CN212161797U - Driving backboard and display panel thereof - Google Patents
Driving backboard and display panel thereof Download PDFInfo
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- CN212161797U CN212161797U CN202021128676.6U CN202021128676U CN212161797U CN 212161797 U CN212161797 U CN 212161797U CN 202021128676 U CN202021128676 U CN 202021128676U CN 212161797 U CN212161797 U CN 212161797U
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Abstract
The utility model discloses a drive backplate and display panel thereof, wherein, include: the heat dissipation structure comprises a backboard substrate, a contact electrode arranged on the backboard substrate, an anisotropic conductive adhesive layer covering the contact electrode and a first heat dissipation layer arranged on the anisotropic conductive adhesive layer; the first heat dissipation layer is provided with a plurality of through holes corresponding to the contact electrodes for mounting the luminous elements. The utility model provides a drive backplate during operation, the heat of illuminating part directly conducts on the first heat dissipation layer, through the direct heat conduction of first heat dissipation layer, disperses the heat on the illuminating part, makes the heat distribution of whole drive backplate even, and the heat dissipation is faster.
Description
Technical Field
The utility model relates to a show technical field, especially relate to a drive backplate and display panel thereof.
Background
At present, with the continuous development of display panel technology, the display industry has increasingly high requirements for the characteristics of the display panel, such as high resolution, high saturation, low power consumption, thin thickness, etc., and the Micro LED technology, as a new generation display technology, has the advantages of high brightness, good light emitting efficiency, low energy consumption, etc., which have begun to enter the visual field of people, but the Micro LED display technology industry still faces several difficulties at present, mainly including chip manufacturing, mass transfer, full color display, backplane design, etc. In the backplane technology, the current circuit is used in the LED, and a Thin Film Transistor (TFT) circuit is printed on the backplane and supplied with a stable current by a Chip Bonding.
However, the back plate of a Printed Circuit Board (PCB) currently on the market is only one whole surface, and is easy to warp when the size is large, and the back plate cannot be used as a flexible screen. In addition, the conversion of one LED into light energy is less than 30% in practice, and most of the conversion into heat energy needs to be carried out through a back plate, a Chip and the like for effective heat dissipation.
Accordingly, the prior art is yet to be improved and developed.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned prior art not enough, the utility model aims at providing a drive backplate and display panel thereof aims at solving the unable effective radiating problem of drive backplate.
The technical scheme of the utility model as follows:
a driving backplate, comprising: the heat dissipation structure comprises a backboard substrate, a contact electrode arranged on the backboard substrate, an anisotropic conductive adhesive layer covering the contact electrode and a first heat dissipation layer arranged on the anisotropic conductive adhesive layer; the first heat dissipation layer is provided with a plurality of through holes corresponding to the contact electrodes, and each through hole is used for correspondingly mounting a light-emitting piece.
The driving back plate is characterized in that the back plate base body is a polyimide film, and a thin film transistor circuit is printed on the back plate base body.
The driving back plate, wherein the cross-sectional width of the through hole is greater than or equal to the cross-sectional width of the contact electrode.
The driving backboard is characterized in that the first heat dissipation layer is an aluminum nitride layer.
The driving back plate comprises a second heat dissipation layer, and the second heat dissipation layer is arranged on one side, away from the contact electrode, of the back plate base body.
The driving back plate is characterized in that a plurality of grooves are formed in one side, deviating from the back plate base body, of the second heat dissipation layer.
The driving backboard is characterized in that the second heat dissipation layer is an aluminum nitride layer.
The driving back plate is characterized in that the light emitting piece is a Micro LED or a mini LED.
The driving backboard is characterized in that the height of the first heat dissipation layer is smaller than or equal to the thickness of the light-emitting piece.
A display panel comprising a light emitting member and a driving backplane as described in any one of the above, the light emitting member being mounted on the driving backplane.
Compared with the prior art, the embodiment of the utility model provides a have following advantage:
the utility model provides an anisotropic conductive adhesive layer is only electrically conductive in the Z direction, but the messenger sets up illuminating part and the contact electrode intercommunication of both sides about the anisotropic conductive adhesive layer, install illuminating part in individual through-hole, make illuminating part's lateral wall and first heat dissipation layer contact, when the work of drive backplate, the heat of illuminating part directly conducts on first heat dissipation layer, the speed of heat conduction is faster than the speed of conduction in the air on first heat dissipation layer, heat is conducted through first heat dissipation layer, the heat on the dispersion illuminating part, make the heat distribution of whole drive backplate even, the heat dissipation is faster.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural view of a driving backplate according to the present invention;
fig. 2 is a schematic structural diagram of a display panel according to the present invention;
fig. 3 is a schematic structural diagram of step 2 in the manufacturing process of the driving back plate of the present invention;
fig. 4 is a schematic structural diagram of step 3 in the manufacturing process of the driving back plate of the present invention;
fig. 5 is a schematic structural diagram of step 5 in the manufacturing process of the driving back plate of the present invention.
