CN212161768U - LED chip pad printing device capable of customizing arrangement scheme - Google Patents

Abstract

The utility model provides a LED chip pad printing device with a user-defined arrangement scheme, which comprises a pad printing platform and an addressing adsorption control device; an initial fixing station and a target fixing station are arranged on the pad printing platform, an LED chip carrier is arranged on the initial fixing station, and a target carrier is arranged on the target fixing station; the addressing adsorption control device comprises an adsorption mechanism, a CCD optical positioning centering device and a wafer scanning block coordinate positioning system, and the addressing adsorption control device realizes the transfer of the LED chips on the LED chip carrier to the target carrier according to the required arrangement array by controlling the adsorption mechanism to carry magnetic according to the required arrangement array. The utility model relates to a but self-defined arrangement scheme's LED chip bat printing device function is easy, can realize the beneficial effect according to the self-defined bat printing scheme of the chip demand of arranging of target carrier.

Description

LED chip pad printing device capable of customizing arrangement scheme

Technical Field

The utility model relates to the field of semiconductor technology, particularly, relate to a LED chip bat printing device of customizable arrangement scheme.

Background

The micro LED (MiniLED or MicroLED) is a display technology which is used for realizing addressing control and individual drive of each pixel point in an LED light source by manufacturing a drive circuit by adopting PCB, flexible FPC, BT, CMOS/TFT integrated circuit technology and the like after traditional LED structures are thinned, miniaturized and matrixed. Because various indexes such as brightness, contrast, reaction time, visual angle, resolution ratio and the like of the micro LED technology are stronger than those of the LCD and OLED technologies, the micro LED technology has attracted extensive attention together with the advantages of self-luminescence, simple structure, small volume and energy conservation.

After the micro LED chip is manufactured, it needs to be transferred to a driving circuit board to form an LED array, which is called Mass Transfer (Mass Transfer). Because the miniature LED chips are too small and huge in quantity, the existing automatic transfer device directly transfers a single LED chip to a driving circuit board through a vacuum adsorption needle in an adsorption mode, and the single LED chip is directly fixed on a crystal or is firstly adsorbed to a transfer adhesive tape, so that the arrangement mode is single and limited, and a user cannot often transfer the LED chips in a huge mode according to the arrangement requirements of different LED chips on different driving circuits.

In view of this, this application utility model people utility model has provided a function is easy, can arrange the self-defined LED chip bat printing device of arranging the scheme of can customizing of the user-defined transfer scheme of demand according to drive circuit's chip, and then realize the solid brilliant, select separately and arrange of LED chip.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a function is easy, can arrange the self-defined LED chip bat printing device of arranging the scheme of the self-defined arrangement of demand according to drive circuit's chip.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a LED chip pad printing device capable of customizing an arrangement scheme comprises a pad printing platform and an addressing adsorption control device; an initial fixing station and a target fixing station are arranged on the pad printing platform, an LED chip carrier is arranged on the initial fixing station, and a target carrier is arranged on the target fixing station; the addressing adsorption control device comprises an adsorption mechanism, a CCD optical positioning centering device and a wafer scanning block coordinate positioning system, and the addressing adsorption control device realizes the transfer of the LED chips on the LED chip carrier to the target carrier according to the required arrangement array by controlling the adsorption mechanism to carry magnetic according to the required arrangement array.

As a further improvement, the adsorption mechanism comprises an adsorption plate and an IC control chip group circuit board, the conductive coil plate is uniformly provided with adsorption holes arranged at intervals in a chip unit, the adsorption holes are arranged in one-to-one correspondence with the LED chips, conductive coils are arranged in the adsorption holes, the IC control chip group circuit board comprises magnetizers and at least one IC control chip, the magnetizers and the at least one IC control chip are all extended into the conductive coils, and each IC control chip controls the on-off state of the at least one conductive coil to realize the adsorption or release of the corresponding LED chip.

