CN212183599U

CN212183599U - Photosensitive assembly, camera module and electronic equipment

Info

Publication number: CN212183599U
Application number: CN202020461712.4U
Authority: CN
Inventors: 江传东
Original assignee: Nanchang OFilm Optoelectronics Technology Co Ltd
Current assignee: Nanchang OFilm Tech Co Ltd; Nanchang OFilm Optoelectronics Technology Co Ltd
Priority date: 2020-04-01
Filing date: 2020-04-01
Publication date: 2020-12-18
Anticipated expiration: 2030-04-01

Abstract

The utility model discloses a photosensitive assembly, module and electronic equipment make a video recording, photosensitive assembly includes: a circuit board; the photosensitive element is arranged on the mounting surface of the circuit board and is electrically connected with the circuit board through an electric connecting wire; the optical filter is arranged on one side of the photosensitive element, which is far away from the circuit board; the optical filter, the circuit board and the rubber wall define a closed accommodating space, and the photosensitive element and the electric connecting wire are positioned in the accommodating space; and the circuit board, the photosensitive element, the optical filter and the rubber wall are packaged into a whole by the packaging piece. The glue wall is arranged on the circuit board, so that the glue wall can be prevented from polluting a photosensitive area of the photosensitive element. Meanwhile, due to the arrangement, a closed accommodating space can be formed by the circuit board, the optical filter and the rubber wall, the impact of the packaging part on the electric connecting line in the injection molding process can be avoided, and the reliability of the electric connecting line is ensured.

Description

Photosensitive assembly, camera module and electronic equipment

Technical Field

The utility model belongs to the technical field of the technique of making a video recording and specifically relates to a photosensitive assembly, module and electronic equipment make a video recording are related to.

Background

In the related art, the photosensitive assembly includes a circuit board, a photosensitive element, a filter, a package, and the like. Generally, the photosensitive element is glued to the filter by dispensing in the non-photosensitive area of the photosensitive element, and then the photosensitive element and the circuit board are injection molded by the package, at this time, the gold wire is encapsulated inside by the package. With the arrangement, the glue is easy to diffuse to the photosensitive area and pollute the photosensitive area, and the performance of the photosensitive element is affected. In addition, the gold wire is wrapped by the injection-molded package and is easily subjected to internal stress of the package, so that the problems of deformation, fracture and the like are easily caused, and the reliability of the photosensitive assembly is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a photosensitive assembly, photosensitive assembly good reliability.

The utility model also provides a module of making a video recording of having above-mentioned photosensitive assembly.

The utility model also provides an electronic equipment of having above-mentioned module of making a video recording.

According to the utility model discloses photosensitive assembly of first aspect embodiment, include: a circuit board; the photosensitive element is arranged on the mounting surface of the circuit board and is electrically connected with the circuit board through an electric connecting wire; the optical filter is arranged on one side of the photosensitive element, which is far away from the circuit board; the optical filter is connected with the circuit board through the annular rubber wall, a closed accommodating space is defined among the optical filter, the circuit board and the rubber wall, and the photosensitive element and the electric connecting wire are located in the accommodating space; and the packaging piece is used for packaging the circuit board, the photosensitive element, the optical filter and the rubber wall into a whole.

According to the utility model discloses photosensitive assembly through set up gluey wall on the circuit board, can avoid gluey wall setting to pollute the condition in photosensitive area on photosensitive element. Meanwhile, the electric connecting line and the packaging part can be separated through the glue wall, a closed containing space can be formed by the circuit board, the optical filter and the glue wall, the photosensitive element and the electric connecting line are arranged in the containing space, the impact of stress generated in the injection molding process of the packaging part on the electric connecting line can be avoided, and the stability and the reliability of the electric connecting line are guaranteed.

According to the utility model discloses photosensitive element, the electric connection line with the link of circuit board with thereby glue the internal surface spaced apart setting of wall and avoid gluing wall infection electric connection line, guaranteed that the electric connection line is reliable and stable.

According to the utility model discloses photosensitive element, perpendicular to in the direction of circuit board, glue the height that the wall is greater than the highest height of electric connecting wire to can avoid light filter and electric connecting wire contact, further guarantee the stability of electric connecting wire.

