CN212330057U

CN212330057U - Laser drilling equipment

Info

Publication number: CN212330057U
Application number: CN202021407345.6U
Authority: CN
Inventors: 赵继伟; 龚江华; 包克兵; 王一颖; 陈妙芳
Original assignee: Xiamen Chongxiang Automation Equipment Co ltd; Xiamen Flexible Electronics Research Institute Co ltd; Xiamen Hongxin Electronic Technology Group Co Ltd
Current assignee: Xiamen Chongxiang Automation Equipment Co ltd; Xiamen Flexible Electronics Research Institute Co ltd; Xiamen Hongxin Electronic Technology Group Co Ltd
Priority date: 2020-07-16
Filing date: 2020-07-16
Publication date: 2021-01-12
Anticipated expiration: 2030-07-16

Abstract

The utility model discloses a laser drilling device, which comprises a frame, a laser drilling mechanism, a lifting platform mechanism, a material moving mechanism and an upper camera; the laser punching mechanism comprises a laser workbench, a moving module, a laser and a camera module, and the lifting platform mechanism is arranged on the rack workbench; move material mechanism and include robot and sucking disc tool, the robot setting is on the frame workstation, and the sucking disc tool sets up on the swinging boom bottom of robot, and upper portion camera setting is in the frame that corresponds with the lift platform top for discern the material on the lift platform. The utility model discloses can improve the operation rate of accuracy, improve production efficiency, automation equipment operation, the cost of using manpower sparingly is realized to many operational equipments alone.

Description

Laser drilling equipment

Technical Field

The utility model relates to a technical field of flexible circuit board production facility especially indicates a laser drilling equipment.

Background

Before SMT, the MARK points of the defective products marked with the defective product MARKs on the circuit board need to be processed, so that components are not attached to the defective products during SMT, and the purpose of saving the cost of the components is achieved. At present, the main treatment mode of the MARK points of defective products is manual treatment of blacking and marking the MARK points by using an oil pen, and the manual operation mainly has the problems: poor products MARK point MARK is bad or missing, so that the bad products which should not be pasted with the components are pasted with the components, and the components are wasted; manually marking errors, and marking the MARK points of good products to cause that the good products are not pasted with components and are scrapped; the manual operation is inefficient, comparatively occupies the manpower, and the human cost is high.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art's not enough, provide a can improve the laser drilling equipment of uniformity and accuracy that defective products MARK handled.

In order to achieve the above purpose, the solution of the present invention is:

a laser drilling apparatus, comprising: the laser punching machine comprises a machine frame with a workbench, a laser punching mechanism, a lifting platform mechanism, a material moving mechanism and an upper camera, wherein the laser punching mechanism comprises a laser workbench, a moving module, a laser and a camera module; move material mechanism and include robot and sucking disc tool, the robot setting is on being located the frame workstation between laser mechanism and the lift platform mechanism of punching, and the sucking disc tool sets up on the swinging boom bottom of robot, and the upper portion camera setting is in the frame that corresponds with the lift platform top for discern the material on the lift platform.

Further, the moving module of the laser punching mechanism comprises a linear guide rail, a Y-axis module, a Y-axis motor, a portal frame, an X-axis module, an X-axis motor and a sliding plate; the laser worktable comprises two linear guide rails, at least one group of Y-axis modules, a Y-axis motor, a portal frame, an X-axis motor, a sliding plate, a laser device, a laser output end and a laser module, wherein the two linear guide rails are arranged on a rack worktable at two sides of the laser worktable in parallel, at least one group of Y-axis modules are arranged on the rack worktable at the outer side of the linear guide rails, the Y-axis motor is connected to the input end of the Y-axis module, the portal frame is erected on guide rail sliding blocks of the two linear guide rails, a bracket at one side of the portal frame is arranged on a module sliding block of the corresponding Y-axis module, the Y-axis module drives the portal frame to move in the space above the laser worktable, the X-axis module is arranged on the portal frame, the X-axis motor is arranged.

Further, the camera module comprises a camera and a light source; the camera is arranged outside the laser through the mounting frame arranged on the sliding plate, and the light source is arranged on the sliding plate and located in the space below the camera.