As a further improvement, the adsorption mechanism comprises a magnetizer array template and a conductive coil plate, the conductive coil plate is uniformly arranged according to the unit interval of the chip and provided with adsorption holes, the adsorption holes are internally provided with conductive coils, the conductive coils in the adsorption holes are connected in series, the magnetizer array template is provided with a plurality of magnetizers according to a required arrangement array, the conductive coil plate can be arranged above the LED chip carrier in a lifting manner, the adsorption holes are arranged in one-to-one correspondence with the LED chip, and the magnetizer array template can be arranged above the conductive coil plate in a lifting manner, and the magnetizers correspond to the adsorption holes.

As a further improvement, the adsorption mechanism comprises a magnetizer array template and a conductive coil plate, a plurality of adsorption holes are uniformly formed in the conductive coil plate according to the arrangement of chip unit intervals, the conductive coil plate outer side wall is provided with a conductive coil, the magnetizer array template is provided with a plurality of magnetizers according to a required arrangement array, the conductive coil plate can be arranged above the LED chip carrier in a lifting manner, the adsorption holes and the LED chips are arranged in a one-to-one correspondence manner, and the magnetizer array template can be arranged above the conductive coil plate in a lifting manner, and the magnetizers correspond to the adsorption holes.

As a further improvement, the adsorption mechanism comprises a conductive coil array template and a magnetic conductive plate, a plurality of magnetic conductors capable of moving up and down are uniformly arranged on the magnetic conductive plate according to the unit interval of the chip, a plurality of adsorption holes connected in series are formed in the conductive coil array template according to the required arrangement array, conductive coils are arranged in the adsorption holes, the magnetic conductive plate can be arranged above the conductive coil array template in a lifting mode, the magnetic conductors are arranged with the adsorption holes in a one-to-one correspondence mode, and the conductive coil array template can be arranged above the LED chip carrier in a lifting mode, wherein the adsorption holes are arranged corresponding to the LED chip.

As a further improvement, the adsorption mechanism comprises a conductive coil array template and a magnetic conductor plate, a plurality of magnetic conductors capable of moving up and down are uniformly arranged on the magnetic conductor plate according to the unit interval of the chip, a plurality of adsorption holes are formed in the conductive coil array template according to the required arrangement array, a conductive coil is arranged on the outer side wall of the conductive coil array template, the magnetic conductor plate can be arranged above the conductive coil array template in a lifting mode, the magnetic conductors and the adsorption holes are arranged correspondingly, and the conductive coil array template can be arranged above the LED chip carrier in a lifting mode, the adsorption holes and the LED chip are arranged correspondingly.

As a further improvement, the adsorption mechanism comprises a conductive coil array template and a magnetic conductor plate, a plurality of magnetic conductors capable of moving up and down are uniformly arranged on the magnetic conductor plate according to the unit interval of the chip, a plurality of adsorption holes are formed in the conductive coil array template according to the required arrangement array, the magnetic conductor plate can be arranged above the conductive coil array template in a lifting mode, the magnetic conductors correspond to the adsorption holes, and the conductive coil array template can be arranged above the LED chip carrier in a lifting mode, the adsorption holes correspond to the LED chip in a corresponding mode.

As a further improvement, the width of the LED chip is defined as d, and the diameter of the magnetizer ranges from 0.25d to 4 d.

As further improvement, adsorption device below is provided with a detachable sticky tape carrier, detachable sticky tape carrier is used for the installation to shift the sticky tape, shift the sticky tape with adsorption device's lower surface distance range is 0 ~ 100 um.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model relates to a but LED chip bat printing device of custom arrangement scheme adopts the conductive coil board to combine the structure of IC control chip group circuit board, can effectively come continuous array control or interval array control or the conducting coil circular telegram of the adsorption hole of custom array control optional position in order to realize corresponding magnetizer area magnetism through a plurality of IC control chips, thereby the realization will LED chip on the LED chip carrier shifts to according to the custom huge amount of required array of arranging effect on the target carrier, overall structure is ingenious, the function is easy, has overcome traditional transfer device and can only realize the single transfer of LED chip, and the transfer mode is single, and the LED chip of different arrangement mode demands can't be shifted in the automation, has caused some different demand LED chip to arrange and can only pass through artifical letter sorting installation, shortcoming that the cost of labor is big.

