CN212316284U - High-frequency coil for simultaneously drawing multiple silicon cores - Google Patents
High-frequency coil for simultaneously drawing multiple silicon cores Download PDFInfo
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- CN212316284U CN212316284U CN202020408737.8U CN202020408737U CN212316284U CN 212316284 U CN212316284 U CN 212316284U CN 202020408737 U CN202020408737 U CN 202020408737U CN 212316284 U CN212316284 U CN 212316284U
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Abstract
The utility model provides a high frequency coil of drawing many silicon cores simultaneously, relates to high frequency coil technical field, the utility model discloses a set up a plurality of drawing hole A in the high frequency coil main part, then set up coolant drainage channel on the coolant channel, with coolant to high frequency coil middle part drainage, draw and reduce the purpose of high frequency coil middle part temperature when realizing many silicon cores, the effectual life who improves high frequency coil, the utility model has the characteristics of simple structure, manufacturing convenience etc. are particularly suitable for popularizing in the polycrystalline silicon trade and implementing.
Description
[ technical field ] A method for producing a semiconductor device
The utility model relates to a high frequency coil technical field, concretely relates to high frequency coil of many silicon cores of simultaneous drawing.
[ background of the invention ]
As is known, since the subsequent products of silicon cores are widely applied to the fields of solar power generation, semiconductors, military industry and the like, the demand for silicon cores is increasing, and most of the existing silicon cores are high-frequency coils which are used for simultaneously drawing five or six silicon cores at a time in the production process, and the operating principle is as follows: when the induction heating type seed crystal silicon core pulling device works, high-frequency current is introduced into the high-frequency coil, the high-frequency coil carries out induction heating on the raw material rod, a melting area is formed at the upper end of the heated raw material rod, then the seed crystal chuck is used for driving the seed crystal to penetrate through a pulling hole of the high-frequency coil and then be inserted into the melting area at the upper end of the raw material rod, after the end of the seed crystal and molten liquid are melted into a whole, the seed crystal is slowly lifted, the melted raw material can rise along with the seed crystal to form a new cylindrical crystal, and the cylindrical crystal is.
Through retrieval and discovery, a plurality of high-frequency coils applied in advance relate to silicon core drawing, and experiments and applications show that the high-frequency coils are only capable of cooling the outer rings of the high-frequency coils due to the fact that cooling medium channels on the high-frequency coils are annular, the central parts of the high-frequency coils are poor in cooling effect, the temperature of the middle parts of the high-frequency coils is excessively high finally, after the high-frequency coils are used for a period of time, the middle parts of the high-frequency coils are prone to being ignited to damage the high-frequency coils, meanwhile, the middle parts of the high-frequency coils are prone to being cracked, hidden cracks and the like.
[ summary of the invention ]
In view of the not enough of existence among the background art, the utility model discloses a high frequency coil of many silicon cores of simultaneous drawing, the utility model discloses a set up a plurality of drawing hole A in the high frequency coil main part, then set up cooling medium drainage channel on the cooling medium passageway, with cooling medium to high frequency coil middle part drainage, realize reducing the temperature purpose at high frequency coil middle part, the utility model has the characteristics of simple structure, processing convenience etc.
In order to achieve the purpose of the invention, the utility model adopts the following technical scheme:
a high-frequency coil for simultaneously drawing a plurality of silicon cores comprises a high-frequency coil body, drawing holes A, drawing holes or chemical material holes, radial diversion trenches and openings, wherein the middle part of the high-frequency coil body is provided with the drawing holes or the chemical material holes, the high-frequency coil body at the periphery of the drawing holes or the chemical material holes is provided with at least two drawing holes A, the inner edge surface of each drawing hole or the chemical material hole is provided with an opening penetrating to the outer edge surface of the high-frequency coil body, the inner edge surface of each drawing hole or the chemical material hole is provided with the radial diversion trenches, the radial diversion trenches extend outwards from the drawing holes or the chemical material holes to a position between every two drawing holes A except the opening, the right side surface of the high-frequency coil body is provided with a concave plane inwards towards the central position, the right side surface or the left side surface or the outer edge surface of the high-frequency coil body is provided with a cooling medium channel, and the cooling medium diversion channels which are concave towards the diversion trenches are respectively arranged on the cooling medium channel in a radial way corresponding to the, and the inlet and the outlet of the cooling medium channel are respectively arranged at two sides of the opening, and the inlet and the outlet of the cooling medium channel are respectively connected with the connecting seat to form the high-frequency coil for simultaneously drawing the plurality of silicon cores.
