CN210110762U

CN210110762U - Ultra-thin booth apart from LED mirror screen

Info

Publication number: CN210110762U
Application number: CN201921324659.7U
Authority: CN
Inventors: 刘保; 袁良岁
Original assignee: Shenzhen Union Photoelectric Co Ltd
Current assignee: Shenzhen Union Photoelectric Co Ltd
Priority date: 2019-08-15
Filing date: 2019-08-15
Publication date: 2020-02-21
Anticipated expiration: 2029-08-15

Abstract

The utility model discloses an ultra-thin small-space LED mirror screen, which comprises a patch substrate, wherein a plurality of LED luminous elements are uniformly distributed on the upper surface of the patch substrate, the lower ends of the LED luminous elements are provided with heat dissipation chambers for dissipating heat, the lower surface of the patch substrate is provided with a plurality of fixed mounting posts perpendicular to the plane of the patch substrate, the LED luminous elements comprise a metal plate, a chip substrate is arranged above the metal plate, a plurality of luminous chips are uniformly arranged on the upper surface of the chip substrate, a heat dissipation substrate is arranged below the metal plate, a plurality of heat dissipation fins are arranged at the lower end of the heat dissipation substrate, the bottom end of the LED luminous element is provided with the heat dissipation efficiency between the heat dissipation substrate and the heat dissipation fins, the heat dissipation efficiency of the chip is accelerated by adopting a mode that an N-type electrode is replaced by a plurality of strip-shaped electrodes to be inserted into the, the problem of the luminous chip in the LED luminous element itself generate heat is solved.

Description

Ultra-thin booth apart from LED mirror screen

Technical Field

The utility model relates to a LED mirror display screen technical field specifically is an ultra-thin booth apart from LED mirror screen.

Background

The LED-light emitting diode is a display mode by controlling a semiconductor light emitting diode, and is composed of a plurality of small lamps, usually red, green and blue, which are turned on or off to display characters or video. The number of rows and columns of pixels of the LED display screen is called the resolution of the LED display screen. Resolution is the total number of pixels of a display screen and determines the information capacity of a display screen. The center distance between two adjacent pixels of the LED display screen is called as a point distance, the point distance reflects the pixel density from the distance between every two pixels, and the point distance and the pixel density are the physical properties of the display screen; the small-space LED display screen is a general name of a whole set of system, and comprises an LED display system, a high-definition display control system, a heat dissipation system and the like. The small-distance LED display screen adopts a pixel-level point control technology to realize the state control of the reducibility and the uniformity of the brightness and the color of a display screen pixel unit. The automatic reflow soldering process is adopted in the production process of the display screen, and manual post soldering is not needed. The characteristic of the small-spacing LED is that the dot spacing of the screen is small and the resolution of unit area is high. The method can display higher-definition graphic images and videos and can also display more multi-path videos and image pictures, and particularly can realize seamless and arbitrary large-area splicing in the aspect of image splicing. The information capacity is the number unit of the information carrying capacity of the pixel density; in general, the smaller the dot pitch, the higher the pixel density, and the more information capacity; in this case, when there are many pixels, the resolution is higher, and the display device is suitable for high-resolution video display and achieves a finer display effect. However, when the number of pixels is large and the dot pitch is small, the heat generation problem of the LED seriously affects the product quality.

For example, utility model patent application No. 201210364435.5 entitled dot-space LED display screen with face mask:

the utility model discloses a combination of the spliced pole on the face guard back and the adapter sleeve at the display panel back for when installing the face guard on display panel, the spliced pole is fixed with the adapter sleeve entangling after passing the aperture of seting up on the display panel. The installation problem of face guard has effectively been solved to make the mode that the dot interval LED display screen below 3mm improves the contrast through installing the face guard additional and can realize.

However, the existing LED mirror display screen with small dot spacing still has the following defects:

the existing small-dot-pitch LED mirror display screen is extremely easy to cause overhigh heat and cannot be timely dissipated due to high integration degree, the heat dissipation problem is still difficult to solve although the existing display screen is structurally adjusted correspondingly, and the tightness degree of the arrangement in a single luminous piece often influences the display quality of the whole screen.

Disclosure of Invention

In order to overcome the not enough of prior art scheme, the utility model provides an ultra-thin booth is apart from LED mirror screen can the effectual problem that the solution background art provided.

The utility model provides a technical scheme that its technical problem adopted is:

an ultrathin small-space LED mirror screen comprises a patch substrate, wherein a plurality of LED luminous elements are uniformly distributed on the upper surface of the patch substrate, a heat dissipation chamber for dissipating heat is arranged at the lower end of each LED luminous element, and a plurality of fixed mounting columns perpendicular to the plane of the patch substrate are arranged on the lower surface of the patch substrate;

the LED illuminating part comprises a metal plate, a chip substrate is arranged above the metal plate, a plurality of illuminating chips are uniformly arranged on the upper surface of the chip substrate, a radiating base plate is arranged below the metal plate, and a plurality of radiating fins are arranged at the lower end of the radiating base plate.