2. The utility model relates to a but LED chip bat printing device of custom arrangement scheme can effectively realize the absorption to the LED chip of different range arrays through the structure of changing the adsorption holes (making all conductive coil circular telegrams simultaneously) that the magnetizer array module that has different range array magnetizers combines the series connection, need not to come the break-make electricity of controlling every conductive coil that adsorbs downthehole respectively through IC control chip, and overall structure is simple ingenious more, and the cost is lower.

3. The utility model relates to a can self-defined LED chip pad printing device of arranging scheme effectively has the adsorption hole array module of the adsorption hole of different range arrays to combine the structure of the magnetic conductor body board that the magnetizer can move about from top to bottom through changing to realize the absorption to the LED chip of different range arrays fast, need not to come the break-make electricity of controlling every conductive coil that adsorbs downthehole respectively through IC control chip, only need guarantee adsorb downthehole conductive coil electrically conductive simultaneously can, overall structure is simple more ingenious, and the cost is lower.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of an LED chip pad printing apparatus capable of customizing an arrangement scheme according to embodiment 1 of the present invention;

fig. 2 is a schematic structural view of an adsorption mechanism in embodiment 1 of the present invention;

fig. 3 is a schematic structural diagram of an LED chip pad printing apparatus capable of customizing an arrangement scheme according to embodiments 2 to 5 of the present invention;

fig. 4 is a schematic structural diagram of an LED chip pad printing apparatus capable of customizing an arrangement scheme according to embodiments 2 to 5 of the present invention;

fig. 5 is a schematic structural view of an adsorption mechanism in embodiment 2 of the present invention;

fig. 6 is a schematic structural view of an adsorption mechanism in embodiment 3 of the present invention;

fig. 7 is a schematic structural view of an adsorption mechanism in embodiment 4 of the present invention;

fig. 8 is a schematic structural view of the adsorption mechanism in embodiment 4 of the present invention when combined;

fig. 9 is a schematic structural view of an adsorption mechanism in embodiment 5 of the present invention.

Description of the main elements

100. A pad printing device; 1. a pad printing platform; 11. an LED chip carrier; 12. a target vehicle;

2. addressing an adsorption control device; 21. an adsorption mechanism; 211. an adsorption plate; 212. IC control chip group circuit board; 2121. a magnetizer; 2122. an IC control chip;

221. a magnetizer array template; 222. a conductive coil plate;

231. a magnetic conductor plate; 232. and (3) forming a conductive coil array template.

Detailed Description

To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Example 1

Referring to fig. 1 to fig. 2, an LED chip pad printing apparatus 100 with a customized arrangement scheme in an embodiment includes a pad printing platform 1 and an addressing adsorption control device 2; an initial fixing station and a target fixing station are arranged on the pad printing platform 1, an LED chip carrier 11 is arranged on the initial fixing station, and a target carrier 12 is arranged on the target fixing station; the addressing adsorption control device 2 comprises an adsorption mechanism 21, a CCD optical positioning centering device and a wafer scanning block coordinate positioning system, and the addressing adsorption control device 2 controls the adsorption mechanism 21 to carry out magnetic tape according to a required arrangement array so as to transfer the LED chips on the LED chip carrier 11 to the target carrier 12 according to the required arrangement array.

The LED chip carriers 11 are customized, namely the size and the shape of the LED chip carriers 11 can be customized according to the requirements of customers, and the carriers with different sizes such as 4 inches, 6 inches, 8 inches and the like can be adapted to different application scenes and different requirements; the center of the LED chip carrier 11 is provided with an area for placing an LED chip to be adsorbed, when the operation is started, the adsorption mechanism 21 and the LED chip carrier 11 are centered by the CCD optical positioning centering device, then the center position of the LED chip carrier 11 is found, a wafer scanning block coordinate positioning system scans a wafer to determine the coordinate of each LED chip and performs positioning assignment, finally, the magnetizer 2121 at the corresponding position of the array to be arranged is accurately controlled by coordinate identification to be magnetized to realize self-defined mass adsorption, the addressing adsorption control device 2 can realize horizontal and vertical movement above the pad printing platform 1 through a guide rail structure, besides, the addressing adsorption control device 2 can also be a mechanical arm structure and is transferred in a turnover mode.