The high-frequency coil simultaneously drawing the plurality of silicon cores is characterized in that the openings are any one of Y-shaped openings, inclined openings or straight openings.
The high-frequency coil simultaneously drawing the plurality of silicon cores is characterized in that a cooling medium channel is arranged on the right side surface or the left side surface of the high-frequency coil body, the cooling medium channel is formed by arranging a cooling medium passage on the right side surface or the left side surface of the high-frequency coil body, grooves sunken to the radial guide grooves are respectively arranged on the cooling medium passage corresponding to the ends of the radial guide grooves, and a cooling medium passage cover plate and a raised cover plate are respectively arranged on the cooling medium passage and the grooves.
The high-frequency coil simultaneously drawing a plurality of silicon cores is characterized in that a replacing structure of a cooling medium channel is arranged on the right side surface or the left side surface of a high-frequency coil body, the replacing structure of the cooling medium channel is that a cooling medium passage is arranged on the right side surface or the left side surface of the high-frequency coil body, grooves sunken to radial guide grooves are respectively arranged on the cooling medium passage corresponding to the ends of the radial guide grooves, copper pipes attached to the cooling medium passage and the inner side walls of the grooves are arranged in the cooling medium passage and the grooves, the copper pipes are welded in the cooling medium passage and the grooves through brazing or silver soldering, and two ends of each copper pipe are respectively an inlet and an outlet of a cooling medium.
The high-frequency coil is characterized in that a plurality of silicon cores are simultaneously drawn, a cooling medium channel is arranged on the outer edge surface of a high-frequency coil body, a concave groove is formed in the outer edge surface of the high-frequency coil body, a drainage groove which is concave towards the radial guide groove is formed in the concave groove and corresponds to the end of the radial guide groove, a cover plate is arranged on the concave groove and the drainage groove through brazing or silver soldering, or a copper pipe which is attached to the inner side wall of the concave groove and the inner side wall of the drainage groove is arranged in the concave groove and the drainage groove, the copper pipe is welded in the concave groove and the drainage groove through brazing or silver soldering, and the two end parts of the copper pipe are respectively an inlet and an outlet of the cooling medium.
And the outer end of the radial diversion trench is provided with a circular end hole or an elliptical end hole.
And a plurality of high-frequency coils of the silicon core are simultaneously drawn, and a high-frequency coil body on the right side surface of each drawing hole A is provided with a lower drawing hole conical surface.
And a plurality of high-frequency coils of the silicon core are simultaneously drawn, and the high-frequency coil body on the left side surface of each drawing hole A is provided with a conical surface on the drawing hole.
The high-frequency coils for simultaneously drawing the silicon cores are provided with rotary notches at one side of the drawing hole A facing the drawing hole or the material melting hole; or one side of the drawing hole or the material melting hole is provided with a V-shaped notch; or a drainage groove is arranged on one side of the drawing hole or the material melting hole.
And the high-frequency coil body on the right side surface of the drawing hole or the material melting hole is provided with a lower conical surface of the drawing hole or the material melting hole.
And the high-frequency coil body on the left side surface of the drawing hole or the material melting hole is provided with a conical surface on the drawing hole or the material melting hole.
The high-frequency coil simultaneously drawing the plurality of silicon cores is characterized in that a wiring board is arranged on the outer edge surface of the high-frequency coil main body.
