CN212062467U - Combined structure of Mini LED chip and double-layer substrate and liquid crystal display panel - Google Patents
Combined structure of Mini LED chip and double-layer substrate and liquid crystal display panel Download PDFInfo
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- CN212062467U CN212062467U CN202020990206.4U CN202020990206U CN212062467U CN 212062467 U CN212062467 U CN 212062467U CN 202020990206 U CN202020990206 U CN 202020990206U CN 212062467 U CN212062467 U CN 212062467U
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Abstract
The utility model discloses a composite structure and liquid crystal display panel of Mini LED chip and double-deck base plate, this composite structure includes: each Mini LED chip is provided with a first electrode and a second electrode, and the second electrode is longer than the first electrode; the first substrate is provided with a first electrode hole corresponding to the first electrode, and the first electrode is inserted into the first electrode hole; the second substrate is arranged below the first substrate, the first substrate and the second substrate are respectively provided with a second electrode hole and a third electrode hole corresponding to the second electrode, the second electrode penetrates through the second electrode hole and the third electrode hole to be welded on the lower surface of the second substrate, and the lower end of the first electrode is in contact with the upper surface of the second substrate. The utility model discloses simple structure can change or restore unusual Mini LED chip, and is easy and simple to handle, has practiced thrift social resource greatly, is worth wideling popularize the use.
Description
Technical Field
The utility model relates to a liquid crystal display panel technical field especially relates to a composite construction and liquid crystal display panel of Mini LED chip and double-deck base plate.
Background
With the change of the backlight industry, the requirements of consumers on display products are higher and higher, and by virtue of the advantages of low power consumption and gorgeous colors, the penetration rate of the Mini LED panel in the market of high-end displays is continuously improved, and the application is increasingly wide. However, under the current technical conditions, if a certain Mini LED chip in the panel is abnormal, the technical problems of dense packaging circuit, complexity, easy disorder and the like cannot be overcome, the abnormal Mini LED chip cannot be replaced or maintained, only the panel can be replaced, and great resource waste is caused. Based on this, a technical structure innovation that the abnormal Mini LED chip can be conveniently replaced is urgently needed so as to save energy, reduce emission and save social resources.
SUMMERY OF THE UTILITY MODEL
For the technical problem who exists more than solving, the utility model provides a composite construction of Mini LED chip and double-deck base plate can change or restore unusual Mini LED chip, and it has practiced thrift social resources greatly, and its simple structure, easy and simple to handle.
For the technical problem who exists more than solving, the utility model provides a liquid crystal display panel to solve and to maintain the liquid crystal display panel and cause this problem of high cost.
The technical scheme of the utility model as follows: the utility model provides a composite structure of Mini LED chip and double-deck base plate, include:
a plurality of Mini LED chips, each of the Mini LED chips having a first electrode and a second electrode, the second electrode being longer than the first electrode;
the first substrate is provided with a first electrode hole corresponding to the first electrode, and the first electrode is inserted into the first electrode hole;
the second substrate is arranged below the first substrate, the first substrate and the second substrate correspond to the second electrode and are respectively provided with a second electrode hole and a third electrode hole, the second electrode penetrates through the second electrode hole and the third electrode hole and is welded on the lower surface of the second substrate, and the lower end of the first electrode is in contact with the upper surface of the second substrate.
Furthermore, an insulating layer is further arranged between the first substrate and the second substrate, a fourth electrode hole is formed in the insulating layer corresponding to the first electrode, and a fifth electrode hole is formed in the insulating layer corresponding to the second electrode.
Further, the first substrate and the second substrate are PCB rigid circuit boards or flexible circuit boards.
Further, the insulating layer is one of insulating paint, insulating glue or resin film material.
Furthermore, the upper surface and/or the lower surface of the first substrate and the second substrate are provided with circuit structures.
Further, the first electrode is a first pin, the second electrode is a second pin, and the length of the second pin is greater than that of the first pin.