Referring to fig. 2, the adsorption mechanism 21 includes an adsorption plate 211 and an IC control chip group circuit board 212, the adsorption plate 211 is uniformly provided with adsorption holes arranged at intervals in a chip unit, the adsorption holes are arranged in one-to-one correspondence with the LED chips, conductive coils are arranged in the adsorption holes, the IC control chip group circuit board 212 includes a magnetizer 2121 and at least one IC control chip 2122, the magnetizer 2121 is vertically and fixedly arranged below the IC control chip group circuit board 212, and each IC control chip 2122 controls the on/off of at least one conductive coil to adsorb or release the corresponding LED chip, that is, each IC control chip 2122 can control the on/off of a plurality of conductive coils, and the conductive coils at any position on the whole adsorption plate 211 can be controlled by matching with a plurality of IC control chips 2122. The circuit structure of the IC control chip set circuit board 212 may refer to the existing micro LED display screen without the LED lamp, and the IC control chip 2122 is connected to the conductive coil, which is not described herein again.

Specifically, threaded grooves are formed in the inner side of each adsorption hole and used for fixedly winding conductive coils, one side of each adsorption hole is provided with a threading hole, one end of each conductive coil is connected with the IC control chip 2122, and then the conductive coils are wound and fixed from the upper portion of each adsorption hole through the threaded grooves and then return to the upper portion from the bottom through the threading holes to be connected with the same IC control chip 2122, so that the conductive coils (not shown in the figure) can be connected to each IC control chip 2122.

By adopting the structure that the adsorption plate 211 is combined with the IC control chip group circuit board 212, the conduction coils of the adsorption holes at any positions can be effectively subjected to continuous array control or interval array control or custom array control through a plurality of IC control chips 2122 to be electrified so as to realize the magnetization of the corresponding magnetizer 2121, thereby realizing the effect of transferring the LED chips on the LED chip carrier 11 to the target carrier 12 according to the required array custom huge amount.

Referring to fig. 1 to 2, if the width of the LED chip is defined as d, the diameter of the magnetizer 2121 ranges from 0.25d to 4d, and preferably, the diameter of the magnetizer 2121 ranges from 0.75 d to 1.25d, such a size arrangement can ensure that the magnetizer 2121 has sufficient magnetic force to adsorb the LED chip, and the magnetizer 2121 is not convenient to penetrate into the adsorption hole due to its too large size.

Further, adsorption equipment 21 below is provided with a detachable sticky tape carrier (not shown in the figure), detachable sticky tape carrier is used for the installation to shift the sticky tape, and detachable sticky tape carrier can set up anchor clamps on the cursor slide of bat printing platform 1 and can dismantle fixedly through fasteners such as bolts, and detachable sticky tape carrier includes solid fixed ring and draw-in groove ring, draw-in groove ring go up seted up with the ring groove of solid fixed ring looks adaptation, at first will shift the sticky tape and lay on solid fixed ring, then detain draw-in groove ring and establish extremely gu will shift the sticky tape and compress tightly on the fixed ring, will have the detachable sticky tape carrier that shifts the sticky tape at last be fixed in on bat printing platform 1's anchor clamps, when needing to be changed from anchor clamps pull down and with solid fixed ring and draw-in groove ring separately can. When the structure is adopted, the distance range between the transfer adhesive tape and the lower surface of the adsorption mechanism is 0-100 um, at the moment, the magnetizer 2121 can completely enter the adsorption hole and is flush with the lower surface of the adsorption hole, the LED chips are adsorbed onto the transfer adhesive tape according to the required arrangement array at intervals, then the adsorption mechanism 21 carries the transfer adhesive tape and the LED chips to move to the target carrier 12, when the target carrier 12 is a driving circuit board which finally wants to be installed, the transfer adhesive tape is not needed, when the target carrier 12 is only a placing carrier, a subsequent user can directly transfer the transfer adhesive tape carrying the LED chips continuously, and the transfer adhesive tape is installed on the driving circuit board manually, and the mass production of the LED chips carrying the required arrangement array can be effectively realized by adopting the structure of the transfer adhesive tape, and the overall production efficiency is improved.