According to the utility model discloses photosensitive element, photosensitive assembly still includes at least one electronic component, electronic component avoids electric connection ground encircles photosensitive element sets up on the circuit board, so can make electric connection and electronic component separate through gluing the wall. The packaging piece packages the circuit board, the photosensitive element, the optical filter, the rubber wall and the electronic element into a whole, so that the reliability and the stability of the whole structure of the packaging piece can be improved.

According to the utility model discloses photosensitive element, electronic component and annular glue the surface in close contact with of wall to can further improve photosensitive element's reliability.

According to the utility model discloses photosensitive element, annular the radial dimension of the surface of gluey wall is greater than the radial dimension of light filter, electronic component with the clearance has between the light filter. Therefore, the reliability of bonding the adhesive wall and the optical filter can be ensured, and the interference between the electronic element and the optical filter can be avoided.

According to the utility model discloses photosensitive element, the packaging part is established on the circuit board, just the peripheral surface of packaging part with the peripheral surface parallel and level of circuit board. The overall structure's after so can guaranteeing to mould plastics steadiness to can not occupy the space of other parts, satisfy the miniaturized demand of sensitization subassembly.

According to the utility model discloses photosensitive element, the packaging part includes: the first packaging part is arranged on the circuit board, wraps the electronic element and at least wraps one part of the rubber wall; and the second packaging part is connected with the first packaging part and is connected with the edge part on the surface of one side, far away from the circuit board, of the optical filter. The circuit board, the photosensitive element, the electronic element, the rubber wall and the optical filter can be cast together to form a whole by arranging the first packaging part and the second packaging part, and the structure of the optical filter is stable and reliable.

According to the utility model discloses the module of making a video recording of second aspect embodiment, include according to the utility model discloses the photosensitive assembly of above-mentioned first aspect embodiment, the module stable in structure of making a video recording is reliable.

According to the utility model discloses electronic equipment of third aspect embodiment, include according to the utility model discloses the module of making a video recording of above-mentioned second aspect embodiment, electronic equipment stable in structure is reliable, long service life.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of a photosensitive element according to an embodiment of the present invention;

fig. 2 is an enlarged view at a of fig. 1.

Reference numerals:

a photosensitive member 100;

a circuit board 10; a mounting surface 11; a photosensitive element 20; an optical filter 30; a rubber wall 40; a package member 50; a first sealing portion 51; the second package portion 52;

an electronic component 60; an electrical connection wire 70; a connection end 71; the accommodating space 80;

a camera module 1000; a lens 200.

Detailed Description

Embodiments of the present invention are described in detail below, and the embodiments described with reference to the drawings are exemplary.

A photosensitive assembly 100 according to an embodiment of the first aspect of the present invention is described below with reference to fig. 1 to 2.

The photosensitive assembly 100 according to the embodiment of the first aspect of the present invention includes a circuit board 10, a photosensitive element 20, a filter 30, a glue wall 40, and a package 50.

As shown in fig. 1, the photosensitive element 20 and the adhesive wall 40 may be disposed on the mounting surface 11 of the circuit board 10, and one end of the electrical connection line 70 may be connected to the photosensitive element 20, and the other end may be connected to the circuit board 10, so that the photosensitive element 20 may be electrically connected to the circuit board 10 through the electrical connection line 70. The filter 30 may be disposed on a side of the photosensitive element 20 away from the circuit board 10. Optionally, the electrical connection line 70 is a gold wire. Gold wire is better conductive and ductile and resistant to corrosion.

The rubber wall 40 may be in the shape of a ring, which may be circular or may be in other shapes connected end to end. A glue wall 40 may be provided between the optical filter 30 and the circuit board 10 to connect the optical filter 30 and the circuit board 10. Alternatively, one end of the glue wall 40 is disposed on the circuit board 10, and the other end is adhered to the optical filter 30. Thus, the circuit board 10, the filter 30 and the annular glue wall 40 can form a sealed accommodating space 80. As shown in fig. 1, the photosensitive element 20 and the electrical connection lines 70 are located in the receiving space 80, so that the sealant wall 40 can space the package 50 from the electrical connection lines 70. Alternatively, the glue wall 40 is formed by spray-coating glue pile.

As shown in fig. 1, the package 50 integrally packages the circuit board 10, the photosensitive element 20, the optical filter 30 and the adhesive wall 40. The package 50 is formed by injection molding. The inside of the package 50 is rapidly subjected to large volume and temperature changes during the injection molding process, resulting in the generation of stress. One end of a rubber wall in the prior art is arranged on a non-photosensitive area of a photosensitive element, the other end of the rubber wall is connected with an optical filter, and an electric connection line is plastically packaged inside a package, so that the rubber wall arranged has the risk of polluting the photosensitive area of the photosensitive element, and the electric connection line can be influenced by stress generated in the injection molding process, and is easy to cause breakage or deformation.

