CN212084555U

CN212084555U - Display panel and display device

Info

Publication number: CN212084555U
Application number: CN202021115857.5U
Authority: CN
Inventors: 张云鹏
Original assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Priority date: 2020-06-16
Filing date: 2020-06-16
Publication date: 2020-12-04
Anticipated expiration: 2030-06-16

Abstract

The utility model relates to a show technical field, provide a display panel and display device. The display panel includes a protective layer at the bonding region; the organic layer is arranged on the protective layer; the first binding pin is arranged on the organic layer; the flexible circuit board is arranged on the first binding pin and comprises a substrate, a second binding pin and an insulating layer, wherein the second binding pin and the insulating layer are arranged below the substrate; the one side of keeping away from the substrate of the tip of pin is bound to the second of insulating layer and the one side of keeping away from the protective layer of the tip of organic layer of keeping away from first binding pin support and lean on, and the thickness of insulating layer is greater than the thickness of first binding pin and the thickness sum of pin is bound to the second, and the thickness of the tip of keeping away from the display area of protective layer is less than the remaining thickness of protective layer, makes insulating layer and organic layer support and supports the back, and organic layer and protective layer can be crooked. The display panel can not generate a short circuit phenomenon, and can also prevent the first binding pin from peeling off the organic layer.

Description

Display panel and display device

Technical Field

The utility model relates to a show technical field, especially relate to a display panel and display device including this display panel.

Background

At present, in the manufacturing process of the display panel, the display panel is cut by laser cutting, such as CO₂Laser and Fento laser. During the cutting process, the cutting edge is carbonized due to the heating of PI (Polyimide) to form a layer of conductive carbide on the panel edge.

After the display panel is bound with the circuit board, the carbide can contact with the circuit board to cause short circuit; but also causes the binding pins of the display panel to peel off the display panel, resulting in poor contact and thus affecting the display effect.

Therefore, it is necessary to research a new display panel and a display device including the same.

The above information disclosed in the background section is only for enhancement of understanding of the background of the present disclosure and therefore it may contain information that does not constitute prior art that is known to a person of ordinary skill in the art.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome above-mentioned prior art's easy short circuit and contact failure not enough, provide a display panel and including this display panel's display device of difficult short circuit and contact failure.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

According to an aspect of the present disclosure, there is provided a display panel including a display area and a bonding area located at a periphery of the display area, the display panel including at the bonding area:

a protective layer;

the organic layer is arranged on the protective layer;

the first binding pin is arranged on one side of the organic layer far away from the protective layer;

the flexible circuit board is arranged on one side, far away from the protective layer, of the first binding pin and comprises a substrate, and a second binding pin and an insulating layer which are arranged on one side, close to the first binding pin, of the substrate, and the second binding pin is in binding connection with the first binding pin;

one surface, close to the end portion of the second binding pin, of the insulating layer, far away from the substrate is abutted against one surface, far away from the protective layer, of the end portion, far away from the first binding pin, of the organic layer, the thickness of the insulating layer is larger than the sum of the thickness of the first binding pin and the thickness of the second binding pin, the thickness of the protective layer, far away from the end portion of the first binding pin, of the protective layer is smaller than the thickness of the rest portion of the protective layer, and therefore after the insulating layer is abutted against the organic layer, the organic layer and the protective layer can be bent.

In an exemplary embodiment of the present disclosure, a side of the protective layer away from the organic layer is provided as a step surface.

In an exemplary embodiment of the present disclosure, the step surface includes one step.

In an exemplary embodiment of the present disclosure, a height of the step is greater than or equal to a difference between a thickness of the insulating layer and a sum of a thickness of the first bonding pin and a thickness of the second bonding pin.

In an exemplary embodiment of the disclosure, a width of the step is greater than or equal to a width of the insulating layer abutting against the organic layer, and is less than or equal to a distance between an edge of the first bonding pin on a side away from the display area and an edge of the protective layer on a side away from the display area.