In addition, a transfer adhesive tape may be directly adhered to the lower surface of the adsorption mechanism 21, and the distance between the transfer adhesive tape and the lower end of the magnetizer 2121 after completely entering the adsorption hole is 0-100 um, and the distance is maintained to ensure that the suction force of the magnetizer 2121 can suck up the LED chip through the transfer adhesive tape; the magnetizer 2121 can adsorb the LED chips to be arrayed to the transfer tape at intervals of magnetic force.

In this embodiment, the size of the adsorption holes is not limited, and may be selected according to the specific size of the mini LED or Micro LED device, the diameter range of the adsorption holes is 0.5 μm to 300 μm, and the conductive coils in each adsorption hole are separately controlled by the IC control chip 2122 in a partitioned manner. In this embodiment, the conductive coil in each adsorption hole may be individually controlled by the IC control chip 2122, or the conductive coils in a plurality of adsorption holes may be collectively controlled by the IC control chip 2122, and the IC control chip 2122 individually drives and controls the conductive coils in the adsorption holes to be turned on or off, so as to realize the suction, transfer, and release of a single core particle or a group of core particles.

Example 2

Referring to fig. 3, 4 and 5, embodiment 2 is different from embodiment 1 in that the adsorption mechanism 21 includes a magnetizer array template 221 and a conductive coil plate 222, the conductive coil plate 222 is uniformly provided with adsorption holes arranged at intervals of a chip unit, the adsorption holes are all provided with conductive coils, the conductive coils in the adsorption holes are connected in series, the magnetizer array template 221 is provided with a plurality of magnetizers 2121 arranged in an array according to a desired arrangement, the conductive coil plate 222 is arranged above the LED chip carrier 11 in a lifting manner, the adsorption holes are arranged in one-to-one correspondence with the LED chips, the magnetizer array template 221 is arranged above the conductive coil plate 222 in a lifting manner, and the magnetizers 2121 are arranged in correspondence with the adsorption holes.

Specifically, the inside of the adsorption hole is provided with a thread groove, the thread groove is used for fixedly winding and establishing a conductive coil, one side of the adsorption hole is provided with a threading hole, one end of each conductive coil is connected with the positive electrode of a power supply, and then the conductive coil returns from the bottom to the upper part through the threading hole after being fixed and connected with one end of the conductive coil of the next adsorption hole after being wound and established through the thread groove from the upper part of the adsorption hole, so that the conductive coil is analogized and finally connected with the negative electrode of the power supply (not shown in.

Referring to fig. 3 to 5, unlike the embodiment 1 in which the conductive coil plate 222 and the IC control chip group circuit board 212 are required to be tightly attached to each other (to prevent the IC control chip 2122 from being disconnected from the conductive coil), the magnetizer array template 221 and the conductive coil plate 222 are matched by a mutually-embedded and clamped structure, the magnetizer array template 221 can achieve vertical lifting movement above the conductive coil plate 222 through a rail mechanism, and meanwhile, the magnetizer array template 221 and the conductive coil plate 222 can be detachably fixed by a fastener such as a bolt by arranging a clamp on a slide arm.

The adsorption of the LED chips in different arrays is quickly realized by replacing the structure of the array module of the magnetizers 2121 with the magnetizers 2121 in different arrays in combination with the adsorption holes (all the conductive coils are electrified simultaneously), the on-off of the conductive coils in each adsorption hole is not required to be controlled by the IC control chip 2122, the overall structure is simpler and more ingenious, and the cost is lower.