The high-frequency coils for simultaneously drawing the plurality of silicon cores are characterized in that a water inlet pipeline is arranged between the inlet of the cooling medium channel and the connecting seat, and a water outlet pipeline is arranged between the outlet of the cooling medium channel and the connecting seat.
Due to the adoption of the technical scheme, the utility model discloses following beneficial effect has:
the utility model discloses a set up a plurality of drawing hole A in the high frequency coil main part, then set up coolant drainage channel on coolant channel, with coolant to the drainage of high frequency coil middle part, drawing and reducing the purpose of high frequency coil middle part temperature when realizing many silicon cores, the effectual life who improves high frequency coil, the utility model has the characteristics of simple structure, it is convenient to make, is particularly suitable for popularizing in the polycrystalline silicon trade and implements.
[ description of the drawings ]
FIG. 1 is a schematic view of a three-dimensional structure of a high-frequency coil for simultaneously drawing five or six silicon cores according to the present invention;
FIG. 2 is a schematic view showing another direction of the high frequency coil for simultaneously drawing five or six silicon cores according to the present invention;
FIG. 3 is a schematic structural diagram of the high frequency coil for simultaneously drawing five or six silicon cores according to the present invention;
FIG. 4 is a schematic diagram of a side view of the high frequency coil for simultaneously drawing five or six silicon cores according to the present invention;
FIG. 5 is a schematic view of the structure of a weld of a high-frequency coil for simultaneously drawing five or six silicon cores according to the present invention;
FIG. 6 is a schematic structural view of a spiral notch formed in the middle drawing hole A of the present invention;
FIG. 7 is a schematic view of a drop-shaped drawing hole formed by the drawing hole A and the V-shaped notch of the present invention;
FIG. 8 is a schematic view of a structure of a racket-shaped drawing hole formed by the drawing hole A and the drainage groove;
FIG. 9 is a schematic view of the structure of the present invention with an oblique opening;
FIG. 10 is a schematic view of the structure of the present invention in which the opening is a straight opening;
fig. 11 is a schematic structural view of the circular end hole formed at the outer end of the middle guide groove of the present invention;
fig. 12 is a schematic structural view of the outer end of the middle diversion trench of the present invention being provided with an elliptical end hole;
fig. 13 is a schematic view of a double-semicircle three-dimensional structure of the middle connection seat of the present invention;
in the figure: 1. a wiring board; 2. a high-frequency coil main body; 3. drawing a hole A; 4. drawing a lower conical surface of the hole; 5. radial diversion trenches; 6. drawing holes or material melting holes; 7. drawing a lower conical surface of the hole or the material dissolving hole; 8. a recessed plane; 9. a Y-shaped opening; 10. a water inlet pipeline; 11. a water outlet pipeline; 12. a connecting seat; 13. drawing a conical surface on the hole; 14. drawing a conical surface on the hole or the material melting hole; 15. a cooling medium passage cover plate; 16. a raised cover plate; 17. connecting holes; 18. a cooling medium passage; 19. a groove; 20. a V-shaped weld; 21. performing rotary notching; 22. a V-shaped notch; 23. a drainage groove; 24. an oblique opening; 25. a straight opening; 26. a circular end hole; 27. an elliptical end hole.
[ detailed description ] embodiments
The present invention will be further described with reference to the following examples; the following examples are not intended to limit the present invention, and only serve as a means for supporting the implementation of the present invention, and any equivalent structural replacements within the technical framework disclosed by the present invention are all the protection scope of the present invention;
it should be noted that the directions or positional relationships indicated by "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., used in describing the structure of the present invention are based on the directions or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the features referred to must have a specific direction, be constructed and operated in a specific direction, and thus, should not be construed as limiting the present invention.
