CN212138205U - Semiconductor heat sink - Google Patents
Semiconductor heat sink Download PDFInfo
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- CN212138205U CN212138205U CN202021054167.3U CN202021054167U CN212138205U CN 212138205 U CN212138205 U CN 212138205U CN 202021054167 U CN202021054167 U CN 202021054167U CN 212138205 U CN212138205 U CN 212138205U
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- circuit board
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Abstract
The utility model discloses a semiconductor heat abstractor for dispel the heat to the controller circuit board, including first heat conduction glue and the second heat conduction glue that is located the control circuit board below, be located the semiconductor fin between first heat conduction glue and the second heat conduction glue and be located the fin subassembly of second heat conduction glue below, form first heat conduction laminated structure between the top of first heat conduction glue and the controller circuit board, the below of first heat conduction glue with the semiconductor fin forms second heat conduction laminated structure, and the top of second heat conduction glue forms third heat conduction laminated structure with the semiconductor fin, and the below of second heat conduction glue forms fourth heat conduction laminated structure with the fin subassembly. Compared with the prior heat dissipation technology of the automobile executive component controller, the semiconductor heat dissipation device has the advantages of being active in heat dissipation, simple in structure, easy to control and capable of solving the heat dissipation problem of the heating element on the circuit board of the automobile executive component controller essentially.
Description
Technical Field
The utility model relates to a semiconductor heat dissipation technical field, in particular to semiconductor heat abstractor of car executive component controller.
Background
At present, new energy vehicles are rapidly developing in the market, and meanwhile, the requirements of laws and regulations in various regions of various countries on the emission of internal combustion engine vehicles are developing in an increasingly strict direction. Since many speed control controls are involved in the normal operation of the automobile, the execution components of the automobile need to be equipped with an appropriate controller for speed control. In particular, the popularization of new energy automobiles and electronic internal combustion engine vehicles does not leave the use of automobile executive component controllers. For example, the controller of an electronic water pump of a thermal management system of an automobile mainly comprises: MCU, Mosfet, electric capacity etc. and the executive component is the water pump, adjusts the water pump rotational speed through the controller to the flow of adjusting the water pump, through controlling flow in order to realize the heat balance of car thermal management system, specifically refer to as shown in figure 1.
Generally, the speed of the execution part of the automobile can be adjusted by controlling the execution part of the automobile through the PWM of the Mosfet on the circuit board of the controller. However, because the mosfets are heating elements, the mosfets will generate a large amount of heat during the speed adjustment process of the circuit board of the controller. When the heat generated by the electronic component is too large and cannot be dissipated in time, the electronic component is prone to fail at high temperature, so that the whole circuit system cannot operate.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat abstractor is so that above-mentioned control circuit's heating element can dispel the heat rapidly.
In order to achieve the above purpose, the utility model provides a following technical scheme:
a semiconductor heat dissipation device is used for dissipating heat of a controller circuit board and comprises a first heat conduction glue and a second heat conduction glue which are positioned below the controller circuit board, a semiconductor heat dissipation sheet positioned between the first heat conduction glue and the second heat conduction glue and a heat dissipation sheet assembly positioned below the second heat conduction glue, wherein a first heat conduction laminated structure is formed between the upper side of the first heat conduction glue and the controller circuit board, a second heat conduction laminated structure is formed between the lower side of the first heat conduction glue and the semiconductor heat dissipation sheet, a third heat conduction laminated structure is formed between the upper side of the second heat conduction glue and the semiconductor heat dissipation sheet, and a fourth heat conduction laminated structure is formed between the lower side of the second heat conduction glue and the heat dissipation sheet assembly.
Further, the controller circuit board powers on or off the semiconductor heat sink.
Further, a temperature detection element is integrated on the controller circuit board, and the controller circuit board controls power supply or power off of the semiconductor heat sink based on the temperature acquired by the temperature detection element.
Further, when the temperature detected by the temperature detecting element exceeds a first set temperature, the controller circuit board supplies power to the semiconductor cooling fin.
Further, when the temperature detected by the temperature detecting element is lower than a second set temperature, the controller circuit board is used for powering off the semiconductor cooling fin.
Further, the value of the first set temperature is greater than the value of the second set temperature.