Example 3

Referring to fig. 6, the difference between the embodiment 3 and the embodiment 2 is that the adsorption mechanism 21 includes a magnetizer array template 221 and a conductive coil plate 222, the conductive coil plate 222 is uniformly provided with a plurality of adsorption holes arranged at intervals of a chip unit, the outer side wall of the conductive coil plate 222 is provided with a conductive coil, the magnetizer array template 221 is provided with a plurality of magnetizers 2121 arranged in a desired array, the conductive coil plate 222 is arranged above the LED chip carrier 11 in a lifting manner, the adsorption holes are arranged in one-to-one correspondence with the LED chips, the magnetizer array template 221 is arranged above the conductive coil plate 222 in a lifting manner, and the magnetizers 2121 are arranged in correspondence with the adsorption holes.

Specifically, a thread groove is formed on the outer side of the conductive coil plate 222, the thread groove is used for fixedly winding a conductive coil, one end of the conductive coil is connected with the positive electrode of the power supply, and the other end of the conductive coil is directly connected with the negative electrode of the power supply (not shown in the figure).

Compared with a structure that the conductive coil is arranged in each adsorption hole, the structure that the large conductive coil is arranged on the outer side wall of the conductive coil plate 222 is simpler, and the cost is lower.

Example 4

Referring to fig. 3, 4, 7, and 8, the difference between the embodiment 4 and the embodiment 2 is that the adsorption mechanism 21 includes a conductive coil array template 232 and a magnetic conductor plate 231, a plurality of magnetic conductors 2121 capable of moving up and down are uniformly arranged on the magnetic conductor plate 231 according to the chip unit interval, a plurality of adsorption holes connected in series are formed on the conductive coil array template 232 according to the required arrangement array, conductive coils are respectively arranged in the adsorption holes, the magnetic conductor plate 231 is arranged above the conductive coil array template 232 in a lifting manner, the magnetic conductors 2121 and the adsorption holes are arranged in a one-to-one correspondence manner, the conductive coil array template 232 is arranged above the LED chip carrier 11 in a lifting manner, and the adsorption holes and the LED chips are arranged in a corresponding manner.

Meanwhile, different from the embodiment 1 in which the conductive coil plate 222 and the IC control chip group circuit board 212 are required to be used in a close contact manner (to prevent the IC control chip 2122 from being disconnected from the conductive coil), the magnetic conductor plate 231 and the conductive coil array template 232 are matched by a mutually-embedded clamping structure, the magnetic conductor plate 231 can vertically move above the conductive coil array template 232 through a guide rail mechanism, and meanwhile, the magnetic conductor plate 231 and the conductive coil array template 232 can be provided with a clamp on a slide arm and detachably fixed through fasteners such as bolts and the like.

Specifically, referring to fig. 7 and 8, a plurality of sliding limiting grooves for the magnetizer 2121 to slide up and down are disposed in the magnetizer plate 231, each sliding limiting groove includes a first groove portion and a second groove portion that are communicated with each other, the first groove portion is disposed close to the conductive coil array template 232, the diameter of the first groove portion is smaller than that of the second groove portion, a limiting portion is disposed on the magnetizer 2121, and the limiting portion can move up and down in the second groove portion and cannot pass through the first groove portion; when the conductive coil array template 232 is used, when the conductive magnet plate 231 is lifted above the conductive coil array template 232, the conductive magnets 2121 conforming to the array penetrate into the conductive coil array template 232 and extend into the adsorption holes to adsorb the LED chip, the conductive magnets 2121 not conforming to the array cannot penetrate into the conductive coil array template 232, and meanwhile, under the reaction force of the conductive coil array template 232, the conductive magnets 2121 are jacked up, and at the moment, the limiting part moves upwards in the second groove part.

In addition, threaded grooves are formed in the inner sides of the adsorption holes and used for fixedly winding conductive coils, a threading hole is formed in one side of each adsorption hole, one end of each conductive coil is connected with the positive electrode of a power supply, and then the conductive coils are wound and fixed from the upper sides of the adsorption holes through the threaded grooves and then return to the upper portions of the conductive coils from the bottoms of the conductive coils to be connected with one end of the conductive coil of the next adsorption hole through the threading hole, so that the conductive coils are analogized, and finally the conductive coils are connected with the negative electrode of.

