CN212277212U - Integrated equipment for sorting solar cell silicon wafers and carving codes by laser - Google Patents
Integrated equipment for sorting solar cell silicon wafers and carving codes by laser Download PDFInfo
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- CN212277212U CN212277212U CN202021073615.4U CN202021073615U CN212277212U CN 212277212 U CN212277212 U CN 212277212U CN 202021073615 U CN202021073615 U CN 202021073615U CN 212277212 U CN212277212 U CN 212277212U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The utility model discloses an integral type equipment that sign indicating number was carved with laser to solar cell silicon chip is selected separately, be in including equipment frame and set gradually silicon chip sorting unit and laser in the equipment frame carves the sign indicating number device, silicon chip sorting unit and laser are carved and are provided with first conveyer between the sign indicating number device. The utility model discloses an integral type equipment of solar wafer, carve a yard device with silicon chip sorting unit and laser and pass through equipment frame integration in an equipment to carve yard device at silicon chip sorting unit and laser and increase first conveyer, the realization is sent into the qualified silicon chip after selecting separately and is carried out laser and carves the sign indicating number in carving yard device to laser, does not need artifical transmission in making the silicon chip sorting to the process that the sign indicating number was carved to laser, the silicon chip pollution and the latent piece or the piece that split that have avoided artifical transmission to cause.
Description
Technical Field
The utility model belongs to the technical field of photovoltaic module manufacture, concretely relates to solar cell silicon chip is selected separately and is carved integral type equipment of sign indicating number with laser.
Background
With the continuous acceleration of the global process of economy and the rapid development of industrial economy, the energy shortage and environmental pollution in the world have become important problems restricting the sustainable development of human society, and the vigorous development of renewable pollution-free energy is urgent. The inexhaustible and pollution-free characteristics of solar energy are paid more and more attention by governments and people, photovoltaic technology is continuously developed, and solar cell products serving as semiconductor devices for converting solar energy into electric energy are rapidly developed.
In the process of manufacturing solar cells, the requirements on cleanliness and automation degree in silicon wafer transmission are higher and higher. Currently, the equipment used in the production line has the following disadvantages: the silicon wafer sorting, laser code engraving and texturing feeding all need manual transmission of the silicon wafer, the manual transmission mode not only increases the labor cost, but also easily causes silicon wafer pollution and fragments, and influences the production efficiency and the product quality. Therefore, how to reduce manual transmission between the processes is crucial to the production of solar cells.
Disclosure of Invention
In view of this, in order to overcome prior art's defect, the utility model aims at providing a solar cell silicon chip is selected separately and laser carves integral type equipment of sign indicating number, and it can effectively reduce the silicon chip and select separately, laser carves the artifical transmission in sign indicating number and the making herbs into wool material loading process, has avoided the silicon chip that artifical transmission caused to pollute and hidden splitting or piece.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides an integral type equipment that sign indicating number is carved with laser to solar cell silicon chip is selected separately, includes the equipment frame and sets gradually silicon chip sorting unit and laser in the equipment frame carves the sign indicating number device, silicon chip sorting unit and laser are carved and are provided with first conveyer between the sign indicating number device.
The silicon chip sorting device is used for sorting the silicon chips, screening unqualified waste chips and qualified silicon chips, collecting the unqualified waste chips, and sending the qualified silicon chips into the laser code carving device through the first conveying device to be subjected to laser code carving. The silicon wafer sorting device and the laser code carving device are integrated in one device through a device frame, and the first conveying device is additionally arranged in the silicon wafer sorting device and the laser code carving device, so that sorted qualified silicon wafers are conveyed into the laser code carving device to be subjected to laser code carving, manual transmission is not needed in the process of sorting the silicon wafers into the laser code carving, and silicon wafer pollution, hidden cracking or fragmentation caused by manual transmission are avoided.
Preferably, the integrated equipment further comprises a texturing feeding mechanism arranged on one side, away from the silicon wafer sorting device, of the laser code engraving device, and a second conveying device is arranged between the texturing feeding mechanism and the laser code engraving device. And the second conveying device is used for conveying the silicon wafers subjected to laser code engraving to the texturing feeding mechanism for subsequent texturing feeding operation.
More preferably, the texturing feeding mechanism comprises a wafer collecting basket, and the wafer collecting basket is used for collecting the silicon wafers conveyed by the second conveying device. The silicon wafers are collected through the wafer collecting basket, and are subsequently and directly used for texturing and feeding, so that manual operation in conveying and collecting the silicon wafers is reduced.
More preferably, the first conveying device and the second conveying device both comprise a conveying belt and a driving mechanism for driving the conveying belt to operate. The driving mechanism drives the conveying belt to operate to drive the silicon wafer to convey.
Preferably, the silicon wafer sorting device comprises a conveying mechanism, a detection mechanism and a waste wafer collecting mechanism, the detection mechanism is used for detecting the silicon wafers on the conveying mechanism, the waste wafer collecting mechanism is used for collecting the silicon wafers which are not detected by the detection mechanism, and the first conveying device is used for conveying the silicon wafers detected by the detection mechanism to the laser code engraving device. The detection device detects the silicon wafers on the conveying mechanism, and if the indexes are unqualified, the conveying mechanism conveys the unqualified silicon wafers to the waste wafer collecting mechanism; if the index is qualified, the qualified silicon chip is transmitted to the laser code-engraving device by using the first transmission device to perform laser code-engraving.
