CN212138031U

CN212138031U - Be applied to COF base plate IC and paste preceding treatment equipment of dress

Info

Publication number: CN212138031U
Application number: CN202020067310.6U
Authority: CN
Inventors: 高明辉; 蒋有平
Original assignee: Zhuhai Haixun Soft Multilayer Prototypes Co ltd
Current assignee: Zhuhai Haixun Soft Multilayer Prototypes Co ltd
Priority date: 2020-01-13
Filing date: 2020-01-13
Publication date: 2020-12-11
Anticipated expiration: 2030-01-13

Abstract

The utility model discloses a pre-processing device applied to the IC mounting of COF substrates, which comprises a base and a positioning piece, wherein the positioning piece is used for positioning when a reinforcing plate and a COF substrate are placed; the supporting column is arranged on the base; the guide plate is arranged on the support column, and the guide plate is provided with a driving assembly; the pressing rod penetrates through the guide plate, one end of the pressing rod is connected to the driving assembly, the other end of the pressing rod is connected with a pressing block, and the pressing block is correspondingly arranged above the aligning piece. When using, counterpoint the reinforcing plate and COF base plate through counterpoint piece, can ensure the precision that reinforcing plate and COF base plate counterpoint, exert pressure for reinforcing plate and COF base plate through depression bar and briquetting, be favorable to guaranteeing that COF base plate atress is even, avoid taking place the skew between pressfitting in-process reinforcing plate and COF base plate.

Description

Be applied to COF base plate IC and paste preceding treatment equipment of dress

Technical Field

The utility model relates to a circuit board technical field, in particular to be applied to COF base plate IC and paste preceding treatment facility of dress.

Background

COF (Chip On Flex, or, Chip On Film), commonly called as Chip On Film, is a flexible packaging technology of a crystal grain in which an Integrated Circuit (IC) is fixed On a flexible circuit board, and a flexible additional circuit board is used as a carrier for packaging a Chip to combine the Chip with a flexible substrate circuit, or a flexible additional circuit board without a packaged Chip. At present, the IC mounting equipment for the circuit board is mainly applied to the rigid circuit board, and the IC mounting equipment for the COF substrate is expensive and needs to be purchased additionally, which not only occupies the factory space, but also increases the production cost.

In order to mount a COF board on an IC mounting apparatus of a rigid circuit board, it is necessary to attach a reinforcing plate to the back surface of the COF board to improve the strength of the COF board. At present, a reinforcing plate is manually pasted, so that a COF substrate is easy to incline, subsequent IC mounting is staggered, and the reject ratio is high.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a be applied to COF base plate IC and paste preceding processing equipment who pastes, precision when can improving COF base plate and reinforcing plate and paste.

The pretreatment equipment applied to the IC mounting of the COF substrate comprises a base, wherein a positioning piece is arranged on the base, and the positioning piece is used for positioning when a reinforcing plate and the COF substrate are placed; the supporting column is arranged on the base; the guide plate is arranged on the support column, and the guide plate is provided with a driving assembly; the pressing rod penetrates through the guide plate, one end of the pressing rod is connected to the driving assembly, the other end of the pressing rod is connected with a pressing block, and the pressing block is correspondingly arranged above the aligning piece.

According to the utility model discloses be applied to COF base plate IC and paste preceding treatment facility of dress has following beneficial effect at least:

when using, counterpoint the reinforcing plate and COF base plate through counterpoint piece, can ensure the precision that reinforcing plate and COF base plate counterpoint, exert pressure for reinforcing plate and COF base plate through depression bar and briquetting, be favorable to guaranteeing that COF base plate atress is even, avoid taking place the skew between pressfitting in-process reinforcing plate and COF base plate.

According to some embodiments of the utility model, the bottom of briquetting is provided with first elastic block.

According to some embodiments of the invention, the first elastic block is a silicone block or a rubber block.

According to some embodiments of the present invention, the aligning member is provided with a second elastic block.

According to some embodiments of the invention, the second elastic block is a silica gel block or a rubber block.

According to some embodiments of the utility model, drive assembly adopts the spanner, drive assembly articulate in the deflector, and with depression bar swing joint.

According to some embodiments of the utility model, drive assembly adopts the cylinder, drive assembly is vertical to be installed on the deflector, drive assembly's output shaft with compression linkage.

According to some embodiments of the utility model, on the base and corresponding to the position of counterpoint piece is provided with the feed roll.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of a pretreatment apparatus applied to IC mounting of a COF substrate according to an embodiment of the present invention.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.

Referring to fig. 1, the embodiment discloses a pre-processing apparatus applied to IC mounting of a COF substrate, including a base 100, a supporting pillar 200, a guiding plate 300 and a pressing rod 500, wherein the base 100 is provided with a positioning member 110, and the positioning member 110 is used for positioning when a reinforcing plate and a COF substrate are placed; the supporting column 200 is arranged on the base 100; the guide plate 300 is installed on the support column 200, and the driving assembly 400 is installed on the guide plate 300; the pressing rod 500 penetrates through the guide plate 300, one end of the pressing rod 500 is connected to the driving assembly 400, the other end of the pressing rod 500 is connected to a pressing block 510, and the pressing block 510 is correspondingly arranged above the aligning member 110.

