CN212211562U - Automatic laminating mechanism of multilayer circuit board - Google Patents

Automatic laminating mechanism of multilayer circuit board Download PDF

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Publication number
CN212211562U
CN212211562U CN202020554098.6U CN202020554098U CN212211562U CN 212211562 U CN212211562 U CN 212211562U CN 202020554098 U CN202020554098 U CN 202020554098U CN 212211562 U CN212211562 U CN 212211562U
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Prior art keywords
unwinding
circuit board
copper foil
multilayer circuit
winding
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CN202020554098.6U
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余辉
李绪东
虞成城
张辉
谈兴
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Shenzhen Sunway Communication Co Ltd
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Shenzhen Sunway Communication Co Ltd
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Abstract

The utility model discloses an automatic laminating mechanism of multilayer circuit board, including first unwinding device, second unwinding device, hot press unit, first coiling mechanism and second coiling mechanism, the utility model provides an automatic laminating mechanism of multilayer circuit board simple structure can satisfy the automated production demand of multiply wood, first unwinding device is used for unreeling the copper foil to first coiling mechanism, second unwinding device is used for unreeling the viscose towards hot press unit, hot press unit is used for the hot pressing the copper foil with the viscose, first coiling mechanism is used for tearing the protection film of viscose, the second coiling mechanism is used for the rolling finished product, so, the copper foil need not to tailor and can accomplish the laminating in carrying out the laminating course of technology to degree of automation is high, has reduced the risk that manual operation error leads to product defect.