Further, laser mechanism of punching still including funnel and honeycomb panel, the funnel setting is put on laser workstation in laser workstation below and its upper end opening cover, and the lower extreme opening of funnel can be connected with air exhaust and exhaust device, and the honeycomb panel setting is on laser workstation and be located the top of funnel, and the honeycomb panel is used for placing product or product laser tool.

Further, the lifting platform mechanism comprises a fixing plate, a bearing, a lifting guide pillar, a lifting platform, a lifting plate, a support column, a motor fixing seat, a jacking motor and a screw rod; the fixed plate is arranged below a rack working table in front of the laser punching mechanism, a plurality of bearings are sleeved on the fixed plate at intervals, a plurality of lifting guide pillars are sleeved in the bearings one by one, the lifting platform is arranged at the top ends of the lifting guide pillars, the lifting plate is arranged at the bottom ends of the lifting guide pillars, a plurality of support pillars are arranged below the periphery of the bottom surface of the fixed plate at intervals, the motor fixing seat is arranged at the bottom ends of the plurality of support pillars, the jacking motor is arranged below the middle of the motor fixing seat, one end of the lead screw is connected to the output end of the jacking motor, the other end of the lead screw penetrates through the lifting plate and is connected below the fixed plate, and a lead screw nut; the jacking motor drives the screw rod to drive the lifting plate to move up and down, materials are placed on the lifting platform, and after the uppermost layer of the materials on the lifting platform are taken away, the jacking motor drives the screw rod to drive the lifting plate and the lifting platform to automatically rise to a specified height.

Furthermore, the lifting platform mechanism also comprises a lifting sensing module, and the lifting sensing module comprises a high-position sensor, a low-position limit sensor and a lifting sensing piece; the high-order inductor passes through the support setting on the fixed plate outside, and be corresponding to the activity orbit top of lifter plate, the high-order inductor is used for the activity orbit top position of sensing the lifter plate, the low level inductor, low level limit inductor passes through the support setting on the motor fixing base outside, and be corresponding to the activity orbit low side of lifter plate, the low side limit, the low level inductor, low level limit inductor is used for the low side of the activity orbit of sensing the lifter plate respectively, low side limit position, the lift response piece sets up on the lifter plate outside that corresponds with the high-order inductor, and can cross the high-order inductor by the vertical induction, the low level inductor, low level limit inductor.

Furthermore, the lifting platform mechanism further comprises a limit baffle and a material taking induction die, wherein at least one limit baffle is arranged on the frame workbench at each periphery of the lifting platform respectively and used for limiting and placing materials on the lifting platform, and at least one material taking induction die is arranged at the upper end part of the limit baffle and corresponds to a material taking position and used for sensing the arrival of the uppermost layer of materials on the lifting platform at the material taking position.

Further, lift platform mechanism is still including the fixed plate pillar, and many fixed plate pillar intervals set up on fixed plate top surface periphery, and the fixed plate passes through many fixed plate pillars and sets up in frame workstation below.

Furthermore, the sucker jig of the material moving mechanism is provided with a plurality of suction nozzle modules, the suction nozzle modules are adjustably arranged on the sucker jig according to the suction positions of products, the robot drives the sucker jig to vertically move up and down and rotate, and materials are taken and placed through the suction nozzle modules; the robot drives the sucker jig to move above the laser workbench of the laser punching mechanism and the lifting platform of the lifting platform mechanism.

Furthermore, the laser drilling equipment also comprises a material receiving mechanism, the material receiving mechanism is arranged on a rack workbench which is positioned at one side close to the laser drilling mechanism and the material moving mechanism, and the material receiving mechanism is any one of a material receiving box, a material receiving lifting platform mechanism or a multi-station sorting turntable mechanism.

Furthermore, the material receiving lifting platform mechanism and the lifting platform mechanism have the same structure, and the material receiving lifting platform mechanism comprises a fixed plate, a bearing, a lifting guide pillar, a lifting platform, a lifting plate, a support column, a motor fixing seat, a jacking motor and a screw rod; the fixed plate is arranged below a rack working table close to the laser punching mechanism and the material moving mechanism, a plurality of bearings are arranged on the fixed plate in a sleeved mode at intervals, a plurality of lifting guide pillars are arranged in the bearings in a sleeved mode one by one, the lifting platform is arranged at the top ends of the lifting guide pillars, the lifting plate is arranged at the bottom ends of the lifting guide pillars, a plurality of supporting columns are arranged below the periphery of the bottom surface of the fixed plate at intervals, the motor fixing seat is arranged at the bottom ends of the plurality of supporting columns, the jacking motor is arranged below the middle of the motor fixing seat, one end of the lead screw is connected to the output end of the jacking motor, the other end of the lead screw penetrates through the lifting plate to be connected below the fixed; the jacking motor drives the screw rod to drive the lifting plate to move up and down; the lifting platform is used for placing materials, and after a material is placed on the lifting platform, the jacking motor drives the screw rod to drive the lifting plate and the lifting platform to automatically descend by a preset height.

