CN212342795U

CN212342795U - Power combining device

Info

Publication number: CN212342795U
Application number: CN202021011876.3U
Authority: CN
Inventors: 李华龙; 刘小刚; 郑凯
Original assignee: Starway Communications
Current assignee: Starway Communications
Priority date: 2020-06-04
Filing date: 2020-06-04
Publication date: 2021-01-12
Anticipated expiration: 2030-06-04

Abstract

The utility model discloses a power synthesis device. The power synthesis device comprises a combiner, wherein the combiner comprises an upper cover, a power amplifier circuit board, a substrate and a bottom shell. A first shielding cavity is arranged on one side of the power amplifier circuit board, and a first microstrip probe is arranged in the first shielding cavity; the power amplifier circuit board is fixedly connected with the substrate; a reflection cavity is arranged on one side of the bottom shell, the side where the reflection cavity is arranged and the side where the first shielding cavity is arranged are opposite sides, the bottom shell is fixedly connected with the upper cover, and the bottom shell is fixedly connected with the substrate; the upper cover the power amplifier circuit board the base plate and the bottom shell are both plate-shaped, and the upper cover the power amplifier circuit board the base plate and the bottom shell are stacked from top to bottom in sequence. The embodiment of the utility model provides an in power synthesis device have small and the better advantage of heat dispersion.

Description

Power combining device

Technical Field

The utility model relates to a microwave device technical field especially relates to a power synthesizer.

Background

The fields of space communication, remote sensing, navigation and the like mainly relate to a microwave frequency band. The output power requirements vary from milliwatts to thousands of watts for different applications. Power amplifiers are one of the key components to meet different power requirements. However, it is often difficult for a single power amplifier unit to achieve the desired goal, and power combining techniques have emerged.

At present, the realization of high-power amplification mainly adopts two modes of space power synthesis and plane power synthesis. However, the planar power synthesis has the disadvantages of large loss, large volume and the like, and the spatial power synthesis has the problem of poor heat dissipation.

SUMMERY OF THE UTILITY MODEL

The main object of the present invention is to solve at least one of the above problems.

The embodiment of the utility model provides a power synthesis device. The power combining apparatus includes a combiner, the combiner including:

an upper cover;

the probe comprises a power amplifier circuit board, a first shielding cavity and a second shielding cavity, wherein a first microstrip probe is arranged in the first shielding cavity;

the power amplifier circuit board is fixedly connected with the substrate;

a reflective cavity is arranged on one side of the bottom shell, the side where the reflective cavity is located and the side where the first shielding cavity is located are opposite sides, the bottom shell is fixedly connected with the upper cover, and the bottom shell is fixedly connected with the substrate;

the upper cover, the power amplifier circuit board, the base plate and the bottom shell are all in a plate shape, and the upper cover, the power amplifier circuit board, the base plate and the bottom shell are sequentially stacked from top to bottom;

the combiner has an output of a waveguide.

According to some embodiments of the invention, the bottom shell and the base plate are in threaded connection.

According to some embodiments of the present invention, the bottom shell and the substrate are bonded together by using conductive adhesive.

According to some embodiments of the present invention, the number of the first shielding cavities and the number of the first microstrip probes are two, two the first microstrip probes are respectively located in two inside of the first shielding cavities.

According to some embodiments of the invention, the length of two of the first microstrip probes is equal.

According to some embodiments of the utility model, the opposite side of upper cover is provided with second shielding chamber, be provided with second microstrip probe, two in the second shielding chamber the length of second microstrip probe equals.

According to some embodiments of the present invention, the microstrip line of the second microstrip probe has an extension section, so that the length of the microstrip line of the second microstrip probe is greater than the length of the microstrip line of the first microstrip probe.

According to some embodiments of the invention, the characteristic impedance of the extension section is 50 ohms.

According to some embodiments of the invention, the power combining device further comprises a filter, the filter being in a stacked relationship with the output of the waveguide of the combiner.

According to some embodiments of the invention, the filter is a band pass filter.

The embodiment of the utility model provides an in power synthesis device has following beneficial effect at least: after the signal is amplified by the power amplifying circuit, the electromagnetic wave is transmitted by the microstrip probe and synthesized and output in the waveguide. Through mutual conversion between the micro-strip and the waveguide, the conversion from plane to space electromagnetic propagation can be realized, the advantage of better heat dissipation of plane electromagnetic propagation can be inherited, and the integration of related circuits and driving circuits of the combiner on the same PCB is facilitated, so that the compact size is realized.

Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

Fig. 1 is a schematic structural diagram of a power combining apparatus according to some embodiments of the present invention in an exploded state;

fig. 2 is a schematic top view of the first shielding cavity and the first microstrip probe in fig. 1.