The high-frequency coil capable of simultaneously drawing a plurality of silicon cores comprises a high-frequency coil body 2, drawing holes A3, drawing holes or material melting holes 6, radial diversion trenches 5 and openings, wherein the high-frequency coil body 2 is of a circular structure, a wiring board 1 for connecting a ground wire is arranged on the outer edge surface of the high-frequency coil body 2, a connecting hole 17 is arranged on the wiring board 1, the drawing holes or material melting holes 6 are arranged in the middle of the high-frequency coil body 2, a drawing hole or material melting hole lower conical surface 7 is arranged on the high-frequency coil body 2 on the right side surface of the drawing holes or material melting holes 6, a drawing hole or material melting hole upper conical surface 14 is arranged on the high-frequency coil body 2 on the left side surface of the drawing holes or material melting holes 6, so that the thickness of the cutting edge of the drawing holes or material melting holes 6 can be reduced, at least two drawing holes A3 are arranged on the high-frequency coil body 2 on the periphery of the drawing holes or material melting holes 6, in specific implementation, the shape of the drawing hole a can be selected to be circular, and a rotary cut 21 can be arranged on one side of the drawing hole a3 facing the drawing hole or the material melting hole 6; or a drop-shaped drawing hole A formed by a V-shaped notch 22 is arranged on one side of the drawing hole or the material melting hole 6; or one side of the drawing hole or the material melting hole 6 is provided with a racket-shaped drawing hole A formed by the drainage groove 23; the high-frequency coil body 2 on the right side surface of each drawing hole A3 is provided with a drawing hole lower conical surface 4, the high-frequency coil body 2 on the left side surface of each drawing hole A3 is provided with a drawing hole upper conical surface 13, and the drawing hole lower conical surface 4 and the drawing hole upper conical surface 13 are arranged for reducing the thickness of the cutting edge of the drawing hole A3; an opening penetrating to the outer edge surface of the high-frequency coil body is arranged on the inner edge surface of the drawing hole or the material melting hole 6, the shape of the opening is any one of a Y-shaped opening 9, an inclined opening 24 or a straight opening 25, in specific implementation, when the Y-shaped opening 9 is selected, the opening end of the Y-shaped opening 9 is connected with the outer edge surface of the high-frequency coil body 2, specifically, as shown in figure 1, a radial diversion trench 5 is arranged on the inner edge surface of the drawing hole or the material melting hole 6, in implementation, a circular end hole 26 or an elliptical end hole 27 can be arranged at the outer end of the radial diversion trench 5, the radial diversion trench 5 extends outwards from the drawing hole or the material melting hole 6 to between every two drawing holes A3 except the opening, a concave plane 8 sinking towards the center is arranged on the right side surface of the high-frequency coil body 2, and a cooling medium channel is arranged on the right side surface or the left side surface or the outer edge surface of the high-frequency coil body 2, cooling medium flow guide channels which are sunken towards the radial flow guide grooves 5 are respectively arranged on the cooling medium channels corresponding to the ends of the radial flow guide grooves 5, inlets and outlets of the cooling medium channels are respectively arranged at two sides of the openings, and the inlets and outlets of the cooling medium channels are respectively connected with the connecting seats 12 to form the high-frequency coil for simultaneously drawing the plurality of silicon cores.
In specific implementation, a water inlet pipeline 10 is arranged between the inlet of the cooling medium channel and the connecting seat 12, and a water outlet pipeline 11 is arranged between the outlet of the cooling medium channel and the connecting seat 12.