100, a backboard substrate; 200. a contact electrode; 300. an anisotropic conductive adhesive layer; 400. a first heat dissipation layer; 410. a through hole; 500. a second heat dissipation layer; 510. a groove; 600. a light emitting member.
Detailed Description
In order to make the technical solution of the present invention better understood, the technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The embodiment of the present invention provides an XYZ rectangular coordinate system, as shown in fig. 2, which is oriented by the contact electrode 200, the direction of the illuminating member 600 is the Z direction, the arrangement direction of the illuminating members 600 is the X direction, and the direction perpendicular to the paper surface is the Y direction.
In the existing display technology, a high-resolution, high-precision and high-brightness display screen is increasingly sought, Micro LEDs are used as a new generation display technology, and have higher brightness, better luminous efficiency and lower power consumption compared with the existing OLED technology, and are widely applied by many industry enterprises, but the high resolution means that on the same panel with the same area and size, the number of light-emitting elements used in the Micro LED display technology is more, so the problem that the back plate needs to dissipate heat is more prominent, the heat generated by the light-emitting elements is slowly conducted in the air, and cannot be dissipated quickly, and the air is flowing gas, which easily causes heat accumulation and even damages the back plate. In addition, the PCB backboard is used as a backboard substrate in the market, the flexibility of the PCB backboard is poor, the resolution cannot be improved due to the limitation on the line width of the driving circuit, the heat conduction speed is also poor, and the heat dissipation is not facilitated.
Referring to fig. 1, the present invention provides a structural schematic diagram of a driving back plate, which discloses a driving back plate, wherein, includes: the heat dissipation structure comprises a backboard substrate 100, a contact electrode 200 arranged on the backboard substrate 100, an anisotropic conductive adhesive layer 300 covering the contact electrode 200, and a first heat dissipation layer 400 arranged on the anisotropic conductive adhesive layer 300; a plurality of through holes 410 are formed in the first heat dissipation layer 400 at positions corresponding to the contact electrodes 200, and each through hole 410 is used for correspondingly mounting one light emitting element 600.
The anisotropic conductive adhesive layer 300 of the present application is only conductive in the Z direction, and is not conductive in the X direction and the Y direction, that is, each electrode is only electrified with the light emitting element 600 installed in the through hole 410 at the corresponding position, and is not short-circuited with other contact electrodes 200 on the backplane substrate 100, so that the light emitting elements 600 and the contact electrodes 200 arranged at the upper and lower sides of the anisotropic conductive adhesive layer 300 are independently communicated, the light emitting elements 600 are installed in the through holes 410, so that the side walls of the light emitting elements 600 are in contact with the first heat dissipation layer 400, when the driving backplane works, the heat of the light emitting elements 600 is directly transferred to the first heat dissipation layer 400, the speed of heat transfer on the first heat dissipation layer 400 is faster than the speed of heat transfer in the air, and the heat on the light emitting elements 600 is dispersed by the heat transfer of the first heat dissipation layer 400, so that the heat of the entire driving backplane is uniformly distributed and dissipates heat; moreover, each through hole 410 is correspondingly provided with one luminescent piece 600, the first heat dissipation layer 400 also has a protection effect on the luminescent piece 600, and the through hole 410 is aligned with the contact electrode 200, so that the through hole 410 arranged on the first heat dissipation layer 400 is also beneficial to the rapid alignment installation of the luminescent piece 600, the installation time and cost are saved, and the installation efficiency is improved.
In addition, since the light emitting elements 600 in the Micro LED display technology are relatively small, the precision requirement of the through hole 410 is high, the through hole 410 can be manufactured by etching, the etching cost is low, the reliability is high, the flexibility is good, the accuracy is good, and the damage to the lower anisotropic conductive adhesive layer 300 is less.
Specifically, the backplane substrate 100 is a polyimide film, and a thin film transistor circuit is printed on the backplane substrate 100. The polyimide film (PI film) has outstanding high temperature resistance, radiation resistance, chemical corrosion resistance and electrical insulation performance, also has excellent thermal stability, is suitable for being used as a base material of the back plate matrix 100, and particularly has good flexibility as the back plate matrix 100, can adapt to market demands and can be used for manufacturing flexible screens; and when the polyimide film is printed on the thin film transistor circuit, the line width of the circuit is not limited, and the small-size light-emitting part 600 meeting the technical requirements of Micro LED display can emit light, so that the requirement of high resolution is met.
