CN212162328U - Laser packaging negative plate structure - Google Patents
Laser packaging negative plate structure Download PDFInfo
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- CN212162328U CN212162328U CN202020911846.1U CN202020911846U CN212162328U CN 212162328 U CN212162328 U CN 212162328U CN 202020911846 U CN202020911846 U CN 202020911846U CN 212162328 U CN212162328 U CN 212162328U
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- negative plate
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- stress release
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Abstract
The utility model relates to a laser instrument technical field, concretely relates to laser instrument encapsulation negative plate structure, include: the negative plate comprises a negative plate body, a first end part and a second end part, wherein the first end part and the second end part are opposite to each other in the length direction of the negative plate body; at least one stress release hole is arranged on the bending part. Above-mentioned laser instrument encapsulation negative pole piece structure is through seting up the stress release hole in the portion of bending for the internal stress that negative pole piece body received when bending passes through the release of stress release hole, thereby has reduced the internal stress of negative pole piece, makes the weld part lie in the chip bonding time, and the laminating is inseparabler, and the welding effect is better, thereby promotes the performance and the encapsulation yield of device.
Description
Technical Field
The utility model belongs to the technical field of the laser instrument, concretely relates to laser instrument encapsulation negative pole piece structure.
Background
The high-power laser and the pumping solid laser thereof have the advantages of small volume, light weight, high photoelectric conversion efficiency, stable performance, high reliability, long service life and the like, become products with the most development prospect in the photoelectric industry, and are widely applied to the fields of industry, military, medical treatment, direct material treatment and the like.
The cathode plate in the micro-channel water-cooled laser package is an indispensable structure and is used as the cathode of the device. The negative plate is made of oxygen-free copper and is formed by rolling and machining. The front section part of the negative plate completely covers the chip and is welded with the chip, bending treatment is needed before welding, and the welding fitting degree of the negative plate and the chip is a great factor influencing the performance of the chip.
The welding part of the front section of the negative plate and the chip in the existing micro-channel water-cooled laser package is generally in a structure as shown in fig. 1, the upper end part of the negative plate is a welding part with the chip, the welding part is in a whole sheet structure, a bending part 14 'is formed when the welding part is bent before welding, and the bending part 14' is in a whole sheet structure, so that the internal stress of the negative plate is large, the welding quality is poor, and the device performance is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that the problem among the prior art is overcome to a laser instrument encapsulation negative plate structure inseparable, that the welding is effectual with the chip bonding laminating is provided.
Therefore, the utility model provides a laser instrument encapsulation negative plate structure, include:
the negative plate comprises a negative plate body, a first end part and a second end part, wherein the first end part and the second end part are opposite to each other in the length direction of the negative plate body;
at least one stress release hole is arranged on the bending part.
Optionally, the laser device packages the negative plate structure, the stress release hole is a flat elliptical hole, and a long axis direction of the flat elliptical hole is parallel to a length direction of the negative plate body.
Optionally, in the laser package negative plate structure, a stress release hole that is not communicated with each other is respectively disposed at a boundary between the welding portion and the bending portion and a boundary between the connecting portion and the bending portion, or both ends of the stress release hole in a long axis direction respectively extend to an outer side of the bending portion.
Optionally, in the laser-encapsulated negative electrode sheet structure, the stress release holes include a plurality of holes, and the stress release holes are arranged in a row at intervals at least along the width direction of the negative electrode sheet body.
Optionally, the laser device encapsulates the negative plate structure, and the stress release hole is a through hole penetrating through the negative plate body.
Optionally, in the laser-packaged negative electrode plate structure, a plane where the connecting portion is located and a plane where the welding portion is located are not on the same plane.
Optionally, in the laser-packaged negative electrode plate structure, the bent portion is obliquely arranged relative to the connecting portion and the welding portion.
Optionally, the laser instrument encapsulation negative plate structure, the portion of bending is including being close to the first portion of bending of welding part and being close to the second portion of bending of connecting portion, first portion of bending with the contained angle that the plane at welding part place becomes will be less than the second portion of bending with the contained angle that the plane at welding part place becomes.