Further, as shown in fig. 3 and 4, a cooling medium passage is provided on the right side surface or the left side surface of the high-frequency coil body 2, the cooling medium passage is provided with a cooling medium passage 18 on the right side surface or the left side surface of the high-frequency coil body 2, a groove 19 recessed toward the radial guide groove 5 is provided on the cooling medium passage 18 at a position corresponding to the end of the radial guide groove 5, and a cooling medium passage cover plate 15 and a convex cover plate 16 are provided on the cooling medium passage 18 and the groove 19, respectively; the replacement structure of the cooling medium channel is characterized in that a cooling medium passage 18 is arranged on the right side surface or the left side surface of the high-frequency coil body 2, grooves 19 which are sunken towards the radial guide grooves 5 are respectively arranged on the cooling medium passage 18 corresponding to the ends of the radial guide grooves 5, copper pipes which are attached to the inner side walls of the cooling medium passage 18 and the grooves 19 are arranged in the cooling medium passage 18 and the grooves 19, the copper pipes are welded in the cooling medium passage 18 and the grooves 19 through brazing or silver welding, and two ends of each copper pipe are respectively an inlet and an outlet of the cooling medium. Be equipped with the coolant passageway on the outer fringe face of high frequency coil main part 2, the coolant passageway is equipped with the depressed groove for being equipped with on the outer fringe face of high frequency coil main part 2, corresponds radial guiding gutter 5 end punishment on the depressed groove and is equipped with the drainage groove that is sunken to radial guiding gutter 5 respectively, is equipped with the apron through brazing or silver-colored welding on depressed groove and drainage groove, or is equipped with the copper pipe with the laminating of depressed groove and drainage inslot lateral wall in depressed groove and drainage inslot, welds the copper pipe in depressed groove and drainage inslot through brazing or silver-colored welding, the both ends head of copper pipe is coolant's import and export respectively.
In specific implementation, when brazing or silver welding is adopted, the welding seams of the cooling medium passage cover plate 15, the convex cover plate 16, the cooling medium passage 18 and the groove 19 are in the form of V-shaped welding seams 20 or rectangular welding seams or trapezoidal welding seams.
The high-frequency coil for simultaneously drawing a plurality of silicon cores is described by combining the attached drawings 1, 2 and 3, the drawing holes A3 are five, five or six silicon cores can be simultaneously drawn, the high-frequency coil comprises a high-frequency coil main body 2, drawing holes A3, drawing holes or chemical material holes 6, radial diversion trenches 5 and openings, the drawing holes or chemical material holes 6 are arranged in the middle of the high-frequency coil main body 2, five drawing holes A3 are uniformly distributed on the high-frequency coil main body 2 at the periphery of the drawing holes or chemical material holes 6, the openings penetrating through the outer edge surface of the high-frequency coil main body are arranged on the inner edge surface of the drawing holes or chemical material holes 6, the radial diversion trenches 5 are extended outwards from the drawing holes or chemical material holes 6 to the positions between every two drawing holes A3 except the openings, a concave plane 8 towards the center position is arranged on the right side of the high-frequency coil main body 2, a cooling medium channel is arranged on the right side surface or the left side surface or the outer edge surface of the high-frequency coil main body 2, cooling medium drainage channels which are sunken towards the radial diversion trenches 5 are respectively arranged on the cooling medium channel corresponding to the ends of the radial diversion trenches 5, the inlet and the outlet of the cooling medium channel are respectively arranged on two sides of the opening, and the inlet and the outlet of the cooling medium channel are respectively connected with the connecting seat 12 to form the high-frequency coil which simultaneously draws five or six silicon cores.
