CN212005143U - High-strength super-thick stiffening plate - Google Patents
High-strength super-thick stiffening plate Download PDFInfo
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- CN212005143U CN212005143U CN202020622090.9U CN202020622090U CN212005143U CN 212005143 U CN212005143 U CN 212005143U CN 202020622090 U CN202020622090 U CN 202020622090U CN 212005143 U CN212005143 U CN 212005143U
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Abstract
The utility model discloses a high strength super thick type stiffening plate, the stiffening plate includes from type layer, glue film layer and through the 10-200 layers PI rete of adhesive coincide together, the thickness of PI rete is 10-100um, between at least two-layer adjacent PI rete, is provided with the enhancement layer of the fine skeleton of area glass. The utility model discloses a high strength super thick type stiffening plate structure is ingenious, adopts the range upon range of addition in layer, has realized the purpose of bodiness, and intensity strengthens extensive applicability greatly.
Description
Technical Field
The utility model belongs to the panel field especially relates to a high strength super thick type stiffening plate.
Background
The rigid-flex printed circuit board not only can provide due supporting function of a rigid printed circuit board, but also has the flexibility of a flexible board, can meet the requirement of three-dimensional assembly, is a flexible board which is very rapidly increased in recent years, and is widely applied to computers, aerospace and aviation, military electronic equipment, collection, digital (camera) cameras, communication equipment, analytical instruments and the like. According to prediction, the annual average growth rate in 2005-2010 is more than 20% calculated according to the production value, and the annual average growth rate is more than 37% according to the area, which greatly exceeds the growth rate of the common printed circuit board PCB. In recent two years, the country greatly improves the construction of 5G websites, the maximum thickness of an ultra-thick PI film used for the rigid-flex printed circuit board reaches 1-2mm, and the dosage is certainly increased year by year, so the development prospect of the PI film is very good.
At present, the PI film produced abroad, namely the polyimide film, can only achieve 125 microns at the thickest, such as: manufacturers such as DuPont, Nippon China, Korea SKC and the like have quite high production cost and are difficult to put into use under the strong market impact; all domestic PI film manufacturers, such as Jiangyin cloud, fine work, BaoYing and the like, can only achieve 250 micrometers at the thickest, and adopt the traditional casting process to produce, the PI film has quite large deformation and expansion and contraction, and cannot meet the high-quality requirement of the existing market. Therefore, under the promotion of the market, there is an urgent need to develop a substitute to be brought to the market with higher quality and more affordable price, so as to promote the sustainable development of the electronic industry.
The development of the project mainly takes the existing import PI film as a basic material, the maximum thickness of the existing import PI film is increased to 1000 microns from 125 microns, and the technical requirements are as follows: the board surface is flat, high temperature resistant more than 280 ℃, high pressure resistant more than 8000V, high insulation, high flame retardant and small expansion. The product is mainly applied to computers, space flight and aviation, military electronic equipment, collection, digital (shooting) cameras, communication equipment, analytical instruments and the like. At present, PI film manufacturers produced in China have the thickest thickness of only 250 micrometers, and have large expansion and contraction and high cost. To reach 1000 microns, the technology is not mature at all and is difficult to realize. However, through the continuous efforts of the research and development team of the company, the purpose of thickening is achieved by adopting a layer-by-layer addition method, and with the establishment of the country 5G, the material is more and more used, so that the market prospect is quite considerable.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that a high strength super thick type stiffening plate is provided.
The utility model discloses a realize through following technical scheme:
the super thick type stiffening plate of high strength, the stiffening plate includes 10-200 layers PI rete from type layer, glue film layer and through the adhesive laminating together, the thickness on PI rete is 10-100um, between at least two-layer adjacent PI rete, is provided with the enhancement layer of the fine skeleton of area glass.
Preferably, the thickness of the PI film layer is 12.5 μm, 25 μm or 75 μm.