In an exemplary embodiment of the present disclosure, a width of the insulating layer abutting the organic layer is greater than a width of carbide sputtering formed when the organic layer is laser cut.

In an exemplary embodiment of the present disclosure, a width of the carbide sputter formed when the organic layer is laser-cut is 20 micrometers or more and 100 micrometers or less.

In an exemplary embodiment of the present disclosure, an end of a side of the protective layer, which is away from the organic layer, which is away from the display area is provided as an inclined surface.

In an exemplary embodiment of the present disclosure, a side of the protection layer away from the organic layer is provided as a step surface, the step surface includes a step, and one or both of two connection surfaces of the step are provided as inclined surfaces.

According to an aspect of the present disclosure, there is provided a display device including: the display panel of any one of the above.

According to the above technical scheme, the utility model discloses possess at least one in following advantage and the positive effect:

the utility model discloses a display panel, the one side of keeping away from the substrate of the tip of pin is bound to the second of being close to of insulating layer and the one side of keeping away from the protective layer of the tip of first binding pin of keeping away from of organic layer support and lean on, make the insulating layer cover the cutting border of organic layer, the carbide that the organic layer of cutting formed can not contact with the circuit board, can not produce short circuit phenomenon. The thickness of the tip of keeping away from the display area of protective layer is less than the thickness of protective layer rest part, makes the intensity of the structure that protective layer and organic layer formed reduce to make insulating layer and organic layer support by the back, under the extrusion force of insulating layer, organic layer and protective layer can be crooked, avoid first binding the pin and peel off organic layer.

Drawings

The above and other features and advantages of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings.

FIG. 1 is a schematic view of a display panel with poor contact in the related art;

FIG. 2 is a schematic diagram of a related art display panel with short circuits;

FIG. 3 is a schematic view of the flexible circuit board of FIG. 2 after bending;

fig. 4 is a schematic structural diagram of an exemplary embodiment of a display panel according to the present invention;

FIG. 5 is a schematic diagram of the dimensional relationship of the display panels of FIG. 4 when they are not bonded;

fig. 6-9 are schematic structural views of further example embodiments of protective layers.

The reference numerals of the main elements in the figures are explained as follows:

1. a protective layer;

2. an organic layer; 21. carbide;

3. a first binding pin; 4. a substrate; 5. a second binding pin; 6. an insulating layer; 7. a back plate.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted.

Referring to fig. 1, a schematic structural diagram of a display panel in the related art that causes a contact failure is shown, in the related art, a flexible circuit board includes a substrate 4, a metal conductive layer disposed on the substrate 4, and an insulating layer 6 disposed on the metal conductive layer, a portion of the metal conductive layer is not covered by the insulating layer 6 to form a bare metal trace, and a second bonding pin 5 is disposed at an end of the metal trace. After the second binding pin 5 is bound with the first binding pin 3, the insulating layer 6 covers the organic layer 2, and because the thickness of the insulating layer 6 is greater than the sum of the thickness of the first binding pin 3 and the thickness of the second binding pin 5, the first binding pin 3 is easily peeled off the organic layer 2 under the supporting action of the insulating layer 6, so that poor contact is caused, and the display effect is influenced.

Referring to fig. 2 and 3, which are schematic structural diagrams illustrating a short circuit occurring in a display panel in the related art, after the second bonding pin 5 is bonded to the first bonding pin 3, the insulating layer 6 does not cover the organic layer 2, but has a certain distance from the edge of the organic layer 2, and the first bonding pin 3 does not peel off the organic layer 2 due to the fact that the thickness of the insulating layer 6 is greater than the sum of the thickness of the first bonding pin 3 and the thickness of the second bonding pin 5; however, after the flexible circuit board is bent, the exposed metal wires on the flexible circuit board can contact with the carbide 21 generated by cutting the organic layer 2, so that the metal wires are short-circuited, and the burn problem is caused; the carbide 21 can be manually removed, but this results in waste of resources and is inefficient.

