CN212393050U

CN212393050U - Board-mounted wire clamp and circuit board device with same

Info

Publication number: CN212393050U
Application number: CN202020514762.4U
Authority: CN
Inventors: 李小林; 黄高锐; 凡小政; 黄艳
Original assignee: Lijun Technology Heyuan Co ltd
Current assignee: Lijun Technology Heyuan Co ltd
Priority date: 2020-04-09
Filing date: 2020-04-09
Publication date: 2021-01-22
Anticipated expiration: 2030-04-09

Abstract

The utility model provides a wire clip on board and a circuit device with the wire clip on board, wherein the wire clip on board is made of conductive metal and is integrally formed by adopting a stamping and bending process; it includes: the circuit board comprises a substrate which can be correspondingly welded on the circuit board and a wire clamping part which extends from the substrate and can be correspondingly clamped with a wire. Is beneficial to the production and processing of the circuit device.

Description

Board-mounted wire clamp and circuit board device with same

Technical Field

The utility model relates to a circuit arrangement is with part, especially involves the regular part of using of bonding wire among the circuit arrangement.

Background

Referring to fig. 1, a conventional circuit apparatus 10a includes: a circuit board 1a, a plurality of components 2a mounted on the circuit board 1a, and a plurality of wirings 3a soldered to the components 2 a. There are problems with this construction: wiring is disordered, and short circuit is easily caused by wiring error; generally, after welding, the welding wires are fixed by a regular component such as a ribbon to realize the regular welding wires, so that the production and the processing are inconvenient.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model lies in, to the above-mentioned defect of prior art, provide a circuit arrangement of fastener on board and having this fastener on board, be favorable to circuit arrangement's production and processing.

The utility model provides a technical scheme that its technical problem adopted is: providing a wire clamp on a plate, wherein the wire clamp is made of conductive metal and is integrally formed by adopting a stamping and bending process; it includes: the circuit board comprises a substrate which can be correspondingly welded on the circuit board and a wire clamping part which extends from the substrate and can be correspondingly clamped with a wire.

In some embodiments, the wire clamping portion has an Ω -shaped cross section, including: the clamping device comprises a base plate and two elastic clamping arms, wherein the base plate extends from one side of the base plate, and the two elastic clamping arms extend from two sides of the base plate in a bending way; the two elastic clamping arms are matched with the bottom plate to enclose a clamping and accommodating cavity for accommodating the wiring and an opening communicated with the clamping and accommodating cavity.

In some embodiments, the resilient clamp arm comprises: a holding part which is bent upwards and inwards from one side of the bottom plate and a guiding part which is further bent upwards and outwards from the top end of the holding part; the clamping parts on the two elastic clamping arms are matched with the bottom plate to enclose the clamping accommodating cavity; the guides on the two resilient clamping arms enclose the opening.

In some embodiments, the base plate is flush with the substrate, and the base plate has an opening.

In some embodiments, the substrate is rectangular and can be attached to a corresponding pad on a circuit board by surface mount soldering.

The utility model provides a technical scheme that its technical problem adopted still: a circuit device is provided, comprising: the circuit board, install a plurality of components and parts on this circuit board, weld a plurality of wiring on these components and parts to and weld on this circuit board be used for regular these wiring, a plurality of as above on board fastener.

The beneficial effects of the utility model reside in that, constitute the fastener on the board ingeniously through integrated into one piece's base plate and double-layered line portion, make the fastener on the board fix on the circuit board with the help of the base plate, correspond a wiring of centre gripping with the help of double-layered line portion and come regular wiring, be favorable to circuit device's production and processing.

Drawings

The invention will be further explained with reference to the drawings and examples, wherein:

fig. 1 is a schematic configuration diagram of a conventional circuit device.

Fig. 2 is a schematic diagram of the circuit device of the present invention.

Fig. 3 is a structural schematic of the wire clamp on the board of the present invention.

Detailed Description

The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

Referring to fig. 2, fig. 2 is a schematic structure of the circuit device of the present invention. The utility model provides a circuit arrangement 10, it includes: the circuit board 1, install a plurality of components and parts 2 on circuit board 1, weld a plurality of wiring 3 on these components and parts 2 to and weld and be used for regulating a plurality of on-board fastener 5 of these wiring 3 on circuit board 1. Every on-board fastener 5 corresponds a rule wiring 3, with the help of these on-board fasteners 5, wiring 3 is clear clean and tidy, and whole lines are not in disorder, the production and processing of circuit arrangement 10 of being convenient for.