Further, the first heat-conducting glue fills a gap between the controller circuit board and the semiconductor heat sink, and the second heat-conducting glue fills a gap between the semiconductor heat sink and the heat sink assembly to form a heat-conducting channel.
Further, the heat sink assembly includes a first heat sink located below the second heat conductive adhesive, a second heat sink located below the first heat sink, and a cooling channel located between the first heat sink and the second heat sink, and the first heat sink, the second heat sink, and the cooling channel form a heat conductive metal cavity structure.
Further, a cooling medium may be provided in the cooling flow passage, and the cooling medium may flow in the cooling flow passage.
Further, the first radiating fin and the second radiating fin are made of aluminum materials.
The beneficial effects of the utility model reside in that: (1) compared with the prior heat dissipation technology of the automobile executive component controller, the semiconductor heat dissipation device has the advantages that the semiconductor heat dissipation device is active in heat dissipation, simple in structure and easy to control, and the heat dissipation problem of the heating element on the circuit board of the automobile executive component controller can be solved substantially.
(2) The semiconductor radiating fin has the characteristics that one side of the semiconductor radiating fin actively absorbs heat and the other side of the semiconductor radiating fin actively releases heat, when the controller circuit board controls the power supply or the power failure of the semiconductor heat conducting fin, the cold end and the hot end are formed above and below the semiconductor radiating fin, the cold end of the semiconductor radiating fin and the heat conducting glue above the semiconductor radiating fin can form a heat conducting laminated structure, and the hot end of the semiconductor radiating fin and the heat conducting glue below the semiconductor radiating fin form the heat conducting laminated structure.
The above description is only an overview of the technical solution of the present invention, and in order to make the technical means of the present invention clearer and can be implemented according to the content of the description, the following detailed description is made with reference to the preferred embodiments of the present invention and accompanying drawings.
Drawings
FIG. 1 is a functional block diagram of a controller for an electronic water pump of an automotive thermal management system.
FIG. 2 is a diagram illustrating a circuit board of the controller for limiting the rotation speed of the water pump according to the temperature.
Fig. 3 is a schematic structural diagram of the controller circuit board and the semiconductor heat dissipation device.
Fig. 4 is a flowchart of the power supply control method.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 2 and 4, for the structural schematic diagram of the embodiment of the present invention, a semiconductor heat dissipation device is provided, which is applied to an automobile executive component controller for cooling an electronic component of the automobile executive component controller, of course, the automobile executive component controller includes but is not limited to components that need heat dissipation, such as an automobile electronic water pump, an electronic air conditioner compressor, and an electronic oil pump. The electronic component is the core component of the controller, therefore the main objective of the heat dissipation structure of the present invention is to realize the heat dissipation of the heating electronic component, and the heat dissipation structure is mainly realized by the bottom or surface heat dissipation mode. The automobile executive component controller comprises a controller circuit board 1 and a semiconductor heat dissipation device. The semiconductor heat dissipation device comprises two layers of heat-conducting glue positioned below the control circuit board 1, a semiconductor heat dissipation sheet 3 positioned between the two layers of heat-conducting glue and a heat dissipation sheet assembly positioned below the two layers of heat-conducting glue. The heat conducting glue can be GapFiller which is mainly a high-performance liquid gap filling heat conducting material, the semiconductor radiating fins are made of semiconductor materials, and based on the Peltier principle, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, so that the aim of refrigeration can be fulfilled. The control circuit board 1 can be used for realizing speed regulation control of an automobile execution part controller, and can form a monitoring circuit, a self-protection circuit and the like.
In addition, the control circuit board 1 and the lower heat conducting glue form a heat conducting laminated structure, so that heat generated by the heating element in the control circuit board 1 can be rapidly conducted out. Namely, the utility model discloses a main heating element such as Mosfet and inductance on control circuit board 1, the heat dissipation of main component such as Mosfet and inductance is guaranteed to the above-mentioned heat conduction laminated structure of accessible, improves the heat dispersion of electronic actuator's controller operation in-process to main component's such as Mosfet and inductance life-span has been guaranteed, control circuit board's reliability has been improved.
