CN212365758U - Low inductance high voltage pulse capacitor - Google Patents
Low inductance high voltage pulse capacitor Download PDFInfo
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- CN212365758U CN212365758U CN202020727213.5U CN202020727213U CN212365758U CN 212365758 U CN212365758 U CN 212365758U CN 202020727213 U CN202020727213 U CN 202020727213U CN 212365758 U CN212365758 U CN 212365758U
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Abstract
The utility model discloses a low inductance high voltage pulse capacitor, which is applied in the capacitor field, solves the technical problems that the capacitor adopts a single element structure, the capacitance is smaller, and the pressure resistance can not meet the requirement; the capacitor has the technical effects of improving the capacitance of the capacitor and increasing the voltage endurance capability of the capacitor.
Description
Technical Field
The utility model belongs to the technical field of the technique of condenser and specifically relates to a low inductance high voltage pulse capacitor is related to.
Background
A capacitor is a component capable of storing electric charges and is one of the most commonly used electronic components. With the development of high-voltage pulse discharge technology, the current intensity required for discharge is higher and higher, and the discharge speed is higher and higher, which puts forward more and more rigorous low inductance requirements on the used high-voltage pulse capacitor.
The prior Chinese patent with publication number CN201210445Y discloses a low-inductance high-voltage pulse capacitor, which is characterized in that a polar plate series structure is arranged in an element, a copper connecting sheet at the high-voltage end of the element is connected with a copper guide rod arranged on an organic plastic insulating cover and is fixed by adopting an inner screw, and the copper guide rod is pressed by a copper nut; the copper connecting sheet at the low-voltage end of the element is fixed with the bottom of the metal shell, and the middle of the organic plastic insulating cover and the metal flange is pressed tightly by a rubber belt through a metal pressing ring by a bolt. The polar plate series structure is formed by connecting a plurality of aluminum foil electrodes in series to form a polar plate, and the starting ends and the terminals of the aluminum foil electrodes are protruded at two ends of the element.
The above prior art solutions have the following drawbacks: the capacitor adopts a single-element structure, so that the capacitance is small, and the voltage resistance can not meet the requirement.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a low inductance high voltage pulse capacitor, its advantage improves the electric capacity of condenser, has increased the pressure-resistant ability of condenser.
The above technical purpose of the present invention can be achieved by the following technical solutions: a low-inductance high-voltage pulse capacitor comprises unit elements, wherein the unit elements are arranged to be odd numbers, the odd numbers of unit elements are mutually connected in series to form capacitor cores, at least two capacitor cores are mutually connected in parallel to form a capacitor device, one side of the capacitor device is connected with a positive lead, and the other side of the capacitor device is connected with a negative lead.
According to the technical scheme, odd single elements are connected in series to form the capacitor cores, at least two capacitor cores are connected in parallel to form a capacitor device, and the capacitor device is connected with the positive lead and the negative lead. The capacitance of the whole capacitor device is increased, and the voltage resistance is enhanced.
The utility model discloses further set up to: the positive end of the unit element is provided with a positive connecting plate with an L-shaped cross section, the positive connecting plate comprises an a plate and a b plate, the inner end surface of the a plate is attached to the positive end surface of the unit element, and the inner end surface of the b plate is attached to the upper surface of one side of the positive end surface of the unit element;
the negative end of the unit element is provided with a negative connecting plate with an L-shaped cross section, the negative connecting plate comprises a plate c and a plate d, the inner end face of the plate c is attached to the negative end face of the unit element, and the inner end face of the plate d is attached to the lower surface of one side of the negative end face of the unit element;
the unit pieces are stacked up and down, the anode and the cathode of the unit pieces are arranged in a reverse direction, and the outer surface of the plate d of the unit pieces is attached to the outer surface of the plate b of the unit pieces adjacent up and down.
According to the technical scheme, when the unit elements are stacked up and down, the outer surface of the plate b of the positive electrode connecting plate of the unit element is attached to the outer surface of the plate d of the negative electrode connecting plate of the adjacent unit element up and down, so that odd unit elements are connected in series to form a capacitor core. Odd number unit pieces are connected in series in a crimping mode through the positive connecting plate and the negative connecting plate, the lead is short, and the inductance is low.
The utility model discloses further set up to: and a heat insulation support plate is arranged between the adjacent unit pieces.
Through the technical scheme, the heat insulation support plate enables the unit pieces to be placed in parallel, the stability among the unit pieces is improved, meanwhile, the heat insulation among the unit pieces is carried out, and the service life of the unit pieces is prolonged.
