CN212182283U

CN212182283U - Ultra-thin packaging structure that integrates

Info

Publication number: CN212182283U
Application number: CN202021498281.5U
Authority: CN
Inventors: 闫志国
Original assignee: Shanghai Beixin Integrated Circuit Technology Co ltd
Current assignee: Shanghai Beixin Integrated Circuit Technology Co ltd
Priority date: 2020-07-27
Filing date: 2020-07-27
Publication date: 2020-12-18
Anticipated expiration: 2030-07-27

Abstract

The utility model relates to a semiconductor packaging structure technical field just discloses an ultra-thin packaging structure that integrates, the on-line screen storage device comprises a base, the lower extreme fixed mounting of base has two pillars, a plurality of recesses have been seted up to the up end of base, the inside fixed mounting of recess has the bearing frame, the inboard movable mounting of base left side bearing frame has the guide bar, the inboard movable mounting of base right side bearing frame has the lead screw. This ultra-thin packaging structure that integrates, the staff at first places the device on the workstation, open driving motor through control panel, and then drive the lead screw and rotate when driving motor opens, owing to set up threaded sleeve and lead screw for threaded connection, be convenient for can control the lifter plate downstream, and then can control and press the briquetting and press the encapsulation chip and press briquetting fixed connection, be convenient for control glue and drip to the encapsulation chip on and evenly distributed through setting up the lower extreme that divides the connecting pipe, the practicality of device has been improved greatly, and convenient to use.

Description

Ultra-thin packaging structure that integrates

Technical Field

The utility model relates to a semiconductor package structure technical field specifically is an ultra-thin packaging structure that integrates.

Background

The package for mounting a semiconductor integrated circuit chip plays an important role in mounting, fixing, sealing, protecting the chip and enhancing the electric heating performance, and also, contacts on a bridge chip which communicates the internal world of the chip with an external circuit are connected to pins of the package by wires, which are connected to other devices through wires on a printed board, so that the package plays an important role in a CPU and other LSI integrated circuits.

At present most packaging hardware all be great device, be not convenient for use, and present packaging hardware often paints unevenly because glue in the in-process that uses to cause the chip encapsulation stable inadequately, and present most packaging hardware is because be provided with a plurality of according to the briquetting, often leads to pressing the structure and unstable inadequately, causes the poor problem of packaging hardware result of use, and is not convenient for use.

Disclosure of Invention

Technical problem to be solved

The utility model provides a not enough to prior art, the utility model provides an ultra-thin packaging structure that integrates has solved present most packaging hardware and all is great device, the use of being not convenient for, and present packaging hardware is often because glue paints inhomogeneously at the in-process that uses to cause the chip encapsulation to be stable inadequately, and present most packaging hardware is because be provided with a plurality of according to the briquetting, often leads to pressing down the structure and insufficiently stable, causes the poor problem of packaging hardware result of use, and the problem of not convenient to use.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: an ultrathin integrated packaging structure comprises a base, wherein two supporting columns are fixedly mounted at the lower end of the base, a plurality of grooves are formed in the upper end face of the base, bearing seats are fixedly mounted in the grooves, guide rods are movably mounted on the inner side of the bearing seat on the left side of the base, lead screws are movably mounted on the inner side of the bearing seat on the right side of the base, a driving motor is fixedly mounted in the base, a lifting plate is movably mounted between the guide rods and the lead screws, a plurality of guide sleeves are fixedly mounted on the upper end face of the lifting plate, threaded sleeves are fixedly mounted on the upper end face of the lifting plate, a control panel is fixedly mounted on the front end face of the lifting plate, a glue tank is fixedly mounted on the upper end face of the lifting plate, a feed inlet is fixedly mounted on the upper end face of the glue tank, a main connecting pipe is fixedly mounted at the lower end of the, the lower extreme fixed mounting of lifter plate has a plurality of according to the briquetting, the packaging chip has been placed to the up end of base, the up end of packaging chip is provided with a plurality of solder balls.

Preferably, the screw rod and the guide rod are symmetrically distributed on the left side and the right side of the packaging chip, the control panel is electrically connected with the driving motor, and the glue tank is located in the center of the lifting plate.

Preferably, the main connection pipe is located inside the lifting plate, an upper end of the main connection pipe extends to the inside of the glue tank, and a lower end of the branch connection pipe extends to the inside of the pressing block.

Preferably, the guide sleeve and the threaded sleeve are symmetrically distributed on the left side and the right side of the glue box, the threaded sleeve is in threaded connection with the screw rod, and the solder balls correspond to the pressing blocks one to one.

