CN212013170U - Anti-adhesion circuit board - Google Patents

Anti-adhesion circuit board Download PDF

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Publication number
CN212013170U
CN212013170U CN202020727388.6U CN202020727388U CN212013170U CN 212013170 U CN212013170 U CN 212013170U CN 202020727388 U CN202020727388 U CN 202020727388U CN 212013170 U CN212013170 U CN 212013170U
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CN
China
Prior art keywords
circuit board
copper foil
pcb
fixedly connected
basic unit
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Expired - Fee Related
Application number
CN202020727388.6U
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Chinese (zh)
Inventor
付鑫
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Hebei Huachuangda Technology Co ltd
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Individual
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Priority to CN202020727388.6U priority Critical patent/CN212013170U/en
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Publication of CN212013170U publication Critical patent/CN212013170U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses an anti-sticking's circuit board, including the circuit board body, the circuit board body is including anti-sticking even sheath, copper foil basic unit and PCB board, the top and the equal fixedly connected with copper foil basic unit in bottom of PCB board, and one side fixedly connected with anti-sticking even sheath that PCB board was kept away from to copper foil basic unit, and anti-sticking even sheath is including preventing static coating and polytetrafluoroethylene coating, and copper foil basic unit is including preventing welding printing ink and copper foil seal carving layer. The utility model discloses a circuit board body, anti-adhesion even sheath, copper foil basic unit, the PCB board, run through the through-hole, the copper post, prevent welding ink, copper foil seal engraving layer, prevent static coating and polytetrafluoroethylene coating, can make the circuit board reach anti-adhesion even function, the circuit board on having solved the current market does not possess anti-adhesion even function, the circuit board surface easily adheres a large amount of dusts in the use, influence the heat dissipation of circuit board and connect the use, easily cause the stitch to connect the problem that the short circuit influences circuit board safety in utilization.