Description

Automatic laminating mechanism of multilayer circuit board
Technical Field
The utility model relates to a circuit board laminating equipment technical field especially relates to an automatic laminating mechanism of multilayer circuit board.
Background
Flexible circuit boards, also known as "flexible boards," are printed circuits made from flexible, insulating substrates. The flexible circuit provides excellent electrical performance, meets design requirements for smaller and higher density mounting, and also helps to reduce assembly processes and enhance reliability. The flexible circuit board is the only solution to meet the miniaturization and movement requirements of electronic products. The flexible printed circuit board can be freely bent, wound and folded, can bear millions of dynamic bending without damaging the lead, can be randomly arranged according to the space layout requirement, and can be freely moved and stretched in a three-dimensional space, so that the integration of component assembly and lead connection is realized; the flexible circuit board can greatly reduce the volume and the weight of the electronic product and is suitable for the development of the electronic product towards high density, miniaturization and high reliability.
The flexible circuit board is divided into a single surface, a double surface and a multilayer board, in the production process of the existing multilayer board, taking a double-layer board as an example, the coiled copper foil is often required to be cut into a single sheet after being glued, and is manually attached to the other single sheet copper foil after being subjected to a CNC drilling process (the CNC drilling is used for positioning during attachment), and then the double-layer board is formed by roller pressing; the single-piece copper foil is thin, creases are easily generated by multiple times of manual taking, the problem that large-area dead folding or glue death is easily caused due to the fact that the roller passing products are affected by temperature and pressure uniformity is solved, the production process in the prior art is complex, the process flow is long, and the requirement of automatic production cannot be met.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: the utility model provides an automatic laminating mechanism of multilayer circuit board to satisfy multilayer circuit board automated production's demand.
In order to solve the technical problem, the utility model discloses a technical scheme be: an automatic laminating mechanism of a multilayer circuit board comprises a first unreeling device, a second unreeling device, a hot pressing device, a first reeling device and a second reeling device;
the first unwinding device is used for unwinding the copper foil to the first winding device;
the second unwinding device is used for unwinding the viscose towards the hot pressing device;
the hot-pressing device is used for hot-pressing the copper foil and the viscose;
the first winding device is used for tearing the protective film of the adhesive;
and the second winding device is used for winding a finished product.
Furthermore, the number of the first unwinding devices is multiple, and the number of the second unwinding devices is one less than that of the first unwinding devices.
Furthermore, the number of the first rolling devices is twice that of the second rolling devices, one of the second rolling devices corresponds to two of the first rolling devices, one of the first rolling devices is used for tearing the upper protective film of the adhesive, and the other first rolling device is used for tearing the lower protective film of the adhesive.
Furthermore, the device also comprises a guiding device for guiding the copper foil and/or the adhesive.
Further, the hot pressing device comprises a roller structure.
Further, the roller structure comprises a heating body.
Furthermore, the first unwinding device comprises a first unwinding rotating shaft, and the second winding device comprises a first material collecting rotating shaft.
Furthermore, the second winding device further comprises a first torsion motor for driving the first material receiving rotating shaft.
Furthermore, the second unwinding device comprises a second unwinding rotating shaft, and the first winding device comprises a second winding rotating shaft.
Furthermore, the first winding device further comprises a second torque motor for driving the second material receiving rotating shaft.
The beneficial effects of the utility model reside in that: the utility model provides an automatic laminating mechanism of multilayer circuit board simple structure can satisfy the automated production demand of multiply wood, first unwinding device is used for unreeling the copper foil to first coiling mechanism, second unwinding device is used for unreeling the viscose towards hot press unit, hot press unit is used for hot pressing the copper foil with the viscose, first coiling mechanism is used for tearing the protection film of viscose, the second coiling mechanism is used for the rolling finished product, so, the copper foil need not to tailor and can accomplish the laminating in carrying out the laminating course of technology to degree of automation is high, has reduced manual operation error and has leaded to product defect's risk.
Drawings
Fig. 1 is a simplified schematic diagram of a structure of an automatic laminating mechanism for a multilayer circuit board according to a first embodiment of the present invention.
Description of reference numerals:
1. a first unwinding device; 11. copper foil; 2. a second unwinding device; 21. gluing; 22. a lower protective film; 23. coating a protective film; 3. a first winding device; 4. a second winding device; 5. a roller structure; 6. a guide device.
Detailed Description
In order to explain the technical content, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
The utility model discloses the most crucial design lies in: through setting up first unwinding device, second unwinding device, hot press unit, first coiling mechanism and second coiling mechanism and realizing that the whole book of copper foil is automatic laminating, eliminate the artifical manual risk that leads to the product defect of laminating.
Referring to fig. 1, an automatic laminating mechanism for a multilayer circuit board includes a first unwinding device 1, a second unwinding device 2, a hot pressing device, a first winding device 3, and a second winding device 4;
the first unwinding device 1 is used for unwinding a copper foil 11 to the first winding device 3;
the second unwinding device 2 is used for unwinding the adhesive 21 towards the hot pressing device;
the hot-pressing device is used for hot-pressing the copper foil 11 and the viscose 21;
the first winding device 3 is used for tearing the protective film of the adhesive 21;
and the second winding device 4 is used for winding a finished product.
From the above description, the beneficial effects of the present invention are: first unwinding device 1 is used for unreeling copper foil 11 to first coiling mechanism 3, second unwinding device 2 is used for unreeling viscose 21 towards hot press unit, hot press unit is used for the hot pressing copper foil 11 with viscose 21, first coiling mechanism 3 is used for tearing the protection film of viscose 21, second coiling mechanism 4 is used for the rolling finished product, so, copper foil 11 need not to tailor and can accomplish the laminating in carrying out the laminating course of technology to degree of automation is high, has reduced the risk that manual operation fault leads to product defect.
Furthermore, the number of the first unwinding devices 1 is multiple, and the number of the second unwinding devices 2 is one less than that of the first unwinding devices 1.
According to the description, the first unwinding devices 1 and the second unwinding devices 2 which are one less than the first unwinding devices 1 in number are arranged, so that the whole roll of the multilayer copper foil 11 can be automatically attached conveniently, the number of the first unwinding devices 1 and the number of the second unwinding devices 2 can be reasonably set according to actual production requirements, and the production automation level is improved conveniently.
Further, the number of the first rolling devices 3 is twice that of the second rolling devices 2, one of the second rolling devices 2 corresponds to two of the first rolling devices 3, one of the first rolling devices 3 is used for tearing the upper protective film 23 of the adhesive 21, and the other one of the first rolling devices 3 is used for tearing the lower protective film 22 of the adhesive 21.
As can be seen from the above description, one second unwinding device 2 corresponds to two first winding devices 3, so that the tearing of the upper protective film 23 and the lower protective film 22 of the adhesive 21 is facilitated, and the automation degree of the mechanism is further improved.
Furthermore, a guiding device 6 for guiding the copper foil 11 and/or the adhesive 21 is also included.
