CN212070705U - Dip soldering device for micro sensor chip - Google Patents
Dip soldering device for micro sensor chip Download PDFInfo
- Publication number
- CN212070705U CN212070705U CN202020332883.7U CN202020332883U CN212070705U CN 212070705 U CN212070705 U CN 212070705U CN 202020332883 U CN202020332883 U CN 202020332883U CN 212070705 U CN212070705 U CN 212070705U
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- China
- Prior art keywords
- dip soldering
- base plate
- dip
- sliding
- adjusting frame
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Abstract
The utility model discloses a dip soldering device of microsensor chip, including welded platform, the dip soldering subassembly that automatic dip soldering was realized to the conveying subassembly and the cooperation conveying subassembly that set up on the welded platform, the dip soldering subassembly includes and just installs in the alignment jig of welded platform up end one side as major structure, and with alignment jig clearance fit's movable base plate, a set of tin stove is installed to one side that welded platform's up end was provided with the alignment jig, the bottom both sides of alignment jig are provided with the spliced pole of connecting the direction sill bar, direction sill bar and a set of slide rail sliding fit, movable base plate's bottom is provided with a set of hydraulic telescoping rod who connects mounting substrate, mounting substrate's up end both sides are provided with the locating plate of connecting electric telescopic handle, one side that electric telescopic handle kept away from hydraulic telescoping rod is connected with a set of grip. This dip soldering device of microsensor chip, it is rational in infrastructure, easily realize automatic efficient chip dip soldering, have higher practical value.
Description
Technical Field
The utility model belongs to the technical field of the chip dip-soldering, concretely relates to dip-soldering device of miniature sensor chip.
Background
The dip soldering is a multi-point soldering method which is widely applied to a plug-in process and an SMT red glue surface, a large amount of tin is boiled and melted by hands or machines, and a soldering surface is immersed so as to solder a soldering point. The dip soldering needs to be completed by using a dip soldering machine, and dip soldering work is carried out by manual operation, and the dip soldering machine is a new circuit board welding production device derived from a tin furnace and wave soldering in recent years.
The existing dip soldering device for the micro sensor chip depends on manual operation, is low in automation degree and low in efficiency, cannot realize quick dip soldering and conveying matching, and is poor in applicability.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a dip soldering device of microsensor chip to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a dip soldering device for a micro sensor chip comprises a soldering platform, a conveying assembly arranged on the soldering platform and a dip soldering assembly matched with the conveying assembly to realize automatic dip soldering;
the dip soldering assembly comprises an adjusting frame which is used as a main body structure and is arranged on one side of the upper end face of the soldering platform, and a movable base plate which is movably matched with the adjusting frame, wherein a group of tin furnaces are arranged on one side, provided with the adjusting frame, of the upper end face of the soldering platform, connecting columns connected with guide bottom rods are arranged on two sides of the bottom end of the adjusting frame, and the guide bottom rods are in sliding fit with a group of sliding rails;
the bottom of activity base plate is provided with a set of hydraulic telescoping rod who connects mounting substrate, mounting substrate's up end both sides are provided with the locating plate of connecting electric telescopic handle, one side that electric telescopic handle kept away from hydraulic telescoping rod is connected with a set of grip block, the bottom of grip block extends to tin stove direction, and sets up the adjustment tank that supplies the grip block activity to adjust on the mounting substrate.
Preferably, the conveying assembly comprises two groups of conveying belts, the upper end face of the welding platform is provided with two groups of grooves matched with the conveying belts, a plurality of groups of driving rollers are arranged in the grooves, and the conveying belts are matched with a group of rotating motors through the driving belts respectively.
Preferably, the bottom end of the guide bottom rod is provided with a sliding chute matched with the sliding rail, and one side of the guide bottom rod, which is far away from the tin furnace, is provided with a group of driving motors.
Preferably, a motor shaft of the driving motor extends into the sliding groove and is matched with the group of transmission gears, and a toothed belt groove in meshing transmission with the transmission gears is formed in the upper end face of the sliding rail.
Preferably, the upper end face of the adjusting frame is provided with a substrate moving groove for sliding adjustment of the movable substrate, the two sides of the substrate moving groove are provided with sliding edge grooves, and the two sides of the movable substrate are provided with rib structures in sliding fit with the sliding edge grooves.
Preferably, the cooperation is inlayed to one side in base plate activity groove has a set of servo motor, and servo motor and a set of ball screw cooperation, ball screw thread transmission activity base plate, and ball screw keep away from servo motor's one end and pass through roller bearing cooperation with the alignment jig.