After the technical scheme is adopted, the utility model discloses following beneficial effect has:

the utility model discloses laser drilling equipment utilizes upper portion camera discernment lift platform on the superiors 'material, distinguish that the superiors' material is circuit board or baffle, if discernment is the circuit board, discernment circuit board position and preliminary identification have defective products MARK in it, so that move material mechanism and carry out corresponding instruction according to upper portion camera feedback result, utilize laser punching mechanism to adopt the MARK point of laser punching mode processing defective products in the circuit board, replace artifical with the processing mode of blacking of oil pen, equipment operation uniformity is high, the MARK point of all defective products on the circuit board can all be handled, and there is not the problem of processing, multiprocessing, processing badness etc., improve MARK point processing uniformity and the accuracy of defective products, be convenient for SMT equipment discernment, when guaranteeing SMT production, defective products can not paste components and parts on the circuit board, and the non-defective products can all be pasted components and parts, save cost, in addition, the laser can be used for a long time, the service life is generally more than 8000H, and the pen point of the oil pen is easy to dry and needs to be replaced frequently.

The lifting platform mechanism is adopted to automatically lift materials, so that the materials on the uppermost layer are all positioned at the same material taking position, and the robot is ensured to take the materials accurately;

the defective products can be photographed and filed by a camera, so that the traceability is increased;

adopt the utility model discloses laser drilling equipment can improve the operation rate of accuracy, improve production efficiency, and automation equipment operation, the cost of using manpower sparingly is realized to many operational equipments alone.

Drawings

Fig. 1 is a perspective view of the laser drilling apparatus of the present invention.

Fig. 2 is a top view of the laser drilling apparatus of the present invention.

Fig. 3 is a front side view of the laser drilling apparatus of the present invention.

Fig. 4 is a rear side view of the laser drilling apparatus of the present invention.

Fig. 5 is the left side view of the laser drilling apparatus of the present invention.

Fig. 6 is a right side view of the laser drilling apparatus of the present invention.

Fig. 7 is a perspective view of the laser drilling mechanism of the present invention.

Fig. 8 is a top view of the laser drilling mechanism of the present invention.

Fig. 9 is a front side view of the laser drilling mechanism of the present invention.

Fig. 10 is a left side view of the laser drilling mechanism of the present invention.

Fig. 11 is a perspective view of the lifting platform mechanism of the present invention.

Fig. 12 is a bottom perspective view of the elevating platform mechanism of the present invention.

Fig. 13 is a front side view of the elevating platform mechanism of the present invention.

Fig. 14 is a perspective view of the material moving mechanism of the present invention.

Fig. 15 is a top view of the material moving mechanism of the present invention.

Fig. 16 is a front side view of the material moving mechanism of the present invention.

Detailed Description

In order to further explain the technical solution of the present invention, the present invention is explained in detail by the following embodiments.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

As shown in fig. 1 to 6, the present invention discloses a laser drilling apparatus 1, which comprises a frame 10 having a worktable, a laser drilling mechanism 20, a lifting platform mechanism 30, and an upper camera (not shown);

the laser punching mechanism 20 comprises a laser workbench 21, a moving module, a laser 28 and a camera module 29, wherein the laser workbench 21 is erected on one side above the workbench of the rack 10, the laser 28 is arranged on the moving module, the moving module is arranged above the laser workbench 21, and the camera module 29 is arranged on one side of the laser 28; the lifting platform mechanism 30 is arranged on a worktable of the frame 10 in front of the laser punching mechanism 20; move material mechanism 50 and include robot 51 and sucking disc tool 52, robot 51 sets up on being located the frame 10 workstation between laser punching machine 20 and lift platform mechanism 30, sucking disc tool 52 sets up on the swinging boom bottom of robot 51, sucking disc tool 52 is provided with a plurality of suction nozzle modules 521, a plurality of suction nozzle modules 521 can adjust according to the product suction position and set up on sucking disc tool 52, upper portion camera (not shown), the upper portion camera sets up in the frame that corresponds with lift platform 34 top, be used for discerning the material on the lift platform 34.

