CN212160567U - Double-width full-size reinforced AMC mainboard - Google Patents

Double-width full-size reinforced AMC mainboard Download PDF

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Publication number
CN212160567U
CN212160567U CN202021243474.6U CN202021243474U CN212160567U CN 212160567 U CN212160567 U CN 212160567U CN 202021243474 U CN202021243474 U CN 202021243474U CN 212160567 U CN212160567 U CN 212160567U
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bottom plate
fixed
reinforcing rib
amc
heat
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CN202021243474.6U
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许东于
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Nanjing Zhonghe Electronic Technology Co ltd
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Nanjing Zhonghe Electronic Technology Co ltd
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Abstract

The utility model discloses a two wide full-size reinforcement type AMC mainboards, including bottom plate and external port, one side on bottom plate top is fixed with external port, the both ends of bottom plate are provided with mosaic structure, mosaic structure includes, slider, fixture block, draw-in groove and spout, the slider all is fixed in the one end of bottom plate, the one end of slider is fixed with the fixture block, the spout is fixed in the other end of bottom plate, the one end of spout is fixed with the draw-in groove, the top of bottom plate is provided with heat radiation structure, the inside of bottom plate is provided with additional strengthening. The utility model discloses a be provided with mosaic structure, when needs splice the AMC mainboard, the staff at first takes out the bottom plate, then aim at the spout with the slider and place into the spout with the slider again, the slider slides in the inside of spout this moment, when the slider slides to the bottom of spout, the inside of draw-in groove is advanced to the fixture block meeting block, can accomplish the concatenation of bottom plate this moment, realized being convenient for splice the bottom plate, greatly increased the practicality of the device when using.