According to the utility model discloses a photosensitive assembly 100, through set up gluey wall 40 on circuit board 10, can avoid the condition that the arrangement mode of gluing the wall among the prior art pollutes photosensitive element's photosensitive zone. Meanwhile, the electrical connection line 70 and the package 50 are spaced by the rubber wall 40, so that the impact of the stress generated by the package 50 in the injection molding process on the electrical connection line 70 can be avoided, and the stability and reliability of the electrical connection line 70 are ensured. In addition, the circuit board 10, the optical filter 30 and the annular rubber wall 40 can form a closed accommodating space 80, and the photosensitive element 20 and the electrical connection line 70 are arranged in the accommodating space 80, so that the stability and reliability of the photosensitive element 20 and the electrical connection line 70 can be further ensured. In addition, the adhesive wall 40 is connected between the circuit board 10 and the optical filter 30, rather than between the circuit board and the photosensitive element in the prior art, which reduces the size limitation of the photosensitive element 20 to some extent, thereby improving the versatility of the photosensitive assembly 100.

According to some embodiments of the present invention, in conjunction with fig. 2, the connecting end of the electrical connection line 70 and the circuit board 10 is labeled as 71, the connecting end 71 being spaced apart from the inner surface of the glue wall 40. Therefore, the glue wall 40 and the electric connection line 70 can be spaced, so that the glue wall 40 is prevented from influencing the electric connection line 70, and the stability and reliability of the electric connection line 70 are ensured.

Further, in the direction perpendicular to the circuit board 10, the height of the glue wall 40 is greater than the highest height of the electrical connection line 70, so that the optical filter 30 can be prevented from contacting the electrical connection line 70, and the stability of the electrical connection line 70 is further ensured. It is understood that the height of the adhesive wall 40 refers to a dimension from one end disposed on the circuit board 10 to one end bonded to the optical filter 30, and the height of the electrical connection line 70 is a dimension from the connection terminal 71 to one end of the electrical connection line closest to the optical filter 30.

As shown in fig. 1 and 2, in some embodiments, the photosensitive assembly 100 further includes at least one electronic component 60, and the electronic component 60 is disposed on the mounting surface 11 of the circuit board 10. Alternatively, the electronic component 60 may be disposed on the mounting surface 11 around the photosensitive element 20 avoiding the electrical connection line 70. Here, the electronic component 60 may be plural, and may be, for example, a relay, a capacitor, or the like. In addition, the electronic component 60 can be disposed outside the accommodating space 80, and the electrical connection line 70 and the electronic component 60 are separated by the glue wall 40, so that the electrical connection line 70 and the electronic component 60 can be prevented from interfering with each other. In addition, the electronic component 60 may further space the electrical connection lines 70 from the package 50, and may also space the photosensitive element 20 from the package 50, so that the electrical connection lines 70 and the photosensitive element 20 may be prevented from being interfered by the injection molding of the package 50.

Optionally, the package 50 integrally packages the circuit board 10, the photosensitive element 20, the optical filter 30, the adhesive wall 40 and the electronic element 60, so that the reliability and stability of the overall structure thereof can be improved.

According to some optional embodiments of the present invention, the electronic component 60 and the outer surface of the annular glue wall 40 can be in close contact with each other to block the impact force generated during the injection molding of the package 50, so as to prevent the package material from entering the accommodating space 80 during the injection molding of the package 50, and thus further prevent the electric connection line 70 and the photosensitive element 20 from being interfered by the injection molding of the package 50.

According to some embodiments of the present invention, the radial dimension of the outer surface of the annular glue wall 40 may be greater than the radial dimension of the optical filter 30, that is, as shown in fig. 1, the outer surface of the glue wall 40 protrudes out of the outer periphery of the optical filter 30, so that after the electronic component 60 contacts the outer surface of the glue wall 40, it can be ensured that a gap is formed between the electronic component 60 and the optical filter 30, and interference between the electronic component 60 and the optical filter 30 can be avoided. It will be understood by those skilled in the art that reference herein to the radial dimension of the glue wall 40 refers to the distance between the opposite ends of the outer perimeter of the glue wall 40 in a radial direction (e.g., in the outer-in-outer direction of fig. 1) passing through the center point of the glue wall 40.