As can be seen from the above description, the guiding device 6 facilitates the stable unwinding or winding of the copper foil 11 and the adhesive 21 to a specific position, and can disperse the stress on the copper foil 11 and the adhesive 21, thereby avoiding the fracture of the copper foil 11 or the adhesive 21 caused by stress concentration.
Further, the hot pressing device comprises a roller structure 5.
As can be seen from the above description, the roller structure 5 facilitates the pressing of the adhesive 21 onto the copper foil 11 or the pressing of the copper foil 11 onto the adhesive 21.
Further, the roller structure 5 includes a heating body.
It can be known from the above description that the heat-generating body is convenient for the gyro wheel structure 5 is right copper foil 11 and heating when viscose 21 carries out the pressfitting, has avoided laminating in-process temperature distribution inhomogeneous to lead to the product defect, ensures the stability of laminating effect.
Further, the first unwinding device 1 includes a first unwinding rotating shaft, and the second winding device 4 includes a first winding rotating shaft.
According to the above description, the first discharging rotating shaft is convenient for more stably unwinding the copper foil 11, the first receiving rotating shaft is convenient for more stably winding a finished product, and the stability of the whole process of the mechanism is effectively improved.
Further, the second winding device 4 further comprises a first torsion motor for driving the first material receiving rotating shaft.
As can be seen from the above description, the first torsion motor is convenient for driving the first material receiving rotating shaft to rotate, and simultaneously can drive the second unwinding device 2 to move to a certain extent, so that the stress on the adhesive 21 on the second unwinding device 2 is more balanced.
Further, the second unwinding device 2 includes a second unwinding rotating shaft, and the first winding device 3 includes a second winding rotating shaft.
As can be seen from the above description, the second discharging rotating shaft facilitates more stably unwinding the adhesive 21, and the second receiving rotating shaft facilitates more stably winding the protective film torn off from the adhesive 21, thereby facilitating improvement of the stability of the whole process of the mechanism.
Further, the first winding device 3 further comprises a second torque motor for driving the second material receiving rotating shaft.
As can be seen from the above description, the second torsion motor is convenient for driving the second material receiving rotating shaft to rotate, and can provide driving force for the overall operation of the mechanism.
Example one
Referring to fig. 1, a first embodiment of the present invention is: an automatic laminating mechanism for a multilayer circuit board comprises a first unreeling device 1, a second unreeling device 2, a hot pressing device, a first reeling device 3 and a second reeling device 4; specifically, first unwinding device 1 is used for unreeling copper foil 11 to first coiling mechanism 3, second unwinding device 2 is used for unreeling viscose 21 towards hot press unit, hot press unit is used for the hot pressing copper foil 11 with viscose 21, first coiling mechanism 3 is used for tearing the protection film of viscose 21, second coiling mechanism 4 is used for the rolling finished product, so, copper foil 11 need not to tailor and can accomplish the laminating in carrying out the laminating course of technology to degree of automation is high, has reduced the risk that manual operation fault leads to product defect.
Optionally, the number of the first unwinding devices 1 is multiple, the number of the second unwinding devices 2 is one less than that of the first unwinding devices 1, the number of the first winding devices 3 is twice that of the second unwinding devices 2, one second unwinding device 2 corresponds to two first winding devices 3, one first winding device 3 is used for tearing the upper protection film 23 of the adhesive 21, and the other first winding device 3 is used for tearing the lower protection film 22 of the adhesive 21; specifically, in this embodiment, the number of the first unwinding devices 1 is two, the number of the second unwinding devices 2 is one, and the number of the first winding devices 3 is two; as can be easily understood, the arrangement of a plurality of first unwinding devices 1 and one less second unwinding device 2 than the first unwinding devices 1 facilitates the automatic lamination of the whole roll of the multilayer copper foil 11, and the number of the first unwinding devices 1 and the number of the second unwinding devices 2 can be reasonably set according to actual production requirements, thereby facilitating the improvement of the production automation level; one second unwinding device 2 corresponds two respectively first unwinding device 3 is convenient for right the tearing of last protection film 23 and lower protection film 22 of viscose 21 has further promoted the degree of automation of mechanism.
Preferably, the first unwinding device 1 comprises a first feeding rotating shaft, the second winding device 4 comprises a first receiving rotating shaft, the second unwinding device 2 comprises a second feeding rotating shaft, and the first winding device 3 comprises a second receiving rotating shaft; the second winding device 4 further comprises a first torsion motor for driving the first material receiving rotating shaft, and the first winding device 3 further comprises a second torsion motor for driving the second material receiving rotating shaft; specifically, the second torque motor is convenient for drive the second material receiving rotating shaft rotates, and meanwhile, the driving force can be provided for the whole operation of the mechanism, the first torque motor is convenient for drive the first material receiving rotating shaft rotates and can drive the second unwinding device 2 to move to a certain degree, the load of the second torque motor is relieved, and the stress of the viscose 21 on the second unwinding device 2 is more balanced.
Optionally, still including being used for copper foil 11 and/or guider 6 of viscose 21 direction, that is to say, copper foil 11 with viscose 21 can set up in the in-process of unreeling and laminating guider 6 leads it, guider 6 is convenient for copper foil 11 with viscose 21 unreels or the rolling to the assigned position steadily, and the while can disperse copper foil 11 with the stress on the viscose 21 avoids stress concentration to lead to copper foil 11 or viscose 21 fracture.
Preferably, hot press unit includes roller structure 5, roller structure 5 includes the heat-generating body, understands easily, roller structure 5 is convenient for with viscose 21 pressfitting is to copper foil 11 or will copper foil 11 pressfitting is to on the viscose 21, the heat-generating body is convenient for roller structure 5 is right copper foil 11 with the viscose 21 heats when carrying out the pressfitting, has avoided the inhomogeneous product defect that leads to of laminating in-process temperature distribution, ensures the stability of laminating effect.
In order to ensure the stability of the hot pressing effect between the copper foil 11 and the adhesive 21, the roller structure 5 includes two sets of hot pressing rollers arranged in pairs, one set of hot pressing rollers is used for pressing the adhesive 21 onto the copper foil 11, and the other set of hot pressing rollers is used for pressing the copper foil 11 onto the adhesive 21.
The action principle of the automatic multilayer circuit board laminating mechanism in this embodiment is that the second torsion motor drives the second winding device 4 to wind, the copper foil 11 on the first unwinding device 1 and the adhesive 21 on the second unwinding device 2 start to unwind under tension, the first torsion motor drives the first winding device 3 to tear the lower protective film 22 of the adhesive 21, the copper foil 11 on the bottom layer and the adhesive 21 tearing the lower protective film 22 are laminated under the action of the first set of hot-pressing rollers, after the lamination is completed, the first torsion motor drives the other first winding device 3 to tear the upper protective film 23 of the adhesive 21, under the action of the second set of hot-pressing rollers, the copper foil 11 on the upper layer is pressed on the adhesive 21 tearing the upper protective film 23, the lamination of the double-layer circuit board is completed, and under the action of the second winding device 4, and rolling the finished product onto a first material receiving rotating shaft of the second rolling device 4 to complete the material receiving of the finished product.
To sum up, the utility model provides an automatic laminating mechanism of multilayer circuit board simple structure, stable performance, degree of automation height.
The above mentioned is only the embodiment of the present invention, and not the limitation of the patent scope of the present invention, all the equivalent transformations made by the contents of the specification and the drawings, or the direct or indirect application in the related technical field, are included in the patent protection scope of the present invention.