Further, the first electrode includes a third pin and a first electrode pin, the second electrode includes a fourth pin and a second electrode pin, the third pin and the fourth pin have the same length, the second electrode pin is longer than the first electrode pin, the first electrode pin and the second electrode pin protrude from the upper surface of the first substrate, and the first electrode pin and the second electrode pin protrude from the upper surface of the first substrate at the same height.
Further, the third pin is connected to the first electrode pin in a welding manner, and the fourth pin is connected to the second electrode pin in a welding manner.
Further, the second electrode pin is connected to the lower surface of the second substrate by soldering.
The utility model also provides a liquid crystal display panel, its be equipped with above the composite construction of Mini LED chip and double-deck base plate.
According to the above technical scheme, the utility model provides a composite construction of Mini LED chip and double-deck base plate, it is through being one long one short structure with the design of Mini LED two electrodes to set up a first base plate and a second base plate, two electrodes are connected to respectively first base plate and second base plate, and with longer electrode weld in the lower surface of second base plate, shorter electrode is inserted and is located on the first base plate. When the Mini LED chip is replaced, only the soldering tin on the second substrate needs to be unwelded, the abnormal Mini LED chip is pulled out, the normal Mini LED chip is replaced, and the longer electrode of the normal Mini LED chip is welded and fixed on the lower surface of the second substrate, so that the operation is simple and rapid. The utility model discloses still include a liquid crystal display panel, this display panel can change the Mini LED chip that shows unusually, and easy operation is swift, has solved display panel among the prior art and has appeared the problem that the Mini LED is unusual and can't be changed, has practiced thrift social resource greatly.
Drawings
Fig. 1 is a schematic diagram of the composite structure embodiment 1 of the Mini LED chip and the double-layer substrate of the present invention.
Fig. 2 is a schematic diagram of the composite structure embodiment 2 of the Mini LED chip and the double-layer substrate of the present invention.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
Example 1
As shown in fig. 1, the present embodiment is a combination structure of a Mini LED chip and a double-layer substrate, including: a first substrate 10, a second substrate 20 and a plurality of Mini LED chips 30. Each Mini LED chip 30 has a first electrode 31 and a second electrode 32, the second electrode 32 being longer than the first electrode 31. In this embodiment, the first electrode 31 is a first pin, the second electrode 32 is a second pin, and the length of the second pin is greater than that of the first pin. The first substrate 10 is provided with a first electrode hole (not shown) corresponding to the first electrode 31, and the first electrode 31 is inserted into the first electrode hole (not shown). The second substrate 20 is disposed below the first substrate 10, the first substrate 10 and the second substrate 20 are respectively provided with a second electrode hole (not marked) and a third electrode hole (not marked) corresponding to the second electrode 32, the second electrode 32 passes through the second electrode hole and the third electrode hole and is welded to the lower surface of the second substrate 20, as shown in fig. 1, the welding point is 50. The lower end of the first electrode 31 contacts the upper surface of the second substrate 20. Preferably, an insulating layer 40 is further disposed between the first substrate 10 and the second substrate 20, a fourth electrode hole (not shown) is disposed on the insulating layer 40 corresponding to the first electrode 31, and a fifth electrode hole (not shown) is disposed on the insulating layer 40 corresponding to the second electrode 32. The first electrode 31 passes through the fourth electrode hole (not shown) to contact the upper surface of the second substrate 20, and the second electrode 32 passes through the fifth electrode hole (not shown) to reach the third electrode hole and is welded to the lower surface of the second substrate 20. Under the condition that a certain Mini LED chip is abnormal, the second electrode 32 is only needed to be welded from the welding point 50 on the lower surface of the second substrate 20, then the abnormal Mini LED chip is pulled out, the normal Mini LED chip is replaced, the first electrode of the abnormal Mini LED chip is inserted and fixed in the first electrode hole, and the second electrode is welded and fixed on the lower surface of the second substrate 20. Due to the design that the two layers of substrates and the middle layer are provided with the insulating layer in a clamped mode, not only is the abnormal Mini LED chip convenient to disassemble, but also the circuit layout can be made on the upper surface and/or the lower surface of the first substrate 10 and the second substrate 20, and the circuit layout space is greatly increased. The lower surface of the second substrate 32 may be soldered with components such as a driver IC and solder for Mini LED electrodes. The first substrate 10 and the second substrate 20 may be a PCB rigid circuit board or a flexible circuit board. The insulating layer 40 is one of insulating paint, insulating glue or resin film materials existing in the market.