With reference to fig. 1, 2, 3 and 13, the shape of the connecting seat 12 may be square or double-semicircular, and the specific selection is selected according to the shape of the coaxial cable;
the utility model discloses a use as follows:
firstly, a raw material rod is conveyed to the lower part of a high-frequency coil, the lower part of the high-frequency coil is a concave plane 8, the distance between the raw material rod and the high-frequency coil is better, but the raw material rod cannot be in contact with the bottom surface of the high-frequency coil, then a water inlet pipeline on the high-frequency coil is electrified to supply water and a water outlet pipeline is electrified to drain water, high-frequency current on the high-frequency coil after the high-frequency coil is electrified to drain water promotes the high-frequency coil to generate strong magnetic lines of force, the part of the upper end of the raw material rod, which is close to the high-frequency coil, is subjected to induction heating by the magnetic lines of force, the high-frequency coil is cooled by cooling medium in a cooling medium channel, after the part of the end of the raw material rod, which is close to the lower part of the high-frequency coil, is melted, a seed crystal chuck descends with the, but the raw material rod thereof must not come into contact with the high-frequency coil; since the end of the starting rod may not be flat, the underside of the high-frequency coil is designed as a depression plane 8, which has the effect of bringing the starting rod as much as possible into proximity with the lower side of the high-frequency coil, and the upward depression of the step surface also has the effect of a heating ring; a cooling medium drainage channel is arranged on the high-frequency coil, so that the cooling medium is cooled to the middle of the high-frequency coil as much as possible, and the effect of uniform heating is realized; after the melting area at the upper part of the raw material rod is driven by the adhesion of the seed crystal and passes through a high-frequency coil drawing hole A3, the melting area is condensed due to the weakening of magnetic lines of force, so that a new columnar crystal is formed, and the seed crystal is carried by the seed crystal chuck to slowly rise, so that a finished silicon core with the required length can be formed.
The part of the utility model not detailed is prior art.
The embodiments selected for the purpose of disclosing the invention are presently considered to be suitable, however, it should be understood that the invention is intended to cover all variations and modifications of the embodiments that fall within the scope of the inventive concept and invention.
Claims (13)
1. The utility model provides a high frequency coil of drawing many silicon cores simultaneously, includes high frequency coil main part (2), draws hole A (3), draws hole or material melting hole (6), radial guiding gutter (5) and opening, characterized by: a drawing hole or a material melting hole (6) is arranged in the middle of the high-frequency coil body (2), at least two drawing holes A (3) are arranged on the high-frequency coil body (2) at the periphery of the drawing hole or the material melting hole (6), an opening penetrating to the outer edge surface of the high-frequency coil body is arranged on the inner edge surface of the drawing hole or the material melting hole (6), a radial diversion trench (5) is arranged on the inner edge surface of the drawing hole or the material melting hole (6), the radial diversion trench (5) extends outwards from the drawing hole or the material melting hole (6) to a position between every two drawing holes A (3) except the opening, a sunken plane (8) sunken towards the center position is arranged on the right side surface of the high-frequency coil body (2), a cooling medium channel is arranged on the right side surface or the left side surface or the outer edge surface of the high-frequency coil body (2), and radial cooling medium channels sunken towards the diversion trench (5) are respectively arranged on the cooling medium channel corresponding to the ends of the radial diversion trench (5), and the inlet and the outlet of the cooling medium channel are respectively arranged at two sides of the opening, and the inlet and the outlet of the cooling medium channel are respectively connected with the connecting seat (12) to form the high-frequency coil for simultaneously drawing the plurality of silicon cores.
2. The high-frequency coil for simultaneously drawing a plurality of silicon cores as claimed in claim 1, wherein: the shape of the opening is any one of a Y-shaped opening (9), an inclined opening (24) or a straight opening (25).
3. The high-frequency coil for simultaneously drawing a plurality of silicon cores as claimed in claim 1, wherein: the cooling medium channel is characterized in that a cooling medium channel is arranged on the right side face or the left side face of the high-frequency coil body (2), the cooling medium channel is formed by arranging a cooling medium channel (18) on the right side face or the left side face of the high-frequency coil body (2), grooves (19) which are sunken towards the radial guide grooves (5) are respectively formed in the cooling medium channel (18) corresponding to the ends of the radial guide grooves (5), and a cooling medium channel cover plate (15) and a convex cover plate (16) are respectively arranged on the cooling medium channel (18) and the grooves (19).
