CN212133592U - Flatness detection device for surface of solar cell silicon wafer - Google Patents
Flatness detection device for surface of solar cell silicon wafer Download PDFInfo
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- CN212133592U CN212133592U CN202020931457.5U CN202020931457U CN212133592U CN 212133592 U CN212133592 U CN 212133592U CN 202020931457 U CN202020931457 U CN 202020931457U CN 212133592 U CN212133592 U CN 212133592U
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Abstract
The utility model relates to a photovoltaic manufacturing technology field discloses a roughness detection device for solar cell silicon chip surface. The utility model provides a roughness detection device for solar cell silicon chip surface, its is including the loading board that is used for bearing the weight of solar cell silicon chip and hang and establish in the loading board top for detect the laser displacement sensor of solar cell silicon chip surface roughness, the top of loading board is seted up and is detected the groove, detects the inslot and is provided with clamping component, clamping component includes the riser. The utility model discloses a roughness detection device for solar cell silicon chip surface has replaced traditional roughness detection device, through the clamping component who detects the inslot and set up, can carry out quick centre gripping to putting into the not unidimensional silicon chip that detects the inslot and fix, makes the silicon chip be in corresponding detection position, has improved the suitability to not unidimensional silicon chip, has also guaranteed simultaneously that laser displacement sensor records the accuracy of roughness testing result.
Description
Technical Field
The utility model relates to a photovoltaic manufacturing technology field especially relates to a roughness detection device for solar cell silicon chip surface.
Background
The solar cell is a photoelectric conversion device developed based on a photovoltaic effect, and currently, solar cells in the international photovoltaic market mainly include crystalline silicon (including monocrystalline silicon and polycrystalline silicon), amorphous/monocrystalline Heterojunction (HIT), amorphous silicon thin films, cadmium telluride (CdTe) thin films, Copper Indium Selenide (CIS) thin film solar cells and the like. Among them, crystalline silicon solar cells still dominate, the photoelectric conversion efficiency thereof has reached 25%, and the calculated limit value of the conversion efficiency thereof is 31%.
In the production and manufacturing process of the crystalline silicon solar cell, silicon wafers are the most main raw materials. For the silicon wafer after production and manufacture, the flatness of the surface of the silicon wafer needs to be detected so as to ensure the product quality of the silicon wafer. Usually, a laser displacement sensor is adopted, that is, an object is directly scanned by the laser displacement sensor, and then a surface flatness curve of the object can be obtained by simply calculating according to a displacement value from the sensor to the object.
The flatness detection device in the prior art has poor adaptability to silicon wafers with different sizes, and before the silicon wafers are detected, the silicon wafers with different sizes cannot be well fixed, so that the silicon wafers cannot be located at corresponding detection positions, flatness detection results measured by the laser displacement sensor are influenced, and the detection requirements of people on the surface flatness of the solar cell silicon wafers cannot be met gradually.
SUMMERY OF THE UTILITY MODEL
For solving the technical problem who exists among the prior art, the utility model provides a roughness detection device for solar cell silicon chip surface.
The utility model discloses a following technical scheme realizes: a flatness detection device for the surface of a solar cell silicon wafer comprises a bearing plate for bearing the solar cell silicon wafer and a laser displacement sensor which is suspended above the bearing plate and used for detecting the flatness of the surface of the solar cell silicon wafer, wherein a detection groove is formed in the top of the bearing plate, a clamping assembly is arranged in the detection groove and comprises a vertical plate, a moving plate is arranged in parallel on one side of the vertical plate, a first screw rod is inserted into the plate body of the vertical plate in a threaded manner, the end part of the rod part of the first screw rod is rotatably connected with the corresponding side wall of the moving plate, the vertical plate is connected with the moving plate through a first telescopic rod, a chute is vertically formed in one side of the moving plate, which is far away from the vertical plate, a sleeve which is perpendicular to the chute is connected in the chute in a sliding manner, and an opening is formed in, a sliding block is connected in the opening in a sliding manner, one side of the sliding block is elastically connected with the corresponding cylinder wall of the sleeve through a spring, and the other opposite side of the sliding block is connected with a first clamping plate parallel to the moving plate through a connecting rod; the top of one side, far away from the vertical plate, of the moving plate is provided with a fixed block, a second screw rod is inserted into the fixed block in a threaded mode, and the end portion of the second rod portion of the second screw rod is rotatably connected with the corresponding side wall of the sleeve.
The further improvement of the scheme is that a first shaft seat is arranged on one side, close to the first screw rod, of the moving plate, a first bearing is installed inside the first shaft seat, and the end of the rod part of the first screw rod is in key connection with an inner ring of the first bearing.
As a further improvement of the scheme, a second shaft seat is arranged on one side, close to the second screw rod, of the sleeve, a second bearing is installed inside the second shaft seat, and the end of the rod part of the second screw rod is in key connection with the inner ring of the second bearing.