As shown in fig. 7 to 10, the moving module of the laser punching mechanism 20 includes a linear guide 22, a Y-axis module 23, a Y-axis motor 24, a gantry 25, an X-axis module 26, an X-axis motor 27, and a sliding plate 210; the laser workbench 21 is erected at one side above the workbench of the machine frame 10, the two linear guide rails 22 are arranged on the workbench of the machine frame 10 at two sides of the laser workbench 21 in parallel, at least one group of Y-axis modules 23 is arranged on the workbench of the machine frame 10 at the outer side of the linear guide rails 22, a Y-axis motor 24 is connected with the input end of the Y-axis module 23, a portal frame 25 is erected on the guide rail slide blocks of the two linear guide rails 22, a side bracket of the portal frame 25 is arranged on the corresponding module slide block of the Y-axis module 23, the Y-axis module 23 drives the portal frame 25 to move in the space above the laser workbench 21, an X-axis module 26 is arranged on the portal frame 25, an X-axis motor 27 is arranged at the input end of the X-axis module 26, a sliding plate 210 is arranged on the module slide block of the X-axis module 26, a laser 28 is arranged on the sliding plate 210 close to one side of the laser workbench, the camera module 29 is arranged on the sliding plate 210 positioned outside the laser 28, and the camera module 29 comprises a camera 291 and a light source 292; the camera 291 is disposed outside the laser 28 through a mounting frame 293 disposed on the sled 210, and the light source 293 is disposed on the sled 210 in a space below the camera 292; the Y-axis motor 24 drives the Y-axis module 23 to drive the portal frame 25 to move along the direction of the Y-axis module 23, the X-axis motor 27 drives the X-axis module 26 to drive the laser 28 and the camera module 29 to move along the direction of the X-axis module 26, and the light source 292 is matched with the camera 291 to complete product identification.

As shown in fig. 9, the laser punching mechanism 20 further includes a funnel 211 and a honeycomb plate 212, the funnel 211 is disposed below the laser worktable 21, an upper opening of the funnel 211 is sleeved on the laser worktable 21, a lower opening of the funnel 211 can be connected to an air suction and waste discharge device, the honeycomb plate 212 is disposed on the laser worktable 21 and above the funnel 211, and the honeycomb plate 212 is used for placing a product or a product laser jig, and adsorbing the product and discharging the waste laser waste through honeycomb holes of the honeycomb plate.

As shown in fig. 1 and 11 to 13, the lifting platform mechanism 30 is disposed on the worktable of the machine frame 10 in front of the laser punching mechanism 20, and the lifting platform mechanism 30 includes a fixing plate 31, a bearing 32, a lifting guide pillar 33, a lifting platform 34, a lifting plate 35, a support post 36, a motor fixing seat 37, a lifting motor 38 and a screw rod 310; the fixed plate 31 is arranged below a workbench of the rack 10 in front of the laser punching mechanism 20, the plurality of bearings 32 are sleeved on the fixed plate 31 at intervals, the plurality of lifting guide pillars 33 are sleeved in the bearings 32 one by one, the lifting platform 34 is arranged at the top ends of the plurality of lifting guide pillars 33, the lifting plate 35 is arranged at the bottom ends of the plurality of lifting guide pillars 33, the plurality of support pillars 36 are arranged below the periphery of the bottom surface of the fixed plate 31 at intervals, the motor fixing seat 37 is arranged at the bottom ends of the plurality of support pillars 36, the jacking motor 38 is arranged below the middle of the motor fixing seat 37, one end of the screw rod 310 is connected to the output end of the jacking motor 38, the other end of the screw rod 310 penetrates through the lifting plate 35 to be connected below the fixed plate 31, and a; the jacking motor 38 drives the screw rod 310 to drive the lifting plate 35 to move up and down, the lifting platform is used for placing materials, and after the uppermost layer of materials on the lifting platform is taken away, the jacking motor drives the screw rod to drive the lifting plate and the lifting platform to automatically ascend to a specified height.