Preferably, the pillars are symmetrically distributed on the left side and the right side of the glue tank, the lower end of the screw rod is fixedly connected with an output shaft of the driving motor, and the lower end of the feed inlet extends to the inside of the glue tank.

Compared with the prior art, the utility model provides an ultra-thin packaging structure that integrates possesses following beneficial effect:

1. this ultra-thin packaging structure that integrates, at staff's in-process of using device, the staff at first places the device on the workstation, open driving motor through control panel, and then drive the lead screw when driving motor opens and rotate, owing to set up threaded sleeve and lead screw and be threaded connection, be convenient for can control the lifter plate downstream, and then can control and press the briquetting and press the encapsulation chip and press down briquetting fixed connection, be convenient for control glue drips to the encapsulation chip on and evenly distributed, the practicality of device has been improved greatly, and convenient to use.

2. This ultra-thin packaging structure that integrates, at staff's in-process of using device, the staff is reverse to be opened driving motor control and is pressed the briquetting upward movement, place the upper end at the encapsulation chip with the second chip, open driving motor control again this moment and press briquetting downward movement, and then realized the encapsulation to the chip, through setting up a plurality of briquetting and a plurality of solder ball one-to-one according to the pressure, can better encapsulate the chip when pressing the encapsulation chip according to the briquetting, and can control main connecting pipe and then do not have glue to drip to the chip when pressing for the second time through setting up control panel, the practicality of device has been improved greatly, and convenient to use.

Drawings

Fig. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic view of the three-dimensional structure of the present invention;

fig. 3 is a schematic view of the cross-sectional structure of the present invention.

Wherein: 1. a base; 2. a pillar; 3. a groove; 4. a bearing seat; 5. a drive motor; 6. a guide bar; 7. a screw rod; 8. a lifting plate; 9. a threaded sleeve; 10. a glue tank; 11. a feed inlet; 12. a main connection pipe; 13. a branch connection pipe; 14. a pressing block; 15. packaging the chip; 16. a solder ball; 17. a control panel; 18. a guide sleeve.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, an ultra-thin integrated package structure comprises a base 1, two pillars 2 are fixedly mounted at the lower end of the base 1, a plurality of grooves 3 are formed in the upper end surface of the base 1, a bearing seat 4 is fixedly mounted in each groove 3, a guide rod 6 is movably mounted on the inner side of the bearing seat 4 at the left side of the base 1, a screw rod 7 is movably mounted on the inner side of the bearing seat 4 at the right side of the base 1, a driving motor 5 is fixedly mounted in the base 1, a lifting plate 8 is movably mounted between the guide rods 6 and the screw rod 7, a plurality of guide sleeves 18 are fixedly mounted on the upper end surface of the lifting plate 8, a threaded sleeve 9 is fixedly mounted on the upper end surface of the lifting plate 8, a control panel 17 is fixedly mounted on the front end surface of the lifting plate 8, a glue tank 10 is fixedly mounted on the upper end surface of the lifting plate 8, a charging opening, a plurality of branch connecting pipes 13 are fixedly mounted at the lower end of the main connecting pipe 12, a plurality of pressing blocks 14 are fixedly mounted at the lower end of the lifting plate 8, a packaged chip 15 is placed on the upper end face of the base 1, and a plurality of solder balls 16 are arranged on the upper end face of the packaged chip 15.

Further, lead screw 7 and 6 symmetric distributions of guide bar are in the left and right sides of encapsulation chip 15, control panel 17 is electric connection with driving motor 5, glue case 10 is located the central point of lifter plate 8 and puts, through setting up lead screw 7 and 6 symmetric distributions of guide bar in the left and right sides of encapsulation chip 15 and control panel 17 and driving motor 5 be electric connection, be convenient for at staff's in-process of using device, open driving motor 5 through control panel 17, and then drive lead screw 7 and rotate when driving motor 5 opens, owing to set up threaded sleeve 9 and lead screw 7 and be threaded connection, be convenient for can control lifter plate 8 downstream, and then can control and press the briquetting 14 to press encapsulation chip 15.

Further, main connecting pipe 12 is located the inside of lifter plate 8, and the upper end of main connecting pipe 12 extends to the inside of gluey water tank 10, and the lower extreme that divides connecting pipe 13 extends to the inside of pressing pressure piece 14, and the upper end through setting up main connecting pipe 12 extends to the inside of gluey water tank 10, is convenient for at staff's in-process using device, transmits the inside glue of gluey water tank 10 to the inside of pressing pressure piece 14, and then distributes to the up end of encapsulation chip 15.