The utility model discloses a technological effect and advantage: the dip soldering device for the micro sensor chip adopts the adjusting frame driven and adjusted by the driving motor to be matched with the slide rail to realize displacement along the transmission direction of the conveying belt, realizes the matching with conveying equipment and reduces the conveying time; the chip products on the conveying belt can be clamped by the height-adjustable hydraulic telescopic rod on the adjusting frame and the two groups of clamping plates with the changeable spacing, the servo motor drives the ball screw to drive the movable base plate to realize transverse displacement, automatic taking, dip-welding and placing are realized, the automatic dip-welding requirement is met, and efficient work is realized; the stability of movable base plate transmission time is guaranteed to movable base plate both sides and smooth arris groove complex rib structure, and the stability of grip block when the grip block removes is guaranteed in the cooperation of grip block and adjustment tank.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the structure of the adjusting bracket of the present invention;
fig. 3 is an enlarged schematic view of a structure a in fig. 2 according to the present invention.
In the figure: 1 welding platform, 2 conveyer belts, 201 rotating electrical machines, 3 adjusting frames, 301 connecting column, 4 guide bottom rods, 401 chutes, 5 slide rails, 501 toothed groove slots, 6 movable base plates, 601 base plate movable slots, 602 sliding edge slots, 7 servo motors, 701 ball screws, 8 mounting base plates, 801 hydraulic telescopic rods, 802 adjusting slots, 9 electric telescopic rods, 901 positioning plates, 902 clamping plates, 10 tin furnaces and 11 driving motors.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model provides a dip soldering device of a micro sensor chip as shown in figures 1-3, which comprises a welding platform 1, a conveying assembly arranged on the welding platform 1 and a dip soldering assembly matched with the conveying assembly to realize automatic dip soldering;
the dip soldering assembly comprises an adjusting frame 3 serving as a main body structure and mounted on one side of the upper end face of the welding platform 1, and a movable base plate 6 movably matched with the adjusting frame 3, wherein a group of tin furnaces 10 are mounted on one side, provided with the adjusting frame 3, of the upper end face of the welding platform 1, connecting columns 301 connected with guide bottom rods 4 are arranged on two sides of the bottom end of the adjusting frame 3, and the guide bottom rods 4 are in sliding fit with a group of sliding rails 5;
the bottom of activity base plate 6 is provided with a set of hydraulic telescoping rod 801 of connecting mounting substrate 8 (during the concrete implementation, hydraulic telescoping rod 801's model can be selected for use according to this demand), mounting substrate 8's up end both sides are provided with locating plate 901 of connecting electric telescopic handle 9 (during the concrete implementation, electric telescopic handle 9's model can be selected for use according to this demand), one side that hydraulic telescoping rod 801 was kept away from to electric telescopic handle 9 is connected with a set of grip block 902, the bottom of grip block 902 extends to tin stove 10 direction, and sets up the adjustment tank 802 that supplies grip block 902 movable adjustment on mounting substrate 8, and grip block 902 and adjustment tank 802's cooperation is guaranteed the stability when grip block 902 removed, and height-adjustable hydraulic telescoping rod 801 and the centre gripping that can change two sets of grip block 902 of interval realize the core product on conveyer belt 2 on the alignment jig 3.
Specifically, the conveying assembly includes two sets of conveyer belts 2, two sets of cooperation conveyer belt 2's groove is seted up to welded platform 1's up end, and the inslot is provided with the multiunit driving roller, and is two sets of conveyer belt 2 passes through the driving belt cooperation with a set of rotating electrical machines 201 respectively, and the motor shaft and the belt pulley cooperation of rotating electrical machines 201, and the belt pulley is connected with the driving belt cooperation, and the other end and a set of driving roller cooperation of driving belt realize synchronous transmission by the cooperation of driving chain belt between the multiunit roller.
Specifically, spout 401 of cooperation slide rail 5 is seted up to the bottom of direction sill bar 4, and the one side that tin stove 10 was kept away from to direction sill bar 4 is provided with a set of driving motor 11, driving motor 11's motor shaft extends into in spout 401, and with a set of drive gear cooperation, slide rail 5's up end is seted up with drive gear meshing driven fluted belt groove 501, adopts 3 cooperation slide rails 5 of alignment jig that are adjusted by driving motor 11 drive to realize along the ascending displacement of 2 transmission directions of conveyer belt, realizes and the cooperation between conveying equipment, reduces transfer time.
Specifically, the base plate activity groove 601 that supplies activity base plate 6 slide adjusting is seted up to the up end of alignment jig 3, and the smooth arris groove 602 has been seted up to the both sides of base plate activity groove 601, the both sides of activity base plate 6 are constructed the rib structure of the smooth arris groove 602 of sliding fit, and the stability when activity base plate 6 transmission is guaranteed to activity base plate 6 both sides and smooth arris groove 602 complex rib structure.
Specifically, the cooperation has a set of servo motor 7 in the cooperation is inlayed to one side of base plate activity groove 601, and servo motor 7 and a set of ball 701 cooperation, ball 701 screw thread transmission activity base plate 6, and ball 701 keeps away from servo motor 7's one end and the cooperation of alignment jig 3 through roller bearing, and servo motor 7 drive ball 701 driven activity base plate 6 can realize horizontal displacement.