Description

Anti-adhesion circuit board
Technical Field
The utility model relates to a circuit board technical field specifically is an anti-adhesion's circuit board.
Background
The PCB board, named as printed circuit board in Chinese, also called printed circuit board, is an important electronic component, is a support of electronic components, is a carrier for electrical connection of electronic components, is called as a printed circuit board because it is manufactured by adopting electronic printing technology, develops from single layer to double-sided, multi-layer and flexible, and still keeps respective development trend.
With the progress of times and the development of science and technology, the circuit board is used more and more in electronic products, the circuit board in the existing market does not have the function of preventing adhesion, a large amount of dust is easily adhered to the surface of the circuit board in the using process, the heat dissipation and the connection use of the circuit board are influenced, and the use safety of the circuit board is influenced due to the fact that pins are connected and short-circuited easily.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an anti-adhesion even circuit board possesses anti-adhesion even advantage, has solved the circuit board on the current market and does not possess anti-adhesion even function, and the circuit board surface easily adheres a large amount of dusts in the use, influences the heat dissipation of circuit board and connects the problem of using.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an anti-sticking's circuit board, includes the circuit board body, the circuit board body is including anti-sticking even sheath, copper foil basic unit and PCB board, the top and the equal fixedly connected with copper foil basic unit in bottom of PCB board, one side fixedly connected with anti-sticking even sheath of PCB board is kept away from to copper foil basic unit, anti-sticking even sheath is including preventing static coating and polytetrafluoroethylene coating, copper foil basic unit is including preventing welding printing ink and copper foil seal engraving layer.
Preferably, a through hole is formed in the surface of the PCB, and a copper column is fixedly connected to an inner cavity of the through hole.
Preferably, the top of the copper foil engraving layer is fixedly connected with solder mask ink, and the surface of the copper foil engraving layer is provided with a mounting hole matched with the through hole for use.
Preferably, the top of the polytetrafluoroethylene coating is fixedly connected with an anti-static coating, the thickness of the polytetrafluoroethylene coating is 0.1mm, and the thickness of the anti-static coating is 0.02 mm.
Preferably, the use thickness of the PCB is 2mm, and the thickness of the copper foil engraving layer is 0.2 mm.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a circuit board body, anti-adhesion even sheath, copper foil basic unit, the PCB board, run through the through-hole, the copper post, prevent welding ink, copper foil seal engraving layer, prevent static coating and polytetrafluoroethylene coating, can make the circuit board reach anti-adhesion even function, the circuit board on having solved the current market does not possess anti-adhesion even function, the circuit board surface easily adheres a large amount of dusts in the use, influence the heat dissipation of circuit board and connect the use, easily cause the stitch to connect the problem that the short circuit influences circuit board safety in utilization.
2. Through the through holes and the copper columns, a user can electrically connect the copper foil engraving layers on the two sides of the top and the bottom of the circuit board body more conveniently, and the integration capability of the circuit board is improved;
by using the solder mask ink, the phenomenon of non-tin-absorption short circuit in part of the through holes without wires can be effectively avoided, and the safety of the device in use is improved;
through the use of the polytetrafluoroethylene coating, the friction coefficient of the surface of the circuit board body can be lower, the phenomenon of surface dust accumulation is avoided, through the use of the anti-static coating, the phenomenon that dust is attached and can not fall off due to the fact that a large amount of static electricity is accumulated on the surface of the circuit board body can be effectively avoided, the cleanness of the circuit board body during use is guaranteed, and meanwhile, the phenomenon that the circuit board body is damaged due to the fact that more static electricity is accumulated on the surface of the circuit board body and concentrated discharge is avoided;
through confirming the use thickness of PCB board, can effectively ensure the use intensity of circuit board body, avoided appearing the phenomenon that fracture deformation influences the use in the installation.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a cross-sectional view of the copper foil base layer of the present invention;
fig. 3 is a cross-sectional view of the anti-adhesion protective layer of the present invention.
In the figure: 1. a circuit board body; 2. an anti-sticking protective layer; 3. a copper foil base layer; 4. a PCB board; 5. a through hole is penetrated; 6. a copper pillar; 7. solder mask ink; 8. a copper foil imprinting layer; 9. an antistatic coating; 10. and (3) coating polytetrafluoroethylene.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to be referred must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "connected", and the like are to be construed broadly, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The utility model discloses a circuit board body 1, anti-sticking even sheath 2, copper foil basic unit 3, PCB board 4, run through-hole 5, copper post 6, prevent welding ink 7, copper foil seal engraving layer 8, prevent that static coating 9 and polytetrafluoroethylene coating 10 part are the parts that universal standard spare or field technician know, and its structure and principle all are that this technical staff all can learn through the technical manual or learn through conventional experimental method.