The utility model discloses further set up to: the capacitor comprises a plurality of capacitor cores, and is characterized in that the capacitor cores are arranged in parallel, a b plate is arranged on the upper end faces of the capacitor cores, and a d plate is arranged on the lower end faces of the capacitor cores.
Through the technical scheme, one end of each capacitor core is connected with the positive connecting plate, the other end of each capacitor core is connected with the negative connecting plate, the positive electrodes of the at least two capacitor cores are located at the upper ends of the capacitor cores, the negative electrodes of the at least two capacitor cores are located at the lower ends of the capacitor cores, the capacitor cores are convenient to connect, and the length of a lead is reduced.
The utility model discloses further set up to: the capacitor comprises a plurality of capacitor cores and is characterized in that a positive parallel connection plate and a plurality of negative parallel connection plates are placed at the upper ends of the capacitor cores, the negative parallel connection plate is placed at the lower ends of the capacitor cores, a positive lead is connected to the outer side face of the positive parallel connection plate, and a negative lead is connected to the outer side face of the negative parallel connection plate.
Through the technical scheme, the positive parallel connection plate is simultaneously contacted with the outer surfaces of the plates b of the plurality of capacitor cores, and the negative parallel connection plate is simultaneously contacted with the plates d of the plurality of capacitor cores. The outer side surface of the positive electrode parallel plate is connected with a positive electrode lead, and the outer side surface of the negative electrode parallel plate is connected with a negative electrode lead, so that a plurality of capacitor cores are connected in parallel between the positive electrode lead and the negative electrode lead. A plurality of capacitor cores are connected in parallel through the positive connecting plate and the negative connecting plate to form the capacitor device, so that the whole structure of the capacitor device is compact.
The utility model discloses further set up to: the capacitor device is characterized in that a plastic capacitor shell is sleeved on the outer side of the capacitor device, and a positive electrode interface and a negative electrode interface are respectively arranged at the upper end and the lower end of the plastic capacitor shell.
Through the technical scheme, the plastic capacitor shell protects the capacitor device, has the functions of preventing collision and moisture, and the anode lead of the capacitor device is led out from the anode interface. And a negative lead of the capacitor device is led out from the negative interface, so that the capacitor device is conveniently connected into a circuit.
The utility model discloses further set up to: and a fixed block is arranged between the side end faces of the adjacent capacitor cores.
Through above-mentioned technical scheme, the fixed block makes a plurality of electric capacity core place more stably in plastic capacitor shell, avoids appearing rocking, makes a plurality of electric capacity core collide each other and cause the damage.
The utility model discloses further set up to: the plastic capacitor shell is provided with a heat dissipation convex edge, and the side end of the heat dissipation convex edge is provided with a plurality of heat dissipation holes.
Through above-mentioned technical scheme, the louvre can improve capacitor device's thermal diffusivity, and the louvre setting can avoid the dust to directly fall into in the plastic capacitor shell through the louvre at the side of heat dissipation bead simultaneously.
To sum up, the utility model discloses a beneficial technological effect does:
1. odd number of single units are connected in series to form a capacitor core, and at least two capacitor cores are connected in parallel to form a capacitor device. The capacitance of the whole capacitor device is increased, and the voltage resistance is enhanced;
2. odd number unit pieces are connected in series in a crimping mode through the positive connecting plate and the negative connecting plate, the lead is short, and the inductance is low.
Drawings
FIG. 1 is a schematic structural diagram showing a serial connection manner of unit elements in the present embodiment;
FIG. 2 is a schematic structural view of a condenser core according to the present embodiment;
FIG. 3 is a schematic structural diagram of the capacitor device of the present embodiment;
fig. 4 is a schematic structural diagram of the plastic capacitor case of the present embodiment.
Description of the drawings, 1, unit element; 2. a capacitor core; 3. a capacitive device; 4. a positive electrode lead; 5. a negative electrode lead; 6. a positive electrode connecting plate; 7. a negative electrode connecting plate; 8. a plate; 9. b, a plate; 10. c, a plate; 11. d, a plate; 12. a thermally insulating support plate; 13. a positive parallel plate; 14. a negative parallel plate; 15. a plastic capacitor case; 18. A fixed block; 19. a heat-dissipating rib; 20. and (4) heat dissipation holes.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Example (b):
referring to fig. 1, the present invention discloses a low inductance high voltage pulse capacitor, which comprises an electrical element. The positive end of the unit piece 1 is provided with a positive connecting plate 6 with an L-shaped cross section, and the positive connecting plate 6 comprises an a plate 8 and a b plate 9. The negative end of the unit element 1 is provided with a negative connecting plate 7 with an L-shaped cross section, and the negative connecting plate 7 comprises a c plate 10 and a d plate 11. 9 unit pieces 1 are stacked up and down, and the anode and the cathode of the unit pieces 1 adjacent up and down are reversely arranged. The inner end surface of the plate (a) 8 is attached to the positive end surface of the unit element 1, the inner end surface of the plate (b) 9 is attached to the upper surface of the side of the positive end surface of the unit element 1, the inner end surface of the plate (c) 10 is attached to the negative end surface of the unit element 1, and the inner end surface of the plate (d) 11 is attached to the lower surface of the side of the negative end surface of the unit element 1.