Example 2
As shown in fig. 2, the present embodiment is a combination structure of a Mini LED chip and a double-layer substrate, including: the LED chip comprises a first substrate 100, a second substrate 200 and a plurality of Mini LED chips 300. Each Mini LED chip 300 has a first electrode and a second electrode, and the length of the two electrodes is the same as that of embodiment 1, except that: the first electrode comprises a third pin 301 and a first electrode pin 302, the third pin 301 is connected to the first electrode pin 302 in a welding mode, the second electrode comprises a fourth pin 401 and a second electrode pin 402, and the fourth pin 401 is connected to the second electrode pin 402 in a welding mode. Similarly to embodiment 1, preferably, an insulating layer 500 is further disposed between the first substrate 100 and the second substrate 200, a first electrode hole (not labeled) is disposed on the insulating layer 500 corresponding to the third electrode pin 302, a second electrode hole (not labeled) is disposed on the insulating layer 500 corresponding to the second electrode pin 402, and the first electrode hole and the second electrode hole are respectively penetrated by the first electrode pin 302 and the second electrode pin 402. A third electrode hole (not labeled) is formed in the first substrate 100, and the first electrode pin 302 is inserted and fixed in the third electrode hole. A fourth electrode hole (not marked) and a fifth electrode hole (not marked) are respectively formed in the same position on the first substrate 100 and the second substrate 200, the second electrode pins 402 are inserted into the fourth electrode hole and the fifth electrode hole, the lower ends of the second electrode pins are welded on the lower surface of the second substrate 200, and the welding spot is 600. Wherein the bottom end of the first electrode pin 302 contacts the upper surface of the second substrate 200 through the first electrode hole of the insulating layer 500. In the case where a Mini LED is abnormal, as in embodiment 1, it is only necessary to desolder the second electrode leg 402 and the lower surface of the second substrate 200, then remove the abnormal Mini LED chip, replace the normal Mini LED chip on which the first electrode leg 302 and the second electrode leg 402 are welded, insert the first electrode leg 302 into the third electrode hole of the first substrate 100, insert the second electrode leg 402 into the fourth electrode hole and the fifth electrode hole, and weld the lower end of the second electrode leg to the lower surface of the second substrate 200. In this embodiment, the third pin 301 and the fourth pin 401 have the same length, and the second electrode pin 402 is longer than the first electrode pin 302. The first electrode pin 302 and the second electrode pin 402 protrude from the upper surface of the first substrate 100 at the same height, which is convenient for operation and ensures that the left and right heights of the Mini LED chip are the same after soldering. In this embodiment, two third pins 301 and two fourth pins 401 with the same length are provided, and then two first electrode pins 302 and two second electrode pins 402 with different lengths are welded to the two pins, so that the final overall structure and the connection manner with the two substrates are the same as those of embodiment 1, thereby achieving the same technical effects.
The utility model discloses still include a liquid crystal display panel, it is equipped with embodiment 1 or embodiment 2 the composite construction of Mini LED chip and double-deck base plate. The display panel can replace the Mini LED chip which displays abnormity, is simple and quick to operate, solves the problem that the display panel in the prior art cannot be replaced due to the fact that the Mini LED is abnormal, and needs to be replaced directly, and greatly saves social resources.