4. The high-frequency coil for simultaneously drawing a plurality of silicon cores as claimed in claim 1, wherein: the replacement structure of the cooling medium channel is characterized in that the right side face or the left side face of the high-frequency coil body (2) is provided with the cooling medium channel (18), grooves (19) which are sunken towards the radial guide grooves (5) are respectively formed in the cooling medium channel (18) corresponding to the ends of the radial guide grooves (5), copper pipes which are attached to the inner side walls of the cooling medium channel (18) and the grooves (19) are arranged in the cooling medium channel (18) and the grooves (19), the copper pipes are welded in the cooling medium channel (18) and the grooves (19) through brazing or silver welding, and two ends of each copper pipe are respectively an inlet and an outlet of the cooling medium.
5. The high-frequency coil for simultaneously drawing a plurality of silicon cores as claimed in claim 1, wherein: be equipped with the coolant passageway on the outer fringe face of high frequency coil main part (2), the coolant passageway is equipped with the depressed groove for being equipped with on the outer fringe face of high frequency coil main part (2), corresponds radial guiding gutter (5) end punishment on the depressed groove and do not is equipped with the drainage groove sunken to radial guiding gutter (5), is equipped with the apron through brazing or copper welding or silver-colored welding on depressed groove and drainage groove, or is equipped with the copper pipe with the laminating of depressed groove and drainage inslot lateral wall in depressed groove and drainage inslot, welds the copper pipe in depressed groove and drainage inslot through brazing or copper welding or silver-colored welding, the both ends head of copper pipe is coolant's import and export respectively.
6. The high-frequency coil for simultaneously drawing a plurality of silicon cores as claimed in claim 1, wherein: and a circular end hole (26) or an elliptical end hole (27) is formed in the outer end of the radial guide groove (5).
7. The high-frequency coil for simultaneously drawing a plurality of silicon cores as claimed in claim 1, wherein: the high-frequency coil body (2) on the right side surface of each drawing hole A (3) is provided with a drawing hole lower conical surface (4).
8. The high-frequency coil for simultaneously drawing a plurality of silicon cores as claimed in claim 1, wherein: the high-frequency coil body (2) on the left side surface of each drawing hole A (3) is provided with a drawing hole upper conical surface (13).
9. The high-frequency coil for simultaneously drawing a plurality of silicon cores as claimed in claim 1, wherein: a rotary cut (21) is arranged on one side of the drawing hole A (3) facing the drawing hole or the material melting hole (6); or one side of the drawing hole or the material melting hole (6) is provided with a V-shaped notch (22); or a drainage groove (23) is arranged on one side of the drawing hole or the material melting hole (6).
10. The high-frequency coil for simultaneously drawing a plurality of silicon cores as claimed in claim 1, wherein: and a lower conical surface (7) of the drawing hole or the material melting hole is arranged on the high-frequency coil main body (2) on the right side surface of the drawing hole or the material melting hole (6).
11. The high-frequency coil for simultaneously drawing a plurality of silicon cores as claimed in claim 1, wherein: and a drawing hole or material melting hole upper conical surface (14) is arranged on the high-frequency coil main body (2) on the left side surface of the drawing hole or material melting hole (6).
12. The high-frequency coil for simultaneously drawing a plurality of silicon cores as claimed in claim 1, wherein: and a wiring board (1) is arranged on the outer edge surface of the high-frequency coil main body (2).
13. The high-frequency coil for simultaneously drawing a plurality of silicon cores as claimed in claim 1, wherein: a water inlet pipeline (10) is arranged between the inlet of the cooling medium channel and the connecting seat (12), and a water outlet pipeline (11) is arranged between the outlet of the cooling medium channel and the connecting seat (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020408737.8U CN212316284U (en) | 2020-03-26 | 2020-03-26 | High-frequency coil for simultaneously drawing multiple silicon cores |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020408737.8U CN212316284U (en) | 2020-03-26 | 2020-03-26 | High-frequency coil for simultaneously drawing multiple silicon cores |
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| CN212316284U true CN212316284U (en) | 2021-01-08 |
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| CN202020408737.8U Active CN212316284U (en) | 2020-03-26 | 2020-03-26 | High-frequency coil for simultaneously drawing multiple silicon cores |
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2020
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