Referring to fig. 2, when the unit pieces 1 are stacked up and down, the outer surface of the b plate 9 of the positive connecting plate 6 of the unit piece 1 is attached to the outer surface of the d plate 11 of the negative connecting plate 7 of the adjacent unit pieces 1 up and down, so that 9 unit pieces 1 are connected in series with each other to form a capacitor core 2. The heat insulation support plate 12 is arranged between the adjacent unit pieces 1, so that the unit pieces 1 are placed in parallel, the stability between the unit pieces 1 is improved, and meanwhile, the heat insulation between the unit pieces 1 is carried out, and the service life of the unit pieces 1 is prolonged.
Referring to fig. 2 and 3, 3 capacitor cores 2 are arranged side by side, a b plate 9 of a positive electrode connecting plate 6 is arranged at the upper end of each of the 3 capacitor cores 2, and a d plate 11 of a negative electrode connecting plate 7 is arranged at the lower end of each of the 3 capacitor cores 2, so that the upper end of each of the 3 capacitor cores 2 is a positive electrode connecting part and the lower end thereof is a negative electrode connecting part. An anode parallel connection plate 13 is placed on the outer surface of a b plate 9 at the upper end of 3 capacitor cores 2, the anode parallel connection plate 13 is simultaneously contacted with the outer surface of the b plate 9 of the 3 capacitor cores 2, a cathode parallel connection plate 14 is placed below the outer surface of a d plate 11 at the lower end of the 3 capacitor cores 2, and the cathode parallel connection plate 14 is simultaneously contacted with the d plate 11 of the 3 capacitor cores 2. The outer side surface of the positive parallel plate 13 is connected with a positive lead 4, the outer side surface of the negative parallel plate 14 is connected with a negative lead 5, and 3 capacitor cores 2 are connected in parallel between the positive lead 4 and the negative lead 5. The 3 capacitor cores 2 are connected in parallel to form a capacitor device 3.
Referring to fig. 3 and 4, a plastic capacitor housing 15 is sleeved outside the capacitor device 3 to protect the capacitor device 3. A fixing block 18 is arranged between the end faces of the side ends of the adjacent capacitor cores 2, so that the 3 capacitor cores 2 are placed more stably in the plastic capacitor shell 15, shaking is avoided, and the 3 capacitor cores 2 are collided with each other to cause damage. The upper end and the lower end of the capacitor shell are respectively provided with a positive electrode interface and a negative electrode interface, and a positive electrode lead 4 of the capacitor device 3 is led out from the positive electrode interface. The negative electrode lead 5 of the capacitor device 3 is led out from the negative electrode interface. The plastic capacitor case 15 is provided with a heat dissipation rib 19, the side of the heat dissipation rib 19 is provided with a plurality of heat dissipation holes 20, the heat dissipation holes 20 can improve the heat dissipation performance of the capacitor device 3, and the heat dissipation holes 20 are disposed at the side of the heat dissipation rib 19 to prevent dust from directly falling into the plastic capacitor case 15 through the heat dissipation holes 20.
The implementation principle of the embodiment is as follows: the method comprises the following steps of connecting 9 single elements 1 in series through a positive connecting plate 6 and a negative connecting plate 7 to form a capacitor core 2, connecting 3 capacitor cores 2 in parallel through a positive parallel plate 13 and a negative parallel plate 14 to form a capacitor device 3, connecting a positive lead 4 and a negative lead 5 to the capacitor device 3, and placing the capacitor device 3 into a capacitor shell to form a capacitor. The whole capacitor is formed by connecting a plurality of unit elements 1 in series and then in parallel, the whole capacitor is compact in size and large in capacitance, and the voltage resistance of the capacitor is improved. Meanwhile, the connection between the single elements 1 and the connection between the capacitor cores 2 adopt a crimping mode, the lead is short, and the inductance is low.