Optionally, in the laser package negative plate structure, in an assembled state, a projection of the first bending portion falls on the upper surface of the chip; the projection of the second bending part falls on the heat sink.
Optionally, the laser encapsulation negative plate structure, link up still has been seted up on the connecting portion the water inlet preformed hole, the delivery port preformed hole and the connecting hole of negative plate body, the connecting hole is located between water inlet preformed hole and the delivery port preformed hole just the center of connecting hole, water inlet preformed hole and delivery port preformed hole is on same straight line.
The utility model discloses technical scheme has following advantage:
1. the utility model provides a laser instrument encapsulation negative plate structure, include: the negative plate comprises a negative plate body, a first end part and a second end part, wherein the first end part and the second end part are opposite to each other in the length direction of the negative plate body;
at least one stress release hole is arranged on the bending part.
Above-mentioned laser instrument encapsulation negative pole piece structure is through seting up the stress release hole in the portion of bending for the internal stress that negative pole piece body received when bending passes through the release of stress release hole, thereby has reduced the internal stress of negative pole piece, makes the weld part lie in the chip bonding time, and the laminating is inseparabler, and the welding effect is better, thereby promotes the performance and the encapsulation yield of device.
2. The utility model provides a laser instrument encapsulation negative plate structure, the both ends of stress release hole's major axis direction extend to respectively the outside of the portion of bending. The welding condition of the welding part and the welding surface of the chip can be observed more directly.
3. The utility model provides a laser instrument encapsulation negative plate structure, stress release hole is for lining up the through-hole of negative plate body. The release of the internal stress of the bent negative plate body is facilitated.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic perspective view of a conventional cathode plate structure for a microchannel laser package;
fig. 2 is a schematic structural diagram of a laser packaging negative plate structure of the present invention;
fig. 3 is a schematic structural diagram of the laser device package cathode plate structure and the chip, the insulation sheet and the heat sink package.
Description of reference numerals:
1-negative plate body; 11-a first end portion; 12-a second end; 13-a weld; 14-bending part; 141-a first bend; 142-a second bend; 15-a connecting part;
2-stress relief holes;
3-reserving holes at the water inlet;
4-reserving holes at the water outlet;
5-connecting holes;
6-heat sink;
7-chip;
8-insulating sheet.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1
The laser-encapsulated negative electrode sheet structure of the present embodiment, as shown in fig. 2 to fig. 3, includes a negative electrode sheet body 1 of a plate-shaped structure, where the negative electrode sheet body 1 is made of an oxygen-free copper material and includes a first end portion 11 and a second end portion 12, the first end portion 11 and the second end portion 12 are located at two ends of the negative electrode sheet body 1 in the length direction, that is, at upper and lower ends as shown in fig. 2, where the negative electrode sheet body 1 is formed with a welding portion 13 welded and fixed to the chip 7 near the first end portion 11, and a connection portion 15 connected to the insulating sheet 8 is formed near the second end portion 12, and as shown in fig. 2, both the width and the length of the welding portion 13 are smaller than the connection; one end of the welding part 13 close to the connecting part 15 is provided with a bending part 14, and the bending part 14 is provided with a row of a plurality of flat oval stress releasing holes 2 which are arranged at intervals along the width direction of the negative electrode plate body 1.