In the figure, 10-power combining means; 100-upper cover, 110-threaded connection element; 200-a power amplifier circuit board, 210-a first shielding cavity, 220-a microstrip probe circuit, 221-a first microstrip probe; 300-a substrate; 400-bottom shell, 410-reflective cavity.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left" and "right" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the term "connected" is to be interpreted broadly, and may be, for example, a fixed connection and a movable connection, a detachable connection and a non-detachable connection, or an integral connection; may be mechanically or electrically connected or may be in communication with each other. And "fixedly connected" includes detachably connected, non-detachably connected, integrally connected, and the like.

The use of terms like "first" or "second" in the present application is for descriptive purposes only and is not to be construed as indicating or implying any relative importance or implicit to the technical features indicated.

The technical solutions of the embodiments of the present invention can be combined with each other, but must be implemented by those skilled in the art. When the technical solutions are contradictory or impossible to be combined, the combination of the technical solutions should be considered to be absent and not be within the protection scope of the present invention.

The embodiment of the utility model provides a power synthesis device 10. Referring to fig. 1, the power combining apparatus 10 includes a combiner including an upper cover 100, a power amplifier circuit board 200, a substrate 300, and a bottom case 400.

A first shielding cavity 210 is arranged at one side of the power amplifier circuit board 200, and a first microstrip probe 221 is arranged in the first shielding cavity 210; the power amplifier circuit board 200 is fixedly connected with the substrate 300.

A reflective cavity 410 is disposed on one side of bottom case 400, the side of reflective cavity 410 opposite to the side of first shielding cavity 210, bottom case 400 is fixedly connected to upper cover 100, and bottom case 400 is fixedly connected to substrate 300;

the upper cover 100, the power amplifier circuit board 200, the substrate 300 and the bottom case 400 are all in a laminated plate shape, and the upper cover 100, the power amplifier circuit board 200, the substrate 300 and the bottom case 400 are sequentially stacked from top to bottom;

the combiner also has an output of the waveguide.

In the embodiment, after the signal is amplified by the power amplifying circuit, the electromagnetic wave is transmitted through the microstrip probe and synthesized and output in the waveguide. Through mutual conversion between the micro-strip and the waveguide, the conversion from plane to space electromagnetic propagation can be realized, the advantage of better heat dissipation of plane electromagnetic propagation can be inherited, and the integration of related circuits and driving circuits of the combiner on the same PCB is facilitated, so that the compact size is realized.

In some embodiments, referring to fig. 1, bottom case 400 is screwed to substrate 300. Specifically, the upper cover 100 is provided with a plurality of screw coupling members 110. The threaded connection structure is simple and reliable in connection, and has the characteristic of being detachable.

In some embodiments, bottom case 400 and substrate 300 are bonded together by conductive adhesive. The adhesive connection also has the advantages of simple structure and reliable connection. Moreover, the conductive adhesive can improve the radio frequency grounding performance.

In some embodiments, the number of the first shielding cavities 210 and the number of the first microstrip probes are two, and the two first microstrip probes are respectively located inside the two first shielding cavities 210. The two microstrip probes form two microstrip probe circuits 220. In contrast, the power splitting/combining topology with two microstrip probe circuits 220 is simpler, and the cost of the whole power combining device is lower.

In some embodiments, the two first microstrip probes 221 are equal in length to facilitate processing. Moreover, the lengths of the two first microstrip probes 221 avoid the situation of one long and one short, which also contributes to the compact structure of the power combining device.

In order to obtain a larger output power, in some embodiments, a second shielding cavity (not shown) is disposed on the other side of the upper cover 100, and a second microstrip probe (not shown) is disposed in the second shielding cavity, and the lengths of the two second microstrip probes are equal. Thus, the power combining apparatus has four microstrip probes, wherein the lengths of the two first microstrip probes 221 are equal, and the lengths of the two second microstrip probes are also equal.

In some embodiments, the microstrip line of the second microstrip probe has an extension such that the length of the microstrip line of the second microstrip probe is greater than the length of the microstrip line of the first microstrip probe 221. If the length of the microstrip line of the second microstrip probe is equal to that of the microstrip line of the first microstrip probe 221, the direction generated by the group of shielding cavities on the left of the first microstrip probe 221 is the same through calculation by a Maxwell equation set, and the default direction of the group of shielding cavities is set to be 0 degree; the directions generated by the shielding cavities on the right side of the second microstrip probe are also the same, and the default direction can be set to be 180 degrees. Thereby, the phase difference between the two is 180 °.

The phase difference is cancelled by adding a section of phase compensation line (namely an extension section of the microstrip line), so that power synthesis is realized.

In some embodiments, the characteristic impedance of the extension is 50 ohms.

The microstrip line is a microwave transmission line formed by a single conductor strip supported on a dielectric substrate, and is suitable for manufacturing a planar transmission line of a microwave integrated circuit. When the transmission line is in a traveling wave state, the ratio of the voltage and the current on the line is the characteristic impedance Z of the transmission line₀. The characteristic impedance of a transmission line is determined by the structure and characteristics of the transmission line. When the transmission line is lossless, the characteristic impedance Z₀Is real number and has a characteristic impedance Z₀Independent of the operating frequency.