In the present embodiment, the semiconductor heat sink 3 can be power-controlled by the controller circuit board 1. The controller circuit board 1 of the automobile executive component controller is further integrated with a temperature detection element (not shown), the temperature detection element can detect the temperature of the element on the controller circuit board 1, and the control circuit board 1 can perform power supply control on the semiconductor cooling fin 3 based on the acquired temperature. Moreover, the monitoring circuit can be realized by detecting the temperature of the controller circuit board 1 through the temperature detection element on the controller circuit board 1, and the self-protection circuit can be formed by limiting the rotating speed of the water pump according to the temperature of the controller circuit board 1.
Further, when the temperature detecting element detects that the temperature of the element on the control circuit board 1 is too high, the controller circuit board 1 immediately supplies power to the semiconductor heat sink 3, and the heat dissipation of the semiconductor heat sink 3 is accelerated. On the contrary, when the temperature detecting element detects that the temperature of the element on the controller board 1 is not high, the controller board 1 may disconnect the power supply of the semiconductor heat sink 3. The controller circuit board 1 controls the semiconductor heat conducting fins 3 to be powered on or powered off, so that cold ends and hot ends are formed above and below the semiconductor heat radiating fins 3, the cold ends of the semiconductor heat radiating fins 3 and the heat conducting glue above the cold ends of the semiconductor heat radiating fins can form a heat conducting laminated structure, and the hot ends of the semiconductor heat radiating fins 3 and the heat conducting glue below the hot ends of the semiconductor heat radiating fins form a heat conducting laminated structure. Because the semiconductor cooling fin is fast in temperature response, the controller circuit board 1 can be effectively cooled in a short time, elements on the controller circuit board 1 are effectively protected, and the stability of the controller circuit board 1 is improved.
In this embodiment, the heat conductive adhesive is provided with two layers, namely a first heat conductive adhesive 2 and a second heat conductive adhesive 4. The first heat-conducting glue 2 and the second heat-conducting glue 4 can be used for filling gaps between the controller circuit board 1 and the semiconductor heat sink 3 and gaps between the semiconductor heat sink 3 and the heat sink assembly, so that a heat-conducting channel is established, and heat conducted by the semiconductor heat sink 3 is rapidly conducted to the heat sink assembly. The upper part of the first heat-conducting glue 2 and the controller circuit board 1 form a first heat-conducting laminated structure, and the lower part of the first heat-conducting glue 1 and the semiconductor cooling fin 3 form a second heat-conducting laminated structure. The upper part of the second heat-conducting glue 4 and the semiconductor radiating fin 3 form a third heat-conducting laminated structure, and the lower part of the second heat-conducting glue 4 and the radiating fin component form a fourth heat-conducting laminated structure. Because the quadruple heat conduction laminated structure who exists, thereby make the utility model discloses a semiconductor heat abstractor can come out with the heat quick conduction on the controller circuit board 1.
Further, the heat sink assembly includes a first heat sink 5 located below the second heat conductive adhesive, a second heat sink 6 located below the first heat sink 5, and a cooling channel 7 located between the first heat sink 5 and the second heat sink 6, and a cooling medium, such as cooling liquid, water, etc., may be disposed in the cooling channel 7. The first heat sink 5 and the second heat sink 6 are made of aluminum, but may be made of a heat conductive material such as copper or steel in other embodiments. The first heat radiating fin 5, the second heat radiating fin 6 and the cooling flow channel 7 form a heat-conducting metal cavity structure, when a cooling medium in the cooling channel 7 flows, the cooling medium can take away heat in the first heat radiating fin 5 and the second heat radiating fin 6, so that the heat conducted out by the semiconductor heat radiating fin 3 is taken away quickly, and heat radiation of the controller circuit board 1 is achieved.
In this embodiment, the power supply control method is as follows:
the power supply of the semiconductor cooling fin 3 is controlled by the mosfets arranged on the controller circuit board 1, when the mosfets are turned on, the semiconductor cooling fin 3 starts to be powered, otherwise, the power supply of the semiconductor cooling fin 3 is cut off. When the automobile executive component controller is started, the real-time temperature detection is carried out on the controller circuit board 1 immediately, and if the temperature exceeds the set temperature T1, the semiconductor refrigeration power supply mode is started. And if the temperature is lower than the set temperature T2, immediately turning off the semiconductor cooling power supply mode. In general, the set temperature T1 has a value greater than the set temperature T2, for example, 130 ℃ for the set temperature T1 and 100 ℃ for the set temperature T2.
