CN211967156U - Simple polishing solution feeding device - Google Patents

Simple polishing solution feeding device Download PDF

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Publication number
CN211967156U
CN211967156U CN202020550994.5U CN202020550994U CN211967156U CN 211967156 U CN211967156 U CN 211967156U CN 202020550994 U CN202020550994 U CN 202020550994U CN 211967156 U CN211967156 U CN 211967156U
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liquid
polishing solution
polishing
quantitative
peristaltic pump
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朱文献
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Onstar Technology Shenzhen Co ltd
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Onstar Technology Shenzhen Co ltd
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Abstract

The utility model discloses a simple and easy polishing solution liquid feeding device, include: the liquid storage device comprises a liquid storage container, a four-way joint, a peristaltic pump and an iron support, wherein the iron support comprises a bottom plate and a support rod vertically arranged on the bottom plate, an adjusting frame is vertically movably arranged on the support rod, a quantitative liquid feeding funnel is arranged on the adjusting frame, liquid inlet ends of the liquid storage container, the quantitative liquid feeding funnel and the peristaltic pump are connected with the four-way joint through plastic hoses, and a liquid outlet end of the peristaltic pump is connected with a liquid outlet nozzle; the inside of four-way connection is provided with the stirring ball, and the stirring ball material is stainless steel or zirconia. The utility model discloses technical scheme is simple and practical, aims at providing a simple and easy liquid feeding mode at polishing in-process polishing solution, utilizes the liquid feeding funnel to add different additives quantitatively ground continuity and make it mix with the principal ingredients and add to the polishing pad, and its main aim at maintains the stability of polishing solution active ingredient along with the time.