In microwave communication, it is common to use 50 ohm characteristic impedance as a standard, so the characteristic impedance of the microstrip line at the working frequency is also selected to be 50 ohm to meet the requirements of maximum power transmission and minimum loss.

In some embodiments, the power combining apparatus further includes a filter (not shown) in stacked relation with the output of the waveguide of the combiner. Generally, an amplifier with a frequency conversion function generates more harmonic waves when frequency conversion is realized, and local oscillation signals are leaked due to frequency conversion. The operating frequency of a general power amplifier is relatively wide, and the power amplifier also has gain in a receiving frequency band. In order to ensure the communication quality, a filter needs to be integrated after the power synthesis device to suppress harmonic waves, local oscillator signal leakage, and gain in the reception band. Therefore, the embodiment of the present invention provides a power synthesis apparatus that integrates a filter to suppress the noise of the harmonic, the local oscillator signal, and the noise in the reception frequency band.

In a conventional satellite communication Ku/Ka band BUC (i.e., a BUC, up-conversion power amplifier), a main function of the BUC is to amplify, filter and up-convert an intermediate frequency input signal to achieve power amplification. When the intermediate frequency input frequency is 0.95GHz, a harmonic signal which is 0.95GHz higher than the radio frequency signal is introduced when the radio frequency signal is subjected to frequency conversion and amplification. Generally, the suppression index for harmonic signals is required to be 60dBc, and the suppression is also required for the reception band. The BUC of the Ku band needs not to exceed-151 dBm/Hz for the noise power spectral density of the receiving segment (frequency range 11.45 GHz-12.75 GHz). This means that a filter is required to suppress this frequency band (frequency range 11.45 GHz-12.75 GHz). The embodiment of the utility model provides an in the wave filter all have the inhibitory action to the noise of harmonic, local oscillator signal and the noise in the receiving frequency range.

The filtering effect of the combiner of the two microstrip probes of the Ku waveband is tested, and the return loss S is within the range of 13.75 GHz-14.5 GHz₁₁Less than-16 dB and an insertion loss of 0.2 dB; the noise suppression for the local oscillator frequency of 13.05GHz and the noise suppression for the receiving frequency of 11.45 GHz-12.75 GHz are both larger than 16 dBc. Under the condition of actually measuring a large signal, l4dB is improved compared with the harmonic index of 14.7GHz without a filter, so that the engineering application can be met.

The output ends of the waveguides of the filter and the combiner are mutually superposed (namely the filters are vertically superposed in space), and the filters and the output ends form a laminated relation, so that the space structure of the whole power synthesis device also presents the laminated relation and is more compact, and the miniaturization of the power synthesis device is further realized.

In some embodiments, the filter is a band pass filter. The frequency range of the filter does not exceed the range of the combiner. It will be appreciated that the combiner may be switched to any frequency range as desired. A range of harmonics, as well as noise, can be filtered using a band pass filter.

The following text briefly describes the main assembly process of the power combining device 10:

s100, adhering the power amplifier circuit board with the microstrip probe to a substrate by conductive glue;

s200, mounting a power amplifier circuit board with a micro-strip probe on a bottom shell with a reflection cavity through a threaded connection element;

s200, pressing the PCB bottom shell of the substrate through the upper cover.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A power combining apparatus, comprising a combiner, the combiner comprising:

an upper cover;

the power amplifier circuit board is fixedly connected with the substrate;

the combiner has an output of a waveguide.

2. The power combining apparatus of claim 1, wherein the bottom housing is threadedly coupled to the base plate.

3. The power combining apparatus of claim 1, wherein the bottom casing and the substrate are bonded together by a conductive adhesive.

4. The power combining device according to claim 1, wherein the number of the first shielding cavities and the number of the first microstrip probes are both two, and the two first microstrip probes are respectively located inside the two first shielding cavities.

5. The power combining apparatus of claim 4, wherein the two first microstrip probes are equal in length.

6. The power combining device according to claim 1, wherein a second shielding cavity is disposed on the other side of the upper cover, a second microstrip probe is disposed in the second shielding cavity, and the lengths of the two second microstrip probes are equal.

7. The power combining apparatus of claim 6, wherein the microstrip line of the second microstrip probe has an extension such that the length of the microstrip line of the second microstrip probe is greater than the length of the microstrip line of the first microstrip probe.

8. The power combining apparatus of claim 7, wherein the characteristic impedance of the extension is 50 ohms.

9. The power combining apparatus of any one of claims 1 to 8, further comprising a filter in stacked relation with an output of the waveguide of the combiner.

10. The power combining apparatus of claim 9, wherein the filter is a band pass filter.