Referring to fig. 1-3, an anti-adhesion circuit board comprises a circuit board body 1, the circuit board body 1 comprises an anti-adhesion protective layer 2, a copper foil base layer 3 and a PCB 4, a through hole 5 is formed on the surface of the PCB 4, a copper pillar 6 is fixedly connected to the inner cavity of the through hole 5, through the use of the through hole 5 and the copper pillar 6, a user can electrically connect copper foil engraving layers 8 on both the top and bottom sides of the circuit board body 1 more conveniently, the integration capability of the circuit board is improved, the copper foil base layer 3 is fixedly connected to both the top and bottom of the PCB 4, the anti-adhesion protective layer 2 is fixedly connected to one side of the copper foil base layer 3 away from the PCB 4, the anti-adhesion protective layer 2 comprises an anti-static coating 9 and a polytetrafluoroethylene coating 10, the anti-static coating 9 is fixedly connected to the top of the polytetrafluoroethylene coating 10, and the thickness of the polytetrafluoroethylene coating 10 is 0.1mm, the thickness of the anti-static coating 9 is 0.02mm, the friction coefficient of the surface of the circuit board body 1 can be lower through the use of the polytetrafluoroethylene coating 10, the phenomenon of surface dust deposition is avoided, the phenomenon that dust adheres to the surface of the circuit board body 1 and cannot fall off due to the accumulation of a large amount of static electricity can be effectively avoided through the use of the anti-static coating 9, the cleanness of the circuit board body 1 in use is ensured, meanwhile, the phenomenon that the circuit board body 1 is damaged due to the accumulation of more concentrated discharge on the surface of the circuit board body 1 is avoided, the copper foil base layer 3 comprises the anti-welding ink 7 and the copper foil engraving layer 8, the top of the copper foil engraving layer 8 is fixedly connected with the anti-welding ink 7, the surface of the copper foil engraving layer 8 is provided with a mounting hole matched with the through hole 5 for use, through the use of the anti-welding ink 7, the phenomenon that the non-tin short, the safety when having promoted the device and using, PCB board 4's use thickness is 2mm, and the thickness on copper foil seal engraving layer 8 is 0.2mm, through confirming PCB board 4's use thickness, can effectively ensure circuit board body 1's use intensity, has avoided the phenomenon that circuit board body 1 appears fracture deformation influence use in the installation.
When in use, through the use of the through hole 5 and the copper column 6, the copper foil imprinting layers 8 at the top and the bottom of the circuit board body 1 can be more conveniently electrically connected by a user, the integration capability of the circuit board is improved, through the use of the solder mask ink 7, the phenomenon of non-tin-eating short circuit in the through hole 5 with part not wired can be effectively avoided, the safety of the device in use is improved, through the use of the polytetrafluoroethylene coating 10, the friction coefficient of the surface of the circuit board body 1 can be lower, the phenomenon of surface dust accumulation is avoided, through the use of the antistatic coating 9, the phenomenon that the dust adheres to and can not fall off due to the accumulation of a large amount of static electricity on the surface of the circuit board body 1 can be effectively avoided, the cleanness of the circuit board body 1 in use is ensured, and meanwhile, the phenomenon that the circuit board body 1 is damaged due to more static electricity accumulated on the surface, through the use thickness of confirming PCB board 4, can effectively ensure circuit board body 1's use intensity, avoided the phenomenon that fracture deformation influences the use in installation in circuit board body 1 appearance, cooperation through above-mentioned structure can make the circuit board reach anti-adhesion's function, the circuit board on having solved current market does not possess anti-adhesion's function, the circuit board surface easily adheres a large amount of dusts in the use, influence the heat dissipation and the connection use of circuit board, easily cause the stitch to connect the problem that the short circuit influences circuit board safety in utilization, and is suitable for being generalized to use.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. The utility model provides a circuit board of anti-adhesion, includes circuit board body (1), its characterized in that: the anti-sticking printed circuit board is characterized in that the circuit board body (1) comprises an anti-sticking connecting protective layer (2), a copper foil base layer (3) and a PCB (4), the top and the bottom of the PCB (4) are respectively fixedly connected with the copper foil base layer (3), one side of the copper foil base layer (3) away from the PCB (4) is fixedly connected with the anti-sticking connecting protective layer (2), the anti-sticking connecting protective layer (2) comprises an anti-static coating (9) and a polytetrafluoroethylene coating (10), and the copper foil base layer (3) comprises an anti-welding ink (7) and a copper foil engraving layer (8).
2. The circuit board of claim 1, wherein: the PCB is characterized in that a through hole (5) is formed in the surface of the PCB (4), and a copper column (6) is fixedly connected to the inner cavity of the through hole (5).
3. The circuit board of claim 2, wherein: the top fixedly connected with of copper foil seal engraving layer (8) prevents welding printing ink (7), the surface of copper foil seal engraving layer (8) is seted up and is run through the mounting hole that through-hole (5) cooperation was used.
4. The circuit board of claim 1, wherein: the top fixedly connected with of polytetrafluoroethylene coating (10) prevents static coating (9), the thickness of polytetrafluoroethylene coating (10) is 0.1mm, the thickness of preventing static coating (9) is 0.02 mm.
5. The circuit board of claim 1, wherein: the use thickness of PCB board (4) is 2mm, the thickness of copper foil imprinting layer (8) is 0.2 mm.
CN202020727388.6U 2020-05-07 2020-05-07 Anti-adhesion circuit board Expired - Fee Related CN212013170U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020727388.6U CN212013170U (en) 2020-05-07 2020-05-07 Anti-adhesion circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020727388.6U CN212013170U (en) 2020-05-07 2020-05-07 Anti-adhesion circuit board

Publications (1)

Publication Number Publication Date
CN212013170U true CN212013170U (en) 2020-11-24

Family

ID=73409717

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020727388.6U Expired - Fee Related CN212013170U (en) 2020-05-07 2020-05-07 Anti-adhesion circuit board

Country Status (1)

Country Link
CN (1) CN212013170U (en)

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Date Code Title Description
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20210701

Address after: 057350 southeast corner of the intersection of maosui street and Shaofeng Road, Xinxing Park, Jize County, Handan City, Hebei Province

Patentee after: Hebei huachuangda Technology Co.,Ltd.

Address before: 351266 No.83 Houfeng, Maoshan village, Duwei Town, Xianyou County, Putian City, Fujian Province

Patentee before: Zhao Xiaoling

TR01 Transfer of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20201124

Termination date: 20210507

CF01 Termination of patent right due to non-payment of annual fee