Preferably, the laser code-engraving device comprises a laser code-engraving device and a code-reading device, wherein the laser code-engraving device is used for performing laser code-engraving on the silicon chip transmitted by the first transmission device, so that the silicon chip has a unique identification code; the code reader is used for reading the identification code of each silicon chip so as to trace the whole process.
More preferably, the identification code is a two-dimensional code or a bar code.
Preferably, the integrated equipment is provided with two sets of laser code carving devices and two sets of texturing and feeding mechanisms. Two sets of laser code carving devices and a texturing feeding mechanism are arranged in the equipment frame, so that the efficiency can be effectively improved.
Compared with the prior art, the utility model discloses an useful part lies in: the utility model discloses an integral type equipment of solar wafer, carve a yard device with silicon chip sorting unit and laser and pass through equipment frame integration in an equipment to carve yard device at silicon chip sorting unit and laser and increase first conveyer, the realization is sent into the qualified silicon chip after selecting separately and is carried out laser and carves the sign indicating number in carving yard device to laser, does not need artifical transmission in making the silicon chip sorting to the process that the sign indicating number was carved to laser, the silicon chip pollution and the latent piece or the piece that split that have avoided artifical transmission to cause.
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In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic plan view of an integrated apparatus for solar cell silicon wafer sorting and laser code scribing provided by an embodiment of the present invention.
Wherein the reference numerals include: the method comprises the following steps of 1-silicon wafer sorting area, 2-silicon wafer sorting device, 3-laser code carving area, 4-laser code scanner, 5-code reader, 6-texturing feeding area, 7-wafer collecting basket, 8-first conveying device and 9-second conveying device.
Detailed Description
In order to make the technical solution of the present invention better understood, the technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.
Referring to the attached drawing 1, this embodiment solar cell silicon chip selects separately and sign indicating number integral type equipment is carved to laser, including equipment frame and set gradually silicon chip sorting unit 2, the sign indicating number device is carved to laser and making herbs into wool feed mechanism in equipment frame, correspond foretell silicon chip sorting unit 2, the sign indicating number device is carved to laser and making herbs into wool feed mechanism, integral type equipment mainly includes following three functional area: the silicon wafer sorting device comprises a silicon wafer sorting area 1 provided with a silicon wafer sorting device 2, a laser code carving area 3 provided with a laser code carving device and a texturing feeding area 6 provided with a texturing feeding mechanism. In the integrated equipment in this embodiment, two sets of laser code engraving devices are provided in the laser code engraving region 3, and two sets of texturing feeding mechanisms are provided in the texturing feeding region 6. Two sets of laser code carving devices and a texturing feeding mechanism are arranged in the equipment frame, so that the efficiency can be effectively improved.
A first conveying device 8 is arranged between the silicon wafer sorting device 2 and the laser code engraving device, and a second conveying device 9 is arranged between the laser code engraving device and the texturing feeding mechanism. The first conveying device 8 is used for conveying the sorted qualified silicon wafers into the laser code carving device for laser code carving, and the second conveying device 9 is used for conveying the silicon wafers subjected to laser code carving to the texturing feeding mechanism for subsequent texturing feeding operation.
The silicon wafer sorting area 1 is used for testing and sorting the original silicon wafers from the raw materials before production and feeding, unqualified silicon wafers are removed, qualified silicon wafers can be produced subsequently, and all qualified silicon wafers flow into the laser code carving area 3 for code carving.
The silicon wafer sorting device 2 comprises a conveying mechanism, a detection mechanism and a waste wafer collecting mechanism, the detection mechanism is used for detecting the silicon wafers on the conveying mechanism, the waste wafer collecting mechanism is used for collecting the silicon wafers which are not detected by the detection mechanism, and the first conveying device 8 is used for conveying the silicon wafers detected by the detection mechanism to the laser code carving device. The detection device detects the silicon wafers on the conveying mechanism, and if the indexes are unqualified, the conveying mechanism conveys the unqualified silicon wafers to the waste wafer collecting mechanism; if the index is qualified, the first conveying device 8 is used for conveying the qualified silicon wafer to the laser code engraving device for laser code engraving.
The laser code-engraving device of the laser code-engraving region 3 comprises a laser code-engraving device 4 and a code-reading device 5, and is used for receiving qualified silicon wafers flowing into the silicon wafer sorting region 1, installing the laser code-engraving device 4 and the code-reading device 5 above the conveyor belt, and performing laser code-engraving and code-reading on the qualified silicon wafers. A two-dimensional code, a bar code or other type of identification code can be imprinted on the surface of the silicon wafer using the laser decoder 4. The identification code is positioned on the front side of the silicon chip, each silicon chip is provided with a unique identification code, and the identification codes can be effectively identified by the code reader 5. After the identification codes are engraved on the surface of the silicon wafer, the identification codes can correspond to the parameters of the silicon wafer one by one, so that the parameters of the raw material silicon wafer can be well monitored. If the quality problem of the subsequent battery piece occurs, the problem that whether the battery piece is a raw material or not can be quickly analyzed and checked through the identification code tracing. The code reader 5 is used for reading the identification code on the silicon chip after laser engraving and sending the data to a computer for storage so as to trace the whole process.