Further, the lifting platform mechanism 30 further comprises a lifting sensing module 39, and the lifting sensing module 39 comprises a high sensor 391, a low sensor 392, a low limit sensor 393 and a lifting sensing piece 394; the high-position sensor 391 is arranged on the outer side of the fixing plate 31 through a bracket and corresponds to the top end of the movable track of the lifting plate 35, the high-position sensor 391 is used for sensing the top end position of the movable track of the lifting plate 35, the low-position sensor 392 and the low-position limit sensor 393 are arranged on the outer side of the motor fixing seat 37 through a bracket and correspond to the low end and the low end limit of the movable track of the lifting plate 35, the low-position sensor 392 and the low-position limit sensor 393 are respectively used for sensing the low end and the low end limit position of the movable track of the lifting plate 35, and the lifting sensing piece is arranged on the outer side of the lifting plate 35 corresponding to the high-position sensor 391 and can vertically sense and cross the high-position sensor 391, the low-position sensor 392 and the low-position limit sensor 394.

Further, the lifting platform mechanism 30 further includes a limiting baffle 311, and at least one limiting baffle 311 is respectively disposed on the working tables of the rack 10 at the periphery of the lifting platform 34, so as to limit the material on the lifting platform 34.

Further, the lifting platform mechanism 30 further includes material taking induction dies 312, and at least one material taking induction die 312 is disposed at the upper end of the limiting baffle 311 and corresponds to the material taking position for sensing that the uppermost layer of material on the lifting platform 34 reaches the material taking position.

Further, the lifting platform mechanism 30 further includes fixing plate support columns 313, the fixing plate support columns 313 are arranged on the periphery of the top surface of the fixing plate 31 at intervals, and the fixing plate 31 is arranged below the workbench of the rack 10 through the fixing plate support columns 313 for increasing the material accommodating space on the lifting platform 34.

As shown in fig. 1 and 14 to 16, the material moving mechanism 50 is disposed on the worktable of the frame 10 between the laser punching mechanism 20 and the lifting platform mechanism 30, and the material moving mechanism 50 includes a robot 51 and a suction cup fixture 52; the robot 51 is a four-axis robot or a six-axis robot, the robot 51 is arranged on the worktable of the frame 10 between the laser punching mechanism 20 and the lifting platform mechanism 30, the suction cup jig 52 is arranged at the bottom end of the rotating arm of the robot 51, the suction cup jig 52 is provided with a plurality of suction nozzle modules 521, and the suction nozzle modules 521 can be arranged on the suction cup jig 52 in an adjustable manner according to the suction positions of products; the robot 51 drives the suction cup jig 52 to vertically move up and down and rotate, and materials are taken and placed through the suction nozzle module 521; the robot 51 drives the suction cup jig 52 to move above the laser table 21 of the laser punching mechanism 20 and the elevating platform 34 of the elevating platform mechanism 30.

Further, the laser drilling device 1 further comprises a material receiving mechanism, the material receiving mechanism is arranged on the workbench of the rack 10 on one side close to the laser drilling mechanism 20 and the material moving mechanism 50, and the material receiving mechanism is any one of a material receiving box (not shown in the figure), a material receiving lifting platform mechanism (not shown in the figure) or a multi-station sorting turntable mechanism.

Further, the material receiving lifting platform mechanism and the lifting platform mechanism 30 have the same structure, and the material receiving lifting platform mechanism comprises a fixing plate, a bearing, a lifting guide pillar, a lifting platform, a lifting plate, a support column, a motor fixing seat, a jacking motor and a screw rod; the fixed plate is arranged below a workbench of the frame 10 close to the laser punching mechanism 20 and the material moving mechanism 50, a plurality of bearings are sleeved on the fixed plate at intervals, a plurality of lifting guide pillars are sleeved in the bearings one by one, the lifting platform is arranged at the top ends of the plurality of lifting guide pillars, the lifting plate is arranged at the bottom ends of the plurality of lifting guide pillars, a plurality of support pillars are arranged below the periphery of the bottom surface of the fixed plate at intervals, the motor fixing seat is arranged at the bottom ends of the plurality of support pillars, the jacking motor is arranged below the middle of the motor fixing seat, one end of the lead screw is connected to the output end of the jacking motor, the other end of the lead screw penetrates through the lifting plate to be connected below the fixed plate, and; the jacking motor drives the screw rod to drive the lifting plate to move up and down; the lifting platform is used for placing materials, and after a material is placed on the lifting platform, the jacking motor drives the screw rod to drive the lifting plate and the lifting platform to automatically descend by a preset height.

