CN212239538U - Temperature control device for reflow soldering - Google Patents
Temperature control device for reflow soldering Download PDFInfo
- Publication number
- CN212239538U CN212239538U CN202020988650.2U CN202020988650U CN212239538U CN 212239538 U CN212239538 U CN 212239538U CN 202020988650 U CN202020988650 U CN 202020988650U CN 212239538 U CN212239538 U CN 212239538U
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- temperature
- heat dissipation
- controller
- reflow soldering
- control device
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Abstract
The utility model is suitable for a reflow soldering accuse temperature technical field, the utility model provides a temperature regulating device of reflow soldering, which comprises a controller, the controller is installed on the installation baffle, the position at four angles of installation baffle is equipped with the bolt hole respectively, the controller is from taking touch display screen, can manual edit temperature-time control curve, the middle part of installation baffle is passed by heat dissipation pipeline and middleware, heat dissipation pipeline and middleware laminating, the right side of heat dissipation pipeline is connected with two radiator fan, the inside driving motor that is equipped with of radiator fan, driving motor's drive shaft has turbine fan blade, radiator fan's top is equipped with the louvre cover plate, the right side of middleware is equipped with heating pipe and temperature sensor, the thermovent of heat dissipation pipeline is equipped with the fin. The utility model discloses a can edit the temperature-time curve of reflow soldering welding intracavity from taking touch display screen controller, realize the accurate control of the temperature of reflow soldering welding intracavity.
Description
Technical Field
The utility model belongs to the technical field of reflow soldering accuse temperature, especially, relate to a temperature regulating device of reflow soldering.
Background
The electronic industry has been rapidly developed in the last 30 years, and miniaturized, integrated and scaled surface mount integrated circuit products are used on a large scale. IT is common in various industries, such as IT, automotive, and automation. Among them, reflow soldering is becoming the development direction and mainstream of electronic assembly technology in the future. The reflow soldering technology can effectively solder the chip components mounted on the bonding pads, and tends to gradually replace wave soldering. Reflow soldering belongs to a set of important welding equipment in the surface mounting technology, and is to cure a chip element device on a bonding pad of a PCB after raising the temperature to the temperature at which soldering tin is melted, so that the electrical welding of the PCB and components is realized. When the temperature control device works, the temperature curve must be controlled according to the standard temperature curve when the patch element is welded, the control requirements are the speed of temperature rise and the stable temperature value, and the accuracy and the stability of the temperature control value are the key points for ensuring good product production. Too high or too low temperature is liable to damage the processed components, which puts higher demands on temperature control of reflow soldering.
SUMMERY OF THE UTILITY MODEL
The utility model provides a temperature regulating device of reflow soldering aims at solving the problem that reflow soldering needs accurate, steady temperature control device.
The utility model is realized in such a way, a reflow soldering temperature control device, which is characterized in that the device comprises a controller, the controller is arranged on an installation clapboard, the positions of four corners of the installation clapboard are respectively provided with bolt holes, the controller is provided with a touch display screen and can manually edit a temperature-time control curve, the middle part of the installation clapboard is penetrated by a heat dissipation pipeline and an intermediate part, the heat dissipation pipeline is jointed with the intermediate part, the right side of the heat dissipation pipeline is connected with two heat dissipation fans, the inside of each heat dissipation fan is provided with a driving motor, the driving shaft of the driving motor is connected with a turbine fan blade, the top of each heat dissipation fan is provided with a heat dissipation hole cover plate, the right side of the intermediate part is provided with a heating pipe and a temperature sensor, the temperature sensor is electrically connected with the controller, the temperature sensor can detect the real-, and the temperature is transmitted to the controller, the heating pipe is electrically connected with the controller, the heating pipe receives a control signal reflected by the controller to heat, the driving shafts of the two cooling fans are also electrically connected with the controller, and cooling fins are arranged at a cooling port of the cooling pipeline.
Furthermore, the touch display screen of the controller can receive the temperature change in the reflow soldering cavity to edit the real-time temperature-time curve, and the real-time temperature-time curve is displayed on the touch display screen.
Furthermore, the material of the intermediate piece is graphite heat dissipation material.
Further, the heat dissipation pipe has a U-shape.
Furthermore, the heat dissipation fan is in a shape of a circular truncated cone, and the heating pipe is in a shape of a circle.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a can edit the temperature-time curve of reflow soldering intracavity from taking touch display screen controller, the data that the controller collected through temperature sensor differentiate reflow soldering intracavity temperature, and when the temperature was too high, controller control radiator fan drive turbine fan blade exhaust steam, when the temperature was low excessively, controller control heating pipe heated, realized the accurate control of temperature to the reflow soldering intracavity.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a left side view of the present invention;
fig. 3 is a plan view of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Please refer to fig. 1 to fig. 3; the utility model provides a pair of implement case: a temperature control device for reflow soldering is characterized by comprising a controller 11, wherein the controller 11 is installed on an installation clapboard 2, bolt holes 8 are respectively arranged at the positions of four corners of the installation clapboard 2, the controller 11 is provided with a touch display screen and can manually edit a temperature-time control curve, the middle part of the installation clapboard 2 is penetrated by a heat dissipation pipeline 3 and an intermediate part 4, the heat dissipation pipeline 3 is jointed with the intermediate part 4, the right side of the heat dissipation pipeline 3 is connected with two heat dissipation fans 1, a driving motor is arranged in each heat dissipation fan 1, a driving shaft of the driving motor is connected with a turbine fan blade 5, a heat dissipation hole cover plate 10 is arranged at the top of each heat dissipation fan 1, a heating pipe 7 and a temperature sensor 6 are arranged on the right side of the intermediate part 4, the temperature sensor 6 is electrically connected with the controller 11, the temperature sensor 6 can detect the real-time temperature in a reflow, the heating pipe 7 is electrically connected with the controller 11, the heating pipe 7 receives a control signal reflected by the controller 11 to heat, the driving shafts of the two cooling fans 1 are also electrically connected with the controller 11, and cooling fins 9 are arranged at a cooling opening of the cooling pipeline 3.
