CN212182357U - LED display device and display apparatus - Google Patents

Abstract

The utility model provides a LED display device and display device, wherein, LED display device includes the base plate and locates pixel on the base plate, and cover the encapsulation of pixel is glued, the pixel includes at least one LED chip, LED display device still including erect in on the base plate and enclose and locate pixel reflecting wall all around, reflecting wall with the base plate constitutes jointly the spotlight chamber of pixel. The utility model provides a LED display device is owing to be equipped with the reflection of light wall all around at the pixel, through the reflection of light wall can with the light reflection that the pixel distributes towards the side extremely LED display device's front, it is right the light of pixel plays the spotlight effect, thereby promotes LED display device's luminous luminance guarantees that the display image under outdoor environment is clear, promotes user experience.

Description

LED display device and display apparatus

Technical Field

The utility model relates to a LED shows technical field, especially relates to a LED display device and adoption LED display device's display device.

Background

At present, because the LED display screen has the advantages of bright color, wide dynamic range, high brightness, low power consumption, long service life, impact resistance, stability, reliability, etc., it has become the most advantageous new generation of display media, and is widely applied to large squares, commercial advertisements, stadiums, etc.

The LED display screen is mainly formed by assembling a plurality of LED display devices. As shown in fig. 1, a conventional LED display device generally adopts a package structure that an LED chip 200 is soldered on a substrate 100 to form a pixel, and then a package layer 300 covering the LED chip 200 is directly formed on the substrate 100. This structure may cause a part of light to leak from the side due to an excessively large light emitting angle of the LED chip 200, resulting in a reduction in brightness of the top surface, thereby causing a blurred and unclear display image, especially in a high brightness environment applied outdoors.

SUMMERY OF THE UTILITY MODEL

The primary object of the present invention is to provide a LED display device with improved brightness by light condensation.

Another object of the present invention is to provide a display device using the above LED display device.

In order to achieve the above object, the present invention provides the following technical solutions:

as a first aspect, the utility model relates to a LED display device, include the base plate and locate pixel on the base plate, and cover the encapsulation of pixel is glued, the pixel includes at least one LED chip, LED display device still including erect in on the base plate and enclose and locate pixel reflecting wall all around, reflecting wall with the base plate constitutes jointly the spotlight chamber of pixel.

Further, the substrate comprises solder resist ink surrounding the pixel points, and the light reflecting wall is arranged on the top of the solder resist ink.

Preferably, the height of the light reflecting wall is 1.5-2.5 times of the height of the LED chip.

Preferably, the light reflecting wall includes a bump standing on the substrate and a light reflecting structure disposed on a sidewall of the bump facing the LED chip.

Preferably, the side wall of the bump facing the LED chip is set to be an inward concave arc shape.

Preferably, the bumps are made of an opaque material.

Further, the pixel point comprises a red light LED chip, a green light LED chip and a blue light LED chip.

As a second aspect, the present invention also relates to a method for manufacturing an LED display device, which is suitable for manufacturing the LED display device, and comprises the following steps: welding at least one LED chip on a substrate to form pixel points; manufacturing a reflective wall surrounding the periphery of the pixel points on the substrate; and coating the packaging adhesive for covering the pixel points and the light reflecting wall on the substrate.

Preferably, the manufacturing of the reflective wall on the substrate for surrounding the periphery of the pixel point specifically includes: forming a bump surrounding the periphery of the pixel point on the substrate by a mould pressing process; and a light reflecting structure is arranged on the side wall of the lug towards the LED chip to form a light reflecting wall.

As a third aspect, the present invention also relates to a display device, which includes a mounting structure and a plurality of the above LED display devices arranged on the mounting structure.

Compared with the prior art, the utility model discloses a scheme has following advantage:

the utility model provides a LED display device is owing to be equipped with the reflection of light wall all around at the pixel, through the reflection of light wall can with the light reflection that the pixel distributes towards the side extremely LED display device's front, it is right the light of pixel plays the spotlight effect, thereby promotes LED display device's luminous luminance guarantees that the display image under outdoor environment is clear, promotes user experience.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic side view of a conventional LED display device;

fig. 2 is a schematic side view of an LED display device according to an embodiment of the present invention;

fig. 3 is a schematic front view of the LED display device shown in fig. 2;

FIG. 4 is a flow chart of the fabrication of the LED display device shown in FIG. 2;

fig. 5 is a step diagram of a method for manufacturing an LED display device according to the present invention.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present invention, and should not be construed as limiting the present invention.