Specifically, the first heat dissipation layer 400 is an aluminum nitride layer. The aluminum nitride is a high-temperature resistant material with good thermal conductivity, good thermal stability and good insulation, the aluminum nitride is used as the first heat dissipation layer 400, the heat dissipation speed of the light-emitting member 600 can be increased, the thermal expansion coefficient of the aluminum nitride is small, when the light-emitting member 600 works, the temperature of the first heat dissipation layer 400 is increased, but the volume change is small, large pressure cannot be generated on the side wall of the light-emitting member 600, and the extrusion to the light-emitting member 600 is reduced; the aluminum nitride is sintered in a liquid phase, a crystal boundary has no second phase, the crystal structure is very compact, the plasma corrosion resistance is good, and the service life of the first heat dissipation layer 400 can be prolonged; in addition, the aluminum nitride is white or off-white, opaque, and is disposed around each light emitting member 600, and also serves as a Bank to prevent light mixing between adjacent light emitting members 600.
In addition, the first heat dissipation plate can be made of materials such as alumina and glass fiber plate, and the same technical effects can be achieved.
Specifically, the cross-sectional width of the through hole 410 is greater than or equal to the cross-sectional width of the contact electrode 200. The through hole 410 is used for installing the light emitting member 600, the light emitting member 600 can normally work only by being communicated with the two poles of the contact electrode 200, and the anisotropic conductive adhesive layer 300 can only conduct electricity in the Z direction and cannot conduct electricity in the inclined direction, so that the cross-sectional width of the through hole 410 aligned above the contact electrode 200 needs to be larger than or equal to that of the contact electrode 200, the light emitting member 600 is prevented from being aligned inaccurately to be directly above the contact electrode 200, and the normal and effective use state of the light emitting member 600 is maintained.
Specifically, the driving back plate includes a second heat dissipation layer 500, and the second heat dissipation layer 500 is disposed on a side of the back plate substrate 100 away from the contact electrode 200. Although the backplane substrate 100 may be made of a polyimide film and has high temperature resistance, the thin film transistor circuit printed on the backplane substrate 100 still may be affected, so the backplane substrate 100 also needs to dissipate heat, the second heat dissipation layer 500 is disposed on one side of the backplane substrate 100 away from the contact electrode 200 to accelerate heat dissipation of the backplane substrate 100, and further accelerate heat dissipation of the light emitting member 600, thereby reducing heat accumulation on the light emitting member 600, further improving the effect of uniform heat dissipation, and facilitating normal work of the light emitting member 600.
Further, a groove 510 is formed in one side of the second heat dissipation layer 500, which is away from the backplate substrate 100, and a plurality of grooves 510 are formed in the groove 510. The groove 510 can increase the surface area of the second heat dissipation layer 500 for heat dissipation, increase the heat dissipation speed, improve the heat dissipation effect, and achieve multi-position heat dissipation.
Further, the grooves 510 may be staggered with respect to the through holes 410, and the grooves 510 may be formed at staggered positions with respect to the through holes 410 by etching, so that the grooves 510 and the through holes 410 are staggered, heat dissipation may be more dispersed, and the overall temperature conduction speed of the surface of the second heat dissipation layer 500 may be increased.
Specifically, the second heat dissipation layer 500 is an aluminum nitride layer. The characteristics of high temperature resistance, good thermal conductivity and long service life of the aluminum nitride are utilized to maintain the long-term effective heat dissipation effect of the second heat dissipation layer 500. And the first heat dissipation layer 400 and the second heat dissipation layer 500 are made of aluminum nitride materials by using a chemical deposition method, so that the types of raw materials are reduced, resources are saved, the manufacturing method and steps are simplified, the production cost is reduced, and the production efficiency is increased.
Specifically, the light emitting element 600 is a Micro LED or a mini LED.
Specifically, the height of the first heat dissipation layer 400 is less than or equal to the thickness of the light emitting member 600. Because a plurality of luminescent members 600 are often installed at one time through the transfer head when the luminescent member 600 is installed, in the alignment installation process, the luminescent member 600 needs to be inserted into the through hole 410, the height of the first heat dissipation layer 400 is a little lower, and the luminescent member 600 can be completely inserted into the anisotropic conductive adhesive layer 300 without being separated from the transfer head when the luminescent member 600 is inserted into the through hole 410, thereby ensuring complete installation.
Referring to fig. 2, based on the above embodiments, the present application further discloses a display panel, which includes a light emitting element 600 and the driving back plate as described above, where the light emitting element 600 is mounted on the driving back plate, specifically as described above.
