CN212095738U - Diamond grinding and polishing processing equipment - Google Patents

Abstract

The utility model discloses a diamond burnishing and polishing processing equipment belongs to burnishing and polishing production technical field. Comprises an upper clamping disc, a polishing disc and a humidity control module communicated between the upper clamping disc and the polishing disc; the top end of the upper clamping plate is provided with a hydraulic lifting device, and the hydraulic lifting device is controlled by a single chip microcomputer system to drive the upper clamping plate to be lifted; the polishing disk is a transparent polishing disk made of a nano polycrystalline diamond material and is fixed on a polishing machine base provided with a power device; the humidity control module sprays gas to change the humidity environment of a grinding processing interface by nitrogen mixed with humidity through vent holes arranged around the upper clamping disc in the diamond grinding processing process. The device is simple and high in flexibility, the surface or point needing to be polished can be changed by rotating the steel ball carrying the diamond, the degree of freedom is high, the diamond is not damaged by a bonding mode, polishing points can be flexibly bonded and selected, and the practicability and the repeatability are improved.

Description

Diamond grinding and polishing processing equipment

Technical Field

The utility model relates to an industry burnishing and polishing production technical field, concretely relates to diamond burnishing and polishing processing equipment.

Background

The technology of polishing diamond has been developed for centuries, and the most common method is to polish with a cast iron millstone in combination with lubricating oil (polishing agent) and diamond powder.

With the development of material science synthesis technology, nano polycrystalline diamond which is harder than diamond can be artificially synthesized, and with the exploration of processing application of diamond-like carbon materials, the diamond is found to be sensitive to humidity environment atmosphere, particularly in the friction process, the visual observation of polishing conditions cannot be guaranteed, but the polishing quality of a diamond crystal face can be observed by using a polishing disc which is high in quality and transparent.

The prior method and equipment for polishing diamond are low in efficiency and unstable, and simultaneously, the chemical polishing agent and the like used in the prior chemical polishing have the defect that chemical components such as phosphoric acid, nitric acid, acetic acid and the like have unfriendliness to the environment.

In view of the above-mentioned prior art, an efficient diamond polishing device and process are yet to be developed.

Disclosure of Invention

Therefore, the utility model provides a diamond burnishing and polishing processing equipment to solve the diamond burnishing and polishing's that provides problem in the above-mentioned background art.

In order to achieve the above object, the present invention provides the following technical solutions:

a diamond grinding and polishing processing device comprises an upper clamping disc, a polishing disc and a humidity control module, wherein the upper clamping disc and the polishing disc correspond to each other, and the humidity control module is communicated with the upper clamping disc and the polishing disc; wherein the content of the first and second substances,

the top end of the upper clamping plate is provided with a hydraulic lifting device, and the hydraulic lifting device is controlled by a single chip microcomputer system to drive the upper clamping plate to be lifted;

the polishing disk is a transparent polishing disk made of a nano polycrystalline diamond material and is fixed on a polishing machine base provided with a power device;

the humidity control module sprays gas to the nitrogen mixed with humidity through the vent holes arranged around the upper clamping disc in the diamond grinding process to change the humidity environment of the grinding interface.

On the basis of the above scheme, the utility model discloses still can make following improvement:

further, the polishing disc is a transparent diamond grinding disc directly synthesized by onion carbon nano particles (with the diameter of 20-50 nm) at the temperature of 18-25GPa, 1850-;

and a round hole fixed with a power rod of the power device is formed in the middle of the polishing disk.

Furthermore, a sample loading table is fixed at the bottom end of the polishing disc, a straight groove is formed in a circular base of the sample loading table, a hole is formed in the center of the straight groove, and the power rod penetrates through the hole from the circular base to be matched with the polishing disc;

and in-situ microscopic cameras are respectively arranged at two ends of the straight groove.

Furthermore, the upper clamping plate is provided with hemispherical grooves, and six vent holes which can be filled with humidity gas are uniformly formed around each hemispherical groove.