It will be understood by those within the art that, unless expressly stated otherwise, the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the term "and/or" includes all or any element and all combinations of one or more of the associated listed items.

Fig. 2 and fig. 3 show jointly the utility model provides a LED display device 1, it includes base plate 11, pixel 12, reflective wall 13 and encapsulation and glues 14, pixel 12 includes that at least one is fixed in LED chip 121 on the base plate 11, reflective wall 13 erects in on the base plate 11 and enclose and locate around pixel 12, just reflective wall 13 with base plate 11 constitutes jointly the spotlight chamber 131 of pixel 12, encapsulation is glued 14 and is covered pixel 12 with reflective wall 13 sets up.

Referring to fig. 2, an arrow in the figure indicates a transmission direction of light, the LED display device 1 can reflect the light emitted from the pixel 12 toward the side surface thereof to the front surface of the LED display device 1 through the reflective wall 13, that is, the light-condensing cavity 131 can condense the light of the pixel 12, so as to improve the luminance of the LED display device 1, ensure that a displayed image is clear in an outdoor environment, and improve user experience.

In this embodiment, the height of the reflective wall 13 relative to the substrate 11 is 2 times the height of the LED chip 121 relative to the substrate 11, so that the LED chip 121 can be effectively focused, and the entire thickness of the LED display device 1 is not increased due to the excessive height of the reflective wall 13. In practical application, a manufacturer can adjust the actual height of the reflective wall 13 according to the actual height of the LED chip 121 and the emitting angle of the light thereof, and in order to ensure a better light condensing effect and thickness control of the overall structure, the height of the reflective wall 13 should be controlled to be 1.5-2.5 times the height of the LED chip 121.

Preferably, the reflective wall 13 includes a bump standing on the substrate 11 and a reflective structure disposed on the sidewall of the LED chip 121 facing the bump, and the reflective structure may be a reflective film attached to the sidewall of the bump or other reflective materials coated on the sidewall of the bump.

Wherein, the lug is made of opaque material, preferably adopts black material.

Preferably, the side wall of the protrusion facing the LED chip 121 is set to be a concave arc (not shown), that is, the emitting surface of the reflective wall 13 facing the LED chip 121 is set to be a circular arc surface capable of condensing light, so as to further improve the light condensing effect of the light condensing cavity 131.

As shown in fig. 2, the substrate 11 includes a base material 111 and solder resist ink 112 disposed on the base material 111 and surrounding the pixel 12, and the base material 111 can be prevented from being damaged at a portion of the periphery of the pixel 12 that does not need to be soldered by the protective effect of the solder resist ink 112, so as to improve the soldering efficiency of the LED chip 121.

Preferably, the light reflecting wall 13 is disposed on the top of the solder resist ink 112, that is, the light reflecting wall 13 is directly disposed according to the layout of the solder resist ink 112 without additional design or increasing the disposition position of the light reflecting wall 13, thereby simplifying the processing process and reducing the production cost.

Further, the substrate 11 further includes a bottom pad 113 disposed at the bottom of the base material 111 and electrically connected to a control circuit of a display device, and a top pad 114 disposed at the top of the base material 111 and used for soldering the LED chip 121.

Preferably, the pixel 12 includes three LED chips 121, and the three LED chips 121 are red LED chips, green LED chips and blue LED chips respectively, and the combination of the three-color chips makes the pixel 12 realize full-color light emission, thereby meeting the requirements of more use scenes.

It should be understood that in other embodiments, the pixel 12 may include only one LED chip 121, implementing monochromatic light emission; four or more LED chips 121 may also be provided, for example, four LED chips 121 including a red LED chip, a green LED chip, a blue LED chip, and a white LED chip, so as to improve the color saturation of the pixel 12.

Referring to fig. 4 and fig. 5, as a second aspect, an embodiment of the present invention further provides a manufacturing method (hereinafter, referred to as "manufacturing method") of an LED display device, where the manufacturing method is suitable for manufacturing the LED display device 1. Specifically, the preparation method comprises the following steps:

step S1: at least one LED chip 121 is soldered on the substrate 11 to form the pixel 12.

Specifically, the prepared solder 15 is coated on the top bonding pad 114 of the substrate 11, then at least one group of LED chips 121 is placed on the corresponding top bonding pad 114, and the electrodes 1211 of the LED chips 121 are in contact with the solder 15 and then are fixed to the top bonding pad 114 by the solder 15, so that the soldering process of the LED chips 121 is completed, and each group of LED chips 121 forms one pixel 12.

