CN212305973U

CN212305973U - Adsorbable miniature radiator

Info

Publication number: CN212305973U
Application number: CN202021076758.0U
Authority: CN
Inventors: 李伟良
Original assignee: Shenzhen Youruigu Technology Co ltd
Current assignee: Shenzhen Youruigu Technology Co ltd
Priority date: 2020-06-11
Filing date: 2020-06-11
Publication date: 2021-01-05
Anticipated expiration: 2030-06-11

Abstract

The utility model provides an adsorbable miniature radiator, which comprises an adsorption panel, wherein the adsorption panel is made of a high-flexibility panel material with a U-shaped recess on the surface after foaming, and a smoothing agent is brushed on the side of the panel material with the U-shaped recess; the utility model provides a miniature radiator main part comprises bottom plate and casing, is equipped with the refrigeration chip on the bottom plate, is located to be equipped with chip radiator fan on the refrigeration chip, and the installation hole site has been seted up all around to the bottom plate, and on the casing passed through fix with rivet on the bottom plate, adsorption panel pasted through the powerful glue and deviates from in the bottom plate casing one side, the utility model discloses an adsorption panel makes miniature radiator can directly adsorb on the cell-phone backshell, has promoted the convenience of radiator greatly, and has not had the position restriction of traditional buckle form, makes the radiator can be applicable to various types of models, and can place the radiator to all kinds of model CPU's position, has promoted the radiating efficiency.

Description

Adsorbable miniature radiator

Technical Field

The utility model relates to a digital electronic technology field, concretely relates to adsorbable miniature radiator.

Background

The common external radiator of the mobile phone on the market generally adopts a fan or a refrigeration chip to cool the mobile phone, and the fixing mode is mostly fixed on the mobile phone in a buckling mode, but the mode has the following disadvantages: firstly, most of the positions of the buckles are fixed, and although the buckles can be stretched to a certain degree, the buckles can not be applied to various mobile phones, so that the positions of the buckles and the sizes of the radiators need to be adjusted according to different types of the mobile phones, and the universality is low; secondly, the fan position or the refrigeration chip position of the buckle type radiator is fixed, but the CPU positions of different machine types are different, so that the heat dissipation effect is poor; finally, the process of assembling and disassembling the buckle is complicated, and the operation is inconvenient.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art's not enough, provide an adsorbable miniature radiator.

The technical scheme of the utility model as follows:

an adsorbable micro heat sink comprising:

the adsorption panel is composed of a high-flexibility plate material with a U-shaped recess on the surface after foaming, and a smoothing agent is brushed on the surface of the plate material with the U-shaped recess.

The utility model discloses in, adsorbable miniature radiator still includes a miniature radiator main part, comprises bottom plate and casing, be equipped with the refrigeration chip on the bottom plate, be located be equipped with chip radiator fan on the refrigeration chip, the installation hole site has been seted up all around to the bottom plate, the casing passes through fix with rivet on the bottom plate.

Furthermore, the adsorption panel is adhered to one side of the bottom plate, which is far away from the shell, through the strong glue.

In the present invention, the high flexibility panel material is a polyurethane material.

In the present invention, the smoothing agent is a bis-amino functional silicone emulsion.

The utility model discloses in, refrigeration chip one side is equipped with the USB interface, just is in USB power supply hole site has been seted up to relevant position on the casing.

The utility model discloses in, casing top and both sides are equipped with the louvre.

Compared with the prior art, the beneficial effects of the utility model reside in that:

the utility model discloses a be the face that has the U-shaped recess with its surface foaming by the polyurethane material, and brush the absorption panel that the two amino functional group organosilicon emulsions made on its surface, pass through the powerful glue with this absorption panel and paste on miniature radiator bottom plate, make this miniature radiator can directly adsorb on the cell-phone backshell, the convenience of radiator has been promoted greatly, and the position restriction that has not had traditional buckle form, make the radiator can be applicable to various types of models, and can place the radiator to all kinds of model CPU's position, the radiating efficiency has been promoted by a wide margin.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a structural diagram of an adsorbable micro heat sink according to the present invention;

FIG. 2 is another perspective view of the micro heat sink;

the reference numerals are explained below:

1. an adsorption panel; 2. a base plate; 21. mounting hole sites; 3. a housing; 31. a USB power supply hole site; 32. and (4) heat dissipation holes.

Detailed Description

In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the present invention.

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In order to explain the technical solution of the present invention, the following description is made by using specific examples.

Examples

Referring to fig. 1 and fig. 2, the present invention provides an adsorbable micro heat sink, including:

an adsorption panel 1, by foaming the surface has U-shaped sunken high compliance plate material to form, and brush the smoothing agent on the plate material has U-shaped sunken one side, realize the adsorption performance through the U-shaped sunken realization on the material cooperation surface of high compliance, in addition the smoothing agent makes the whole smoother of adsorption panel, can adsorb and take down repeatedly.

In this embodiment, the adsorbable miniature radiator further comprises a miniature radiator main body which is composed of a bottom plate 2 and a shell 3, wherein a refrigeration chip (not shown) is arranged on the bottom plate 2, a chip heat radiation fan (not shown) is arranged on the refrigeration chip, mounting hole sites 21 are arranged around the bottom plate 2, the shell 3 is fixed on the bottom plate 2 through rivets, and a high-efficiency refrigeration effect is realized by matching the refrigeration chip with the chip heat radiation fan.

Further, the adsorption panel 1 is adhered to the side of the bottom plate 2 departing from the shell 3 through strong glue.

The utility model discloses in, high compliance panel material is the polyurethane material.

The utility model discloses in, refrigeration chip one side is equipped with the USB interface, and has seted up USB power supply hole site 31 in the relevant position on casing 3.

The utility model discloses in, casing 3 top and both sides are equipped with louvre 32.

While the present invention has been described with reference to several exemplary embodiments, it is understood that the terminology used is intended to be in the nature of words of description and illustration, rather than of limitation. As the present invention may be embodied in several forms without departing from the spirit or essential characteristics thereof, it should also be understood that the above-described embodiments are not limited by any of the details of the foregoing description, but rather should be construed broadly within its spirit and scope as defined in the appended claims, and therefore all changes and modifications that fall within the meets and bounds of the claims, or equivalences of such meets and bounds are therefore intended to be embraced by the appended claims.

Claims

1. An adsorbable miniature radiator is characterized by comprising an adsorption panel, wherein the adsorption panel is made of a high-flexibility plate material with a U-shaped recess on the surface after foaming, and a smoothing agent is brushed on the surface of the plate material with the U-shaped recess.

2. The adsorbable minisize heat sink of claim 1, wherein the adsorbable minisize heat sink further comprises a minisize heat sink main body composed of a bottom plate and a shell, the bottom plate is provided with a refrigeration chip, the refrigeration chip is provided with a chip heat dissipation fan, the bottom plate is provided with mounting holes around, and the shell is fixed on the bottom plate through rivets.

3. The adsorbable micro heat sink of claim 2, wherein the adsorption panel is adhered to a side of the base plate facing away from the housing by a super glue.

4. An adsorbable micro heat sink according to claim 1, wherein the high flexibility panel material is a polyurethane material.

5. The adsorbable micro heat sink of claim 1, wherein the smoothing agent is a bis-amino-functional silicone emulsion.

6. The adsorbable minisize heat sink of claim 2, wherein a USB port is provided at one side of the refrigeration chip, and a USB power supply hole is provided at a corresponding position on the housing.

7. The adsorbable micro heat sink of claim 2, wherein the top and two sides of the housing are provided with heat dissipation holes.