The present exemplary embodiment first provides a display panel, referring to fig. 4, which illustrates a schematic structural diagram of the display panel of the present invention, the display panel may include a display area and a binding area located at a periphery of the display area, where the display panel may include a protective layer 1, an organic layer 2, a first binding pin 3, and a flexible circuit board; the organic layer 2 is arranged on the protective layer 1; the first binding pin 3 is arranged on one side of the organic layer 2, which is far away from the protective layer 1; the flexible circuit board is arranged on one side, far away from the protective layer 1, of the first binding pin 3 and comprises a substrate 4, and a second binding pin 5 and an insulating layer 6 which are arranged on one side, close to the first binding pin 3, of the substrate 4, wherein the second binding pin 5 is in binding connection with the first binding pin 3; wherein, the surface of the insulating layer 6 close to the end of the second binding pin 5 far away from the substrate 4 abuts against the surface of the organic layer 2 far away from the end of the first binding pin 3 far away from the protective layer 1, the thickness H3 of the insulating layer 6 is greater than the sum of the thickness H1 of the first binding pin 3 and the thickness H2 of the second binding pin 5, and the thickness of the protective layer 1 far away from the end of the first binding pin 3 is less than the thickness of the rest part of the protective layer 1, so that after the insulating layer 6 abuts against the organic layer 2, the organic layer 2 and the protective layer 1 can be bent.

Referring to fig. 4, in the present exemplary embodiment, the material of the protection layer 1 may be PET (Polyethylene terephthalate). On top of the protective layer 1 an organic layer 2 is arranged, which organic layer 2 may be polyimide, transparent polyimide or plastic or the like, the edges of the organic layer 2 being formed with carbides 21 due to laser cutting. A back plate 7 formed by an array substrate, a light emitting layer, a color film substrate and the like is arranged in the display region of the organic layer 2. A binding region is arranged on the periphery of the display region of the organic layer 2, a first binding pin 3 is arranged in the binding region, and the first binding pin 3 is positioned on one side, far away from the protective layer 1, of the organic layer 2.

Referring to fig. 5, the schematic diagram of the dimension relationship structure when the display panels of the present invention are not bound together, the flexible circuit board in the figure is moved downward to form fig. 4, that is, the dimension label in fig. 5 is the same as the dimension label after binding. The surface of the protective layer 1, which is far away from the organic layer 2, is set to be a step surface, and the plane where the protective layer 1 and the organic layer 2 are combined is a plane, so that the thickness of the end part, which is far away from the first binding pin 3, of the protective layer 1 is smaller than the thickness of the rest part of the protective layer 3, where the thickness of the rest part refers to that the thickness of the protective layer 3 in the binding region is the same relative to the thickness of the protective layer 3 in the binding region in the prior art. The step surface can be formed by a U-lami process or laser cutting. The U-Lami process is to separate the area of the protective film 1 to be removed independently, the adhesive force is low, the protective film is consistent with a normal protective film in normal film pasting and process, namely, a tearable protective film can be arranged on the end part of the protective film 1 far away from the first binding pin 3 independently, the adhesive force of the tearable protective film is low, and the tearable protective film can be removed before binding by adopting an A-Lami process, namely, the tearable protective film is directly torn off. The thickness of the protective film is made zero here.

The step surface may comprise a step, having a height difference that is considered a step. Specifically, the height H of the step is greater than or equal to the difference between the thickness H3 of the insulating layer 6 and the sum of the thicknesses H1 of the first bonding pins 3 and the thicknesses H2 of the second bonding pins 5 (H ≧ H3-H1-H2), and the thickness H1 of the first bonding pins 3 refers to the distance between the face of the first bonding pins 3 away from the passivation layer 1 and the face of the organic layer 2 away from the passivation layer 1, in the present exemplary embodiment, the first bonding pins 3 protrude from the organic layer 2, and therefore, H1 is a positive value; however, in other exemplary embodiments, the first bonding pin 3 is recessed within the organic layer 2, and H1 has a negative value. The width L of the step is greater than or equal to the width L2 of the insulating layer 6 abutting against the organic layer 2, that is, the width L of the step is greater than or equal to the distance L2 between the edge of the insulating layer 6 close to the second bonding pin 5 and the edge of the organic layer 2 far from the first bonding pin 3; and the width L of the step is less than or equal to the distance L1 between the edge of the first bonding pin 3 far away from the display area and the edge of the first protection layer 1 far away from the display area (L1 is more than or equal to L2).