Preferably, the LED chips 121 may be provided with a plurality of groups to simultaneously manufacture a plurality of pixel points 12, and finally, a plurality of LED display devices 1 may be formed by cutting, so as to improve the manufacturing efficiency.

Further, the top pad 114 should be cleaned prior to applying the solder 15. After the LED chip 121 is disposed, a next process is performed after the LED chip 121 is completely fixed, so as to ensure that the LED chip 121 is not loosened.

Step S2: and manufacturing a reflecting wall 13 surrounding the periphery of the pixel 12 on the substrate 11.

Firstly, bumps surrounding the periphery of the pixel points 12 are manufactured on the substrate 11 through a mould pressing process, then, reflective structures are arranged on the side walls, facing the LED chip 121, of the bumps to form reflective walls 13, the reflective walls 13 and the substrate 11 jointly form light-gathering cavities 131 of the pixel points 12, and the light-gathering cavities 131 can achieve the light-gathering effect aiming at the pixel points 12 and enhance the brightness and the color saturation of light.

The lug is made of a black material, preferably a black rubber material, so that the lug has a good light-blocking effect, is high in plasticity and is convenient to process. The light reflecting structure can be a light reflecting film attached to the side wall of the bump or other light reflecting materials coated on the side wall of the bump.

Step S3: and coating the packaging adhesive 14 covering the pixel points 12 and the reflective walls 13 on the substrate 11.

After the pixel points 12 and the light reflecting wall 13 are completely arranged, the packaging adhesive 14 for protecting the LED chip 121 is coated, and the packaging adhesive 14 can be liquid silicone rubber made of organic silicon as a main raw material, so as to have good high and low temperature resistance and electrical insulation capability, excellent dielectric property and moisture resistance, and good refractive index and light transmittance.

Secondly, because the encapsulation glue 14 covers the arrangement of the light reflecting wall 13, the light reflecting wall 13 can also be fixed through the encapsulation glue 14, and the stability and the reliability of the whole structure are ensured.

Further, after the encapsulation adhesive 14 is coated, the encapsulation adhesive 14 should be heated and cured, and after the encapsulation adhesive 14 is cured, the excess substrate 11 and the encapsulation adhesive 14 at the edge are cut according to requirements, so as to finally form the LED display device 1.

Preferably, a plurality of LED display devices 1 may be simultaneously prepared on one large substrate, and finally, a single LED display device 1 is formed by dicing.

As a third aspect, the embodiments of the present invention further relate to a display device (not shown, the same applies below), the display device may be an LED display, an LED billboard, or the like, and includes a mounting structure and a plurality of the above LED display devices 1 arranged on the mounting structure, where the mounting structure includes a mounting bracket and a driving circuit, a control circuit, and the like of the LED display devices 1.

Due to the adoption of the LED display device 1, the reflecting wall 13 in the LED display device 1 can condense light rays emitted by the pixel points 12, so that parameters such as brightness, color saturation and the like of a final image of the display device are improved, and the image is clear.

Secondly, through the reflection of light effect of reflection of light wall 13 still can effectively avoid taking place the phenomenon of cross light between arbitrary two adjacent LED display devices 1, further promotes image display effect.

The foregoing is only a partial embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims (8)

1. The LED display device is characterized by further comprising a reflective wall which is erected on the substrate and arranged around the periphery of the pixel point, and the reflective wall and the substrate jointly form a light-gathering cavity of the pixel point.

2. The LED display device as claimed in claim 1, wherein the substrate comprises solder mask ink disposed around the pixel dots, the light reflecting wall being disposed on top of the solder mask ink.

3. The LED display device as claimed in claim 1, wherein the height of the reflective wall is 1.5-2.5 times the height of the LED chip.

4. The LED display device as claimed in claim 1, wherein the light reflecting wall comprises a bump standing on the substrate and a light reflecting structure provided on a side wall of the bump facing the LED chip.

5. The LED display device according to claim 4, wherein the side wall of the bump facing the LED chip is formed in an inwardly concave arc shape.

6. The LED display device as recited in claim 4 wherein the bumps are made of an opaque material.

7. The LED display device of claim 1, wherein said pixel sites comprise red LED chips, green LED chips, and blue LED chips.

8. A display apparatus comprising a mounting structure and a plurality of display devices arranged on the mounting structure, characterized in that the display devices are LED display devices according to any one of claims 1 to 7.

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