CN211980584U

CN211980584U - Wafer storage device with damping function

Info

Publication number: CN211980584U
Application number: CN202020972153.3U
Authority: CN
Inventors: 魏剑宏
Original assignee: Suzhou Angke Microelectronics Technology Co ltd
Current assignee: Suzhou Angke Microelectronics Technology Co ltd
Priority date: 2020-06-01
Filing date: 2020-06-01
Publication date: 2020-11-20
Anticipated expiration: 2030-06-01

Abstract

The utility model discloses a there is shock-absorbing function wafer save set, include: bottom plate, shell, inner support post and backup pad, fixed surface is connected with the shell on the bottom plate, bottom plate upper portion symmetry fixedly connected with inner support post, four the inner support post is located inside the shell, the inner support post is kept away from bottom plate one end fixedly connected with backup pad, backup pad lower fixed surface has the mount, the inside fan that is provided with of mount, backup pad lower part symmetry is provided with the device that generates heat, the device that generates heat includes: the heat-insulation base device comprises a lamp holder and a heat-generating lamp tube, wherein the heat-generating device is fixedly connected with the inner support column and the lamp holder in a matched mode, the heat-generating device is connected with the heat-generating lamp tube in a matched mode, the heat-generating device is connected with the inner support column and the lamp holder in a matched mode, the heat-generating device is connected with the heat-generating lamp tube in a matched mode, the surface of the support plate is fixedly connected with limiting angle steel.

Description

Wafer storage device with damping function

Technical Field

The utility model relates to a wafer save set field specifically is a there is shock-absorbing function wafer save set.

Background

The wafer is as the product of semiconductor trade, and the requirement to the environment is very high in the production process, can lead to the wafer quality to descend under the condition of unsuitable temperature and, humidity and violent vibrations, but in the transportation of finished product wafer and the in-process of keeping, often can have above-mentioned circumstances, but such circumstances often are unwilling to see, for this reason, we propose a wafer save set that has shock-absorbing function.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a there is shock-absorbing function wafer save set to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a wafer storage device with a shock absorption function.

In order to achieve the above object, the utility model provides a following technical scheme: a wafer retention device with shock absorbing function, comprising: the material box comprises a bottom plate, a shell, a mounting support plate and a material box, wherein the shell is fixedly connected to the upper surface of the bottom plate, buffer cylinders are symmetrically arranged on two sides of the top of the bottom plate, four buffer rods are arranged on the inner wall of the top of each buffer cylinder, springs are arranged at the tops of the buffer cylinders and the bottoms of the buffer rods and are positioned in the buffer cylinders, one end of each spring is fixedly connected with the bottom of each buffer cylinder, the other end of each spring is fixedly connected with the bottom of each buffer rod, the end, away from each spring, of each buffer rod is fixedly connected with the mounting support plate, a through hole is formed in the middle of the mounting support plate, the material box is arranged on the upper portion of the mounting support plate, the bottom of the material box is hollowed, grooves are symmetrically arranged on the inner wall of the shell, and the fan is electrically connected with the electric cabinet.

Preferably, threaded holes are symmetrically formed in two ends of the bottom plate, and the bottom of the bottom plate is fixedly connected with a rubber base through bolts.

Preferably, the upper surface of the base is symmetrically and fixedly connected with a drying box, and the drying box is positioned between the fan and the buffer cylinder.

Preferably, the top cover is arranged at the top of the shell, a buckle is arranged on the top cover, the sealing cover is connected with the shell in a clamping mode through the buckle, and a movable handle is fixedly connected to the middle position of the top of the sealing cover.

Preferably, the outer wall of the shell is fixedly connected with a ground wire connector, and the ground wire connector is positioned at one end close to the bottom plate.

Preferably, material box inner wall equidistance symmetry is provided with the draw-in groove, the inside division board that sets up of draw-in groove, the bleeder vent has been seted up on the division board.