The controller 11 can receive the temperature change in the reflow soldering cavity from the touch display screen to edit a real-time temperature-time curve, and the real-time temperature-time curve is displayed on the touch display screen and used for editing and checking the temperature change in the reflow soldering cavity, the intermediate piece 4 is made of a graphite heat dissipation material, the heat dissipation of the heat dissipation pipeline 3 is accelerated, the heat dissipation pipeline 3 is prevented from being overheated, the heat dissipation pipeline 3 is U-shaped, the two heat dissipation channels are formed, the heat dissipation fan 1 is in a circular truncated cone shape, the heating pipe 7 is circular, and the circular shape has a large air contact area.
The utility model discloses a temperature sensor 6 can monitor real-time temperature, crosses when low when reflow soldering intracavity temperature, heats through the control signal that heating pipe 7 accepted 11 reflections of controller, and when reflow soldering intracavity temperature was too high, motor drive shaft in 11 control radiator fan 1 of controller, drive shaft drive turbine fan 5 steam of discharging outside to the reflow soldering chamber.
The utility model has the advantages that: the utility model discloses a can edit the temperature-time curve of reflow soldering intracavity from taking touch display screen controller 11, reflow soldering intracavity temperature is differentiateed through the data that temperature sensor 6 was collected to controller 11, and when the temperature was too high, controller 11 controls 1 drive turbine fan leaf 5 exhaust steam of radiator fan, and when the temperature was crossed low, controller 11 control heating pipe 7 heated, realized the accurate control of temperature to the reflow soldering intracavity.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (5)
1. The temperature control device for reflow soldering is characterized by comprising a controller (11), wherein the controller (11) is installed on an installation partition plate (2), bolt holes (8) are respectively arranged at the positions of four corners of the installation partition plate (2), the controller (11) is provided with a touch display screen, a temperature-time control curve can be manually edited, the middle part of the installation partition plate (2) is penetrated by a heat dissipation pipeline (3) and an intermediate piece (4), the heat dissipation pipeline (3) is attached to the intermediate piece (4), the right side of the heat dissipation pipeline (3) is connected with two heat dissipation fans (1), a driving motor is arranged inside each heat dissipation fan (1), a driving shaft of the driving motor is connected with a turbine fan blade (5), a heat dissipation hole cover plate (10) is arranged at the top of each heat dissipation fan (1), a heating pipe (7) and a temperature sensor (6) are arranged on the right side of the intermediate piece (4), temperature sensor (6) are connected with controller (11) electricity, temperature sensor (6) can survey the real-time temperature of reflow soldering intracavity, and pass to the temperature controller (11), heating pipe (7) with controller (11) electricity is connected, heating pipe (7) are accepted the control signal of controller (11) reflection heats, the drive shaft of two radiator fan (1) also with controller (11) electricity is connected, the thermovent of heat dissipation pipeline (3) is equipped with fin (9).
2. The temperature control device for reflow soldering according to claim 1, wherein the touch display screen of the controller (11) can receive the temperature change in the reflow soldering chamber to edit the real-time temperature-time curve, and the real-time temperature-time curve is displayed on the touch display screen.
3. A temperature control device for reflow soldering according to claim 1, wherein the material of the intermediate member (4) is graphite heat dissipation material.
4. A temperature control device for reflow soldering according to claim 1, wherein the heat dissipation pipe (3) is U-shaped.
5. A temperature control device for reflow soldering according to claim 1, wherein the heat dissipation fan (1) is truncated cone-shaped and the heating tube (7) is circular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020988650.2U CN212239538U (en) | 2020-06-03 | 2020-06-03 | Temperature control device for reflow soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020988650.2U CN212239538U (en) | 2020-06-03 | 2020-06-03 | Temperature control device for reflow soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212239538U true CN212239538U (en) | 2020-12-29 |
Family
ID=73977215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020988650.2U Expired - Fee Related CN212239538U (en) | 2020-06-03 | 2020-06-03 | Temperature control device for reflow soldering |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212239538U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114371188A (en) * | 2021-12-06 | 2022-04-19 | 深圳市迈瑞自动化设备有限公司 | High-temperature warping degree tester |
-
2020
- 2020-06-03 CN CN202020988650.2U patent/CN212239538U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114371188A (en) * | 2021-12-06 | 2022-04-19 | 深圳市迈瑞自动化设备有限公司 | High-temperature warping degree tester |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201229 |