The embodiment of this specific implementation mode is the preferred embodiment of the present invention, not limit according to this the utility model discloses a protection scope, so: all equivalent changes made according to the structure, shape and principle of the utility model are covered within the protection scope of the utility model.
Claims (8)
1. The utility model provides a low inductance high voltage pulse capacitor, includes unit spare (1), its characterized in that, unit spare (1) sets up to odd number, odd number unit spare (1) is established ties each other and is formed electric capacity core (2), at least two electric capacity core (2) are parallelly connected each other and are formed capacitance device (3), one side of capacitance device (3) is connected with anodal lead wire (4), the opposite side of capacitance device (3) is connected with negative pole lead wire (5).
2. The low-inductance high-voltage pulse capacitor is characterized in that a positive connecting plate (6) with an L-shaped cross section is arranged at the positive end of the unit element (1), the positive connecting plate (6) comprises an a plate (8) and a b plate (9), the inner end surface of the a plate (8) is attached to the positive end surface of the unit element (1), and the inner end surface of the b plate (9) is attached to the upper surface of one side of the positive end surface of the unit element (1);
the negative end of the unit element (1) is provided with a negative connecting plate (7) with an L-shaped cross section, the negative connecting plate (7) comprises a c plate (10) and a d plate (11), the inner end face of the c plate (10) is attached to the negative end face of the unit element (1), and the inner end face of the d plate (11) is attached to the lower surface of one side of the negative end face of the unit element (1);
the single element (1) is stacked up and down, the anode and the cathode of the single element (1) are arranged in a reverse mode, and the outer surface of a plate (11) of the single element (1) is attached to the outer surface of a plate (9) b of the adjacent single element (1) up and down.
3. A low inductance high voltage pulse capacitor according to claim 2, wherein a thermally insulated support plate (12) is provided between adjacent unit elements (1).
4. A low inductance high voltage pulse capacitor according to claim 1, wherein a plurality of said capacitor cores (2) are arranged in parallel, a b plate (9) is provided on an upper end surface of a plurality of said capacitor cores (2), and a d plate (11) is provided on a lower end surface of a plurality of said capacitor cores (2).
5. A low inductance high voltage pulse capacitor according to claim 4, wherein a positive parallel plate (13) is placed at the upper end of a plurality of said capacitor cores (2), a negative parallel plate (14) is placed at the lower end of a plurality of said capacitor cores (2), the outer side of said positive parallel plate (13) is connected with a positive lead (4), and the outer side of said negative parallel plate (14) is connected with a negative lead (5).
6. A low inductance high voltage pulse capacitor according to claim 5, wherein a plastic capacitor case (15) is sleeved outside the capacitor device (3), and the upper end and the lower end of the plastic capacitor case (15) are respectively provided with a positive electrode interface and a negative electrode interface.
7. A low inductance, high voltage pulse capacitor according to claim 1, wherein a mounting block (18) is provided between the side end faces of adjacent capacitor cores (2).
8. A low inductance, high voltage pulse capacitor according to claim 6, wherein said plastic capacitor case (15) is provided with heat dissipating ribs (19), and the side ends of said heat dissipating ribs (19) are provided with heat dissipating holes (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020727213.5U CN212365758U (en) | 2020-05-06 | 2020-05-06 | Low inductance high voltage pulse capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020727213.5U CN212365758U (en) | 2020-05-06 | 2020-05-06 | Low inductance high voltage pulse capacitor |
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| Publication Number | Publication Date |
|---|---|
| CN212365758U true CN212365758U (en) | 2021-01-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202020727213.5U Active CN212365758U (en) | 2020-05-06 | 2020-05-06 | Low inductance high voltage pulse capacitor |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023095473A1 (en) * | 2021-11-24 | 2023-06-01 | Tdk株式会社 | Thin-film capacitor |
| WO2024150493A1 (en) * | 2023-01-09 | 2024-07-18 | Tdk株式会社 | Thin film capacitor and circuit board provided with same |
| WO2024150492A1 (en) * | 2023-01-09 | 2024-07-18 | Tdk株式会社 | Thin film capacitor and circuit board provided with same |
-
2020
- 2020-05-06 CN CN202020727213.5U patent/CN212365758U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023095473A1 (en) * | 2021-11-24 | 2023-06-01 | Tdk株式会社 | Thin-film capacitor |
| WO2024150493A1 (en) * | 2023-01-09 | 2024-07-18 | Tdk株式会社 | Thin film capacitor and circuit board provided with same |
| WO2024150492A1 (en) * | 2023-01-09 | 2024-07-18 | Tdk株式会社 | Thin film capacitor and circuit board provided with same |
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