CN211980600U - Internal structure of high-heat-conductivity rectifier bridge with unequal leg pitches - Google Patents

Abstract

The utility model discloses a high heat conduction type rectifier bridge inner structure of leg distance not relates to rectifier bridge technical field, including epoxy plastic envelope body and chip, the inboard of epoxy plastic envelope body is inlayed and is equipped with first bottom plate and second bottom plate, and first bottom plate and second bottom plate are in same water flat line. This high heat conduction type rectifier bridge inner structure of leg distance that varies, through adopting thickening heterotypic copper product to absorb heat with higher speed, be equipped with the through-hole at the body intermediate part, heat conduction can accelerate, the pin extends through the transition pin at the special-shaped copper product, bottom plate and springboard appearance design, increase the plastic envelope area, guarantee the fine and close effect of encapsulation, this high heat conduction type rectifier bridge inner structure of leg distance that varies, through at the epoxy plastic envelope body, between the pin that the positive terminal was visited and the AC input pin, pin centre-to-centre spacing enlarges, stop the "creepage" condition that probably appears in the application, get rid of output direct current high voltage and input electromagnetism or high frequency interference through the leg distance that varies.

Description

Internal structure of high-heat-conductivity rectifier bridge with unequal leg pitches

Technical Field

The utility model relates to a rectifier bridge technical field specifically is a high heat conduction type rectifier bridge inner structure of leg pitch that varies.

Background

In the application of semiconductor discrete devices, not only the heat dissipation performance of the devices in the application needs to be considered, but also the reliability and stability of the electrical performance in the application need to be combined, although the assembly space and the device appearance are continuously improved along with the continuous improvement of the integration technology, the reliability and stability brought by the expansion matching of the packaging body and the structural member and the influence of the thermal energy of the electrical performance caused by high heat generated in the application of the power type devices are still limited, so that the patch type devices can not completely replace the direct-insertion type discrete devices in the power type application circuit, although the patch type devices have the advantages in space, the vibration resistance, the mounting welding defects and the heat dissipation performance caused by the undersized pin pitch, the 'creepage' among pins and the electromagnetic interference are still solved.

SUMMERY OF THE UTILITY MODEL

The utility model provides a high heat conduction type rectifier bridge inner structure of leg distance varies, through adopting thickening heterotypic copper product heat absorption with higher speed, be equipped with the through-hole at the body intermediate part, heat conduction can accelerate, the pin extends through the transition pin at the heterotypic copper product, bottom plate and springboard appearance design, increase the plastic envelope area, guarantee the fine and close effect of encapsulation, through at the epoxy plastic envelope body, between the pin that the positive terminal was visited and the AC input pin, enlarge pin center distance, stop the "creepage" condition that probably appears in the application, through the leg distance varies and get rid of direct current high pressure and input electromagnetism or high frequency interference.

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: an inner structure of a high-heat-conductivity rectifier bridge with unequal leg pitches comprises an epoxy plastic package body and a chip, wherein a first bottom plate and a second bottom plate are embedded in the inner side of the epoxy plastic package body, the first bottom plate and the second bottom plate are positioned on the same horizontal line, wing-shaped protrusions are arranged on the rear surfaces of the first bottom plate and the second bottom plate in a backward extending mode, a first bottom plate anti-overflow groove is formed in the position, close to the top, of the front surface of the first bottom plate, a second bottom plate anti-overflow groove is formed in the position, close to the top, of the front surface of the second bottom plate, the second bottom plate anti-overflow groove is positioned on the same horizontal line with the first bottom plate anti-overflow groove, a first bottom plate boss is arranged on the position, close to the bottom, of the front surface of the first bottom plate, and a second bottom plate boss is arranged on the position, close to the bottom, of the box in an outward extending mode, the second bottom plate boss is flush with the first bottom, the rear surface axis of the first springboard extends backwards to form two first springboard bosses, the rear surface axis of the second springboard is provided with two second springboard anti-overflow grooves, and the two second springboard anti-overflow grooves are positioned right in front of the first bottom board bosses and the second bottom board bosses.