Furthermore, two adjacent light-emitting chips are connected through a conduction gold wire, an encapsulation layer is arranged above the light-emitting chips, and a heat conduction layer is arranged between the heat dissipation substrate and the metal plate.

Further, the light-emitting chip comprises a precious stone layer, an N-pole gallium nitride layer is arranged below the precious stone layer, a P-pole gallium nitride layer is arranged below the N-pole gallium nitride layer, a comb-tooth-shaped N electrode is arranged between the N-pole gallium nitride layer and the P-pole gallium nitride layer, and P electrodes are arranged at the left end and the right end of the N electrode.

Further, the fixed mounting post comprises a cylindrical mounting post shell, a metal heat conduction post body is arranged in the mounting post shell, and a fixing buckle is arranged at the bottom end of the metal heat conduction post body.

The utility model has the advantages that:

the utility model adopts the structure that the bottom end of the LED luminous element is provided with the radiating base plate and the radiating fins to accelerate the radiating efficiency between the large structures, thereby solving the problem of heat accumulated by the interaction of the LED luminous element; secondly, the mode that the N-type electrode is replaced by a plurality of strip-shaped electrodes to be inserted into the LED chip is adopted to accelerate the heat dissipation efficiency of the chip, and the problem that the light emitting chip in the LED light emitting piece generates heat is solved.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic structural view of an LED light-emitting member according to the present invention;

fig. 3 is a schematic diagram of the structure of the light emitting chip of the present invention.

Reference numbers in the figures: 1-a patch substrate; 2-an LED lighting element; 3-a heat dissipation chamber; 4-fixing the mounting post;

201-metal plate; 202-a thermally conductive layer; 203-crystal glue layer; 204-a chip substrate; 205-a light emitting chip; 206-conducting gold wire; 207-an encapsulation layer; 208-a heat-dissipating substrate; 209-heat dissipation fins;

401-metal heat conducting cylinder; 402-fixing buckle; 403-mounting post housing;

2051-precious stone layer; 2052-N-polar gallium nitride layer; 2053-P-pole gallium nitride layer; 2054-P electrode; 2055-N electrodes.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1, the utility model provides an ultra-thin booth is apart from LED mirror screen includes paster base plate 1, and paster base plate 1's upper surface evenly distributed has a plurality of LED illuminating parts 2, and LED illuminating part 2's lower extreme is provided with and is used for radiating heat dissipation chamber 3, and paster base plate 1's lower surface is provided with a plurality of perpendicular to paster base plate 1 planar fixed mounting post 4.

As shown in fig. 1, the fixed mounting post 4 includes a cylindrical mounting post housing 403, a metal heat-conducting cylinder 401 is disposed in the mounting post housing 403, and a fixing buckle 402 is disposed at a bottom end of the metal heat-conducting cylinder 401.

The utility model discloses a concrete implementation mode does, and LED mirror screen is that the combination of 2 modules of LED illuminating part of booth interval forms, because booth interval LED display screen adopts the point accuse technique of pixel level, realizes the state management and control to the luminance of display screen pixel unit, the reducibility and the unity of color. The small-spacing LED has the characteristics that the dot spacing of the screen is small, the resolution ratio of unit area is high, and the LED is used as a mirror surface of the LED and is suitable for the mirror surface. The small pitch arrangement generates a large amount of heat from the heat generated by the LED luminary 2 itself and the heat collected by the interaction of the LED luminary 2. Firstly, in order to solve the problem of heat accumulated by the interaction of the LED luminous element 2, the heat dissipation efficiency between large structures is accelerated by arranging the heat dissipation substrate 208 and the heat dissipation fins 209 at the bottom end of the LED luminous element 2, and secondly, in order to solve the problem of heat generation of the luminous chip 205 in the LED luminous element 2, the heat dissipation efficiency of the chip is accelerated by replacing a plurality of strip-shaped electrodes with N-type electrodes in an LED chip.

The fixing post 4 is used to fix a special mirror, and a metal heat conducting cylinder 401 is provided to transfer the residual heat to the outside of the mirror and exhaust the residual heat in order to further improve the heat dissipation.

As shown in fig. 2, the LED light emitting element 2 includes a metal plate 201, a chip substrate 204 is disposed above the metal plate 201, a plurality of light emitting chips 205 are uniformly disposed on the upper surface of the chip substrate 204, a heat dissipation base plate 208 is disposed below the metal plate 201, and a plurality of heat dissipation fins 209 are disposed at the lower end of the heat dissipation base plate 208.