Furthermore, the diamond carrier corresponding to the upper clamping plate is a steel ball, the steel ball is polished to form a circular plane on the surface, the diamond to be polished is fixed through the circular plane, the other end face of the crystal face of the diamond to be polished and the other end face of the diamond structure, which are axially symmetrical, is selected, the other end face of the diamond is bonded on the circular plane ground by the steel ball through glue, other bonding agents are used for carrying out wrapping type bonding on the periphery of the diamond (except the crystal face to be processed), and the steel ball is fixed in the hemispherical groove of the upper clamping plate through an electromagnetic adsorption method.

Further, the humidity control module comprises a nitrogen box and a cavity of deionized water;

and introducing dry nitrogen transmitted by the nitrogen box into the cavity with the deionized water to form humidity gas.

Further, the humidity control module further comprises a humidity mixing chamber;

humidity control lets in the cavity that has the deionized water respectively through dry nitrogen gas and gets into humidity mixing chamber and directly get into humidity mixing chamber, mixes two strands of gas at humidity mixing chamber, shows humidity on humidity meter and the humidity display of humidity mixing chamber, lets in the intake pipe that is linked together with the air vent when reaching required humidity, and gas is sprayed at the air vent and is changed the processing interface department humidity of polishing and influence the polishing interface environment of polishing.

The utility model has the advantages of as follows:

1. the device is simple and high in flexibility, the surface or point needing to be polished can be changed by rotating the steel ball carrying the diamond, the degree of freedom is high, the diamond is not damaged by a bonding mode, polishing points can be flexibly bonded and selected, and the practicability and the repeatability are improved.

2. The single chip microcomputer controls the hydraulic lifting and the applied pressure, the running stability of the device is guaranteed, and the usability is improved.

3. The polishing solution is replaced by humidity, so that the influence on the environment is greatly reduced, high-efficiency polishing is realized by a scientific theory, and the utilization rate of the scientific theory and chemical polishing is improved.

4. The novel nano polycrystalline diamond sheet is used as a polishing disc, so that the utilization rate and polishing efficiency of the polishing disc are improved, and the polishing quality of the diamond with higher grade is ensured.

Drawings

In order to clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, and the structures, proportions, sizes, etc. shown in the present specification are only used to match the contents disclosed in the specification, so as to be understood and read by those skilled in the art, and any modifications of the structures, changes of the proportion relations, or adjustments of the sizes, should still fall within the scope of the technical contents disclosed in the present invention without affecting the functions and the achievable objects of the present invention.

Fig. 1 is a schematic overall structure diagram of an embodiment of the present invention;

FIG. 2 is a schematic diagram illustrating a bonding state of diamond according to an embodiment of the present invention;

fig. 3 is a schematic diagram of a position structure of an in-situ micro-camera according to an embodiment of the present invention;

FIG. 4-1 is a schematic view of an upper chuck according to an embodiment of the present invention;

fig. 4-2 is a second schematic structural view of the upper chuck plate according to the embodiment of the present invention;

FIG. 5 is a schematic diagram of an arrangement of a humidity mixing chamber according to an embodiment of the present invention;

fig. 6 is a schematic structural view of the humidity vent according to an embodiment of the present invention.

In the drawings, the components represented by the respective reference numerals are listed below:

1-upper chuck, 2-lower sample table, 3-hydraulic lifting device, 4-air inlet pipe, 5-lower sample table, 6-revolution meter, 7-hydraulic lifting meter, 8-power button, 9-glass cover, 10-fastening screw hole, 11-in-situ micro camera, 12-air vent, 13-hemispherical groove, 14-nitrogen box, 15-cavity with deionized water, 16-humidity meter and humidity display.