As the controller circuit board 1 and the semiconductor cooling fins 3 have stronger cold and heat exchange, the surface of the controller circuit board 1 can be additionally provided with processes of spraying three-proofing paint and the like, so that the short circuit phenomenon of the controller circuit board caused by condensed water is avoided.
The utility model has the advantages that:
(1) compared with the prior heat dissipation technology of the automobile executive component controller, the semiconductor heat dissipation device has the advantages that the semiconductor heat dissipation device is active in heat dissipation, simple in structure and easy to control, and the heat dissipation problem of the heating element on the circuit board of the automobile executive component controller can be solved substantially.
(2) The semiconductor radiating fin has the characteristics that one side of the semiconductor radiating fin actively absorbs heat and the other side of the semiconductor radiating fin actively releases heat, when the controller circuit board controls the power supply or the power failure of the semiconductor heat conducting fin, the cold end and the hot end are formed above and below the semiconductor radiating fin, the cold end of the semiconductor radiating fin and the heat conducting glue above the semiconductor radiating fin can form a heat conducting laminated structure, and the hot end of the semiconductor radiating fin and the heat conducting glue below the semiconductor radiating fin form the heat conducting laminated structure.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art. Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. A semiconductor heat dissipation device is used for dissipating heat of a controller circuit board, and is characterized in that: the heat dissipation structure comprises a first heat conduction glue and a second heat conduction glue which are positioned below a controller circuit board, a semiconductor cooling fin positioned between the first heat conduction glue and the second heat conduction glue, and a cooling fin assembly positioned below the second heat conduction glue, wherein a first heat conduction laminated structure is formed between the upper side of the first heat conduction glue and the controller circuit board, a second heat conduction laminated structure is formed between the lower side of the first heat conduction glue and the semiconductor cooling fin, a third heat conduction laminated structure is formed between the upper side of the second heat conduction glue and the semiconductor cooling fin, and a fourth heat conduction laminated structure is formed between the lower side of the second heat conduction glue and the cooling fin assembly.
2. The semiconductor heat sink of claim 1, wherein the controller circuit board powers the semiconductor heat sink on and off.
3. The semiconductor heat sink according to claim 2, wherein a temperature detection element is integrated on the controller circuit board, and the controller circuit board controls power supply to or power off of the semiconductor heat sink based on the temperature detected by the temperature detection element.
4. The semiconductor heat sink according to claim 3, wherein the controller circuit board supplies power to the semiconductor heat sink when the temperature detected by the temperature detecting element exceeds a first set temperature.
5. The semiconductor heat sink according to claim 4, wherein the controller circuit board powers off the semiconductor heat sink when the temperature detected by the temperature detecting unit is lower than a second set temperature.
6. The semiconductor heat sink of claim 5, wherein the first set temperature is greater in value than the second set temperature.
7. The semiconductor heat sink device as claimed in claim 3, wherein the first thermal paste fills a gap between the controller circuit board and the semiconductor heat sink, and the second thermal paste fills a gap between the semiconductor heat sink and the heat sink assembly to form a thermal conduction channel.
8. The semiconductor heat sink device according to claim 7, wherein the heat sink assembly comprises a first heat sink under the second thermally conductive adhesive, a second heat sink under the first heat sink, and a cooling channel between the first heat sink and the second heat sink, the first heat sink, the second heat sink, and the cooling channel forming a thermally conductive metal cavity structure.
9. The semiconductor heat sink according to claim 8, wherein a cooling medium is disposed in the cooling channel, and the cooling medium is capable of flowing in the cooling channel.
10. The semiconductor heat sink of claim 9, wherein the first and second fins are made of aluminum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021054167.3U CN212138205U (en) | 2020-06-10 | 2020-06-10 | Semiconductor heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021054167.3U CN212138205U (en) | 2020-06-10 | 2020-06-10 | Semiconductor heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212138205U true CN212138205U (en) | 2020-12-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021054167.3U Active CN212138205U (en) | 2020-06-10 | 2020-06-10 | Semiconductor heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212138205U (en) |
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2020
- 2020-06-10 CN CN202021054167.3U patent/CN212138205U/en active Active
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