In an embodiment, the utility model discloses laser drilling equipment's receiving agencies is multistation letter sorting carousel, can improve letter sorting efficiency, and concrete operation process and theory of operation are:

when in use, a stack of materials is firstly placed on the lifting platform 34 of the lifting platform mechanism 30, and generally the stack of materials comprises circuit boards and partition boards for separating the circuit boards;

the upper camera identifies the uppermost layer of the material on the lifting platform 34, if the circuit board is identified, the position of the circuit board is identified, whether a defective product mark exists in the circuit board is identified preliminarily, if the defective product mark does not exist in the circuit board, the multi-station sorting turntable mechanism 40 rotates the multi-station turntable 42 to rotate the receiving station 43 corresponding to the all-OK product on the multi-station sorting turntable mechanism to the receiving station 100, and the robot 51 drives the suction cup jig 52 to directly convey the all-OK circuit board to the receiving box 431 of the all-OK product at the receiving station 100; if the circuit board has a defective product mark, the robot 51 drives the suction cup jig 52 to the lifting platform 34 to suck the circuit board, correct the position and then convey the circuit board to the laser workbench 21;

the laser worktable 21 adsorbs the circuit board;

the Y-axis module 23 and the X-axis module 26 are matched with each other to drive the camera module 29 to identify MRAK points and defective product marks of products in each unit of the circuit board on the laser workbench 21 in a linkage manner, and further the camera module 29 can shoot and store defective products while identifying the defective products so as to facilitate tracing;

according to the result identified by the camera module 29, the Y-axis module 23 and the X-axis module 26 are started again to cooperate with each other to drive the laser 28 to carry out laser drilling processing on the MARK points of the defective products in the circuit board on the laser workbench 21, and the MARK points of the defective products are removed;

meanwhile, according to the number of defective products identified by the camera module 29, the multi-station sorting turntable mechanism 40 rotates the multi-station turntable thereof to rotate the material receiving stations corresponding to the number of the defective products thereon to the material receiving station 100;

meanwhile, the upper camera recognizes the uppermost material, such as a partition, on the lifting platform 34 again, and the robot 51 drives the suction cup jig 52 to the lifting platform 34 to transport the partition to the material receiving box 431 corresponding to the material receiving position 100;

completing laser drilling on the MARK points of defective products in the circuit board on the laser workbench 21;

the robot 51 drives the suction cup jig 52 to the laser workbench 21 to convey the circuit board into the material receiving box corresponding to the material receiving position 100;

further, after completing the laser drilling of the MARK points of the defective products in the circuit board on the laser workbench 21, the Y-axis module 23 and the X-axis module 26 can be started again to cooperate with the linkage action to drive the camera module 29 to detect whether the MARK points of the defective products in the circuit board are all removed by the laser drilling, and if the hole is missed, the hole is reworked to prevent the defective products from being pasted with components due to the missed hole drilling.

After the production of a stack of materials is completed, the staff take out the materials from a plurality of material receiving boxes on the multi-station turntable in sequence and then place the materials again for production.

After the technical scheme is adopted, the utility model discloses beneficial effect does:

the utility model discloses laser drilling equipment adopts the MARK point of laser drilling mode processing circuit board interior defective products, replace artifical blacking processing mode with oil pen, equipment operation uniformity is high, the MARK point of all defective products on the circuit board can all be handled, and there is not hourglass processing, multiprocessing, handle bad scheduling problem, improve MARK point processing uniformity and accuracy of defective products, the SMT equipment discernment of being convenient for, when guaranteeing SMT production, the defective products can not paste components and parts in the circuit board, and the non-defective products can all be pasted components and parts, save components and parts cost, in addition the laser instrument can be used for a long time, general life-span is more than 8000H, and oil pen nib is easily done, need often to change;

the robot 50 is matched with the multi-station sorting turntable mechanism 40, the circuit boards with full OK and the circuit boards with defective product quantity are automatically sorted and placed, manual sorting operation is replaced, sorting efficiency and accuracy are improved, and SMT line bodies can be produced in different categories during SMT, so that the production efficiency of the SMT line bodies is improved;

the lifting platform mechanism 30 is adopted to automatically lift the materials, so that the materials on the uppermost layer are all positioned at the same material taking position, and the robot is ensured to take the materials accurately;

adopt the utility model discloses laser drilling equipment can improve the operation rate of accuracy, improve production efficiency, and automation equipment operation, many equipment of alone operatable use the cost of using manpower sparingly realizes intelligent manufacturing.