Referring to fig. 3, fig. 3 is a structural schematic diagram of the wire clip on board of the present invention. The utility model provides a clamp 5 on board, it is the conductive metal material, adopts the punching press technology integrated into one piece of buckling. The on-board wire clip 5 includes: a substrate 51 and a wire clamping portion 52 extending from the substrate 51. The substrate 51 can be correspondingly soldered on the circuit board 1 (see fig. 2), so that the on-board wire clip 5 is fixed on the circuit board 1; the wire clamping portion 52 can clamp the wires 3 correspondingly, so as to achieve the purpose of arranging the wires 3.

The substrate 51 has a rectangular shape and can be fixed to a corresponding pad (not shown) on the circuit board 1 (see fig. 2) in a surface mount manner.

The cross section of the line clamping part 52 is in an omega (omega) shape, and specifically comprises: a bottom plate 53 extending from one side of the base plate 51, and two elastic holding arms 54 extending from both sides of the bottom plate 53. The two elastic holding arms 54 cooperate with the bottom plate 53 to enclose a holding chamber 55 for holding the wiring 3 and an opening 56 communicating with the holding chamber 55. With this structure, the wires 3 can be pushed down from the relatively large opening 56 into the relatively small holding-receiving cavity 55 during the actual assembly process, thereby achieving the positioning and alignment of the wires 3 on the circuit board 1.

The elastic gripping arm 54 comprises in particular: a clasping portion 541 extending from one side of the bottom plate 53 and bending upwards and inwards, and a guiding portion 542 extending from the top end of the clasping portion 541 and further bending upwards and outwards. The holding portion 541 is an arc surface recessed outward, and the guiding portion 542 is a plane surface.

The clasping parts 541 on the two elastic clamping arms 54 are matched with the bottom plate 53 to enclose the clamping accommodating cavity 55; the guides 542 on the two resilient retaining arms 54 enclose the aforementioned opening 56.

It is worth mentioning that the bottom plate 53 is provided with an opening 531, and the opening 531 is a tin-catching hole, so that the tin-eating force of the wire clip 5 and the circuit board 1 on the board can be enhanced. It will be appreciated that the substrate 51 may be provided with solder-catching holes as required by the application.

In the present embodiment, the bottom plate 53 is flush with the substrate 51, and the bottom plate 53 can be fixed on the circuit board 1 along with the substrate 51 in a surface-mount manner as long as the pads on the circuit board 1 can correspond to both the bottom plate 53 and the substrate 51.

In other embodiments, the bottom plate 53 does not have to be fixed to the circuit board 1 along with the substrate 51 in a surface mount manner, such as: the pads on the circuit board 1 correspond only to the substrate 51. For another example: the bottom plate 53 is raised a set distance from the substrate 51 to ensure that solder does not extend onto the bottom plate 53 when the substrate 51 is soldered to the pads on the circuit board 1.

The beneficial effects of the utility model reside in that, constitute on-board fastener 5 ingeniously through integrated into one piece's base plate 51 and double-layered line portion 52, make on-board fastener 5 fix on circuit board 1 with the help of base plate 51, correspond a wiring 3 of centre gripping with the help of double-layered line portion 52 and come regular wiring 3, be favorable to circuit device 10's production and processing.

It should be understood that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same, and those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some technical features; and that such modifications and substitutions are intended to be included within the scope of the appended claims.

Claims

1. A wire clip on a board is characterized in that the wire clip on the board is made of conductive metal and is integrally formed by adopting a stamping and bending process; it includes: the circuit board comprises a substrate which can be correspondingly welded on the circuit board and a wire clamping part which extends from the substrate and can be correspondingly clamped with a wire.

2. The wire clamp on board of claim 1, wherein the wire clamping portion has an omega-shaped cross-section comprising: a bottom plate horizontally extending from one side of the substrate, and two elastic clamping arms bent and extending from two sides of the bottom plate; the two elastic clamping arms are matched with the bottom plate to enclose a clamping and accommodating cavity for accommodating the wiring and an opening communicated with the clamping and accommodating cavity.

3. A wire clamp on board as claimed in claim 2, wherein the resilient clamping arm comprises: a holding part which is bent upwards and inwards from one side of the bottom plate and a guiding part which is further bent upwards and outwards from the top end of the holding part; the clamping parts on the two elastic clamping arms are matched with the bottom plate to enclose the clamping accommodating cavity; the guides on the two resilient clamping arms enclose the opening.

4. A clip as claimed in claim 3, wherein the clasping portion is in the form of an outwardly concave arc and the guide portion is in the form of a flat surface.

5. The clip of claim 2, wherein the base is flush with the base, the base having an opening.

6. The on-board clip of claim 1, wherein the base is rectangular and is adapted to be attached to a corresponding pad on a circuit board by surface mount soldering.

7. A circuit arrangement, comprising: a circuit board, a plurality of components mounted on the circuit board, a plurality of wires soldered to the components, and a plurality of the on-board clips of any one of claims 1 to 6 soldered to the circuit board for organizing the wires.