As a further improvement of the scheme, a buffer cushion is laid at the bottom of the detection tank body.
As a further improvement of the above scheme, a second clamping plate corresponding to the first clamping plate is arranged at one end, away from the clamping assembly, of the detection groove.
As a further improvement of the above scheme, a stand column is arranged at the top of the bearing plate on one side of the detection groove, a lead screw perpendicular to the stand column is rotatably connected to the stand column, a nut sleeve is sleeved on a rod body of the lead screw in a threaded manner, the nut sleeve is connected with the stand column through a second telescopic rod, and the laser displacement sensor is installed at the bottom of the nut sleeve through a hanging rod.
As a further improvement of the above scheme, a motor is installed on one side of the upright column, which is far away from the screw rod, and an output shaft of the motor is connected with the screw rod.
The utility model has the advantages that:
1. the utility model discloses a roughness detection device for solar cell silicon chip surface has replaced traditional roughness detection device, through the clamping component who detects the inslot and set up, can carry out quick centre gripping to putting into the not unidimensional silicon chip that detects the inslot and fix, makes the silicon chip be in corresponding detection position, has improved the suitability to not unidimensional silicon chip, has also guaranteed simultaneously that laser displacement sensor records the accuracy of roughness testing result.
Drawings
Fig. 1 is a schematic overall structure diagram of a flatness detection apparatus for a surface of a solar cell silicon wafer according to an embodiment of the present invention;
FIG. 2 is an enlarged schematic view of the structure at A in FIG. 1;
fig. 3 is an enlarged schematic view of a structure at B in fig. 2.
Description of the main symbols:
1. a carrier plate; 2. a laser displacement sensor; 3. a detection tank; 4. a cushion pad; 5. a vertical plate; 6. moving the plate; 7. a first screw rod; 8. a first telescopic rod; 9. a first shaft seat; 10. a chute; 11. a sleeve; 12. a slider; 13. a spring; 14. a connecting rod; 15. a first clamping plate; 16. a fixed block; 17. a second screw; 18. a second shaft seat; 19. a column; 20. a screw rod; 21. a nut sleeve; 22. a boom; 23. a second telescopic rod; 24. a motor; 25. and a second clamping plate.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
Referring to fig. 1 to 3, a flatness detecting device for a surface of a solar cell silicon wafer includes a supporting plate 1 for supporting the solar cell silicon wafer and a laser displacement sensor 2 suspended above the supporting plate 1 for detecting the flatness of the surface of the solar cell silicon wafer, wherein a detecting groove 3 is formed at the top of the supporting plate 1, and a clamping assembly is disposed in the detecting groove 3 and can clamp and fix the silicon wafer. The clamping assembly comprises a vertical plate 5, a movable plate 6 is arranged on one side of the vertical plate 5 in parallel, a first screw rod 7 is inserted into the plate body of the vertical plate 5 in a threaded manner, the end part of the rod part of the first screw rod 7 is rotatably connected with the corresponding side wall of the movable plate 6, the vertical plate 5 is further connected with the movable plate 6 through a first telescopic rod 8, the two ends of the first telescopic rod 8 are respectively connected with the vertical plate 5 and the movable plate 6 through screws, and the first telescopic rod 8 can limit the movement of the movable plate 6 relative to the vertical plate 5 under the threaded action of the first screw. The model of the laser displacement sensor 2 of the present embodiment may be selected as ZLDS 11X.
One side of the moving plate 6, which is far away from the vertical plate 5, is vertically provided with a sliding groove 10, the sliding groove 10 is internally and slidably connected with a sleeve 11 which is perpendicular to the sliding groove 10, one end, which is far away from the sliding groove 10, of the sleeve 11 is provided with an opening (not marked), and a stop block (not marked) is arranged at the joint of the inner wall of the opening and the outer wall of the sleeve 11, so that the sliding block 12 is prevented. A sliding block 12 is connected in the opening in a sliding manner, one side of the sliding block 12 is elastically connected with the corresponding cylinder wall of the sleeve 11 through a spring 13, two ends of the spring 13 are respectively welded and fixed with the corresponding inner wall of the sleeve 11 and one side of the sliding block 12, and the other opposite side of the sliding block 12 is connected with a first clamping plate 15 parallel to the moving plate 6 through a connecting rod 14. The top of one side of the moving plate 6, which is far away from the vertical plate 5, is provided with a fixed block 16, a second screw 17 is inserted in the fixed block 16 in a threaded manner, and the end part of the rod part of the second screw 17 is rotatably connected with the corresponding side wall of the sleeve 11. The second screw 17 rotates on the fixing block 16 to drive the sleeve 11 to slide in the chute 10, so as to adjust the first clamping plate 15 to a proper height in the vertical direction.
