CN212367813U - Heat radiator for electronic equipment - Google Patents
Heat radiator for electronic equipment Download PDFInfo
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- CN212367813U CN212367813U CN202021295093.2U CN202021295093U CN212367813U CN 212367813 U CN212367813 U CN 212367813U CN 202021295093 U CN202021295093 U CN 202021295093U CN 212367813 U CN212367813 U CN 212367813U
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Abstract
The utility model relates to an electronic equipment heat dissipation technical field, concretely relates to electronic equipment's heat abstractor, include: the liquid circulation component is internally provided with liquid; the refrigeration assembly comprises a compressor, a refrigerant heat dissipation assembly, a throttling element and an evaporator, wherein the compressor, the refrigerant heat dissipation assembly, the throttling element and the evaporator are enclosed to form a closed loop pipeline; the refrigerant heat dissipation assembly comprises a plurality of refrigerant radiators arranged in series and a heat dissipation structure for dissipating heat of the refrigerant radiators, and the refrigerant radiators and the heat dissipation structure are arranged in parallel. The utility model provides a less electronic equipment's of noise heat abstractor.
Description
Technical Field
The utility model relates to an electronic equipment heat dissipation technical field, concretely relates to electronic equipment's heat abstractor.
Background
With the rapid development of society, high-power electronic devices such as high-power CPUs, display cards, LED lamps, lasers and the like have become an indispensable part of people's lives. In the operation process of the electronic device, high heat is generated, which affects the working performance of the electronic device and reduces the service life of the electronic device, so that the electronic device needs to be cooled or cooled.
In the prior art, a water cooling circulation system is generally adopted to be connected with a cold head, and the cold head is directly attached to electronic equipment, so that the electronic equipment is cooled. The water cooling circulation system comprises a refrigerant radiator and a radiating structure for radiating the refrigerant radiator, but the radiating structure can generate great noise in the using process, so that the using experience of a user is influenced.
SUMMERY OF THE UTILITY MODEL
Therefore, the to-be-solved technical problem of the utility model lies in the great defect of noise to heat abstractor when cooling for electronic equipment among the prior art to a less electronic equipment's of noise heat abstractor is provided.
In order to solve the technical problem, the utility model provides an electronic equipment's heat abstractor, include:
the liquid circulation component is internally provided with liquid;
the refrigeration assembly comprises a compressor, a refrigerant heat dissipation assembly, a throttling element and an evaporator, wherein the compressor, the refrigerant heat dissipation assembly, the throttling element and the evaporator are enclosed to form a closed loop pipeline;
the refrigerant heat dissipation assembly comprises a plurality of refrigerant radiators arranged in series and a heat dissipation structure for dissipating heat of the refrigerant radiators, and the refrigerant radiators and the heat dissipation structure are arranged in parallel.
Further, the heat dissipation structure comprises a plurality of fans arranged in series.
Furthermore, a refrigerant circulating pipeline is arranged between the refrigerant heat dissipation assembly and the throttling element, the refrigerant circulating pipeline comprises at least two branch pipelines which are arranged in parallel, and the throttling element is arranged on the branch pipelines.
Furthermore, the branch pipeline is provided with an electromagnetic valve for adjusting the refrigerating capacity.
Further, the liquid circulation assembly comprises a liquid tank, a pressure regulating assembly and a contact end, wherein the liquid tank, the pressure regulating assembly and the contact end are arranged in a closed loop mode, and the evaporator is connected in the liquid circulation assembly in series and is respectively connected with the liquid tank and the contact end.
Further, a liquid level sensor for monitoring the position of the liquid is arranged in the liquid tank.
Further, a liquid temperature sensor for monitoring the position of the liquid is arranged in the liquid tank.
Further, the device also comprises an environment temperature and humidity sensor used for monitoring the environment temperature and the environment humidity.
Further, still include the controller, the controller with liquid circulation subassembly and refrigeration subassembly electricity are connected.
The utility model discloses technical scheme has following advantage:
1. the utility model provides an electronic equipment's heat abstractor, include: the liquid circulation component is internally provided with liquid; the refrigeration assembly comprises a compressor, a refrigerant heat dissipation assembly, a throttling element and an evaporator, wherein the compressor, the refrigerant heat dissipation assembly, the throttling element and the evaporator are enclosed to form a closed loop pipeline; the refrigerant heat dissipation assembly comprises a plurality of refrigerant radiators arranged in series and a heat dissipation structure for dissipating heat of the refrigerant radiators, and the refrigerant radiators and the heat dissipation structure are arranged in parallel.