When the COF substrate aligning device is used, a tape-wound COF substrate is placed on the left side of the base 100, the reinforcing plate is placed on the aligning piece 110, after the surface of the reinforcing plate is coated with adhesive, the COF substrate is placed on the reinforcing plate, the reinforcing plate and the COF substrate are aligned through the aligning piece 110, the aligning precision of the reinforcing plate and the COF substrate can be ensured, pressure is applied to the reinforcing plate and the COF substrate through the pressure rod 500 and the pressure block 510, the stress uniformity of the COF substrate is facilitated, and the phenomenon that the reinforcing plate and the COF substrate are deviated due to uneven stress in the pressing process is avoided. Wherein, counterpoint piece 110 adopts L type sheet metal component, and L type sheet metal component is easily processed and is assembled, and can adjust the position of L type sheet metal component on base 100 as required, is favorable to improving the suitability.

In some embodiments, the bottom of the pressing block 510 is provided with a first elastic block (not shown), and when the pressing block is pressed down, the first elastic block can generate a micro deformation, so as to prevent the circuit on the surface of the COF substrate from being damaged due to an excessive pressure, thereby protecting the circuit on the surface of the COF substrate.

Specifically, first elastic block adopts silica gel piece or block rubber, and silica gel piece or block rubber are common elastic material, can produce micro deformation when receiving pressure, and the cost of silica gel piece or block rubber is lower, and easily processing is favorable to practicing thrift the cost of manufacture.

In some embodiments, the alignment member 110 is provided with a second elastic block (not shown), which can deform slightly when subjected to a pressure, so as to avoid damaging the COF substrate and the stiffener.

Specifically, the second elastic block adopts silica gel piece or rubber block, can produce micro deformation when receiving pressure, and the cost of silica gel piece or rubber block is lower, easily processing is favorable to practicing thrift the cost of manufacture.

In some embodiments, the driving assembly 400 is a wrench, and the driving assembly 400 is hinged to the guide plate 300 and movably connected to the pressing rod 500. The COF substrate is driven by a wrench, has a simple structure and low manufacturing cost, and is suitable for small-batch production of COF substrates.

In other embodiments, the driving assembly 400 employs an air cylinder, the driving assembly 400 is vertically mounted on the guide plate 300, and the power output end of the driving assembly 400 is connected to the pressing rod 500. The cylinder is adopted for driving, so that the labor is saved, the labor intensity of operators is reduced, and the COF substrate processing device is suitable for mass production of COF substrates.

In order to improve the smoothness of feeding the COF substrate, a feeding roller 600 is disposed on the base 100 at a position corresponding to the aligning member 110. The COF substrate of the tape winding type is placed on the left side of the base 100 and is arranged between the two feeding rollers 600 in a penetrating mode, after the COF substrate is processed, when the COF substrate is replaced, the feeding rollers 600 can be driven by the COF substrate to rotate, and the COF substrate is prevented from being clamped or even bent at the edge of the base 100.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.

Claims

1. A pretreatment device applied to IC mounting of a COF substrate is characterized by comprising:

a chassis (100) provided with a positioning member (110), wherein the positioning member (110) is used for positioning when a reinforcing plate and a COF substrate are placed;

a support column (200) disposed on the base (100);

a guide plate (300) mounted on the support column (200), the guide plate (300) having a drive assembly (400) mounted thereon;

the pressing rod (500) penetrates through the guide plate (300), one end of the pressing rod (500) is connected to the driving assembly (400), the other end of the pressing rod (500) is connected with a pressing block (510), and the pressing block (510) is correspondingly arranged above the aligning piece (110).

2. The pre-processing equipment applied to the IC mounting of COF substrates in accordance with claim 1, wherein the bottom of the pressing block (510) is provided with a first elastic block.

3. The pre-processing equipment applied to the IC mounting of COF substrates of claim 2, wherein the first elastic block is a silicone block or a rubber block.

4. The pre-processing equipment applied to IC mounting of COF substrates according to any one of claims 1 to 3, wherein the alignment member (110) is provided with a second elastic block.

5. The pre-processing equipment applied to IC mounting of COF substrates of claim 4, wherein the second elastic block is a silicone block or a rubber block.

6. The pre-processing equipment applied to the IC mounting of COF substrates of claim 1, wherein the driving assembly (400) is a wrench, and the driving assembly (400) is hinged to the guide plate (300) and movably connected to the pressing rod (500).

7. The pre-processing equipment applied to the IC mounting of COF substrates of claim 1, wherein the driving assembly (400) adopts a cylinder, the driving assembly (400) is vertically installed on the guide plate (300), and an output shaft of the driving assembly (400) is connected with the compression bar (500).

8. The pre-processing equipment applied to the IC mounting of COF substrates according to claim 1, wherein a feeding roller (600) is disposed on the base (100) at a position corresponding to the alignment member (110).