Description

Simple polishing solution feeding device
Technical Field
The utility model relates to a polishing technical field, in particular to simple and easy polishing solution liquid feeding device.
Background
The Chemical Mechanical Polishing (CMP) technology adopts the dual functions of chemical reaction and mechanical friction to achieve the purpose of flattening and polishing the surface of a device. Due to its high selectivity of chemical action and its excellent physical properties of polishing the surface roughness of devices to atomic levels, it is currently not only the preferred surface planarization technique in the semiconductor industry, especially in the field of integrated circuit and chip fabrication, but is also widely used in the field of semiconductor discrete devices, optical devices, cell phone panels, and high precision processing where high surface planarization is required. Devices that can be polished and abraded using CMP techniques encompass different materials such as semiconductor wafers, ceramics, glass, plastics, metals, and the like.
The equipment used in CMP technology is mainly a polisher. A simple polisher includes a rotating polishing platen on which is a flat polishing pad, the surface of which is adhered with the polishing pad, the surface of the device to be polished is faced down on the rotating polishing pad, and the mechanical friction of the polishing pad and the chemical action of the polishing liquid are used for grinding and polishing. The polishing solution is generally prepared in advance and is added dropwise at one time in the polishing process. However, some chemical additives need to be added temporarily, and the additives are often prepared into a solution to be added at one time, but sometimes, the liquid adding mode brings problems, for example, some easily-reactive and volatile additives such as hydrogen peroxide solution are easily inconsistent in concentration before and after consumption with time due to one-time addition, and some polishing solutions are repeatedly used, and the inconsistent components are caused due to intermittent addition of the additives once and again. It is therefore a real need to be able to continuously add different additives as required in a simple and efficient manner.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a simple and easy polishing solution liquid feeding device aims at providing a simple and easy liquid feeding mode at polishing in-process polishing solution, utilizes the liquid feeding funnel to add different additives quantitatively ground continuity and make it mix with the principal component and add to the polishing pad, and its main aim at maintains the stability of polishing solution active ingredient along with time.
In order to achieve the above object, the utility model provides a simple and easy polishing solution liquid feeding device, include: the liquid storage device comprises a liquid storage container, a four-way joint, a peristaltic pump and an iron stand platform, wherein the iron stand platform comprises a bottom plate and a support rod vertically arranged on the bottom plate, an adjusting frame is vertically movably arranged on the support rod, a quantitative liquid feeding funnel is arranged on the adjusting frame, liquid inlet ends of the liquid storage container, the quantitative liquid feeding funnel and the peristaltic pump are connected with the four-way joint through plastic hoses, and a liquid outlet end of the peristaltic pump is connected with a liquid outlet nozzle; and a stirring ball is arranged in the four-way joint and is made of stainless steel or zirconia.
Preferably, the alignment jig includes lantern ring mounting and a plurality of joint spare, the lantern ring mounting with bracing piece threaded connection, it is a plurality of the joint spare evenly sets up on the lateral wall of lantern ring mounting.
Preferably, the joint spare with the quantity of ration liquid feeding funnel is two, just ration liquid feeding funnel one-to-one sets up on the joint spare.
Preferably, the liquid outlet ends of the quantitative liquid adding funnels are provided with liquid outlet valves.
Compared with the prior art, the beneficial effects of the utility model are that: first, some additives, such as hydrogen peroxide oxide solutions, which are widely used in polishing of various materials, are generally added to the polishing solution at the time of use. But the polishing solution is very easy to volatilize and escape, so that the concentration of the polishing solution is different before and after the polishing process, thereby affecting the polishing effect. The device corrects the defect, so that the concentration of the product is uniform before and after the product is concentrated, and the product is not volatilized and wasted. Secondly, if more than one additive is added at the time of use, it may cause user trouble, and even may add errors to make the polishing solution useless. By utilizing the device, the additives are only required to be loaded into different liquid adding funnels according to requirements, even if the additives are mistaken, the additives are only local problems, the main components of the polishing solution cannot be influenced, and if the polishing solution is recycled, the additives can be added by using the quantitative liquid adding funnels according to the loss of effective components, so that the stability of the effective components is kept.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of the adjusting bracket of the present invention;
FIG. 3 is a schematic view of the middle four-way joint of the present invention;
the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The simple polishing solution adding device provided in this embodiment, as shown in fig. 1 to 3, includes: the liquid storage device comprises a liquid storage container 10, a four-way joint 20, a peristaltic pump 30 and an iron support 40, wherein the iron support 40 comprises a bottom plate 41 and a support rod 42 vertically arranged on the bottom plate 41, an adjusting frame 50 is vertically movably arranged on the support rod 42, a quantitative liquid adding funnel (6162) is arranged on the adjusting frame 50, liquid inlet ends of the liquid storage container 10, the quantitative liquid adding funnel (6162) and the peristaltic pump 30 are connected with the four-way joint 20 through plastic hoses 70, and a liquid outlet end of the peristaltic pump 30 is connected with a liquid outlet nozzle; the four-way joint 20 is internally provided with a stirring ball 21, and the stirring ball 21 is made of stainless steel or zirconia.
Preferably, the adjusting bracket 50 includes a collar fixing member 51 and a plurality of clamping members 52, the collar fixing member 51 is in threaded connection with the supporting rod 42, and the plurality of clamping members 52 are uniformly arranged on the outer side wall of the collar fixing member 51.
Preferably, the number of the clamping pieces 52 and the quantitative charging funnels (6162) is two, and the quantitative charging funnels (6162) are arranged on the clamping pieces 52 in a one-to-one correspondence manner.
Preferably, the liquid outlet ends of the quantitative liquid adding funnels (6162) are provided with liquid outlet valves 80.
The utility model has the advantages that: first, some additives, such as hydrogen peroxide oxide solutions, which are widely used in polishing of various materials, are generally added to the polishing solution at the time of use. But the polishing solution is very easy to volatilize and escape, so that the concentration of the polishing solution is different before and after the polishing process, thereby affecting the polishing effect. The device corrects the defect, so that the concentration of the product is uniform before and after the product is concentrated, and the product is not volatilized and wasted. Secondly, if more than one additive is added at the time of use, it may cause user trouble, and even may add errors to make the polishing solution useless. By utilizing the device, only the additives are loaded into different liquid adding funnels according to requirements, even if the additives are mistaken, the additives are only local problems, the main components of the polishing solution cannot be influenced, and if the polishing solution is recycled, the additives can be added by using a quantitative liquid adding funnel (6162) according to the loss of effective components, so that the stability of the effective components is kept.
The first embodiment is as follows:
this example is a polishing and grinding of an aluminum alloy. The polishing solution comprises 20% silica sol as main component, has a particle size of 90 nm, and has a pH of 10. To add 1% hydrogen peroxide (H)2O2) As an oxidant, 2% EDTA as a complexing agent, and 0.1% Benzotriazole (BTA) as an anticorrosive agent, and the liquid adding speed is 102 ml/min. Since hydrogen peroxide is added when it needs to be used, and EDTA is used as a high-valence complexing agent, which is likely to cause the colloidal solution to settle when the concentration is high, thereby affecting the stability of the polishing solution, a temporary addition method is adopted in this embodiment. Then, 200ml of 30% hydrogen peroxide solution was added to the quantitative addition funnel 61, the flow rate was adjusted to 3ml/min, 500ml of 20% EDTA solution was added to the quantitative addition funnel 62, the flow rate was adjusted to 9ml/min, and the polishing solution containing silica sol and BTA was stored in the 10L stock container 10. After the peristaltic pump 30 is started, the liquid outlet valves 80 of the quantitative liquid adding funnel 61 and the quantitative liquid adding funnel 62 are opened to start polishing, the surface of the aluminum alloy meets the requirement of mirror surface brightness, and the removal rate can reach 10 micrometers per hour.
Example two:
in this example, polishing liquid is used repeatedly for polishing and grinding stainless steel, so that new liquid needs to be added to compensate for the loss of effective components, and hydrogen peroxide as an oxidizing agent needs to be added continuously. The polishing solution comprises 15% silica sol as main component, has a particle size of 90 nm, and has a pH of 10. To add 1% hydrogen peroxide (H)2O2) As an oxidant, 1% of potassium citrate is used as a complexing agent, 0.2% of Benzotriazole (BTA) is used as an anticorrosive agent, and the liquid adding speed is 100 ml/min. Since it is judged that about two thirds of hydrogen peroxide is consumed during polishing, 200ml of 30% hydrogen peroxide solution is added to the quantitative addition funnel 61 to adjust the flow rate to 2ml/min, and fresh polishing solution is added to the quantitative addition funnel 62 to adjust the flow rate to 10ml/min, and the fresh polishing solution is first stored in a 10L storage container 10, and a magnetic stirrer is added, and then the storage container 10 is placed on a magnetic stirrer to be stirred. After the peristaltic pump 30 is started, the liquid outlet valves 80 of the quantitative charging funnel 61 and the quantitative charging funnel 62 are opened to start polishing, and the used polishing liquid is collected and flows back to the liquid storage container 10 for recycling. The surface of stainless steel can meet the requirement of mirror brightness, the removal rate can reach 10 microns per hour, and the polishing solution can be repeatedly used for several hours.
Moreover, if more than two additives need to be temporarily added, only a plurality of quantitative liquid adding funnels and three-way or four-way joints need to be added.
The above is only the preferred embodiment of the present invention, and not the scope of the present invention, all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings or the direct or indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims (4)