According to the utility model discloses a some optional embodiments, packaging part 50 is established on circuit board 10, and packaging part 50's peripheral surface and circuit board 10's peripheral surface parallel and level, so, can guarantee the steadiness of the overall structure after moulding plastics to can not occupy the space of other parts, satisfied photosensitive assembly 100's miniaturized demand.

In the example of fig. 1 and 2, the package 50 includes a first package portion 51 and a second package portion 52. The first package portion 51 is provided on the circuit board 10. The first packaging part 51 wraps the electronic component 60 and at least a part of the glue wall 40. By providing the first packing portion 51, the adhesive wall 40 and the electronic component 60 can be more stably connected to the circuit board 10. As shown in fig. 2, the second encapsulating portion 52 is connected to the first encapsulating portion 51, and the second encapsulating portion 52 is connected to an edge portion on a side surface of the optical filter 30 away from the circuit board 10. The circuit board 10, the photosensitive element 20, the electronic element 60, the adhesive wall 40 and the optical filter 30 can be molded together to form a whole by providing the first packaging part 51 and the second packaging part 52, and the structure is stable and reliable.

According to the utility model discloses the module 1000 of making a video recording of second aspect embodiment, include according to the utility model discloses the photosensitive component 100 of the above-mentioned first aspect embodiment, photosensitive element 20's photosensitive zone sets up towards the direction of light filter 30. The camera module 1000 further includes a lens, and light enters the photosensitive area of the photosensitive element 20 through the lens 200.

According to the utility model discloses electronic equipment of third aspect embodiment, include according to the utility model discloses the module of making a video recording 1000 of above-mentioned second aspect embodiment. The electronic equipment is the electronic equipment with image acquisition function such as camera, cell-phone and panel computer, and electronic equipment life is high, and the reliability is high.

In the description of the present invention, it is to be understood that the terms "radial", "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

In the description of the present invention, "the first feature" and "the second feature" may include one or more of the features. In the description of the present invention, "a plurality" means two or more. In the description of the present invention, the first feature "on" or "under" the second feature may include the first and second features being in direct contact, and may also include the first and second features being in contact with each other not directly but through another feature therebetween. In the description of the invention, the first feature being "on", "above" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A photosensitive assembly, comprising:

a circuit board;

the photosensitive element is arranged on the mounting surface of the circuit board and is electrically connected with the circuit board through an electric connecting wire;

the optical filter is arranged on one side of the photosensitive element, which is far away from the circuit board;

the optical filter is connected with the circuit board through the annular rubber wall, a closed accommodating space is defined among the optical filter, the circuit board and the rubber wall, and the photosensitive element and the electric connecting wire are located in the accommodating space; and

and the circuit board, the photosensitive element, the optical filter and the rubber wall are packaged into a whole by the packaging piece.

2. A photosensitive assembly according to claim 1, wherein the connecting ends of the electrical connection wires and the circuit board are disposed spaced apart from the inner surface of the adhesive wall.

3. A photosensitive assembly according to claim 1, wherein the height of the adhesive wall in a direction perpendicular to the circuit board is greater than the highest height of the electrical connection lines.

4. A photosensitive assembly according to claim 1, further comprising at least one electronic component disposed on said circuit board around said photosensitive element avoiding said electrical connection line.

5. A photosensitive assembly according to claim 4, wherein said electronic component is in close contact with an outer surface of said rubber wall in a ring shape.

6. The photosensitive assembly of claim 5, wherein a radial dimension of the outer surface of the annular rubber wall is larger than a radial dimension of the filter, and a gap is formed between the electronic component and the filter.

7. A photosensitive assembly according to any one of claims 4 to 6, wherein the package is provided on the circuit board with an outer peripheral surface of the package flush with an outer peripheral surface of the circuit board.

8. A photosensitive assembly according to claim 7, wherein said package comprises:

the first packaging part is arranged on the circuit board, wraps the electronic element and at least wraps one part of the rubber wall;

and the second packaging part is connected with the first packaging part and is connected with the edge part on the surface of one side, far away from the circuit board, of the optical filter.

9. A camera module comprising a photosensitive assembly according to any one of claims 1 to 8.

10. An electronic apparatus characterized by comprising the camera module according to claim 9.