In order to improve the device's rectification function, as the utility model relates to a not equidistance high heat conduction type rectifier bridge inner structure is preferred, one of them second springboard anti-overflow tank passes through chip and first bottom plate boss electric connection, another one the second springboard anti-overflow tank passes through chip and second bottom plate boss electric connection, two first springboard boss is in the dead ahead department in first bottom plate anti-overflow tank and second bottom plate anti-overflow tank, one of them first springboard boss passes through chip and first bottom plate anti-overflow tank electric connection, the other one first springboard boss passes through chip and second bottom plate anti-overflow tank electric connection.

In order to improve the device's quick installation, as the utility model relates to a high heat conduction type rectifier bridge inner structure is preferred not equidistance, the bottom downwardly extending of first bottom plate is provided with first bottom plate transition pin, and the bottom downwardly extending of first bottom plate transition pin is provided with first bottom plate pin, the bottom downwardly extending of second bottom plate is provided with second bottom plate transition pin, and the bottom downwardly extending of second bottom plate transition pin is provided with second bottom plate pin.

In order to improve the device connect the electric security, conduct the utility model relates to a high heat-conducting type rectifier bridge inner structure is preferred not equidistance, the bottom downwardly extending of first springboard is provided with first springboard transition pin, and the bottom downwardly extending of first springboard transition pin is provided with the negative pole pin, the bottom downwardly extending of second springboard is provided with second springboard transition pin, and the bottom downwardly extending of second springboard transition pin is provided with anodal pin.

In order to improve the device's heat dissipation and fixity ability, conduct the utility model relates to a leg pitch height heat conduction type rectifier bridge inner structure is preferred not, the bolt lockhole has been seted up to the positive surface axle center department of epoxy plastic envelope body, and the bolt lockhole is in first bottom plate and second bottom plate groove.

In order to improve the device prevent slow-witted function, conduct the utility model relates to a high heat conduction type rectifier bridge inner structure of leg pitch is preferred not, rectangular shape mark has been seted up to the surface edge of epoxy plastic envelope body, and one side of rectangular shape mark sets up to positive surface.

The utility model provides a high heat conduction type rectifier bridge inner structure of leg distance that varies. The method has the following beneficial effects:

(1) this high heat conduction type rectifier bridge inner structure of foot pitch that varies is through adopting thickening deformed copper product to absorb heat with higher speed, is equipped with the through-hole at the body intermediate part, can accelerate heat conduction, and the pin extends through the transition pin at deformed copper product, and bottom plate and springboard appearance design increase the plastic envelope area, guarantee the fine and close effect of encapsulation.

(2) This high heat-conducting type rectifier bridge inner structure of foot distance that varies through at epoxy plastic envelope body, between the pin that the positive terminal was visited and the AC input pin, draws big pin centre-to-centre spacing, stops the "creepage" condition that probably appears in using, gets rid of output direct current high voltage and input electromagnetism or high frequency interference through the foot distance that varies.

Drawings

Fig. 1 is a cross-sectional view of the present invention;

fig. 2 is a front view of the first and second bottom plates of the present invention;

fig. 3 is a front view of the first springboard and the second springboard of the present invention;

fig. 4 is a side sectional view of the present invention.