1. The utility model provides a simple and easy polishing solution liquid feeding device which characterized in that includes: the liquid storage device comprises a liquid storage container, a four-way joint, a peristaltic pump and an iron stand platform, wherein the iron stand platform comprises a bottom plate and a support rod vertically arranged on the bottom plate, an adjusting frame is vertically movably arranged on the support rod, a quantitative liquid feeding funnel is arranged on the adjusting frame, liquid inlet ends of the liquid storage container, the quantitative liquid feeding funnel and the peristaltic pump are connected with the four-way joint through plastic hoses, and a liquid outlet end of the peristaltic pump is connected with a liquid outlet nozzle; and a stirring ball is arranged in the four-way joint and is made of stainless steel or zirconia.
2. The simple polishing solution adding device of claim 1, wherein the adjusting frame comprises a lantern ring fixing piece and a plurality of clamping pieces, the lantern ring fixing piece is in threaded connection with the supporting rod, and the clamping pieces are uniformly arranged on the outer side wall of the lantern ring fixing piece.
3. The simple polishing solution adding device of claim 1, wherein the number of the clamping pieces and the quantitative adding funnels is two, and the quantitative adding funnels are correspondingly arranged on the clamping pieces one to one.
4. The simple polishing solution adding device of claim 1, wherein the liquid outlet ends of the quantitative adding funnel are provided with liquid outlet valves.
CN202020550994.5U 2020-04-14 2020-04-14 Simple polishing solution feeding device Active CN211967156U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020550994.5U CN211967156U (en) 2020-04-14 2020-04-14 Simple polishing solution feeding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020550994.5U CN211967156U (en) 2020-04-14 2020-04-14 Simple polishing solution feeding device

Publications (1)

Publication Number Publication Date
CN211967156U true CN211967156U (en) 2020-11-20

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Application Number Title Priority Date Filing Date
CN202020550994.5U Active CN211967156U (en) 2020-04-14 2020-04-14 Simple polishing solution feeding device

Country Status (1)

Country Link
CN (1) CN211967156U (en)

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Inventor after: Wang Jiaxiong

Inventor before: Zhu Wenxian