The adsorption of the LED chips in different arrays can be quickly realized by replacing the adsorption hole array module with adsorption holes in different arrays in combination with the structure of the magnetic conductor plate 231, which can move up and down, of the magnetic conductor 2121, without controlling the on/off of the conductive coil in each adsorption hole through the IC control chip 2122, and only the conductive coil in the adsorption hole is required to be simultaneously conductive, so that the whole structure is simpler and more ingenious, and the cost is lower.

Example 5

Referring to fig. 9, the difference between the embodiment 5 and the embodiment 4 is that the adsorption mechanism 21 includes a conductive coil array template 232 and a magnetic conductive plate 231, a plurality of magnetic conductors 2121 capable of moving up and down are uniformly arranged on the magnetic conductive plate 231 according to the unit interval of the chip, a plurality of adsorption holes are formed in the conductive coil array template 232 according to the required arrangement array, a conductive coil is arranged on the outer side wall of the conductive coil array template 232, the magnetic conductive plate 231 is arranged above the conductive coil array template 232 in a lifting manner, the magnetic conductors 2121 correspond to the adsorption holes, the conductive coil array template 232 is arranged above the LED chip carrier 11 in a lifting manner, and the adsorption holes correspond to the LED chips.

Specifically, a thread groove is formed in the outer side of the conductive coil array template 232, the thread groove is used for fixedly winding a conductive coil, one end of the conductive coil is connected with the positive electrode of the power supply, and the other end of the conductive coil is directly connected with the negative electrode of the power supply (not shown in the figure).

Compared with a structure that the conductive coil is arranged in each adsorption hole, the structure that the outer side wall of the conductive coil array template 232 is provided with the large conductive coil is simpler, and the cost is lower.

Example 6

The difference between embodiment 6 and embodiment 4 is that the adsorption mechanism 21 includes a conductive coil array template 232 and a magnetic conductor plate 231, a plurality of magnetic conductors 2121 capable of moving up and down are uniformly arranged on the magnetic conductor plate 231 according to the unit interval of the chip, the magnetic conductor plate 231 and the magnetic conductors 2121 are permanent magnets, a plurality of adsorption holes are formed in the conductive coil array template 232 according to the required arrangement array, the magnetic conductor plate 231 is arranged above the conductive coil array template 232 in a liftable manner and the magnetic conductors 2121 and the adsorption holes are correspondingly arranged, the conductive coil array template 232 is arranged above the LED chip carrier 11 in a liftable manner and the adsorption holes and the LED chip are correspondingly arranged.

The magnetic conductor plate 231 and the magnetic conductor 2121 adopt a permanent magnet structure, so that the overall structure is simpler, the magnetic conductor 2121 can be magnetized without arranging a conductive coil in the adsorption hole, and the adsorption of the LED chip of the required array is quickly realized by combining the conductive coil array template 232.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (9)

1. The utility model provides a but LED chip bat printing device of custom arrangement scheme which characterized in that: comprises a pad printing platform (1) and an addressing adsorption control device (2); an initial fixing station and a target fixing station are arranged on the pad printing platform (1), an LED chip carrier (11) is arranged on the initial fixing station, and a target carrier (12) is arranged on the target fixing station; the addressing adsorption control device (2) comprises an adsorption mechanism (21), a CCD optical positioning centering device and a wafer scanning block coordinate positioning system, and the addressing adsorption control device (2) transfers the LED chips on the LED chip carriers (11) to the target carriers (12) according to the required arrangement array by controlling the adsorption mechanism (21) to carry magnetic according to the required arrangement array.

2. The apparatus for pad printing of LED chips with customizable alignment according to claim 1, wherein: the adsorption mechanism (21) comprises an adsorption plate (211) and an IC control chip group circuit board (212), adsorption holes are uniformly formed in the conductive coil plate (222) according to the arrangement of chip unit intervals, the adsorption holes are arranged in one-to-one correspondence with the LED chips, conductive coils are arranged in the adsorption holes, the IC control chip group circuit board (212) comprises a magnetizer (2121) and at least one IC control chip (2122), the magnetizer and the IC control chip are all extended into the conductive coils, and each IC control chip (2122) controls the on-off state of at least one conductive coil so as to adsorb or release the corresponding LED chip.