Detailed Description

The present invention is described in terms of specific embodiments, and other advantages and benefits of the present invention will become apparent to those skilled in the art from the following disclosure. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1-6, an embodiment of the present invention provides a diamond grinding and polishing processing device, which includes an upper chuck plate 1, a lower sample table 2, a polishing plate, and a humidity control module, wherein the upper chuck plate 1 is controlled by a single chip microcomputer device to ascend and descend; the polishing disk is a transparent polishing disk made of a nano polycrystalline diamond material, and a circular hole in the center of the polishing disk is fixed on a polishing machine base with a power device; the humidity control module is used for spraying gas to change the humidity environment of a grinding processing interface in the diamond grinding processing process by nitrogen mixed with humidity through the vent holes 12 around the upper clamping disc 1, and the vent holes 12 are used for spraying nitrogen containing humidity so as to change the physical and chemical effects of a friction interface. The specific settings are as follows:

the polishing disk is a transparent diamond polishing disk directly synthesized by onion carbon nano particles (with the diameter of 20-50 nm) in the environment of 18-25GPa, 1850-.

Specifically, the polishing disc is fixedly arranged on the lower sample stage 2, a straight groove passing through the circle center is formed in the circular base of the lower sample stage 2, the power shaft is arranged in the circle center of the circular base, the two ends of the straight groove are respectively provided with one in-situ micro camera 11, and the in-situ micro camera 11 can directly observe the polishing condition of the diamond surface through the transparent polishing disc during polishing of the polishing disc.

Referring to fig. 4-1 and 2, the upper chuck 1 is provided with a plurality of hemispherical recesses 13, and six ventilation holes 12 for allowing the humidity-containing gas to flow therein are uniformly formed around each hemispherical recess 13.

The diamond carrier corresponding to the upper clamping plate 1 is a steel ball, the steel ball is polished to form a circular plane with a size larger than that of a diamond crystal face to be polished on the surface, the diamond to be polished is fixed through the circular plane, the other end face of the diamond crystal face to be polished and the other end face of the diamond structure which is axially symmetrical are selected, the other end face of the diamond is bonded on the circular plane ground by the steel ball through glue in the first step, other bonding agents are used for fixing and bonding the periphery of the diamond (except the crystal face to be processed) again in the second step, and finally, the bottom of the steel ball is fixed in the hemispherical groove 13 through the hemispherical groove 13 on the upper clamping plate 1 by means of an electromagnetic adsorption method.

The top of facial make-up chuck 1 is equipped with hydraulic pressure elevating gear 3, realizes facial make-up chuck 1 liftable by single chip microcomputer system control hydraulic pressure elevating gear 3, and then realizes the dress of the sample of polishing and gets through going up and down to and improve the contact quality between diamond face and the polishing dish on facial make-up chuck 1.

The humidity control module comprises a nitrogen box 14, a deionized water cavity 15 and a humidity mixing chamber, wherein the humidity gas is formed by introducing dry nitrogen transmitted by the nitrogen box 14 into the deionized water cavity 15, the humidity control is that the dry nitrogen is introduced into the deionized water cavity 15 respectively and enters the humidity mixing chamber and directly enters the humidity mixing chamber, two gas streams are mixed in the humidity mixing chamber, the humidity is displayed on a humidity meter and a humidity display 16 of the humidity mixing chamber, when the required humidity is reached, the dry nitrogen is introduced into an air inlet pipe 4 communicated with a vent hole 12, the gas is sprayed out from the vent hole 12 to change the humidity at a grinding processing interface so as to influence the grinding environment of a polishing interface, as the diamond material is sensitive to the humidity atmosphere environment, and different water molecules can form carbon-hydrogen bonds with different masses on a diamond surface, so that the grinding and polishing can utilize the characteristic and perform chemical sensitivity on the grinding process, the grinding and polishing quality can be controlled by controlling the humidity between the diamond and the grinding disc.

In order to avoid the influence of external gas flow in the grinding process, a glass cover 9 is arranged around the grinding and polishing (the upper clamping disc 1 and the polishing disc) of the equipment for protection.