The working principle of the dip soldering device for the micro sensor chip is that when the dip soldering device is used, two groups of conveying belts 2 can be adjusted to different conveying directions, one group is used for conveying a chip to be dip soldered, and the other group is used for outputting the dip soldered chip, when the dip soldering device is in use, a servo motor 7 drives a ball screw 701 to realize the movement of a movable base plate 6 to the conveying direction of the conveying belt 2 for conveying the chip to be dip soldered, a driving motor 11 drives a transmission gear meshing toothed belt groove 501 to realize the transmission of an adjusting frame 3 along a sliding rail 5, at the moment, an adjusting hydraulic telescopic rod 801 descends, an electric telescopic rod 9 adjusts two groups of clamping plates 902 to clamp the chip, at the moment, the adjusting hydraulic telescopic rod 801 ascends, the driving motor 11 reversely rotates to realize the reset of the adjusting frame 3, the servo motor 7 reversely adjusts the movable base plate 6 to the position above a tin furnace 10, the chip part where, servo motor 7 drive ball 701 realizes that movable substrate 6 has realized the removal of 2 directions of dip-soldering chip conveyer belt to the output, driving motor 11 drive gear meshing fluted tape 501 realizes 3 transmissions along slide rail 5 of alignment jig, adjust hydraulic telescoping rod 801 decline this moment, electric telescoping rod 9 adjusts two sets of grip blocks 902 and loosens the chip, realize singly organizing the dip-soldering work of group chip, so reciprocal, realize automatic dip-soldering processing, this microsensor chip's dip-soldering device, moreover, the steam generator is rational in infrastructure, easily realize automatic efficient chip dip-soldering, and has higher practical value.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (6)
1. A dip soldering device for a micro sensor chip comprises a welding platform (1), a conveying assembly arranged on the welding platform (1) and a dip soldering assembly matched with the conveying assembly to realize automatic dip soldering;
the method is characterized in that: the dip soldering assembly comprises an adjusting frame (3) serving as a main body structure and mounted on one side of the upper end face of the soldering platform (1), and a movable base plate (6) movably matched with the adjusting frame (3), wherein one side, provided with the adjusting frame (3), of the upper end face of the soldering platform (1) is provided with a group of tin furnaces (10), two sides of the bottom end of the adjusting frame (3) are provided with connecting columns (301) connected with guide bottom rods (4), and the guide bottom rods (4) are in sliding fit with a group of sliding rails (5);
the bottom of activity base plate (6) is provided with a set of hydraulic telescoping rod (801) of connecting mounting substrate (8), the up end both sides of mounting substrate (8) are provided with locating plate (901) of connecting electric telescopic handle (9), one side that hydraulic telescoping rod (801) were kept away from in electric telescopic handle (9) is connected with a set of grip block (902), the bottom of grip block (902) extends to tin stove (10) direction, and sets up on mounting substrate (8) and supply grip block (902) regulation groove (802) of movable adjustment.
2. The dip soldering apparatus for a microsensor chip according to claim 1, wherein: conveying assembly includes two sets of conveyer belts (2), the groove of two sets of cooperation conveyer belts (2) is seted up to the up end of welded platform (1), and the inslot is provided with multiunit driving roller, and is two sets of conveyer belt (2) pass through driving belt cooperation with a set of rotating electrical machines (201) respectively.
3. The dip soldering apparatus for a microsensor chip according to claim 1, wherein: the bottom of the guide bottom rod (4) is provided with a sliding chute (401) matched with the sliding rail (5), and one side, away from the tin furnace (10), of the guide bottom rod (4) is provided with a group of driving motors (11).
4. The dip soldering apparatus for a microsensor chip according to claim 3, wherein: the motor shaft of driving motor (11) extends into spout (401), and with a set of drive gear cooperation, the up end of slide rail (5) is seted up with drive gear meshing driven tooth groove (501).
5. The dip soldering apparatus for a microsensor chip according to claim 1, wherein: the upper end face of the adjusting frame (3) is provided with a substrate moving groove (601) for sliding adjustment of the moving substrate (6), the two sides of the substrate moving groove (601) are provided with sliding edge grooves (602), and the two sides of the moving substrate (6) are constructed with edge strip structures in sliding fit with the sliding edge grooves (602).
6. The dip soldering apparatus for a microsensor chip according to claim 5, wherein: one side of the base plate moving groove (601) is embedded and matched with a group of servo motors (7), the servo motors (7) are matched with a group of ball screws (701), the ball screws (701) transmit the moving base plate (6) in a threaded mode, and one ends, far away from the servo motors (7), of the ball screws (701) are matched with the adjusting frame (3) through roller bearings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020332883.7U CN212070705U (en) | 2020-03-17 | 2020-03-17 | Dip soldering device for micro sensor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020332883.7U CN212070705U (en) | 2020-03-17 | 2020-03-17 | Dip soldering device for micro sensor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212070705U true CN212070705U (en) | 2020-12-04 |
Family
ID=73563036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020332883.7U Expired - Fee Related CN212070705U (en) | 2020-03-17 | 2020-03-17 | Dip soldering device for micro sensor chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212070705U (en) |
-
2020
- 2020-03-17 CN CN202020332883.7U patent/CN212070705U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201204 |