In the figure: 1. epoxy plastic package body; 2. a first base plate; 3. a second base plate; 4. a first gangboard; 5. a second gangboard; 6. a chip; 7. a bolt lock hole; 8. a first springboard boss; 9. marking in a strip shape; 10. a first springboard transition pin; 11. a negative electrode pin; 12. a first backplane transition pin; 13. a first backplane pin; 14. a second backplane transition pin; 15. a second backplane pin; 16. a second springboard transition pin; 17. a positive electrode pin; 18. a first base plate overflow prevention groove; 19. a second base plate overflow prevention groove; 20. a first base plate boss; 21. a second base plate boss; 22. The second springboard anti-overflow groove; 23. the wing profile is convex.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: an internal structure of a high-heat-conductivity rectifier bridge with unequal pin pitches comprises an epoxy plastic package body 1 and a chip 6, wherein a first bottom plate 2 and a second bottom plate 3 are embedded in the inner side of the epoxy plastic package body 1, the first bottom plate 2 and the second bottom plate 3 are positioned on the same horizontal line, wing-shaped protrusions 23 extend backwards from the rear surfaces of the first bottom plate 2 and the second bottom plate 3, a first bottom plate anti-overflow groove 18 is formed in the front surface of the first bottom plate 2 close to the top, a second bottom plate anti-overflow groove 19 is formed in the front surface of the second bottom plate 3 close to the top, the second bottom plate anti-overflow groove 19 is positioned on the same horizontal line in the first bottom plate anti-overflow groove 18, a first bottom plate boss 20 extends outwards from the front surface of the first bottom plate 2 close to the bottom, a second bottom plate boss 21 extends outwards from the front surface of the second bottom plate 3 close to the bottom, and the second bottom plate bosses 21 are flush with each other in the first bottom, the inner side of the epoxy plastic package body 1 is embedded with a first springboard 4 and a second springboard 5, the axis of the rear surface of the first springboard 4 extends backwards to form two first springboard bosses 8, the axis of the rear surface of the second springboard 5 is provided with two second springboard anti-overflow grooves 22, and the two second springboard anti-overflow grooves 22 are positioned at the positions right ahead of the first bottom board bosses 20 and the second bottom board bosses 21.

In this embodiment: the sizes of the first bottom plate 2 and the second bottom plate 3 are 8.7 × 13.6 mm, the thickness is 1.32 mm, the arc of the abdicating notch of the first bottom plate 2 and the second bottom plate 3 is R3.26 mm, the sizes of the extension transition pins 12 and 14 of the first bottom plate 2 and the second bottom plate 3 are 0.6, and the widths are 2.5 mm and 1.6 mm respectively; wing-shaped bulges 23 with the thickness of 0.2 mm extend out of the bottoms of the first bottom plate 2 and the second bottom plate 3, the L-shaped cross pieces of the first springboard 4 and the second springboard 5 have the size of 6.13 x 23.1, the first springboard 4 with the thickness of 1.32 mm is provided with a conical flat-head boss, the diameter of the boss is 1.8 mm, and the height of the boss is 0.55 mm; the L-shaped cross piece of the second springboard 5 is provided with a second springboard anti-overflow groove 22 with the size of 5.6 x 4.6 mm and the groove depth of 0.08 mm, the first soleplate boss 20 and the second soleplate boss 21 are conical flat-head bosses with the diameter of 1.8 mm and the height of 0.55 mm. The anti-overflow device comprises a first bottom plate anti-overflow groove 18 and a second bottom plate anti-overflow groove 19, wherein the anti-overflow groove is 5.6 x 4.6 mm, the groove depth is 0.08 mm, the first springboard boss 8 is a conical flat-head boss, the diameter of the first springboard boss is 1.8 mm, the height of the first springboard boss is 0.55 mm, and a wing-shaped protrusion 23 with the thickness of 0.2 mm extends out of the bottoms of the first bottom plate 2 and the second bottom plate 3.

Specifically, one of the second jump board overflow preventing grooves 22 is electrically connected with the first bottom board boss 20 through the chip 6, the other second jump board overflow preventing groove 22 is electrically connected with the second bottom board boss 21 through the chip 6, the two first jump board bosses 8 are positioned at positions right in front of the first bottom board overflow preventing groove 18 and the second bottom board overflow preventing groove 19, one of the first jump board bosses 8 is electrically connected with the first bottom board overflow preventing groove 18 through the chip 6, and the other first jump board boss 8 is electrically connected with the second bottom board overflow preventing groove 19 through the chip 6.