One side of the moving plate 6, which is close to the first screw 7, is provided with a first shaft seat 9, a first bearing is installed inside the first shaft seat 9, and the end part of the rod part of the first screw 7 is in key connection with the inner ring of the first bearing.
One side of the sleeve 11, which is close to the second screw rod 17, is provided with a second shaft seat 18, a second bearing is installed inside the second shaft seat 18, and the end part of the rod part of the second screw rod 17 is in key connection with the inner ring of the second bearing.
A buffer pad 4 is laid at the bottom of the detection tank 3. The buffer pad 4 can buffer the silicon chip, and the silicon chip is prevented from being damaged when placed on the bottom of the detection groove 3.
And a second clamping plate 25 corresponding to the first clamping plate 15 is arranged at one end of the detection groove 3 away from the clamping assembly. The second clamping plate 25 is matched with the first clamping plate 15 to clamp and fix the silicon wafer.
The top of the bearing plate 1 positioned on one side of the detection groove 3 is provided with an upright column 19, the upright column 19 is rotatably connected with a screw rod 20 vertical to the upright column 19, a nut sleeve 21 is sleeved on a rod body of the screw rod 20 in a threaded manner, the nut sleeve 21 is connected with the upright column 19 through a second telescopic rod 23, and the second telescopic rod 23 can limit the movement of the nut sleeve 21 on the screw rod 20. The laser displacement sensor 2 is mounted at the bottom of the nut case 21 through a suspension rod 22. The rotation of the screw rod 20 can enable the screw rod and the nut sleeve 21 to have a mutual thread effect, so that the nut sleeve 21 moves in the axial direction of the screw rod 20, the laser displacement sensor 2 is driven to move synchronously through the suspension rod 22, and the detection position of the laser displacement sensor 2 above a silicon wafer is changed.
A motor 24 is installed on one side of the upright post 19 far away from the screw rod 20, and an output shaft of the motor 24 is connected with the screw rod 20. The motor 24 may alternatively be a stepper motor. A shaft hole (not shown) for the output shaft of the motor 24 to pass through is formed on the column body of the upright column 19, and the output shaft of the motor 24 can rotate in the shaft hole.
The working principle of the utility model is that, when in use, a silicon wafer to be detected is placed in the detection groove 3, one side of the silicon wafer is tightly attached to the surface of the clamp plate two 25, the screw rod two 17 is screwed to enable the silicon wafer to be in thread fit with the fixed block 16, the end part of the rod part of the screw rod two 17 rotates on the shaft seat two 18 on the barrel body of the sleeve 11, the sleeve 11 is pushed to slide in the chute 10, so as to drive the clamp plate one 15 to move synchronously through the connecting rod 14, the clamp plate one 15 is adjusted to a proper height, the screw rod one 7 is screwed to enable the screw rod to be in thread fit with the vertical plate 5, meanwhile, the end part of the rod part of the screw rod one 7 rotates on the shaft seat one 9 on the surface of the movable plate 6, under the limiting action of the telescopic rod one 8, so as to push the movable plate 6, the sleeve 11 and the clamp plate one 15 to move towards the other side of the silicon wafer and gradually attach tightly, in the process, so that the slide block 12 compresses the spring 13 in the sleeve 11 to buffer the impact of the silicon chip side wall from the clamping plate one 15 and avoid damaging the silicon chip. After the silicon chip is fixed, the output shaft of the control motor 24 drives the screw rod 20 to rotate, under the mutual screw action of the nut sleeve 21 and the screw rod 20 and the limiting action of the second telescopic rod 23, the nut sleeve 21 moves in the axial direction of the screw rod 20, so that the laser displacement sensor 2 is driven to move synchronously through the suspender 22, the detection position of the laser displacement sensor 2 above the silicon chip is changed, and the surface of the silicon chip is detected. And after the silicon wafer is detected, the screw rod I7 is reversely screwed to enable the clamping plate I15 to be far away from the silicon wafer, and then the silicon wafer is taken down from the detection groove 3.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (7)
1. A flatness detection device for the surface of a solar cell silicon wafer comprises a bearing plate for bearing the solar cell silicon wafer and a laser displacement sensor which is suspended above the bearing plate and used for detecting the flatness of the surface of the solar cell silicon wafer, and is characterized in that a detection groove is formed in the top of the bearing plate, a clamping assembly is arranged in the detection groove and comprises a vertical plate, a movable plate is arranged on one side of the vertical plate in parallel, a first screw rod is inserted into the plate body of the vertical plate in a threaded manner, the end part of one rod part of the first screw rod is rotatably connected with the corresponding side wall of the movable plate, the vertical plate is connected with the movable plate through a first telescopic rod, a chute is vertically formed in one side of the movable plate, which is far away from the vertical plate, a sleeve which is vertical to the chute is slidably connected in the chute, and an opening is formed in one end, a sliding block is connected in the opening in a sliding manner, one side of the sliding block is elastically connected with the corresponding cylinder wall of the sleeve through a spring, and the other opposite side of the sliding block is connected with a first clamping plate parallel to the moving plate through a connecting rod; the top of one side, far away from the vertical plate, of the moving plate is provided with a fixed block, a second screw rod is inserted into the fixed block in a threaded mode, and the end portion of the second rod portion of the second screw rod is rotatably connected with the corresponding side wall of the sleeve.