The texturing feeding mechanism comprises a wafer collecting flower basket 7, and the wafer collecting flower basket 7 is used for collecting the silicon wafers conveyed by the second conveying device 9. The silicon wafers are collected through the wafer collecting flower basket 7 and then directly used for texturing and feeding, so that manual operation in silicon wafer conveying and collecting is reduced. Namely, the texturing feeding area 6 is used for flowing the laser-engraved silicon wafers into the wafer collecting flower basket 7, so that the silicon wafers are all guided into the wafer collecting flower basket 7 for the production of the subsequent texturing process.
The first conveying device 8 and the second conveying device 9 both comprise a conveying belt and a driving mechanism for driving the conveying belt to operate. The driving mechanism drives the conveying belt to operate to drive the silicon wafer to convey.
The silicon wafer sorting device 2, the laser code engraving device and other devices or mechanisms with structures not specifically described in the above embodiments can all adopt conventional arrangements in the prior art.
The utility model discloses an integral type equipment that sign indicating number was carved with laser is selected separately to solar cell silicon chip optimizes through equipment integration, selects separately the silicon chip, the sign indicating number is beaten to laser and the material loading function of making herbs into wool integrates mutually, forms an integrative equipment. The silicon wafer sorting function: sorting incoming silicon wafers, sorting qualified silicon wafers and producing; the laser code engraving function is as follows: performing laser engraving on qualified silicon wafers to enable each silicon wafer to have a unique identification code, and tracing the whole process; the flocking and feeding functions are as follows: and (4) guiding the silicon wafer into a flower basket of texturing equipment, and carrying out subsequent texturing process production. Thus, manual transmission among the working procedures is reduced, and the automation degree of the equipment is improved. On one hand, the labor cost is reduced, and the production efficiency is improved; on the other hand, the risk that staff contact the silicon wafer and reduce silicon wafer pollution and fragments is reduced, and therefore product quality and yield are improved.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention, so as not to limit the protection scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (8)
1. The utility model provides an integral type equipment that solar cell silicon chip was selected separately and sign indicating number is carved to laser which characterized in that: the silicon wafer laser marking device comprises an equipment frame, and a silicon wafer sorting device and a laser marking device which are arranged in the equipment frame in sequence, wherein a first conveying device is arranged between the silicon wafer sorting device and the laser marking device.
2. The integrated apparatus of claim 1, wherein: the integrated equipment further comprises a texturing feeding mechanism, the laser code carving device is far away from one side of the silicon wafer sorting device, and a second conveying device is arranged between the texturing feeding mechanism and the laser code carving device.
3. The integrated apparatus of claim 2, wherein: and the texturing feeding mechanism comprises a wafer collecting flower basket which is used for collecting the silicon wafers conveyed by the second conveying device.
4. The integrated apparatus of claim 2, wherein: the first conveying device and the second conveying device both comprise conveying belts and driving mechanisms for driving the conveying belts to operate.
5. The integrated apparatus of claim 1, wherein: the silicon wafer sorting device comprises a conveying mechanism, a detection mechanism and a waste wafer collecting mechanism, wherein the detection mechanism is used for detecting a silicon wafer on the conveying mechanism, the waste wafer collecting mechanism is used for collecting a silicon wafer which does not pass through the detection mechanism, and the first conveying device is used for conveying the silicon wafer which passes through the detection mechanism to the laser code carving device.
6. The integrated apparatus of claim 1, wherein: the laser code carving device comprises a laser code carving device and a code reading device, wherein the laser code carving device is used for carrying out laser code carving on the silicon chip transmitted by the first transmission device, so that the silicon chip has a unique identification code; the code reader is used for reading the identification code of each silicon chip.
7. The integrated apparatus of claim 6, wherein: the identification code is a two-dimensional code or a bar code.
8. The integrated apparatus of claim 2, wherein: the integrated equipment is provided with two sets of laser code carving devices and two sets of texturing and feeding mechanisms.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202021073615.4U CN212277212U (en) | 2020-06-11 | 2020-06-11 | Integrated equipment for sorting solar cell silicon wafers and carving codes by laser |
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| CN202021073615.4U CN212277212U (en) | 2020-06-11 | 2020-06-11 | Integrated equipment for sorting solar cell silicon wafers and carving codes by laser |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115020540A (en) * | 2022-05-30 | 2022-09-06 | 晶科能源股份有限公司 | Silicon wafer manufacturing method and silicon wafer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115020540A (en) * | 2022-05-30 | 2022-09-06 | 晶科能源股份有限公司 | Silicon wafer manufacturing method and silicon wafer |
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