In another embodiment, the utility model discloses laser drilling equipment's receiving agencies is for receiving material upgrading platform mechanism, and concrete operation process and theory of operation are:

the upper camera identifies the uppermost layer of material on the lifting platform 34 to distinguish whether the uppermost layer of material is a circuit board or a partition, and if the uppermost layer of material is identified to be a partition, the robot 51 drives the suction cup jig 52 to the lifting platform 34 to convey the partition to the lifting platform of the material lifting platform mechanism;

if the circuit board is identified, identifying the position of the circuit board and identifying whether a defective product mark exists in the circuit board, if no defective product mark exists in the circuit board, the robot 51 drives the suction cup jig 52 to directly convey the fully-OK circuit board to a lifting platform of the material lifting platform mechanism; if the circuit board has a defective product mark, the robot 51 drives the suction cup jig 52 to the lifting platform 34 to suck the circuit board, correct the position and then convey the circuit board to the laser workbench 21;

the laser worktable 21 adsorbs the circuit board;

the robot 51 drives the suction cup jig 52 to the laser workbench 21 to convey the circuit board to the lifting platform of the material receiving lifting platform mechanism;

And after the production of the stack of materials is finished, the staff take out the materials from the lifting platform of the material receiving lifting platform mechanism and then place the materials again for production.

the utility model discloses laser drilling device adopts the MARK point of laser drilling mode processing circuit board interior defective products, replace artifical blacking processing mode with oil pen, equipment operation uniformity is high, the MARK point of all defective products on the circuit board can all be handled, and there is not hourglass processing, multiprocessing, handle bad scheduling problem, improve MARK point processing uniformity and the accuracy of defective products, the SMT equipment discernment of being convenient for, when guaranteeing SMT production, the defective products can not paste components and parts in the circuit board, and the non-defective products can all be pasted components and parts, save components and parts cost, in addition the laser instrument can be used for a long time, general life-span is more than 8000H, and oil pen nib is easily done, need often to change;

the receiving lifting platform mechanism is adopted to automatically descend for receiving materials, so that the materials on the uppermost layer are all positioned at the same material taking position, the robot is ensured to accurately discharge the materials, and the received materials are orderly;

The above embodiments and drawings are not intended to limit the form and style of the present invention, and any suitable changes or modifications made by those skilled in the art should not be construed as departing from the scope of the present invention.

Claims

1. A laser drilling apparatus, comprising: the laser punching machine comprises a machine frame with a workbench, a laser punching mechanism, a lifting platform mechanism, a material moving mechanism and an upper camera, wherein the laser punching mechanism comprises a laser workbench, a moving module, a laser and a camera module; move material mechanism and include robot and sucking disc tool, the robot setting is on being located the frame workstation between laser mechanism and the lift platform mechanism of punching, and the sucking disc tool sets up on the swinging boom bottom of robot, and the upper portion camera setting is in the frame that corresponds with the lift platform top for discern the material on the lift platform.

2. The laser drilling apparatus of claim 1, wherein: the moving module of the laser punching mechanism comprises a linear guide rail, a Y-axis module, a Y-axis motor, a portal frame, an X-axis module, an X-axis motor and a sliding plate; the laser worktable comprises two linear guide rails, at least one group of Y-axis modules, a Y-axis motor, a portal frame, an X-axis motor, a sliding plate, a laser device, a laser output end and a laser module, wherein the two linear guide rails are arranged on a rack worktable at two sides of the laser worktable in parallel, at least one group of Y-axis modules are arranged on the rack worktable at the outer side of the linear guide rails, the Y-axis motor is connected to the input end of the Y-axis module, the portal frame is erected on guide rail sliding blocks of the two linear guide rails, a bracket at one side of the portal frame is arranged on a module sliding block of the corresponding Y-axis module, the Y-axis module drives the portal frame to move in the space above the laser worktable, the X-axis module is arranged on the portal frame, the X-axis motor is arranged.