In this embodiment: the first bottom plate 2, the second bottom plate 3, the first springboard 4, the second springboard 5 and the chip 6 are welded by high-temperature welding materials of Pb, Sn and Ag, the ratio of Pb to Sn to Ag is 92.5: 5: 2.5, the resistance and the impedance of a welding position are reduced, the rectifying capacity of the device is further improved, the current is prevented from being consumed due to heat effect, the packaging chip 6 is welded on the first bottom plate anti-overflow groove 18, the packaging chip 6 is welded on the second bottom plate anti-overflow groove 19, the first springboard 4 is arranged on the front surface of the welding chip 6, the first springboard boss 8 is in welding contact with the center position of the chip 6, the first springboard is L-shaped, and after the first springboard is vertically extended, the first springboard boss 10 extends all the way and extends out of the plastic package body 1 to form a negative electrode pin 11; a second springboard anti-overflow groove 22 is formed in the second springboard 5, and the second springboard anti-overflow groove 22 is welded with the N surface of the chip 6; during the equipment, second springboard 5 is rotatory 180, and the plane central point of chip 6 puts and first bottom plate boss 20, the welding contact of second bottom plate boss 21 that corresponds, through boss and anti-overflow tank, can further improve on the one hand with chip 6's electric connection efficiency, has guaranteed the structural strength and the leakproofness of this device on the other hand, and chip 6 is difficult for receiving external force to damage.

Specifically, the bottom of the first bottom plate 2 extends downwards to form a first bottom plate transition pin 12, the bottom of the first bottom plate transition pin 12 extends downwards to form a first bottom plate pin 13, the bottom of the second bottom plate 3 extends downwards to form a second bottom plate transition pin 14, and the bottom of the second bottom plate transition pin 14 extends downwards to form a second bottom plate pin 15.

In this embodiment: through first bottom plate transition pin and second bottom plate transition pin, a coal hospital improves the device's structural strength, avoids the pin because the broken needle problem that the installation is improper leads to, and the restriction of upper limit current can be avoided on the one hand in addition, further improves the device's job stabilization nature.

Specifically, the bottom of the first springboard 4 extends downwards to be provided with a first springboard transition pin 10, the bottom of the first springboard transition pin 10 extends downwards to be provided with a negative electrode pin 11, the bottom of the second springboard 5 extends downwards to be provided with a second springboard transition pin 16, and the bottom of the second springboard transition pin 16 extends downwards to be provided with a positive electrode pin 17.

In this embodiment: through negative pole pin 11 and anodal pin 17, can realize the quick electrical access to the power, avoid the connecting segment resistance of device great, lead to the great problem of loss.

Specifically, a bolt locking hole 7 is formed in the axis of the front surface of the epoxy plastic package body 1, and the bolt locking hole 7 is located in a groove of the first bottom plate 2 and the second bottom plate 3.

In this embodiment: through-hole through bolt lockhole 7 steps down, and the through-hole diameter is 3.3 millimeters, can tentatively fix the device through the bolt on the one hand, can improve the device's radiating effect on the other hand, avoids chip 6 because the not good damage problem that leads to of heat dissipation.

Specifically, the surface corner of the epoxy plastic package body 1 is provided with a strip-shaped mark 9, and one side of the strip-shaped mark 9 is set as a front surface.

In this embodiment: through last 9 breachs of long bar mark, the breach degree of depth is 0.5 millimeter, and the width is 2 millimeters, and length is 4.5 millimeters, can the person of facilitating the use can discern the pin fast, avoids the device damage that the misuse pin leads to.

When in use, the pins are identified by the strip marks, then the positive electrode pin 17 and the negative electrode pin 11 are firstly connected into an external power supply line, the first bottom plate pin 13 and the second bottom plate pin 15 are connected into a specified circuit, when current enters the second springboard transition pin through the positive pin 17, and finally enters the second springboard 5, and through the second springboard overflow prevention grooves 22 with the first 2 and second 3 base plate bosses to the chips 6, through the diode-like chips 6, the current is rectified, the forward power supply diode is switched on to not block the current, the current is blocked to flow when the negative voltage is passed, the rapid rectification of the alternating current is realized, and the device is plastically packaged through the epoxy plastic packaging body 1, the sealing performance of the device is improved, meanwhile, the damage of the chip 6 inside the device due to external force is avoided, and finally, the device is fixed on a heat dissipation sheet through bolts and bolt locking holes 7.

