer fragment limiting force Fa, and the suction force of the first suction piece part is larger than that of the second suction piece part; on the contrary, if the adsorption force of the first suction piece portion 20 and the second suction piece portion 40 is greater than the wafer fragment limiting force Fa, when the silicon wafer w is not adsorbed by a plurality of wafers, the silicon wafer w may be damaged by the combined action of the first suction piece portion 20 and the second suction piece portion 40.
Adopt above-mentioned technical scheme: when the silicon wafer w is only one wafer, the suction force of the first suction piece part is greater than that of the second suction piece part, so that the silicon wafer w stays in the first suction piece part 20; and the suction force of the second suction piece part 40 is smaller than the silicon chip fragment limiting force Fa, so that the silicon chip w cannot be damaged.
As shown in fig. 2, the first suction piece portion 20/the second suction piece portion 40 is connected with a rotation driving portion 60; the rotation driving part 60 is used for driving the first suction piece part 20/the second suction piece part 40 to rotate (only the first suction piece part 20 is shown to be connected with the rotation driving part 60); thereby, the first suction piece portion 20 is away from the second suction piece portion 40 to facilitate the first suction piece portion 20 to place the sucked silicon wafer w.
Adopt above-mentioned technical scheme: the silicon wafer w sucked to each other is separated by the first linear driving unit 30, and the silicon wafer w sucked to the first suction piece unit 20 and the second suction piece unit 40 is transferred to a position where the silicon wafer w is placed by the rotary driving unit 60.
As shown in fig. 2, the rotation driving part 60 is rotatable in a first direction a; simple structure and convenient operation.
The above is the preferred embodiment of the present invention, and is not used to limit the protection scope of the present invention. It should be recognized that non-inventive variations and modifications to the disclosed embodiments, as understood by those skilled in the art, are intended to be included within the scope of the present invention as claimed and claimed.
Claims (7)
1. The utility model provides a silicon chip gets piece mechanism which characterized in that: the silicon wafer taking mechanism comprises a first suction piece part, a second suction piece part and a third suction piece part, wherein the first suction piece part can suck a silicon wafer along a first direction; a first linear drive connected to the first suction piece portion, the first linear drive being capable of moving the first suction piece portion in a first direction; a second suction piece portion capable of sucking the silicon wafer in the first direction; the first suction piece portion and the second suction piece portion are arranged in a first direction in an opposite manner.
2. The silicon wafer taking mechanism according to claim 1, wherein: the first direction is a vertical direction.
3. The silicon wafer taking mechanism according to claim 1, wherein: the first suction piece part/the second suction piece part is connected with a second linear driving part which can drive the first suction piece part/the second suction piece part to move along a second direction; the second direction is at an angle theta to the first direction of 0 DEG < theta <180 deg.
4. The silicon wafer taking mechanism according to claim 3, wherein: θ =90 °.
5. The silicon wafer taking mechanism according to claim 1, wherein: the suction force of the first suction piece part and/or the second suction piece part is smaller than the silicon wafer fragment limiting force Fa, and the first suction piece part is larger than the second suction piece part.
6. The silicon wafer taking mechanism according to claim 1, wherein: the first suction piece part/the second suction piece part are connected with a rotation driving part.
7. The silicon wafer taking mechanism according to claim 6, wherein: the rotation driving part is rotatable in a first direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021291084.6U CN212412027U (en) | 2020-07-06 | 2020-07-06 | Silicon chip taking mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021291084.6U CN212412027U (en) | 2020-07-06 | 2020-07-06 | Silicon chip taking mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212412027U true CN212412027U (en) | 2021-01-26 |
Family
ID=74405609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021291084.6U Active CN212412027U (en) | 2020-07-06 | 2020-07-06 | Silicon chip taking mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212412027U (en) |
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2020
- 2020-07-06 CN CN202021291084.6U patent/CN212412027U/en active Active
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