As for the bent portion 14, as shown in fig. 2, the area between the two broken lines indicates the bent portion 14, and the bent portion 14 is disposed obliquely with respect to the connecting portion 15 and the welding portion 13, specifically, as shown in fig. 3, the package structure includes a first bending portion 141 close to the soldering portion 13 and a second bending portion 142 close to the connecting portion 15, an included angle between the first bending portion 141 and a plane of the soldering portion 13 is smaller than an included angle between the second bending portion 142 and a plane of the soldering portion 13 or a plane of the connecting portion 15, the plane of the soldering portion 13 and the plane of the connecting portion 15 are vertically parallel, that is, the plane of the connecting portion 15 and the plane of the soldering portion 13 are not on the same plane, specifically, as shown in fig. 3, the plane of the connecting portion 15 is higher than the plane of the soldering portion 13, because the thickness of the chip 7 in the package structure is lower than the thickness of the insulating sheet 8. Optionally, the bending portion 14 may also be a Z-shaped configuration or an S-shaped configuration, which is not particularly limited, and a person skilled in the art may select and design the bending portion according to actual situations. Alternatively, as shown in fig. 3, in the assembled state, the projection of the first bending portion 141 is on the upper surface of the chip 7, and the projection of the second bending portion 142 is on the heat sink 6.
As shown in fig. 2, the stress release holes 2 are formed in an oblong shape, and the long axis direction of the stress release holes 2 is parallel to the longitudinal direction of the negative electrode sheet body 1. Stress release hole 2 includes a plurality of, and a plurality of stress release holes 2 are that periodic array arranges, and is specific, and a plurality of stress release holes 2 are arranged along the even interval of the width direction of negative pole piece body 1. The wheelbase and the number of the stress release holes 2 are obtained by simulation calculation, and are not specifically described and limited in detail, and can be designed by those skilled in the art according to actual situations. The stress release holes 2 not communicating with each other are formed at the boundary between the connection portion 15 and the second bent portion 142 and the boundary between the welding portion 13 and the first bent portion 141. Alternatively, both ends of the stress release hole 2 in the long axis direction extend to the outside of the bent portion 14, that is, to the connecting portion 15 and the welding portion 13, respectively. As for the number of the stress release holes 2, other numbers, such as one, two, etc., can be selected and designed according to the bending degree of the bending portion 14 and the material of the negative electrode tab body 1; the shape of the stress release hole 2 can also be other shapes, such as a circle, a square, a special shape, and the like, and the design can be selected according to actual requirements. Optionally, the stress release hole is a through hole penetrating through the negative electrode plate body, so that the welding condition of the welding surface between the negative electrode plate body 1 and the chip 7 can be observed more directly. Alternatively, the stress release holes 2 may not penetrate through the negative electrode tab body 1, but may be blind holes opened in the negative electrode tab body 1.
As shown in fig. 1, still be equipped with water inlet preformed hole 3, delivery port preformed hole 4 and the connecting hole 5 that link up negative plate body 1 on connecting portion 15, connecting hole 5 is located between water inlet preformed hole 3 and the delivery port preformed hole 4 and the three sets up along the length direction interval of negative plate body 1, and water inlet preformed hole 3, delivery port preformed hole 4 and connecting hole 5 are the circular port, and the aperture of water inlet preformed hole 3, delivery port preformed hole 4 is greater than the aperture of connecting hole 5. Optionally, the centers of the connecting hole 5, the water inlet preformed hole 3 and the water outlet preformed hole 4 are on the same straight line.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.
Claims (10)
1. A laser package negative plate structure, comprising:
the negative electrode sheet comprises a negative electrode sheet body (1) and a negative electrode sheet body, wherein the negative electrode sheet body (1) is provided with a first end part (11) and a second end part (12) which are opposite to each other along the length direction of the negative electrode sheet body, a welding part (13) welded with a chip (7) is formed close to the first end part (11), a connecting part (15) connected with an insulating sheet (8) is formed close to the second end part (12), and a bending part (14) is formed between the welding part (13) and the connecting part (15);
at least one stress release hole (2) is arranged on the bending part (14).
2. The laser packaging negative plate structure according to claim 1, wherein the stress release hole (2) is a flat elliptical hole, and the long axis direction of the flat elliptical hole is parallel to the length direction of the negative plate body (1).
3. The laser packaging negative plate structure according to claim 2, wherein a stress release hole (2) which is not communicated with each other is respectively formed at a boundary between the welding portion (13) and the bent portion (14) and a boundary between the connecting portion (15) and the bent portion (14), or both ends of the stress release hole (2) in a long axis direction respectively extend to the outer side of the bent portion (14).