Description

Double-width full-size reinforced AMC mainboard
Technical Field
The utility model relates to a AMC mainboard technical field specifically is two wide full-scale reinforcement type AMC mainboards.
Background
Along with the development of economy, the living standard of people is improved, the technology is developed more and more quickly, a plurality of electronic products appear in our lives, the electronic products are controlled by a mainboard, the mainboard is equivalent to the brains of the electronic products, and in order to ensure that the quality of the electronic products is better when the electronic products are used, a special double-width full-size reinforced AMC mainboard is needed;
however, when the AMC main board in the prior art is used, the AMC main board is not easy to splice, and the practicability of the main board in use is affected, so a dual-width full-size reinforced AMC main board has been developed to solve the above problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a two wide full-size reinforcement type AMC mainboards to propose the inconvenient problem of carrying out the concatenation to the AMC mainboard in solving above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: double-width full-size reinforcement type AMC mainboard, including bottom plate and external port, one side on bottom plate top is fixed with external port, the both ends of bottom plate are provided with mosaic structure, mosaic structure includes, slider, fixture block, draw-in groove and spout, the slider all is fixed in the one end of bottom plate, the one end of slider is fixed with the fixture block, the spout is fixed in the other end of bottom plate, the one end of spout is fixed with the draw-in groove, the top of bottom plate is provided with heat radiation structure, the inside of bottom plate is provided with additional strengthening.
Preferably, the cross section of the sliding groove is larger than that of the sliding block, and a sliding structure is formed between the sliding block and the sliding groove.
Preferably, the heat radiation structure includes radiating fin, heat-conducting plate and connecting block, the connecting block is fixed in the top of bottom plate, the top of connecting block is fixed with the heat-conducting plate, the top of heat-conducting plate is fixed with radiating fin.
Preferably, the radiating fins are provided with five groups, and the five groups of radiating fins are distributed at equal intervals on the top end of the heat conducting plate.
Preferably, the heat-conducting plates are arranged in two groups, and the two groups of heat-conducting plates are symmetrically distributed around the central axis of the bottom plate.
Preferably, the additional strengthening includes first strengthening rib, second strengthening rib and third strengthening rib, the third strengthening rib sets up in the inside of bottom plate, the one end of first strengthening rib is fixed with the second strengthening rib, one side of second strengthening rib is provided with the third strengthening rib, be the crisscross arrangement between second strengthening rib and the third strengthening rib.
Compared with the prior art, the beneficial effects of the utility model are that: the double-width full-size reinforced AMC mainboard not only realizes the convenience of splicing the mainboard, realizes the enhancement of the heat dissipation function of the mainboard, but also realizes the enhancement of the internal structure of the mainboard;
(1) through the splicing structures arranged at the two ends of the bottom plate, when the AMC mainboard needs to be spliced, a worker firstly takes out the bottom plate, then aligns the sliding block with the sliding groove and places the sliding block into the sliding groove, the sliding block slides in the sliding groove at the moment, when the sliding block slides to the bottom of the sliding groove, the clamping block can be clamped into the clamping groove, and the splicing of the bottom plate can be completed at the moment, so that the convenience in splicing the bottom plate is realized, and the practicability of the device in use is greatly increased;
(2) the heat dissipation structure is arranged at the top end of the bottom plate, so that heat generated by the bottom plate during working can be transferred to the multiple groups of heat dissipation fins through the heat conduction plate, and then the heat is released to the air through the action of the heat dissipation fins, the bottom plate is convenient to dissipate heat, and the service life of electronic elements in the bottom plate is greatly prolonged;
(3) through being provided with additional strengthening in the inside of bottom plate, when using, through the common cooperation of first strengthening rib, second strengthening rib and third strengthening rib for the inner structure of bottom plate is more firm, has realized the enhancement to bottom plate inner structure, greatly increased the fastness of bottom plate when using.
Drawings
Fig. 1 is a schematic front view of a cross-sectional structure of the present invention;
FIG. 2 is a schematic side view of the heat dissipation structure of the present invention;
FIG. 3 is a schematic view of a front view of a partial cross-sectional structure of the reinforcement structure of the present invention;
fig. 4 is the utility model discloses a mosaic structure looks sideways at local section structure sketch map.
In the figure: 1. a base plate; 2. splicing structures; 201. a slider; 202. a clamping block; 203. a card slot; 204. a chute; 3. an external port; 4. a heat dissipation structure; 401. a heat dissipating fin; 402. a heat conducting plate; 403. connecting blocks; 5. a reinforcing structure; 501. a first reinforcing rib; 502. a second reinforcing rib; 503. and a third reinforcing rib.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides an embodiment: the double-width full-size reinforced AMC mainboard comprises a bottom plate 1 and an external port 3, wherein the external port 3 is fixed on one side of the top end of the bottom plate 1, splicing structures 2 are arranged at two ends of the bottom plate 1, each splicing structure 2 comprises a sliding block 201, a clamping block 202, a clamping groove 203 and a sliding groove 204, the sliding blocks 201 are fixed at one ends of the bottom plate 1, the clamping blocks 202 are fixed at one ends of the sliding blocks 201, the sliding grooves 204 are fixed at the other end of the bottom plate 1, the clamping grooves 203 are fixed at one ends of the sliding grooves 204, the cross sections of the sliding grooves 204 are larger than that of the sliding blocks 201;
specifically, as shown in fig. 1 and 4, when the mechanism is used, when the AMC mainboard needs to be spliced, a worker takes out the bottom plate 1 at first, then aligns the slider 201 with the chute 204 and places the slider 201 into the chute 204, at this time, the slider 201 slides inside the chute 204, when the slider 201 slides to the bottom of the chute 204, the fixture block 202 is clamped inside the fixture groove 203, at this time, the splicing of the bottom plate 1 can be completed, when the bottom plate 1 needs to be separated, the bottom plate 1 is held at first and then is pulled outwards with force, at this time, the fixture block 202 is separated from the fixture groove 203, the slider 201 slides inside the chute 204, when the slider 201 is separated from the chute 204, the bottom plate 1 can be separated, thereby facilitating the splicing of the bottom plate 1, and greatly increasing the practicability of the device when in use;
the top end of the bottom plate 1 is provided with a heat dissipation structure 4, the heat dissipation structure 4 comprises heat dissipation fins 401, heat conduction plates 402 and connecting blocks 403, the connecting blocks 403 are fixed at the top end of the bottom plate 1, the heat conduction plates 402 are fixed at the top ends of the connecting blocks 403, the heat dissipation fins 401 are fixed at the top ends of the heat conduction plates 402, the heat dissipation fins 401 are arranged in five groups, the five groups of heat dissipation fins 401 are distributed at equal intervals at the top ends of the heat conduction plates 402, the heat conduction plates 402 are provided with two groups, and the two groups of heat conduction;
specifically, as shown in fig. 1 and fig. 2, when the mechanism is used, when the bottom plate 1 is used, the bottom plate 1 needs to be radiated, heat generated when the bottom plate 1 works can be transmitted to a plurality of groups of radiating fins 401 through the use of the heat conducting plate 402, and then the heat is released to the air through the action of the radiating fins 401 to complete the radiation, so that the convenience in radiating the bottom plate 1 is realized, and the service life of electronic elements in the bottom plate 1 is greatly prolonged;
a reinforcing structure 5 is arranged in the bottom plate 1, the reinforcing structure 5 comprises a first reinforcing rib 501, a second reinforcing rib 502 and a third reinforcing rib 503, the third reinforcing rib 503 is arranged in the bottom plate 1, the second reinforcing rib 502 is fixed at one end of the first reinforcing rib 501, the third reinforcing rib 503 is arranged at one side of the second reinforcing rib 502, and the second reinforcing rib 502 and the third reinforcing rib 503 are arranged in a crossed manner;
specifically, as shown in fig. 1 and 3, when the mechanism is used, since the first reinforcing rib 501, the second reinforcing rib 502 and the third reinforcing rib 503 are arranged inside the bottom plate 1, when the mechanism is used, the internal structure of the bottom plate 1 is firmer through the common cooperation of the first reinforcing rib 501, the second reinforcing rib 502 and the third reinforcing rib 503, the internal structure of the bottom plate 1 is strengthened, and the firmness of the bottom plate 1 in use is greatly increased.
The working principle is as follows: when the device is used, firstly, a worker takes the device to a proper position, when the bottom plate 1 needs to be spliced, the bottom plate 1 is taken out, then the sliding block 201 is aligned to the sliding groove 204, the sliding block 201 is placed in the sliding groove 204, the sliding block 201 slides in the sliding groove 204 at the moment, when the sliding block 201 slides to the bottom of the sliding groove 204, the clamping block 202 is clamped into the clamping groove 203, and the bottom plate 1 can be spliced at the moment;
then, heat is generated when the bottom plate 1 works, the heat generated when the bottom plate 1 works can be transmitted to the multiple groups of radiating fins 401 through the heat conducting plate 402, the heat is released to the air through the action of the radiating fins 401 to complete heat dissipation, and meanwhile, the internal structure of the bottom plate 1 can be enhanced due to the common use of the first reinforcing ribs 501, the second reinforcing ribs 502 and the third reinforcing ribs 503, so that the bottom plate 1 is firmer in use;
finally, when the bottom plate 1 needs to be detached, the bottom plate 1 is firstly held and then pulled outwards with force, at this time, the fixture block 202 is separated from the fixture groove 203, the slide block 201 slides in the slide groove 204, when the slide block 201 is separated from the slide groove 204, the bottom plate 1 can be detached, and finally, the whole work of the AMC mainboard is completed.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (6)