3. The apparatus for pad printing of LED chips with customizable alignment according to claim 1, wherein: adsorption apparatus constructs (21) including magnetizer array template (221) and conductive coil board (222), adsorption holes have evenly been seted up according to chip unit interval arrangement to conductive coil board (222), the downthehole conductive coil that all is provided with of adsorption, the conductive coil in the adsorption holes passes through series connection, magnetizer array template (221) is provided with a plurality of magnetizer (2121) according to required range array, conductive coil board (222) liftable set up in LED chip carrier (11) top just the adsorption holes sets up with the LED chip one-to-one, magnetizer array template (221) liftable set up in conductive coil board (222) top just magnetizer (2121) with the adsorption holes correspond the setting.

4. The apparatus for pad printing of LED chips with customizable alignment according to claim 1, wherein: adsorption apparatus constructs (21) including magnetizer array template (221) and conductive coil board (222), a plurality of adsorption holes have evenly been seted up according to chip unit interval arrangement to conductive coil board (222), conductive coil board (222) lateral wall is provided with the conductive coil, magnetizer array template (221) is provided with a plurality of magnetizer (2121) according to required range array, conductive coil board (222) liftable set up in LED chip carrier (11) top just adsorb the hole and LED chip one-to-one setting, magnetizer array template (221) liftable set up in conductive coil board (222) top just magnetizer (2121) with adsorb the hole and correspond the setting.

5. The apparatus for pad printing of LED chips with customizable alignment according to claim 1, wherein: adsorption apparatus constructs (21) and includes conductive coil array template (232) and magnetic conductor board (231), evenly be provided with a plurality of magnetizer (2121) that can move about from top to bottom according to chip unit interval arrangement on magnetic conductor board (231), a plurality of absorption holes that establish ties mutually are seted up according to required range array in conductive coil array template (232), all be provided with the conductive coil in the absorption hole, magnetic conductor board (231) liftable set up in conductive coil array template (232) top just magnetizer (2121) with the absorption hole one-to-one sets up, conductive coil array template (232) liftable set up in LED chip carrier (11) top just the absorption hole corresponds the setting with the LED chip.

6. The apparatus for pad printing of LED chips with customizable alignment according to claim 1, wherein: adsorption apparatus constructs (21) including conductive coil array template (232) and magnetic conductor board (231), evenly be provided with magnetizer (2121) that a plurality of can move about from top to bottom according to chip unit interval arrangement on magnetic conductor board (231), a plurality of adsorption holes have been seted up according to required range array in conductive coil array template (232), conductive coil array template (232) lateral wall is provided with the conductive coil, magnetic conductor board (231) liftable set up in conductive coil array template (232) top just magnetizer (2121) with the adsorption holes corresponds the setting, conductive coil array template (232) liftable set up in LED chip carrier (11) top just the adsorption holes correspond the setting with the LED chip.

7. The apparatus for pad printing of LED chips with customizable alignment according to claim 1, wherein: adsorption apparatus constructs (21) and includes conductive coil array template (232) and magnetic conductor board (231), evenly be provided with magnetizer (2121) that a plurality of can move about from top to bottom according to chip unit interval arrangement on magnetic conductor board (231), a plurality of adsorption holes have been seted up according to required range array in conductive coil array template (232), magnetic conductor board (231) liftable set up in conductive coil array template (232) top just magnetizer (2121) with the adsorption holes correspond the setting, conductive coil array template (232) liftable set up in LED chip carrier (11) top just the adsorption holes correspond the setting with the LED chip.

8. The LED chip pad printing device of any one of claims 2 to 7, wherein: and the width of the LED chip is defined as d, and the diameter range of the magnetizer (2121) is 0.25 d-4 d.

9. The LED chip pad printing device of any one of claims 1 to 7, wherein: adsorption device (21) below is provided with a detachable sticky tape carrier, and detachable sticky tape carrier is used for the installation to shift the sticky tape, shift the sticky tape with the lower surface distance scope of adsorption device (21) is 0 ~ 100 um.

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