4. The laser packaging negative plate structure according to any one of claims 1 to 3, wherein the stress release holes (2) comprise a plurality of stress release holes, and the stress release holes (2) are arranged in a row at least along the width direction of the negative plate body (1).
5. The laser packaging negative plate structure according to claim 4, wherein the stress release hole (2) is a through hole penetrating through the negative plate body (1).
6. The laser packaging negative plate structure according to claim 1, wherein the plane of the connecting portion (15) is not on the same plane as the plane of the welding portion (13).
7. The laser packaging negative plate structure according to claim 6, wherein the bent portion (14) is arranged obliquely with respect to the connecting portion (15) and the welding portion (13).
8. The negative plate structure for laser packaging according to claim 7, wherein the bent portion (14) comprises a first bent portion (141) close to the welding portion (13) and a second bent portion (142) close to the connecting portion (15), and an included angle formed by the first bent portion (141) and a plane where the welding portion (13) is located is smaller than an included angle formed by the second bent portion (142) and a plane where the welding portion (13) is located.
9. The laser package negative plate structure according to claim 8, wherein, in an assembled state, a projection of the first bending portion (141) falls on an upper surface of the chip (7); the projection of the second bending part (142) falls on the heat sink (6).
10. The laser packaging negative plate structure according to claim 1, wherein the connecting portion (15) is further provided with a water inlet preformed hole (3), a water outlet preformed hole (4) and a connecting hole (5) which penetrate through the negative plate body (1), the connecting hole (5) is located between the water inlet preformed hole (3) and the water outlet preformed hole (4), and centers of the connecting hole (5), the water inlet preformed hole (3) and the water outlet preformed hole (4) are on the same straight line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020911846.1U CN212162328U (en) | 2020-05-26 | 2020-05-26 | Laser packaging negative plate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020911846.1U CN212162328U (en) | 2020-05-26 | 2020-05-26 | Laser packaging negative plate structure |
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| Publication Number | Publication Date |
|---|---|
| CN212162328U true CN212162328U (en) | 2020-12-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202020911846.1U Active CN212162328U (en) | 2020-05-26 | 2020-05-26 | Laser packaging negative plate structure |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112490844A (en) * | 2020-11-26 | 2021-03-12 | 苏州长光华芯光电技术股份有限公司 | Bar laser packaging structure and preparation method thereof |
| CN114784618A (en) * | 2022-06-22 | 2022-07-22 | 度亘激光技术（苏州）有限公司 | Chip packaging method, negative plate and laser |
| CN114784621A (en) * | 2022-06-22 | 2022-07-22 | 度亘激光技术（苏州）有限公司 | Negative plate and laser packaging method |
| CN115102029A (en) * | 2022-06-22 | 2022-09-23 | 度亘激光技术（苏州）有限公司 | Negative plate and laser |
-
2020
- 2020-05-26 CN CN202020911846.1U patent/CN212162328U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112490844A (en) * | 2020-11-26 | 2021-03-12 | 苏州长光华芯光电技术股份有限公司 | Bar laser packaging structure and preparation method thereof |
| CN114784618A (en) * | 2022-06-22 | 2022-07-22 | 度亘激光技术（苏州）有限公司 | Chip packaging method, negative plate and laser |
| CN114784621A (en) * | 2022-06-22 | 2022-07-22 | 度亘激光技术（苏州）有限公司 | Negative plate and laser packaging method |
| CN114784621B (en) * | 2022-06-22 | 2022-09-20 | 度亘激光技术（苏州）有限公司 | Negative plate and laser packaging method |
| CN115102029A (en) * | 2022-06-22 | 2022-09-23 | 度亘激光技术（苏州）有限公司 | Negative plate and laser |
| CN115102029B (en) * | 2022-06-22 | 2023-11-07 | 度亘激光技术（苏州）有限公司 | Negative plate and laser |
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