Referring to fig. 4, in the present exemplary embodiment, the flexible circuit board may be a single-layer chip on film, and the flexible circuit board is disposed on a side of the first bonding pins 3 away from the passivation layer 1. The flexible circuit board may include a substrate 4, a metal conductive layer disposed at a side of the substrate 4 adjacent to the first binding pins 3, and an insulating layer 6 disposed at a side of the metal conductive layer adjacent to the first binding pins 3. The substrate 4 may be an organic material, such as polyimide, plastic, or the like. The material of the insulating layer 6 may be epoxy resin. The part of the metal conductive layer is not covered by the insulating layer 6 to form a bare metal wire, and a second binding pin 5 is arranged at the end part of the metal wire.

After the second bonding pin 5 and the first bonding pin 3 of the chip on film are bonded, one surface, which is far away from the substrate 4, of the end part of the insulating layer 6, which is close to the second bonding pin 5 is abutted against one surface, which is far away from the protective layer 1, of the end part of the organic layer 2, which is far away from the first bonding pin 3, and the abutting width of the insulating layer 6 and the organic layer 2 is larger than the sputtering width of the carbide 21 formed when the organic layer 2 is cut by laser, wherein the width is about 20 micrometers to 50 micrometers, and the maximum width is not more than 100 micrometers; the insulating layer 6 covers the cutting edge of the organic layer 2, and the carbide 21 formed by cutting the organic layer 2 will not contact with the circuit board, and will not generate short circuit.

Bind the back, because the thickness of insulating layer 6 is greater than the first thickness of binding pin 3 and the thickness sum of binding pin 5 of second, and the thickness on border of protective layer 1 reduces, the intensity that makes the structure that protective layer 1 and organic layer 2 formed reduces, the bending force is little, release stress is little after the bending, so that insulating layer 6 supports with organic layer 2 and leans on the back, under the extrusion force effect of insulating layer 6, organic layer 2 and protective layer 1 can be crooked, the insulating layer is not compressed, can not make first binding pin 3 after the stress release peel off organic layer 2, can not influence the display effect.

In other exemplary embodiments of the present invention, the disposition of the protection layer 1 is not limited to the above description, and as shown in fig. 6 to 9, an end portion of the side of the protection layer 1 away from the organic layer 2, which is away from the display area, may be disposed as an inclined surface, and a width of the inclined surface may be greater than a distance L1 between an edge of the first bonding pin 3 on the side away from the display area and an edge of the first protection layer 1 on the side away from the display area. The surface of the protective layer 1 away from the organic layer 2 may also be a step surface, and the step surface may include a step, but both connection surfaces of the step surface may be inclined surfaces or a certain surface may be inclined surfaces. Of course, the step surface may include a plurality of steps, and the farther from the display region, the steps are sequentially adjacent to the organic layer. As long as it is possible to make the organic layer 2 and the protective layer 1 bendable under the pressing force of the insulating layer 6, that is, the force required to thin the protective layer 1 to bend the organic layer 2 and the protective layer 1 is smaller than the force required to peel off the organic layer 2 from the first bonding pins 3.

The one side of keeping away from the substrate 4 of the tip of pin 5 is bound to the second of being close to of insulating layer 6 supports with the one side of keeping away from protective layer 1 of the tip of keeping away from first binding pin 3 of organic layer 2 and leans on, makes the cutting border of insulating layer 6 cover organic layer 2, cuts the carbide that organic layer 2 formed and can not contact with the circuit board, can not produce short circuit phenomenon. The thickness of the tip of keeping away from the display area of protective layer 1 is less than the thickness of protective layer 1 rest, makes the intensity of the structure that protective layer 1 and organic layer 2 formed reduce to make insulating layer 6 support with organic layer 2 and lean on the back, under the extrusion force of insulating layer 6, organic layer 2 and protective layer 1 can be crooked, avoid first binding pin 3 to peel off organic layer.