2. The flatness detecting device for the surface of a solar cell silicon wafer as claimed in claim 1, wherein a first shaft seat is arranged on one side of the moving plate close to the first screw rod, a first bearing is installed inside the first shaft seat, and the end part of the rod part of the first screw rod is in key connection with the inner ring of the first bearing.
3. The flatness detecting device for the surface of a solar cell silicon wafer as claimed in claim 1, wherein a second shaft seat is arranged on one side of the sleeve close to the second screw rod, a second bearing is arranged inside the second shaft seat, and the end part of the rod part of the second screw rod is in key connection with the inner ring of the second bearing.
4. The flatness detecting device for the surface of a silicon wafer of a solar cell according to claim 1, wherein a cushion pad is laid at the bottom of the detecting groove.
5. The flatness detecting apparatus for the silicon wafer surface of a solar cell according to claim 1, wherein a second clamping plate corresponding to the first clamping plate is disposed at one end of the detecting groove away from the clamping assembly.
6. The flatness detecting device for the surface of a solar cell silicon wafer as claimed in claim 1, wherein a vertical column is disposed on the top of the loading plate on one side of the detecting groove, a screw rod perpendicular to the vertical column is rotatably connected to the vertical column, a nut sleeve is screwed on a rod body of the screw rod, the nut sleeve and the vertical column are further connected through a second telescopic rod, and the laser displacement sensor is mounted at the bottom of the nut sleeve through a suspension rod.
7. The flatness detecting device for the surface of a solar cell silicon wafer according to claim 6, wherein a motor is installed on one side of the upright column away from the screw rod, and an output shaft of the motor is connected with the screw rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020931457.5U CN212133592U (en) | 2020-05-28 | 2020-05-28 | Flatness detection device for surface of solar cell silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020931457.5U CN212133592U (en) | 2020-05-28 | 2020-05-28 | Flatness detection device for surface of solar cell silicon wafer |
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| Publication Number | Publication Date |
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| CN212133592U true CN212133592U (en) | 2020-12-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202020931457.5U Expired - Fee Related CN212133592U (en) | 2020-05-28 | 2020-05-28 | Flatness detection device for surface of solar cell silicon wafer |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113787001A (en) * | 2021-08-28 | 2021-12-14 | 黄娜 | Self-cleaning formula lithium ion battery that can reduce error makes with bulging detection device |
| CN114280631A (en) * | 2021-12-24 | 2022-04-05 | 宁夏中欣晶圆半导体科技有限公司 | Silicon wafer BMD auxiliary positioning device and silicon wafer BMD measuring method |
| CN114710103A (en) * | 2022-06-02 | 2022-07-05 | 浙江晴天太阳能科技股份有限公司 | Photovoltaic module installation method capable of accurately identifying optimal installation angle |
| CN116967150A (en) * | 2023-09-25 | 2023-10-31 | 万华化学集团股份有限公司 | Silicon wafer flatness detection device and silicon wafer thickness sorting system |
-
2020
- 2020-05-28 CN CN202020931457.5U patent/CN212133592U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113787001A (en) * | 2021-08-28 | 2021-12-14 | 黄娜 | Self-cleaning formula lithium ion battery that can reduce error makes with bulging detection device |
| CN114280631A (en) * | 2021-12-24 | 2022-04-05 | 宁夏中欣晶圆半导体科技有限公司 | Silicon wafer BMD auxiliary positioning device and silicon wafer BMD measuring method |
| CN114710103A (en) * | 2022-06-02 | 2022-07-05 | 浙江晴天太阳能科技股份有限公司 | Photovoltaic module installation method capable of accurately identifying optimal installation angle |
| CN114710103B (en) * | 2022-06-02 | 2022-10-04 | 浙江晴天太阳能科技股份有限公司 | Photovoltaic module installation method capable of accurately identifying optimal installation angle |
| CN116967150A (en) * | 2023-09-25 | 2023-10-31 | 万华化学集团股份有限公司 | Silicon wafer flatness detection device and silicon wafer thickness sorting system |
| CN116967150B (en) * | 2023-09-25 | 2024-02-02 | 万华化学集团股份有限公司 | Silicon wafer flatness detection device and silicon wafer thickness sorting system |
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Granted publication date: 20201211 Termination date: 20210528 |