The refrigerant radiators are arranged in series, so that the heat dissipation area of the refrigerant radiators is increased in a limited space, the refrigerant flows in the refrigerant radiators and sequentially passes through the refrigerant radiators arranged in series, and the air volume generated by the heat dissipation structure can directly act on the refrigerant radiators, so that the refrigeration effect is improved. The refrigerant heat dissipation assembly is connected in series, the air quantity required by the refrigerant heat dissipation device is reduced in a limited space, and due to the reduction of the heat dissipation air quantity, the rotating speed of the heat dissipation structure can be reduced under the requirement of the same air quantity, so that the noise generated by the rotation of the heat dissipation structure is reduced.
2. The utility model provides a heat abstractor of electronic equipment, heat radiation structure includes the fan of a plurality of series connection settings. Since a lower fan speed generates lower noise and a sufficient wind pressure can be obtained when the fan speed is reduced as much as possible, a plurality of fans are arranged in series in a limited space.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic diagram of a heat dissipation device of an electronic device according to the present invention;
fig. 2 is a schematic structural diagram of a heat dissipation device of an electronic apparatus;
FIG. 3 is a partial schematic view of FIG. 2;
fig. 4 is a schematic view of the connection of the liquid tank to the evaporator.
Description of reference numerals:
1-a contact end; 2-an evaporator; 3-a heat dissipation structure; 4-a refrigerant radiator; 5-a liquid inlet; 6-a liquid outlet; 7-a voltage regulation component; 8-a compressor; 9-an electromagnetic valve; 91-a first solenoid valve; 92-a second solenoid valve; 10-a throttling element; 101-a first throttle valve; 102-a second throttle valve; 11-a housing; 12-a controller; 13-a liquid tank; 14-a liquid temperature sensor; 15-a liquid level sensor; 16-a handle; 17-an electronic device; 18-ambient temperature and humidity sensor.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
As shown in fig. 1 to 4, an embodiment of the present invention provides a heat dissipation apparatus for an electronic device, including a liquid circulation component and a refrigeration component, wherein liquid is disposed inside the liquid circulation component; the refrigerating assembly comprises a compressor 8, a refrigerant heat dissipation assembly, a throttling element 10 and an evaporator 2 which are enclosed to form a closed loop pipeline, and the liquid circulation assembly is connected with the refrigerating assembly in series and used for refrigerating liquid in the liquid circulation assembly; the refrigerant heat dissipation assembly comprises a plurality of refrigerant radiators 4 arranged in series and a heat dissipation structure 3 for dissipating heat of the refrigerant radiators 4, and the refrigerant radiators 4 and the heat dissipation structure 3 are arranged in parallel.
The liquid circulation assembly is connected with the refrigeration assembly, liquid refrigeration in the liquid circulation assembly is carried out through the refrigeration assembly, and the contact end 1 of the refrigeration assembly is in contact with the electronic equipment 17, so that the electronic equipment 17 is cooled.
The compressor 8 and the refrigerant radiator 4, the throttling element 10 and the evaporator 2 are connected by copper pipe brazing. The refrigeration assembly is internally provided with a refrigerant, the refrigerant sequentially flows through a closed loop formed by the compressor 8, the refrigerant heat dissipation assembly, the throttling element 10 and the evaporator 2, and the refrigerant continuously circulates in the refrigeration assembly. After the refrigeration component and the liquid circulation component are connected in series, the refrigerant absorbs liquid heat in the evaporator 2, is vaporized into low-temperature and low-pressure steam, is sucked by the compressor 8, is compressed into high-pressure and high-temperature steam, and is discharged into the refrigerant radiator 4 to release heat, meanwhile, the heat dissipation structure 3 is utilized to dissipate heat, the heat is taken away by the heat dissipation structure 3, the refrigerant is condensed into high-pressure liquid, is converted into low-pressure and low-temperature refrigerant after passing through the throttling element 10, and enters the evaporator 2 again to absorb heat and vaporize, and the refrigeration cycle. And an environment temperature and humidity sensor 18 is arranged in the refrigeration assembly, so that the environment temperature and the environment humidity in the refrigeration assembly can be monitored better. The compressor 8 is a fixed frequency compressor or a variable frequency compressor.
