CN211957848U - Cavity microwave device connection structure - Google Patents

Cavity microwave device connection structure Download PDF

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Publication number
CN211957848U
CN211957848U CN202020348114.6U CN202020348114U CN211957848U CN 211957848 U CN211957848 U CN 211957848U CN 202020348114 U CN202020348114 U CN 202020348114U CN 211957848 U CN211957848 U CN 211957848U
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CN
China
Prior art keywords
cavity
pcb
microwave device
microwave
connecting structure
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Active
Application number
CN202020348114.6U
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Chinese (zh)
Inventor
万鹏
高晓春
夏兴旺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHONGQING HUISU INTELLIGENT COMMUNICATION Co.,Ltd.
Original Assignee
Guangdong Huisu Telecommunication Tech Inc
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Publication date
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Priority to CN202020348114.6U priority Critical patent/CN211957848U/en
Application granted granted Critical
Publication of CN211957848U publication Critical patent/CN211957848U/en
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Abstract

The utility model relates to the technical field of microwave communication, in particular to a cavity microwave device connecting structure, which comprises a cavity and a microwave network circuit arranged in the cavity; the cavity is used for internally arranging the microwave network circuit; a through hole communicated with the cavity is arranged on one of the packaging walls in a penetrating manner; the cavity microwave device connecting structure also comprises a first PCB arranged on the outer wall of the packaging wall with the through hole; the microwave network circuit comprises a second PCB and a microstrip line arranged on the second PCB; the second PCB is provided with a convex block; and the lug is connected with the second PCB after penetrating through the through hole. The utility model discloses a wear out the perforation back with the lug part of second PCB board, be connected the lug and the first PCB board of second PCB board to accomplish being connected of microwave network circuit and outer microwave device, replace the cable to be connected, make the structure of cavity cleaner and tidier and more simple to operate.

Description

Cavity microwave device connection structure
Technical Field
The utility model relates to a microwave communication technical field, concretely relates to cavity microwave device connection structure.
Background
In mobile communication network coverage, microwave devices are indispensable. The microwave devices commonly used at present mainly include phase shifters, power dividers, filters, couplers, duplexers, and the like. The quality of the performance of the microwave device can affect the quality of the whole network coverage, so the importance of the microwave device in the field of mobile communication is self-evident.
The traditional microwave device mainly comprises a microwave network circuit, a cavity, an outer microwave device and other parts, wherein the microwave network circuit is fixed on the cavity by using some structural parts during assembly, and then the microwave network circuit is connected with the outer microwave device outside the cavity through a cable, but the overall structure is not simple easily due to excessive cables.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a cavity microwave device connection structure to the above-mentioned not enough among the prior art.
The purpose of the utility model is realized through the following technical scheme: a cavity microwave device connecting structure comprises a cavity and a microwave network circuit arranged in the cavity; the cavity comprises a plurality of packaging walls and a cavity defined by the plurality of packaging walls; the cavity is used for internally arranging the microwave network circuit;
a through hole communicated with the cavity is arranged on one of the packaging walls in a penetrating manner; the cavity microwave device connecting structure also comprises a first PCB arranged on the outer wall of the packaging wall with the through hole; the microwave network circuit comprises a second PCB and a microstrip line arranged on the second PCB; the second PCB is provided with a convex block; and the lug is connected with the second PCB after penetrating through the through hole.
The utility model discloses further set up as, first PCB board pastes tightly on the outer wall that has fenestrate encapsulation wall.
The utility model is further arranged that the first PCB board is provided with a through groove in a penetrating way; the lug passes through the through hole and the through groove in sequence and then is connected with the first PCB.
The utility model discloses further set up to, lug and first PCB board welding.
The utility model is further arranged that the first PCB board is provided with a welding pad; the bump is welded with the bonding pad.
The utility model discloses further set up to, be equipped with the packing between cavity and the first PCB board.
The utility model discloses further set up to, the middle part of cavity is located to first PCB board.
The utility model is further provided with two filling pieces; two filling pieces are respectively arranged on two sides of the first PCB.
The utility model has the advantages that: the utility model discloses a wear out the perforation back with the lug part of second PCB board, be connected the lug and the first PCB board of second PCB board to accomplish being connected of microwave network circuit and outer microwave device, replace the cable to be connected, make the structure of cavity cleaner and tidier and more simple to operate.
Drawings
The invention is further described with the aid of the accompanying drawings, in which, however, the embodiments do not constitute any limitation to the invention, and for a person skilled in the art, other drawings can be derived from the following drawings without inventive effort.
Fig. 1 is a schematic structural diagram of the present invention;
fig. 2 is an exploded view of the present invention;
fig. 3 is a schematic structural diagram of a second PCB board of the present invention;
fig. 4 is a schematic structural view of the cavity of the present invention;
wherein: 1. a cavity; 2. a package wall; 21. perforating; 3. a cavity; 4. a first PCB board; 51. a second PCB board; 52. a microstrip line; 53. a bump; 6. a through groove; 7. and a filling member.
Detailed Description
The invention will be further described with reference to the following examples.
As can be seen from fig. 1 to 4, the cavity microwave device connection structure of the present embodiment includes a cavity 1 and a microwave network circuit disposed in the cavity 1; the cavity 1 comprises a plurality of enclosing walls 2 and a cavity 3 defined by the plurality of enclosing walls 2; the cavity 3 is used for internally arranging the microwave network circuit;
one of the packaging walls 2 is provided with a through hole 21 communicated with the cavity 3 in a penetrating way; the cavity microwave device connecting structure also comprises a first PCB 4 arranged on the outer wall of the packaging wall 2 with a perforation 21; the microwave network circuit comprises a second PCB board 51 and a microstrip line 52 arranged on the second PCB board 51; the second PCB 51 is provided with a bump 53; the bump 53 is connected to the second PCB 51 after passing through the through hole 21.
Specifically, in the cavity microwave device connection structure of the present embodiment, the first PCB 4 is used for connecting with an external microwave device; when the microwave network circuit is installed, the first PCB 4 and the external microwave device are firstly placed on the outer wall of the packaging wall 2 with the through hole 21, then the second PCB 51 and the microstrip line 52 penetrate into the cavity 3, then the second PCB 51 is moved towards the direction of the through hole 21 until the bump 53 of the second PCB 51 partially penetrates out of the through hole 21, and then the bump 53 of the second PCB 51 is connected with the first PCB 4, so that the connection between the microwave network circuit and the external microwave device is completed, cable connection is replaced, and the structure of the cavity 1 is neat and convenient to install.
In the cavity microwave device connecting structure of the embodiment, the first PCB 4 is attached to the outer wall of the package wall 2 with the through hole 21. The whole structure is more compact through the arrangement.
In the cavity microwave device connecting structure of the present embodiment, the first PCB 4 is provided with a through slot 6 in a penetrating manner; the projection 53 is connected to the first PCB 4 after passing through the through hole 21 and the through groove 6 in sequence. The connection of the first PCB 4 and the bump 53 is facilitated by the above arrangement.
In the cavity microwave device connecting structure of this embodiment, the bump 53 is soldered to the first PCB 4. The connection of the first PCB 4 and the bump 53 is facilitated by the above arrangement.
In the cavity microwave device connection structure of this embodiment, the first PCB 4 is provided with a pad; the bumps 53 are soldered to the pads. The connection of the first PCB 4 and the bump 53 is facilitated by the above arrangement.
In the cavity microwave device connecting structure of this embodiment, a filling member 7 is disposed between the cavity 3 and the first PCB 4. The second PCB 51 can be stably disposed in the cavity 3 by the above-mentioned arrangement.
In the cavity microwave device connection structure of this embodiment, the first PCB 4 is disposed in the middle of the cavity 3. In the cavity microwave device connecting structure of this embodiment, the number of the filling members 7 is two; two filling members 7 are respectively provided at both sides of the first PCB 4. The structure is reasonable, and the second PCB 51 can be stably arranged in the cavity 3 through the arrangement.
It should be finally noted that the above embodiments are only intended to illustrate the technical solutions of the present invention, and not to limit the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified or replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention.