As shown in fig. 2, two adjacent light emitting chips 205 are connected by conductive gold wires 206, a package layer 207 is disposed above the light emitting chips 205, and a heat conduction layer 202 is disposed between a heat dissipation substrate 208 and a metal plate 201.

In order to reduce the mutual heat generation of the collected LED light emitting elements 2, the LED light emitting elements 2 are provided with a heat dissipation substrate 208 to dissipate the heat quickly through the heat dissipation fins 209, so as to achieve the problem of dissipating and collecting the heat quickly.

The heat conduction layer 202 arranged between the heat dissipation substrate 208 and the metal plate 201 increases heat conductivity and accelerates heat dissipation.

As shown in fig. 3, the light emitting chip 205 includes a gem layer 2051, an N-pole gallium nitride layer 2052 is disposed below the gem layer 2051, a P-pole gallium nitride layer 2053 is disposed below the N-pole gallium nitride layer 2052, a comb-tooth-shaped N electrode 2055 is disposed between the N-pole gallium nitride layer 2052 and the P-pole gallium nitride layer 2053, and P electrodes 2054 are disposed at both left and right ends of the N electrode 2055. In the present embodiment, since the integrated method is adopted, the surfaces of the electrodes are coated with the insulating varnish, and the electrodes are connected only through the connection ports.

The utility model discloses replace into a plurality of rectangular shape electrodes with the N type electrode in the chip 205 structure of giving out light, alternate inside the LED chip, with local heavy current by a plurality of N electrode homodisperses, reduced the electric current edge effect, the inside N electrode of LED chip can act as the heat conduction passageway moreover, because the thermal conductivity of metal is very high, so, produced heat can be through the quick conduction of N electrode in the active layer external to improve the radiating efficiency.

In this embodiment, in addition to the foregoing, it should be further emphasized that the main structure of the light emitting chip 205 is the same as that of the conventional chip structure, and the N-type electrode is replaced by a plurality of strip-shaped electrodes to be inserted into the LED chip on the basis of the conventional chip structure, which is essentially the same as that of the conventional N-type electrode mounting method, except that there is some difference in shape. In addition, in this embodiment, after the specific structure is constructed, the chip is packaged, the purpose of the package is to mount a package for a semiconductor integrated circuit chip, which plays roles of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, and the package structure is also a bridge for communicating the inside of the chip with an external circuit, that is, a contact on the chip is connected to pins of the package by wires, and the pins are connected to other devices by wires on the printed board.

Based on the N-type electrode and the packaging structure, even if the N-type electrode is changed into a long strip-shaped electrode to be exposed, short circuit can not be caused for packaging the chip.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides an ultra-thin booth is apart from LED mirror screen which characterized in that: the LED heat dissipation device comprises a patch substrate (1), wherein a plurality of LED luminous elements (2) are uniformly distributed on the upper surface of the patch substrate (1), a heat dissipation chamber (3) for dissipating heat is arranged at the lower end of each LED luminous element (2), and a plurality of fixed mounting columns (4) perpendicular to the plane of the patch substrate (1) are arranged on the lower surface of the patch substrate (1);

the LED luminous element (2) comprises a metal plate (201), a chip substrate (204) is arranged above the metal plate (201), a plurality of luminous chips (205) are uniformly arranged on the upper surface of the chip substrate (204), a heat dissipation base plate (208) is arranged below the metal plate (201), and a plurality of heat dissipation fins (209) are arranged at the lower end of the heat dissipation base plate (208).

2. The ultra-thin small-pitch LED mirror screen according to claim 1, wherein: two adjacent light-emitting chips (205) are connected through a conduction gold wire (206), an encapsulation layer (207) is arranged above the light-emitting chips (205), and a heat conduction layer (202) is arranged between the heat dissipation substrate (208) and the metal plate (201).

3. The ultra-thin small-pitch LED mirror screen according to claim 1, wherein: the light-emitting chip (205) comprises a precious stone layer (2051), an N-pole gallium nitride layer (2052) is arranged below the precious stone layer (2051), a P-pole gallium nitride layer (2053) is arranged below the N-pole gallium nitride layer (2052), a comb-tooth-shaped N electrode (2055) is arranged between the N-pole gallium nitride layer (2052) and the P-pole gallium nitride layer (2053), and P electrodes (2054) are arranged at the left end and the right end of the N electrode (2055).

4. The ultra-thin small-pitch LED mirror screen according to claim 1, wherein: the fixed mounting column (4) comprises a cylindrical mounting column shell (403), a metal heat-conducting column body (401) is arranged in the mounting column shell (403), and a fixing buckle (402) is arranged at the bottom end of the metal heat-conducting column body (401).