1. Double-width full-size reinforcement type AMC mainboard includes bottom plate (1) and external port (3), its characterized in that: one side on bottom plate (1) top is fixed with external port (3), the both ends of bottom plate (1) are provided with mosaic structure (2), mosaic structure (2) include, slider (201), fixture block (202), draw-in groove (203) and spout (204), the one end of bottom plate (1) is all fixed in slider (201), the one end of slider (201) is fixed with fixture block (202), the other end of bottom plate (1) is fixed in spout (204), the one end of spout (204) is fixed with draw-in groove (203), the top of bottom plate (1) is provided with heat radiation structure (4), the inside of bottom plate (1) is provided with additional strengthening (5).
2. The dual-wide full-scale reinforced AMC motherboard of claim 1, wherein: the cross section of the sliding groove (204) is larger than that of the sliding block (201), and a sliding structure is formed between the sliding block (201) and the sliding groove (204).
3. The dual-wide full-scale reinforced AMC motherboard of claim 1, wherein: heat radiation structure (4) include radiating fin (401), heat-conducting plate (402) and connecting block (403), the top of bottom plate (1) is fixed in connecting block (403), the top of connecting block (403) is fixed with heat-conducting plate (402), the top of heat-conducting plate (402) is fixed with radiating fin (401).
4. The dual-wide full-scale reinforced AMC motherboard of claim 3, wherein: the radiating fins (401) are provided with five groups, and the five groups of radiating fins (401) are distributed at equal intervals on the top end of the heat conducting plate (402).
5. The dual-wide full-scale reinforced AMC motherboard of claim 3, wherein: the heat-conducting plates (402) are arranged in two groups, and the two groups of heat-conducting plates (402) are symmetrically distributed around the central axis of the bottom plate (1).
6. The dual-wide full-scale reinforced AMC motherboard of claim 1, wherein: the reinforcing structure (5) comprises a first reinforcing rib (501), a second reinforcing rib (502) and a third reinforcing rib (503), wherein the third reinforcing rib (503) is arranged inside the bottom plate (1), the second reinforcing rib (502) is fixed at one end of the first reinforcing rib (501), the third reinforcing rib (503) is arranged on one side of the second reinforcing rib (502), and the second reinforcing rib (502) and the third reinforcing rib (503) are arranged in a crossed mode.
CN202021243474.6U 2020-06-29 2020-06-29 Double-width full-size reinforced AMC mainboard Active CN212160567U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021243474.6U CN212160567U (en) 2020-06-29 2020-06-29 Double-width full-size reinforced AMC mainboard

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021243474.6U CN212160567U (en) 2020-06-29 2020-06-29 Double-width full-size reinforced AMC mainboard

Publications (1)

Publication Number Publication Date
CN212160567U true CN212160567U (en) 2020-12-15

Family

ID=73700066

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021243474.6U Active CN212160567U (en) 2020-06-29 2020-06-29 Double-width full-size reinforced AMC mainboard

Country Status (1)

Country Link
CN (1) CN212160567U (en)

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