Claims (8)

1. A cavity microwave device connection structure is characterized in that: the microwave oven comprises a cavity (1) and a microwave network circuit arranged in the cavity (1); the cavity (1) comprises a plurality of enclosing walls (2) and a cavity (3) defined by the plurality of enclosing walls (2); the cavity (3) is used for internally arranging the microwave network circuit;
a through hole (21) communicated with the cavity (3) is arranged on one of the packaging walls (2) in a penetrating way; the cavity microwave device connecting structure further comprises a first PCB (4) arranged on the outer wall of the packaging wall (2) with a through hole (21); the microwave network circuit comprises a second PCB (51) and a microstrip line (52) arranged on the second PCB (51); the second PCB (51) is provided with a lug (53); the lug (53) passes through the through hole (21) and then is connected with the second PCB (51).
2. The cavity microwave device connecting structure of claim 1, wherein: the first PCB (4) is attached to the outer wall of the packaging wall (2) with the through hole (21).
3. The cavity microwave device connecting structure of claim 1, wherein: the first PCB (4) is provided with a through groove (6) in a penetrating way; the lug (53) penetrates through the through hole (21) and the through groove (6) in sequence and then is connected with the first PCB (4).
4. The cavity microwave device connecting structure of claim 1, wherein: the bump (53) is welded with the first PCB (4).
5. The cavity microwave device connecting structure of claim 4, wherein: the first PCB (4) is provided with a bonding pad; the bump (53) is soldered to the pad.
6. The cavity microwave device connecting structure of claim 1, wherein: and a filling piece (7) is arranged between the cavity (3) and the first PCB (4).
7. The cavity microwave device connecting structure of claim 6, wherein: the first PCB (4) is arranged in the middle of the cavity (3).
8. The cavity microwave device connecting structure of claim 7, wherein: the number of the filling pieces (7) is two; the two filling pieces (7) are respectively arranged on two sides of the first PCB (4).
CN202020348114.6U 2020-03-18 2020-03-18 Cavity microwave device connection structure Active CN211957848U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020348114.6U CN211957848U (en) 2020-03-18 2020-03-18 Cavity microwave device connection structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020348114.6U CN211957848U (en) 2020-03-18 2020-03-18 Cavity microwave device connection structure

Publications (1)

Publication Number Publication Date
CN211957848U true CN211957848U (en) 2020-11-17

Family

ID=73180669

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020348114.6U Active CN211957848U (en) 2020-03-18 2020-03-18 Cavity microwave device connection structure

Country Status (1)

Country Link
CN (1) CN211957848U (en)

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GR01 Patent grant
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Effective date of registration: 20210225

Address after: 400800 building J1, Pingshan Industrial Park (intelligent terminal Industrial Park), 115 Fuyao Road, Wansheng Economic Development Zone, Qijiang District, Chongqing

Patentee after: CHONGQING HUISU INTELLIGENT COMMUNICATION Co.,Ltd.

Address before: No.16, niushanjingjing Road, Dongcheng Street, Dongguan City, Guangdong Province, 523000

Patentee before: GUANGDONG HUISU TELECOMMUNICATION TECH Inc.

TR01 Transfer of patent right