The specific scheme of the application comprises the following process flows:
step 1, using a PI polyimide film as a backboard substrate, printing a TFT circuit on the PI polyimide film, depositing an ITO film layer on the PI film, cleaning the PI film layer by using ionized water, coating photoresist on the ITO film layer, irradiating the surface of the photoresist by using a pre-manufactured electrode pattern mask plate to react, cleaning the exposed photoresist by using a developer to leave an unexposed photoresist part, etching the ITO film without the photoresist cover by using a proper acid etching solution to obtain an electrode, removing the residual photoresist by using a high-concentration alkali solution to finish the processes of 'film-yellow light-etching-photoresist removing', and the like, printing a TFT Gate/source electrode/drain electrode and a circuit connected with each Pixel in series, and finally binding an IC on the PI film;
step 2, referring to fig. 3, coating anisotropic conductive adhesive on the printed PI film of the TFT, wherein the coated conductive adhesive is in a semi-solid state and covers the contact electrode;
step 3, referring to fig. 4, after the conductive paste is coated, depositing an aluminum nitride material on the upper surface of the anisotropic conductive paste by CVD chemical vapor deposition to form a solid first aluminum nitride layer, and depositing an aluminum nitride material on the lower surface of the PI film to form a solid second aluminum nitride layer; then forming a through hole on the first aluminum nitride layer through an etching process to obtain a first heat dissipation layer; forming a groove on the second aluminum nitride layer to obtain a second heat dissipation layer;
step 4, when the aluminum nitride material is etched, etching is carried out on the first heat dissipation layer according to the placement position of the luminescent piece, and a through hole penetrating through the first heat dissipation layer is formed through etching; on the PI film surface, the heat dissipation effect is ensured according to the most common reactive ion etching mode of the heat dissipation plate;
step 5, referring to fig. 5, after the PI film is processed as above, fixing the light-emitting member on the transfer head for transfer, and mounting the light-emitting member at a position aligned with the through hole;
and 6, accurately aligning the PI film and the luminous piece, and after the luminous piece is completely inserted into the through hole, loosening the luminous piece by the transfer head and moving away, thereby completing the whole process. And subsequently, current is introduced to the TFT on the PI film, and the LED emits light through the electrode and the conductive adhesive. If the RGB chips are transferred, the RGB chips are placed on the transient substrate in advance according to the arrangement mode of the RGB chips during transfer.
It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (10)
1. A drive backplate, comprising: the heat dissipation structure comprises a backboard substrate, a contact electrode arranged on the backboard substrate, an anisotropic conductive adhesive layer covering the contact electrode and a first heat dissipation layer arranged on the anisotropic conductive adhesive layer; the first heat dissipation layer is provided with a plurality of through holes corresponding to the contact electrodes, and each through hole is used for correspondingly mounting a light-emitting piece.
2. A driving backplate according to claim 1 in which the backplate substrate is a polyimide film and the backplate substrate has thin film transistor circuitry printed thereon.
3. A driving backplate according to claim 1 in which the cross-sectional width of the through-hole is greater than or equal to the cross-sectional width of the contact electrode.
4. A driving backplate according to any one of claims 1 to 3, wherein the first heat sink layer is an aluminum nitride layer.
5. A driving backplate according to claim 1, comprising a second heat sink layer disposed on the side of the backplate substrate facing away from the contact electrodes.
6. A driving backplate according to claim 5, in which the second heat-dissipating layer is provided with a plurality of grooves on the side facing away from the backplate substrate.
7. A driving backplate according to any one of claims 5 or 6 in which the second heat sink layer is an aluminium nitride layer.
8. The driving backplane according to claim 1, wherein the light emitting elements are Micro LEDs or mini LEDs.
9. The driving backplate of claim 1, wherein the height of the first heat dissipation layer is less than or equal to the thickness of the light emitting member.
10. A display panel comprising a driving backplane according to any one of claims 1 to 9 and a light emitting member, wherein the light emitting member is mounted on the driving backplane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021128676.6U CN212161797U (en) | 2020-06-17 | 2020-06-17 | Driving backboard and display panel thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202021128676.6U CN212161797U (en) | 2020-06-17 | 2020-06-17 | Driving backboard and display panel thereof |
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| CN212161797U true CN212161797U (en) | 2020-12-15 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115863379A (en) * | 2022-12-19 | 2023-03-28 | 惠科股份有限公司 | Display device and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115863379A (en) * | 2022-12-19 | 2023-03-28 | 惠科股份有限公司 | Display device and manufacturing method thereof |
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