As shown in fig. 1, the heat dissipation structure 3 is disposed on the right side of the refrigerant radiator 4, and by disposing the plurality of refrigerant radiators 4 in series, the refrigerant having the increased heat dissipation area of the refrigerant radiator 4 flows in the refrigerant radiator 4 in a limited space, and sequentially passes through the plurality of refrigerant radiators 4 disposed in series, and the air volume generated by the heat dissipation structure 3 can directly act on the refrigerant radiator 4, thereby improving the refrigeration effect. Describing by taking the example that three refrigerant radiators 4 are connected in series, the wind generated by the heat dissipation structure 3 sequentially passes through the third refrigerant radiator 4, then passes through the second refrigerant radiator 4, and then passes through the first refrigerant radiator 4; and the refrigerant flows through the first refrigerant radiator 4, then through the second refrigerant radiator 4, and finally through the third refrigerant radiator 4. Because the heat exchange principle is according to the heat exchange principle: q is K × a × dT, wherein K is the amount of heat dissipation air; a is the cross-sectional area; dT is the heat exchange temperature difference; under the condition that other conditions are not changed, in order to obtain a larger heat exchange temperature difference dT, the refrigerant heat dissipation assembly is connected in series, the air quantity required by the refrigerant heat radiator 4 is reduced, and due to the reduction of the heat dissipation air quantity, the rotating speed of the heat dissipation structure 3 can be reduced under the requirement of the same air quantity, so that the noise generated by the rotation of the heat dissipation structure 3 is reduced.
In the embodiment, the heat dissipation structure 3 is a fan, and since a lower fan speed will generate lower noise, and meanwhile, in order to obtain sufficient wind pressure when the fan speed is reduced as much as possible, a plurality of fans are arranged in series in a limited space. Similarly, three fans are connected in series for description, and the wind pressure generated by the three fans can be three times of that generated by one fan at the rotating speed, so that the purpose of reducing noise is achieved, and a high heat dissipation effect is achieved.
The refrigerant radiators 4 and the fans may be arranged in a cross or other arrangement, as long as the refrigerant passing through each refrigerant radiator 4 in series and the air passing through each refrigerant radiator in series can be formed.
As shown in fig. 2 and 3, when the thermal load of the electronic device 17 is low, in order to reduce the frequent start-stop noise caused by the excessive start-stop frequency of the compressor 8, especially the fixed-frequency compressor; a refrigerant circulating pipeline is arranged between the refrigerant heat dissipation assembly and the throttling element 10, the refrigerant circulating pipeline comprises at least two branch pipelines which are arranged in parallel, namely a first branch pipeline and a second branch pipeline, the branch pipelines are provided with electromagnetic valves 9 and throttling elements 10, the throttling element 10 comprises a first throttling valve 101 and a second throttling valve 102, and the first branch pipeline is provided with a first throttling valve 101 and a first electromagnetic valve 91; the second branch pipeline is provided with a second throttle valve 102 and a second electromagnetic valve 92 so as to control the refrigerating capacity of the refrigerant heat dissipation assembly; the solenoid valve 9 also has a manual opening/closing function, and controls the opening/closing of the refrigerant flow path. In practical application, several branch lines may be provided with the electromagnetic valves 9, and the rest branch lines are not provided with the electromagnetic valves 9. The specific setting is set according to actual needs.
When the variable frequency compressor is adopted, the rotating speed of the variable frequency compressor can be directly adjusted, and low-rotating-speed starting is realized, so that the starting noise of the heat dissipation device of the electronic equipment 17 is reduced; meanwhile, when the heat load of the electronic equipment 17 is low, the inverter compressor operates at a low rotation speed, so that the starting noise of the heat sink of the electronic equipment 17 is reduced.
The liquid circulation assembly comprises a liquid tank 13, a pressure regulating assembly 7 and a contact end 1 which are arranged in a closed loop, a pipeline is connected between the liquid tank 13 and the pressure regulating assembly 7 as well as between the liquid tank 13 and the contact end 1, a liquid inlet 5 and a liquid outlet 6 are arranged on the pipeline, and the contact end 1 can be directly inserted into the liquid inlet 5 and the liquid outlet 6; the contact end 1 is a cold head. The evaporator 2 is connected in series in the liquid circulation assembly and is respectively connected with the liquid tank 13 and the contact end 1; the pressure regulating assembly 7 regulates the pressure, flow rate and the like of liquid circulation in the liquid circulation assembly, so that liquid passes through the contact end 1 uniformly and stably, the contact end 1 is directly attached to the electronic equipment 17, and the electronic equipment 17 is cooled stably. The pressure regulating assembly 7 in this embodiment is a liquid pump; the evaporator 2 is a plate evaporator or other heat exchanger, and may be placed inside the liquid tank 13 or outside the liquid tank 13.
As shown in fig. 4, a level sensor 15 for monitoring the position of the liquid is provided inside the liquid tank 13, thereby facilitating the monitoring of the position of the liquid in the liquid tank 13 and the addition of the liquid when necessary. A liquid temperature sensor 14 for monitoring the temperature of the liquid may also be provided inside the liquid tank 13.