The base of the polishing machine is also provided with a revolution meter 6 connected with a power device and a hydraulic lifting meter 7 connected with the hydraulic lifting device 3 respectively, so that the revolution condition of the polishing disc can be observed more visually through the revolution meter 6, and the lifting condition of the upper clamping disc 1 can be observed more visually through the hydraulic lifting meter 7.

And the polishing machine base is also provided with a power button 8 electrically connected with a power supply.

The upper clamping plate 1 is also provided with a fastening screw hole 10 which is matched with an external bolt and used for stably mounting the upper clamping plate 1 at the output end of the hydraulic lifting device 3.

For those skilled in the art, based on the teachings of the present invention, changes, modifications, substitutions and variations can be made to the embodiments without departing from the principles and spirit of the invention.

Claims (7)

1. The utility model provides a diamond burnishing and polishing processing equipment which characterized in that: the polishing machine comprises an upper clamping disc, a polishing disc and a humidity control module, wherein the upper clamping disc and the polishing disc are corresponding to each other, and the humidity control module is communicated with the upper clamping disc and the polishing disc; wherein the content of the first and second substances,

the top end of the upper clamping plate is provided with a hydraulic lifting device, and the hydraulic lifting device is controlled by a single chip microcomputer system to drive the upper clamping plate to be lifted;

the polishing disk is a transparent polishing disk made of a nano polycrystalline diamond material and is fixed on a polishing machine base provided with a power device;

the humidity control module sprays gas to the nitrogen mixed with humidity through the vent holes arranged around the upper clamping disc in the diamond grinding process to change the humidity environment of the grinding interface.

2. The diamond grinding and polishing processing device as claimed in claim 1, wherein the polishing disc is a transparent diamond grinding disc directly synthesized by onion carbon nanoparticles with a diameter of 20-50nm at 18-25GPa, 1850-;

and a round hole fixed with a power rod of the power device is formed in the middle of the polishing disk.

3. The diamond grinding and polishing processing device as claimed in claim 2, wherein a lower sample-loading table is fixed at the bottom end of the polishing disc, a straight groove is formed in a circular base of the lower sample-loading table, a hole is formed in the center of the straight groove, and the power rod penetrates through the hole from the circular base to be matched with the polishing disc;

and in-situ microscopic cameras are respectively arranged at two ends of the straight groove.

4. A diamond grinding and polishing processing device as claimed in claim 1, wherein said upper chuck plate is formed with hemispherical recesses, and six ventilation holes are uniformly formed around each of said hemispherical recesses for allowing the introduction of a moisture-containing gas.

5. The diamond grinding and polishing processing device as claimed in claim 1, wherein the diamond carrier corresponding to the upper clamping plate is a steel ball, the steel ball is ground to form a circular plane on the surface, the diamond to be ground and polished is fixed through the circular plane, the other end face of the crystal face of the diamond to be ground and the other end face of the diamond structure which is axially symmetrical are selected, the other end face of the diamond is bonded on the circular plane ground by the steel ball through glue, other bonding agents are used for wrapping and bonding the periphery of the crystal face of the diamond which does not need to be processed, and the steel ball is fixed in the hemispherical groove of the upper clamping plate through an electromagnetic adsorption method.

6. The diamond grinding and polishing processing device as claimed in claim 1, wherein the humidity control module comprises a nitrogen gas tank and a cavity of deionized water;

and introducing dry nitrogen transmitted by the nitrogen box into the cavity with the deionized water to form humidity gas.

7. The diamond grinding and polishing processing device as set forth in claim 1, wherein the humidity control module further comprises a humidity mixing chamber;

humidity control lets in the cavity that has the deionized water respectively through dry nitrogen gas and gets into humidity mixing chamber and directly get into humidity mixing chamber, mixes two strands of gas at humidity mixing chamber, shows humidity on humidity meter and the humidity display of humidity mixing chamber, lets in the intake pipe that is linked together with the air vent when reaching required humidity, and gas is sprayed at the air vent and is changed the processing interface department humidity of polishing and influence the polishing interface environment of polishing.

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