Claims (10)

1. An automatic laminating mechanism for a multilayer circuit board is characterized by comprising a first unreeling device, a second unreeling device, a hot pressing device, a first reeling device and a second reeling device;
the first unwinding device is used for unwinding the copper foil to the first winding device;
the second unwinding device is used for unwinding the viscose towards the hot pressing device;
the hot-pressing device is used for hot-pressing the copper foil and the viscose;
the first winding device is used for tearing the protective film of the adhesive;
and the second winding device is used for winding a finished product.
2. The automatic laminating mechanism of claim 1, wherein the number of the first unwinding devices is more than one, and the number of the second unwinding devices is one less than the number of the first unwinding devices.
3. The automatic laminating mechanism of multilayer circuit board of claim 2, wherein the number of the first unwinding devices is twice the number of the second unwinding devices, one of the second unwinding devices corresponds to two of the first unwinding devices, one of the first unwinding devices is used for tearing the upper protection film of the adhesive, and the other of the first unwinding devices is used for tearing the lower protection film of the adhesive.
4. The automatic multilayer circuit board attaching mechanism according to claim 1, further comprising a guide means for guiding said copper foil and/or said adhesive.
5. The automatic multilayer circuit board attaching mechanism according to claim 1, wherein the heat pressing device includes a roller structure.
6. The automatic bonding mechanism of multilayer circuit board of claim 5, wherein the roller structure comprises a heating element.
7. The automatic laminating mechanism of claim 1, wherein the first unwinding device comprises a first unwinding shaft, and the second unwinding device comprises a first winding shaft.
8. The automatic multilayer circuit board attaching mechanism according to claim 7, wherein the second winding device further comprises a first torsion motor for driving the first material receiving rotating shaft.
9. The automatic laminating mechanism of multilayer circuit board of claim 1, wherein the second unwinding device comprises a second unwinding rotating shaft, and the first winding device comprises a second winding rotating shaft.
10. The automatic laminating mechanism of multilayer circuit board of claim 9, wherein the first winding device further comprises a second torque motor for driving the second material receiving spindle.
CN202020554098.6U 2020-04-15 2020-04-15 Automatic laminating mechanism of multilayer circuit board Active CN212211562U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020554098.6U CN212211562U (en) 2020-04-15 2020-04-15 Automatic laminating mechanism of multilayer circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020554098.6U CN212211562U (en) 2020-04-15 2020-04-15 Automatic laminating mechanism of multilayer circuit board

Publications (1)

Publication Number Publication Date
CN212211562U true CN212211562U (en) 2020-12-22

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CN202020554098.6U Active CN212211562U (en) 2020-04-15 2020-04-15 Automatic laminating mechanism of multilayer circuit board

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114938574A (en) * 2022-06-02 2022-08-23 深圳市益达兴科技股份有限公司 Multi-stage hot-pressing roll-to-roll large-size FDC production process

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114938574A (en) * 2022-06-02 2022-08-23 深圳市益达兴科技股份有限公司 Multi-stage hot-pressing roll-to-roll large-size FDC production process
CN114938574B (en) * 2022-06-02 2024-02-09 深圳市益达兴科技股份有限公司 Multistage hot-pressing roll-to-roll large-size FDC production process

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