A controller 12 is also included, the controller 12 being electrically connected to the liquid circulation assembly and the refrigeration assembly. The controller 12 is arranged in the shell 11, the normal work of the refrigeration assembly and the liquid circulation assembly is controlled through the controller 12, and the screen is arranged on the shell 11, so that data values monitored by various sensors arranged in the shell 11 can be conveniently observed. A power supply device is provided in the housing 11, and the power supply device includes a power adapter or a power conversion module, a battery, an electrical connector, and the like. The power adapter or the power conversion module is disposed in the housing 11, or may be disposed outside the housing 11, and the storage battery may be disposed in the housing 11, or may be disposed outside the housing 11. Meanwhile, the handle 16 is arranged on the shell 11, so that the portability of the heat dissipation device is improved.
The specific working process comprises the steps of firstly filling liquid into the liquid tank 13, then inserting the contact end 1 into the liquid outlet 6 and the liquid inlet 5, when the electronic equipment 17 needs to be cooled, turning on a switch of a compressor 8 in a refrigerating assembly, enabling the compressor 8 to start working, refrigerating the liquid in the liquid tank 13, adjusting the pressure or flow of the liquid entering the contact end 1 through a pressure adjusting assembly 7, cooling the electronic equipment 17, and enabling the liquid in the contact end 1 to flow back into the liquid tank 13 through a pipeline after the electronic equipment 17 is used, so that the electronic equipment 17 is cooled.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.
Claims (9)
1. A heat dissipation device for an electronic device, comprising:
the liquid circulation component is internally provided with liquid;
the refrigeration assembly comprises a compressor (8) and a refrigerant heat dissipation assembly which are enclosed into a closed loop pipeline, a throttling element (10) and an evaporator (2), and the liquid circulation assembly is connected with the refrigeration assembly in series and is used for refrigerating liquid in the liquid circulation assembly;
the refrigerant heat dissipation assembly comprises a plurality of refrigerant radiators (4) which are arranged in series and a heat dissipation structure (3) for dissipating heat of the refrigerant radiators (4), wherein the refrigerant radiators (4) and the heat dissipation structure (3) are arranged in parallel.
2. The heat sink of an electronic device according to claim 1, wherein the heat dissipation structure (3) comprises a plurality of fans arranged in series.
3. The heat dissipating device for electronic equipment according to claim 2, wherein a refrigerant circulation line is provided between the refrigerant heat dissipating assembly and the throttling element (10), the refrigerant circulation line including at least two branch lines provided in parallel, the throttling element (10) being provided on the branch lines.
4. The heat sink of the electronic device as claimed in claim 3, wherein the branch line is provided with a solenoid valve (9) for adjusting cooling capacity.
5. The heat dissipation device of electronic equipment according to any one of claims 1-4, wherein the liquid circulation assembly comprises a liquid tank (13), a pressure regulating assembly (7) and a contact end (1) which are arranged in a closed loop, and the evaporator (2) is connected in series in the liquid circulation assembly and is respectively connected with the liquid tank (13) and the contact end (1).
6. The heat sink of an electronic device according to claim 5, wherein a liquid level sensor (15) for monitoring a liquid level is provided inside the liquid tank (13).
7. The heat sink of an electronic device according to claim 5, wherein a liquid temperature sensor (14) for monitoring a temperature of the liquid is provided inside the liquid tank (13).
8. The heat sink of the electronic device as claimed in claim 5, further comprising an ambient temperature and humidity sensor (18) for monitoring ambient temperature and ambient humidity.
9. The heat sink of any of claims 6-8, further comprising a controller (12), the controller (12) being electrically connected to the liquid circulation assembly and the refrigeration assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021295093.2U CN212367813U (en) | 2020-07-03 | 2020-07-03 | Heat radiator for electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021295093.2U CN212367813U (en) | 2020-07-03 | 2020-07-03 | Heat radiator for electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212367813U true CN212367813U (en) | 2021-01-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021295093.2U Active CN212367813U (en) | 2020-07-03 | 2020-07-03 | Heat radiator for electronic equipment |
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| Country | Link |
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| CN (1) | CN212367813U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115279153A (en) * | 2022-08-29 | 2022-11-01 | 中国工程物理研究院流体物理研究所 | Heat dissipation device suitable for high-heat-flux-density large-depression-angle aircraft electronic cabinet |
-
2020
- 2020-07-03 CN CN202021295093.2U patent/CN212367813U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115279153A (en) * | 2022-08-29 | 2022-11-01 | 中国工程物理研究院流体物理研究所 | Heat dissipation device suitable for high-heat-flux-density large-depression-angle aircraft electronic cabinet |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230812 Address after: Room 2101-10, Building 2, No. 700 Qingshan Road, Licang District, Qingdao City, Shandong Province, 266000 Patentee after: Qingdao Hairui Baichuan Drive Technology Co.,Ltd. Address before: Room 1304, 13 / F, 1418-40 Moganshan Road, Hangzhou, Zhejiang 310000 Patentee before: Hangzhou ramda Technology Co.,Ltd. |
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| TR01 | Transfer of patent right |