Furthermore, the guide sleeve 18 and the threaded sleeve 9 are symmetrically distributed on the left side and the right side of the glue box 10, the threaded sleeve 9 is in threaded connection with the lead screw 7, the solder balls 16 are in one-to-one correspondence with the pressing blocks 14, and the solder balls 16 are in one-to-one correspondence with the pressing blocks 14, so that the chips can be better packaged when the packaged chips 15 are pressed by the pressing blocks 14.

Further, 2 symmetric distributions of pillar are in the left and right sides of glue case 10, and the lower extreme of lead screw 7 and driving motor 5's output shaft fixed connection, and the lower extreme of charge door 11 extends to the inside of glue case 10, through setting up 2 symmetric distributions of pillar in the left and right sides of glue case 10, is convenient for place the device on the workstation, extends to the inside of glue case 10 through the lower extreme that sets up charge door 11, is convenient for feed in raw material to the inside of glue case 10.

When the device is used, in the process of using the device by a worker, the worker firstly places the device on a workbench, the driving motor 5 is started through the control panel 17, the lead screw 7 is driven to rotate when the driving motor 5 is started, the lifting plate 8 can be controlled to move downwards due to the threaded connection between the threaded sleeve 9 and the lead screw 7, the pressing block 14 can be controlled to press the packaged chip 15, the lower end of the branch connecting pipe 13 is fixedly connected with the pressing block 14, the glue can be conveniently controlled to drip onto the packaged chip 15 and be uniformly distributed, the worker reversely starts the driving motor 5 to control the pressing block 14 to move upwards at the moment, a second chip is placed at the upper end of the packaged chip 15, the driving motor 5 is started again to control the pressing block 14 to move downwards at the moment, the chip is packaged, and the plurality of blocks 14 are arranged to correspond to the plurality of solder balls 16 one by one to one, can better encapsulate the chip when pressing according to briquetting 14 and pressing encapsulation chip 15, and can control main connecting pipe 12 through setting up control panel 17 and then do not have glue to drip to the chip when pressing for the second time, improve the practicality of device greatly, convenient to use.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an ultra-thin packaging structure that integrates, includes base (1), its characterized in that: the lower end of the base (1) is fixedly provided with two pillars (2), the upper end face of the base (1) is provided with a plurality of grooves (3), the inside of each groove (3) is fixedly provided with a bearing seat (4), the inside of the bearing seat (4) on the left side of the base (1) is movably provided with a guide rod (6), the inside of the bearing seat (4) on the right side of the base (1) is movably provided with a lead screw (7), the inside of the base (1) is fixedly provided with a driving motor (5), a lifting plate (8) is movably arranged between the guide rod (6) and the lead screw (7), the upper end face of the lifting plate (8) is fixedly provided with a plurality of guide sleeves (18), the upper end face of the lifting plate (8) is fixedly provided with a threaded sleeve (9), the front end face of the lifting plate (8) is fixedly provided with a control panel (17), the upper end face of the lifting plate (8, the up end fixed mounting of gluey water tank (10) has charge door (11), the lower extreme fixed mounting of gluey water tank (10) has main connecting pipe (12), the lower extreme fixed mounting of main connecting pipe (12) has a plurality of branch connecting pipes (13), the lower extreme fixed mounting of lifter plate (8) has a plurality of pressure blocks (14), encapsulation chip (15) have been placed to the up end of base (1), the up end of encapsulation chip (15) is provided with a plurality of solder balls (16).

2. The ultra-thin integrated package structure of claim 1, wherein: lead screw (7) and guide bar (6) symmetric distribution are in the left and right sides of encapsulation chip (15), control panel (17) and driving motor (5) are electric connection, glue water tank (10) are located the central point of lifter plate (8) and put.

3. The ultra-thin integrated package structure of claim 1, wherein: the main connecting pipe (12) is positioned inside the lifting plate (8), the upper end of the main connecting pipe (12) extends to the inside of the glue tank (10), and the lower end of the branch connecting pipe (13) extends to the inside of the pressing block (14).

4. The ultra-thin integrated package structure of claim 1, wherein: the guide sleeve (18) and the threaded sleeve (9) are symmetrically distributed on the left side and the right side of the glue tank (10), the threaded sleeve (9) is in threaded connection with the screw rod (7), and the solder balls (16) correspond to the pressing blocks (14) one to one.

5. The ultra-thin integrated package structure of claim 1, wherein: pillar (2) symmetric distribution is in the left and right sides of gluey water tank (10), the lower extreme of lead screw (7) and driving motor (5) output shaft fixed connection, the lower extreme of charge door (11) extends to the inside of gluey water tank (10).