Compared with the prior art, the beneficial effects of the utility model are that:

the rubber base arranged at the lower part of the bottom plate raises the height of the whole device, thereby avoiding the influence of underground moisture on the product, the rubber base has good anti-skid effect to ensure the stability of the device, the drying agent can be added in the drying box at the upper part of the bottom plate and is matched with the blowing of the fan to ensure that the inside of the whole device is constantly kept in a proper temperature and humidity range, thereby ensuring the performance of the product, the spring between the buffer cylinder and the buffer column at the upper part of the bottom plate can greatly reduce the influence of external vibration on the product, absorb most of vibration energy, and the buffer cylinder can play the roles of guiding and limiting, the freedom degree of the upper mounting support plate is limited in the horizontal plane, the matching between the groove in the shell and the lug outside the material box is convenient for an operator to take the material box, the freedom degree of the material box is also limited, and the stability of a product is ensured.

Drawings

FIG. 1 is a front view of the present invention;

fig. 2 is a side view of the present invention;

fig. 3 is a top view of the present invention.

In the figure: 1. a base plate; 2. a housing; 3. mounting a supporting plate; 4. a material box; 5. a buffer cylinder; 6. a buffer rod; 7. a spring; 8. a groove; 9. a bump; 10. a fixed mount; 11. a fan; 12. a rubber base; 13. drying the box; 14. a top cover; 15. buckling; 16. a movable handle; 17. a ground wire connector; 18. a card slot; 19. a partition plate; 20. and (4) air holes.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1, a wafer storage device with shock absorbing function includes: the material box comprises a bottom plate 1, a shell 2, mounting support plates 3 and a material box 4, wherein the shell 2 is fixedly connected to the upper surface of the bottom plate 1, buffer cylinders 5 are symmetrically and fixedly connected to two sides of the top of the bottom plate 1, buffer rods 6 are arranged on the inner walls of the tops of the four buffer cylinders 5, springs 7 are arranged at the tops of the buffer cylinders 5 and the bottoms of the buffer rods 6, the springs 7 are located inside the buffer cylinders 5, the springs 7 inside the buffer cylinders 5 can achieve a good buffering effect, components on the upper portions are prevented from being impacted, the buffer cylinders 5 can also achieve a limiting and guiding effect, one ends of the springs 7 are fixedly connected with the bottoms of the buffer cylinders 5, the other ends of the springs 7 are fixedly connected with the bottoms of the buffer rods 6, the mounting support plates 3 are fixedly connected to the ends of the buffer rods 6, which are far away from the springs 7, 3 upper portions of mounting plate are provided with

material box

4, 4 bottom fretworks of material box, 2 inner wall symmetries of shell are provided with

recess

8, 4 outer wall symmetries of material box are provided with lug 9, two lug 9 and recess 8 sliding connection, and such connected mode makes material box 4 can conveniently extract, also can restrict material box 4 at the inside degree of freedom of shell 2, and then guarantees inside product, there is mount 10 bottom plate 1 upper surface intermediate position through bolted connection, the inside fan 11 that is provided with of mount 10, and fan 11 and electric cabinet electric connection.

Referring to fig. 2, threaded holes are symmetrically formed in two ends of the bottom of a bottom plate 1, a rubber base 12 is fixedly connected to the bottom of the bottom plate 1 through bolts, the rubber base 12 can achieve a good anti-slip effect, the whole device is more stable, a drying box 13 is symmetrically and fixedly connected to the upper surface of the bottom plate 1, the drying box 13 is located between a fan 11 and a buffer cylinder 5, a drying agent can be added into the drying box 13 and is blown by the fan 11, the inside of the whole device is constantly kept at a proper temperature and humidity to prevent a product from being damaged due to humidity, a top cover 14 is arranged on the top of a shell 2, a buckle 15 is arranged on the top cover 14, the top cover 14 is clamped with the shell 2 through the buckle 15, a movable handle 16 is fixedly connected to the middle position of the top cover 14, and the movable handle 16 added during operation can facilitate a user to operate the, the material box 4 inner wall equidistance symmetry is provided with draw-in groove 18, draw-in groove 18 is inside to be set up by division board 19, division board 19 is last to have seted up bleeder vent 20, division board 19 mainly can be inner space with reasonable utilization.