Further, the present exemplary embodiment first provides a display device, which may include any one of the display panels described above. The detailed structure of the display panel has already been described above, and therefore, the detailed description thereof is omitted here.

The specific type of the display device is not particularly limited, and any display device commonly used in the art may be used, specifically, for example, a liquid crystal display, an OLED display, a mobile device such as a mobile phone, a wearable device such as a watch, a VR device, and the like.

It should be noted that the display device includes other necessary components and components besides the display panel, taking the display as an example, specifically, such as a housing, a circuit board, a power line, and the like, and those skilled in the art can supplement the display device accordingly according to the specific use requirements of the display device, and details are not described herein.

Compared with the prior art, the embodiment of the utility model provides a display device's beneficial effect is the same with the beneficial effect of the display panel that above-mentioned embodiment provided, does not do here and describes repeatedly.

The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments, and the features discussed in connection with the embodiments are interchangeable, if possible. In the description above, numerous specific details are provided to give a thorough understanding of embodiments of the invention. One skilled in the relevant art will recognize, however, that the invention may be practiced without one or more of the specific details, or with other methods, components, materials, and so forth. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of the invention.

Although relative terms, such as "upper" and "lower," may be used in this specification to describe one element of an icon relative to another, these terms are used in this specification for convenience only, e.g., in accordance with the orientation of the examples described in the figures. It will be appreciated that if the device of the icon were turned upside down, the element described as "upper" would become the element "lower". When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via another structure.

In this specification, the terms "a", "an", "the" and "the" are used to indicate the presence of one or more elements/components/parts/etc.; the terms "comprising," "including," and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. other than the listed elements/components/etc.; the terms "first," "second," and "third," etc. are used merely as labels, and are not limiting on the number of their objects.

It is to be understood that the invention is not limited in its application to the details of construction and the arrangement of components set forth in the description. The present invention is capable of other embodiments and of being practiced and carried out in a variety of ways. The foregoing variations and modifications fall within the scope of the present invention. It will be understood that the invention disclosed and defined in this specification extends to all alternative combinations of two or more of the individual features mentioned or evident from the text and/or drawings. All of these different combinations constitute various alternative aspects of the present invention. The embodiments set forth herein explain the best modes known for practicing the invention and will enable others skilled in the art to utilize the invention.

Claims

1. A display panel comprising a display area and a bonding area located at a periphery of the display area, wherein the display panel comprises in the bonding area:

a protective layer;

the organic layer is arranged on the protective layer;

2. The display panel according to claim 1, wherein a surface of the protective layer facing away from the organic layer is provided as a step surface.

3. The display panel of claim 2, wherein the step surface comprises a step.

4. The display panel according to claim 3, wherein a height of the step is greater than or equal to a difference between a thickness of the insulating layer and a sum of the thickness of the first and second bonding pins.

5. The display panel according to claim 3, wherein the width of the step is greater than or equal to the width of the insulating layer abutting against the organic layer, and is less than or equal to the distance between the edge of the first bonding pin on the side far away from the display area and the edge of the protective layer on the side far away from the display area.

6. The display panel according to claim 1, wherein a width of the insulating layer abutting against the organic layer is larger than a width of carbide sputtering formed when the organic layer is laser-cut.

7. The display panel according to claim 6, wherein a width of the carbide sputter formed when the organic layer is laser-cut is 20 μm or more and 100 μm or less.

8. The display panel according to claim 1, wherein an end portion of a surface of the protective layer facing away from the organic layer facing away from the display region is provided as an inclined surface.

9. The display panel according to claim 1, wherein a surface of the protective layer facing away from the organic layer is provided as a step surface, the step surface comprises a step, and one or both of two connection surfaces of the step are provided as inclined surfaces.

10. A display device, comprising: the display panel according to any one of claims 1 to 9.