3. The laser drilling apparatus of claim 2, wherein: the camera module comprises a camera and a light source; the camera is arranged outside the laser through the mounting frame arranged on the sliding plate, and the light source is arranged on the sliding plate and located in the space below the camera.

4. The laser drilling apparatus according to any one of claims 1 to 3, wherein: the laser punching mechanism further comprises a funnel and a honeycomb plate, the funnel is arranged below the laser workbench and sleeved with an upper end opening of the funnel, the lower end opening of the funnel can be connected with an air exhaust and waste discharge device, the honeycomb plate is arranged on the laser workbench and located above the funnel, and the honeycomb plate is used for placing a product or a product laser jig.

5. The laser drilling apparatus of claim 1, wherein: the lifting platform mechanism comprises a fixed plate, a bearing, a lifting guide pillar, a lifting platform, a lifting plate, a support pillar, a motor fixing seat, a jacking motor and a screw rod; the fixed plate is arranged below a rack working table in front of the laser punching mechanism, a plurality of bearings are sleeved on the fixed plate at intervals, a plurality of lifting guide pillars are sleeved in the bearings one by one, the lifting platform is arranged at the top ends of the lifting guide pillars, the lifting plate is arranged at the bottom ends of the lifting guide pillars, a plurality of support pillars are arranged below the periphery of the bottom surface of the fixed plate at intervals, the motor fixing seat is arranged at the bottom ends of the plurality of support pillars, the jacking motor is arranged below the middle of the motor fixing seat, one end of the lead screw is connected to the output end of the jacking motor, the other end of the lead screw penetrates through the lifting plate and is connected below the fixed plate, and a lead screw nut; the jacking motor drives the screw rod to drive the lifting plate to move up and down.

6. The laser drilling apparatus of claim 5, wherein: the lifting platform mechanism also comprises a lifting sensing module, and the lifting sensing module comprises a high-position sensor, a low-position limit sensor and a lifting sensing piece; the high-order inductor passes through the support setting on the fixed plate outside, and be corresponding to the activity orbit top of lifter plate, the high-order inductor is used for the activity orbit top position of sensing the lifter plate, the low level inductor, low level limit inductor passes through the support setting on the motor fixing base outside, and be corresponding to the activity orbit low side of lifter plate, the low side limit, the low level inductor, low level limit inductor is used for the low side of the activity orbit of sensing the lifter plate respectively, low side limit position, the lift response piece sets up on the lifter plate outside that corresponds with the high-order inductor, and can cross the high-order inductor by the vertical induction, the low level inductor, low level limit inductor.

7. The laser drilling apparatus according to claim 5 or 6, wherein: the lifting platform mechanism further comprises a limiting baffle and a material taking induction die, wherein at least one limiting baffle is arranged on the frame workbench at each periphery of the lifting platform respectively and used for limiting and placing materials on the lifting platform, and at least one material taking induction die is arranged at the upper end part of the limiting baffle and corresponds to a material taking position and used for sensing the arrival of the uppermost layer of materials on the lifting platform at the material taking position.

8. The laser drilling apparatus of claim 5, wherein: the lifting platform mechanism further comprises fixing plate pillars, a plurality of fixing plate pillars are arranged on the periphery of the top surface of the fixing plate at intervals, and the fixing plate is arranged below the rack workbench through the plurality of fixing plate pillars.

9. The laser drilling apparatus of claim 1, wherein: the sucking disc jig of the material moving mechanism is provided with a plurality of suction nozzle modules, the suction nozzle modules are adjustably arranged on the sucking disc jig according to the product suction positions, the robot drives the sucking disc jig to vertically move up and down and rotate, and materials are taken and placed through the suction nozzle modules; the robot drives the sucker jig to move above a laser workbench of the laser punching mechanism and a lifting platform of the lifting platform mechanism.

10. The laser drilling apparatus of claim 1, wherein: the automatic material receiving and conveying device is characterized by further comprising a material receiving mechanism, wherein the material receiving mechanism is arranged on a rack working table on one side of the laser punching mechanism and the material moving mechanism, the material receiving mechanism is a material receiving box or a material receiving lifting platform mechanism, and the material receiving lifting platform mechanism is the same as the lifting platform mechanism in structure.