Referring to fig. 3, the outer wall of the housing 2 is fixedly connected with a ground wire connector 17, and the ground wire connector 17 is located at one end close to the bottom plate 1, because the wafer is very afraid of electrostatic breakdown in the processes of production, storage and transportation, which results in product failure, and static electricity is very easy to generate in production and life, the storage device must have a ground wire to guide the static electricity into the ground, so the ground wire connector 17 arranged on the housing 2 can have a good effect in electrostatic protection.

The working principle is as follows:

the rubber base 12 arranged at the lower part of the bottom plate 1 raises the height of the whole device to avoid the influence of underground moisture on products, the rubber base 12 has good anti-skidding effect and ensures the stability of the device, drying agents can be added in the drying box 13 at the upper part of the bottom plate 1 and the drying agents can be matched with the blowing of the fan 11 to ensure that the inside of the whole device is kept in a proper temperature and humidity range all the time, so that the performance of the products is ensured, the influence of external vibration on the products can be greatly reduced by the spring 7 between the buffer cylinder 5 and the buffer rod 6 at the upper part of the bottom plate 1 to absorb most of vibration energy, the buffer cylinder 5 can play a role in guiding and limiting, the freedom degree of the upper part mounting support plate 3 is limited in the horizontal plane, the matching between the groove 8 in the shell 2 and the lug 9 outside the material box 4 is convenient for operators to take the material box 4, and the, ensuring the stability of the product.

There may be any such actual relationship or order between these entities or operations. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. A wafer retention device with shock absorbing function, comprising: bottom plate (1), shell (2), installation layer board (3) and material box (4), its characterized in that: the material box is characterized in that a shell (2) is fixedly connected to the upper surface of the bottom plate (1), buffer cylinders (5) are symmetrically and fixedly connected to the two sides of the top of the bottom plate (1), four buffer cylinders (5) are provided with buffer rods (6) on the inner wall of the top of each buffer cylinder (5), springs (7) are arranged at the tops of the buffer cylinders (5) and the bottoms of the buffer rods (6), the springs (7) are located inside the buffer cylinders (5), one ends of the springs (7) are fixedly connected with the bottoms of the buffer cylinders (5), the other ends of the springs are fixedly connected with the bottoms of the buffer rods (6), a mounting support plate (3) is fixedly connected to one end, far away from the springs (7), of each buffer rod (6), a through hole is formed in the middle of the mounting support plate (3), a material box (4) is arranged on the upper portion of the, the material box is characterized in that the outer wall of the material box (4) is symmetrically provided with lugs (9), the lugs (9) are in sliding connection with the grooves (8), the middle position of the upper surface of the bottom plate (1) is connected with a fixing frame (10) through a bolt, a fan (11) is arranged inside the fixing frame (10), and the fan (11) is electrically connected with the electric cabinet.

2. A wafer holding device with a shock absorbing function according to claim 1, wherein: threaded holes are symmetrically formed in two ends of the bottom plate (1), and the bottom of the bottom plate (1) is fixedly connected with a rubber base (12) through bolts.

3. A wafer holding device with a shock absorbing function according to claim 1, wherein: the upper surface of the bottom plate (1) is symmetrically and fixedly connected with a drying box (13), and the drying box (13) is located between the fan (11) and the buffer cylinder (5).

4. A wafer holding device with a shock absorbing function according to claim 1, wherein: the improved multifunctional shell is characterized in that a top cover (14) is arranged at the top of the shell (2), a buckle (15) is arranged on the top cover (14), the top cover (14) is connected with the shell (2) in a clamping mode through the buckle (15), and a movable handle (16) is fixedly connected to the middle position of the top cover (14).

5. A wafer holding device with a shock absorbing function according to claim 1, wherein: the outer wall of the shell (2) is fixedly connected with a ground wire joint (17), and the ground wire joint (17) is positioned at one end close to the bottom plate (1).

6. A wafer holding device with a shock absorbing function according to claim 1, wherein: the material box (4) inner wall equidistance symmetry is provided with draw-in groove (18), draw-in groove (18) inside sets up by division board (19), division board (19) are last to have seted up bleeder vent (20).