Claims (6)

1. The utility model provides a high heat conduction type rectifier bridge inner structure of pin pitch that varies, includes epoxy plastic envelope body (1) and chip (6), its characterized in that: the epoxy plastic package comprises an epoxy plastic package body (1), wherein a first bottom plate (2) and a second bottom plate (3) are embedded on the inner side of the epoxy plastic package body (1), the first bottom plate (2) and the second bottom plate (3) are located on the same horizontal line, wing-shaped protrusions (23) extend backwards from the rear surfaces of the first bottom plate (2) and the second bottom plate (3), a first bottom plate anti-overflow groove (18) is formed in the position, close to the top, of the front surface of the first bottom plate (2), a second bottom plate anti-overflow groove (19) is formed in the position, close to the top, of the front surface of the second bottom plate (3), the second bottom plate anti-overflow groove (19) is located on the same horizontal line in the first bottom plate anti-overflow groove (18), a first bottom plate boss (20) extends outwards from the position, close to the bottom, of the front surface of the first bottom plate (2), a second bottom plate boss (21) extends outwards from the position, close to the bottom, and is flush with the first bottom plate boss (, the epoxy plastic packaging body is characterized in that a first springboard (4) and a second springboard (5) are embedded on the inner side of the epoxy plastic packaging body (1), two first springboard bosses (8) are arranged on the rear surface axis of the first springboard (4) in a backward extending mode, two second springboard anti-overflow grooves (22) are formed in the rear surface axis of the second springboard (5), and the two second springboard anti-overflow grooves (22) are located in the positions in front of the first bottom board bosses (20) and the second bottom board bosses (21).

2. The internal structure of a non-uniform-pitch high-thermal-conductivity rectifier bridge as claimed in claim 1, wherein: one of them second springboard anti-overflow groove (22) passes through chip (6) and first bottom plate boss (20) electric connection, another one second springboard anti-overflow groove (22) passes through chip (6) and second bottom plate boss (21) electric connection, two first springboard boss (8) are in the position of the dead ahead in first bottom plate anti-overflow groove (18) and second bottom plate anti-overflow groove (19), one of them first springboard boss (8) pass through chip (6) and first bottom plate anti-overflow groove (18) electric connection, another one first springboard boss (8) pass through chip (6) and second bottom plate anti-overflow groove (19) electric connection.

3. The internal structure of a non-uniform-pitch high-thermal-conductivity rectifier bridge as claimed in claim 2, wherein: the bottom of the first bottom plate (2) extends downwards to be provided with a first bottom plate transition pin (12), the bottom of the first bottom plate transition pin (12) extends downwards to be provided with a first bottom plate pin (13), the bottom of the second bottom plate (3) extends downwards to be provided with a second bottom plate transition pin (14), and the bottom of the second bottom plate transition pin (14) extends downwards to be provided with a second bottom plate pin (15).

4. The internal structure of a non-uniform-pitch high-thermal-conductivity rectifier bridge as claimed in claim 3, wherein: the bottom downwardly extending of first springboard (4) is provided with first springboard transition pin (10), and the bottom downwardly extending of first springboard transition pin (10) is provided with negative pole pin (11), the bottom downwardly extending of second springboard (5) is provided with second springboard transition pin (16), and the bottom downwardly extending of second springboard transition pin (16) is provided with positive pole pin (17).

5. The internal structure of a non-uniform-pitch high-thermal-conductivity rectifier bridge as claimed in claim 4, wherein: the front surface axis of the epoxy plastic package body (1) is provided with a bolt locking hole (7), and the bolt locking hole (7) is positioned at the groove of the first bottom plate (2) and the second bottom plate (3).

6. The internal structure of a non-uniform-pitch high-thermal-conductivity rectifier bridge as claimed in claim 5, wherein: the surface corner of the epoxy plastic package body (1) is provided with a strip-shaped mark (9), and one side marked by the strip-shaped mark (9) is arranged to be a front surface.

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