To sum up, the utility model provides a combination structure of Mini LED chip and double-deck base plate, it is through being one long one short structure with the design of Mini LED two electrodes to set up two superimposed first base plates and second base plate, shorter electrode is inserted and is established and be fixed in on the first base plate, longer electrode passes first base plate and second base plate weld in the lower surface of second base plate. When the Mini LED chip is replaced, only the soldering tin on the second substrate needs to be unwelded, the abnormal Mini LED chip is pulled out, the normal Mini LED chip is replaced, and the longer electrode of the normal Mini LED chip is welded and fixed on the lower surface of the second substrate, so that the operation is simple and rapid. The utility model discloses still include a liquid crystal display panel, it is equipped with above a combination structure of Mini LED chip and double-deck base plate. The display panel can replace the Mini LED chip which displays abnormity, is simple and quick to operate, solves the problem that the Mini LED chip cannot be replaced due to abnormity of the display panel in the prior art, and greatly saves social resources.
In the description of the present invention, it should be understood that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the drawings of the present invention, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. The utility model provides a composite construction of Mini LED chip and double-deck base plate which characterized in that includes:
a plurality of Mini LED chips, each of the Mini LED chips having a first electrode and a second electrode, the second electrode being longer than the first electrode;
the first substrate is provided with a first electrode hole corresponding to the first electrode, and the first electrode is inserted into the first electrode hole;
the second substrate is arranged below the first substrate, the first substrate and the second substrate correspond to the second electrode and are respectively provided with a second electrode hole and a third electrode hole, the second electrode penetrates through the second electrode hole and the third electrode hole and is welded on the lower surface of the second substrate, and the lower end of the first electrode is in contact with the upper surface of the second substrate.
2. The combination structure of a Mini LED chip and a double-layered substrate as claimed in claim 1, wherein an insulating layer is further disposed between the first substrate and the second substrate, the insulating layer has a fourth electrode hole corresponding to the first electrode, and the insulating layer has a fifth electrode hole corresponding to the second electrode.
3. The combination structure of a Mini LED chip and a double-layer substrate of claim 1, wherein the first substrate and the second substrate are PCB rigid circuit boards or flexible circuit boards.
4. The combination structure of the Mini LED chip and the double-layer substrate as claimed in claim 2, wherein the insulating layer is one of insulating paint, insulating glue or resin film.
5. The combination structure of a Mini LED chip and a double-layer substrate as claimed in claim 1, wherein the upper surface and/or the lower surface of the first substrate and the second substrate are provided with circuit structures.
6. The combination structure of a Mini LED chip and a bi-layer substrate as claimed in any one of claims 1 to 5, wherein the first electrode is a first lead, the second electrode is a second lead, and the length of the second lead is greater than the length of the first lead.
7. The combination structure of a Mini LED chip and a double-layered substrate as claimed in any one of claims 1 to 5, wherein the first electrode comprises a third lead and a first electrode pin, the second electrode comprises a fourth lead and a second electrode pin, the third lead and the fourth lead are the same in length, the second electrode pin is longer than the first electrode pin, the first electrode pin and the second electrode pin protrude from the upper surface of the first substrate, and the first electrode pin and the second electrode pin protrude from the upper surface of the first substrate at the same height.
8. The combination structure of a Mini LED chip and a double-layered substrate as claimed in claim 7, wherein said third lead is solder-connected to said first electrode pin, and said fourth lead is solder-connected to said second electrode pin.
9. The combination structure of a Mini LED chip and a double-layered substrate as claimed in claim 7, wherein said second electrode pin is soldered to the lower surface of said second substrate.
10. A liquid crystal display panel having a combination structure of the Mini LED chip according to any one of claims 1 to 9 and a double-layered substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020990206.4U CN212062467U (en) | 2020-06-01 | 2020-06-01 | Combined structure of Mini LED chip and double-layer substrate and liquid crystal display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020990206.4U CN212062467U (en) | 2020-06-01 | 2020-06-01 | Combined structure of Mini LED chip and double-layer substrate and liquid crystal display panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212062467U true CN212062467U (en) | 2020-12-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020990206.4U Active CN212062467U (en) | 2020-06-01 | 2020-06-01 | Combined structure of Mini LED chip and double-layer substrate and liquid crystal display panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212062467U (en) |
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2020
- 2020-06-01 CN CN202020990206.4U patent/CN212062467U/en active Active
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