Preferably, the bottom surface of the reinforcing plate is provided with a layer of glass fiber mesh cloth for resisting tearing.
Preferably, the thickness of the reinforced layer with the glass fiber framework is 20-100um, and PI is filled in the glass fiber framework.
Preferably, the glass fiber framework is a honeycomb structure or a conical hole structure with mutually staggered orientation.
Preferably, the reinforcing layer with the glass fiber framework and the PI film are directly overlapped together through an adhesive.
The utility model has the advantages that:
the utility model discloses a high strength super thick type stiffening plate structure is ingenious, adopts the range upon range of addition in layer, has realized the purpose of bodiness, and intensity strengthens extensive applicability greatly.
Drawings
For ease of illustration, the invention is described in detail by the following specific examples and figures.
Fig. 1 is a schematic perspective view of an embodiment of the present invention;
FIG. 2 is a schematic view of the bottom structure of FIG. 1;
FIG. 3 is a schematic structural view of a honeycomb-structured fiberglass framework;
FIG. 4 is a schematic structural view of a glass fiber skeleton with a tapered hole structure arranged in a staggered manner.
Detailed Description
As shown in fig. 1-4, the high-strength ultra-thick stiffening plate comprises a release layer, an adhesive film layer and 10-200 layers of PI film layers laminated together by an adhesive, wherein the thickness of the PI film layers is 10-100um, and a reinforcing layer with a glass fiber framework is arranged between at least two adjacent PI film layers.
The thickness of the PI film layer is 12.5 [ mu ] m, 25 [ mu ] m or 75 [ mu ] m.
The bottom surface of the reinforcing plate is provided with a layer of glass fiber gridding cloth for resisting tearing.
The thickness of the enhancement layer with the glass fiber framework is 20-100um, and PI is filled in the glass fiber framework.
The glass fiber framework is of a honeycomb structure or a conical hole structure which is arranged in a staggered mode in the direction.
The enhancement layer with the glass fiber framework is directly overlapped with the PI film through an adhesive.
The utility model discloses a high strength super thick type stiffening plate structure is ingenious, adopts the range upon range of addition in layer, has realized the purpose of bodiness, and intensity strengthens extensive applicability greatly.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the creative work should be covered within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope defined by the claims.
Claims (6)
1. The high-strength ultra-thick reinforcing plate is characterized by comprising a release layer, a glue film layer and 10-200 PI film layers which are overlapped together through an adhesive, wherein the thickness of the PI film layers is 10-100um, and an enhancement layer with a glass fiber framework is arranged between at least two adjacent PI film layers.
2. The high-strength ultra-thick type stiffening plate according to claim 1, wherein the thickness of the PI film layer is 12.5 μm, 25 μm or 75 μm.
3. The high strength ultra-thick stiffener according to claim 1, wherein a fiberglass mesh is disposed on the bottom surface of the stiffener.
4. The high-strength ultra-thick-type reinforcing plate according to claim 1, wherein the thickness of the reinforcing layer with the glass fiber framework is 20-100um, and the glass fiber framework is filled with PI.
5. The high-strength ultra-thick-type reinforcing plate as claimed in claim 1, wherein the glass fiber framework has a honeycomb structure or a structure of tapered holes staggered in orientation.
6. The high-strength ultra-thick-type reinforcing plate as claimed in claim 1, wherein the glass fiber skeleton-equipped reinforcing layer and the PI film are directly laminated together by an adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020622090.9U CN212005143U (en) | 2020-04-23 | 2020-04-23 | High-strength super-thick stiffening plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020622090.9U CN212005143U (en) | 2020-04-23 | 2020-04-23 | High-strength super-thick stiffening plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212005143U true CN212005143U (en) | 2020-11-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020622090.9U Active CN212005143U (en) | 2020-04-23 | 2020-04-23 | High-strength super-thick stiffening plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212005143U (en) |
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2020
- 2020-04-23 CN CN202020622090.9U patent/CN212005143U/en active Active
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